JPH01168826A - Method for removing copper component in molten solder - Google Patents
Method for removing copper component in molten solderInfo
- Publication number
- JPH01168826A JPH01168826A JP32519987A JP32519987A JPH01168826A JP H01168826 A JPH01168826 A JP H01168826A JP 32519987 A JP32519987 A JP 32519987A JP 32519987 A JP32519987 A JP 32519987A JP H01168826 A JPH01168826 A JP H01168826A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- molten
- molten solder
- tank
- copper component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 184
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 33
- 239000010949 copper Substances 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title abstract description 7
- 238000001816 cooling Methods 0.000 claims abstract description 15
- 238000005192 partition Methods 0.000 abstract description 20
- 238000005476 soldering Methods 0.000 abstract description 10
- 239000004065 semiconductor Substances 0.000 abstract description 9
- 239000011810 insulating material Substances 0.000 abstract description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 4
- 238000000151 deposition Methods 0.000 abstract description 2
- 230000001376 precipitating effect Effects 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
Landscapes
- Manufacture And Refinement Of Metals (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、溶融半田を循環しながら冷却して、溶融半田
内に溶は出した半導体のリード線等の銅分を析出させて
除去するようにした溶融半田内の銅分除去装置に関する
ものである。[Detailed Description of the Invention] Industrial Application Field The present invention provides a method for cooling molten solder while circulating it, and depositing and removing copper content such as lead wires of semiconductors that have melted into the molten solder. This invention relates to a device for removing copper content from molten solder.
従来の技術
半田付は装置の半田槽に貯留した溶融半ｕ１に半導体の
リード線をつけ、リード線の半田付は加工をある程度行
なうと、リード線の材質である銅分が半田槽の２５０℃
〜３００℃の温度範囲の溶融半田内に溶は出して化合物
となり、溶融半田の温度が次第に低下し、半導体のリー
ド線への半田付は工程が不可能となる。Conventional technology In soldering, a semiconductor lead wire is attached to the molten semi-conductor U1 stored in the solder tank of the device, and when the lead wire is soldered to a certain extent, the copper content of the lead wire is heated to 250°C in the solder tank.
The melt melts into the molten solder in the temperature range of ~300° C. and forms a compound, and the temperature of the molten solder gradually decreases, making it impossible to solder to semiconductor lead wires.
このため、ある頻度で半田槽全体の温度を２１０℃〜２
５０℃の温度範囲に下げ、半田槽内の溶解半田をある程
度冷却することにより、溶解半田内に溶は出した銅分を
析出して固体とし、溶融半田内から析出した銅のみを半
田槽の開口する上部より取除いていた。For this reason, the temperature of the entire soldering bath is increased from 210℃ to 210℃ at a certain frequency.
By lowering the temperature to a temperature range of 50°C and cooling the molten solder in the solder bath to some extent, the copper that has molten in the molten solder will precipitate and become solid, and only the copper that has precipitated from the molten solder will be transferred to the solder bath. It was removed from the top where it opens.
しかし、この作業には半田付は装置の稼働を１〜２Ｈ！
ｆ停止しなければならず、この間半導体のリード線への
半田付は加工を行なうことができず、作業能率が悪く、
溶融半田より銅分を取除いた後、半田槽内の低下した溶
融半田の温度を再び元の温度に上昇しなければならず、
余分なエネルギーを必要とした。However, soldering requires 1 to 2 hours of operation for this work!
During this period, soldering to semiconductor lead wires cannot be performed, resulting in poor work efficiency.
After removing the copper content from the molten solder, the temperature of the molten solder in the solder bath must be raised to the original temperature again.
It required extra energy.
発明が解決しようとする問題点
本発明の目的は、上記欠点を解消し、半田付は装置の稼
働を停止する必要がなく、半１ｆｌｌ槽での半導体のリ
ード線への半田付は工程を継続して行なえ、半田槽の溶
融半田の温度に変化を与えることがなく、作業能率が良
く、エネルギーの節約となり、循環しながら溶融半田に
溶は出した銅分を析出して確実に取除くことが可能な溶
融半田内の銅分除去装置を提供することにある。Problems to be Solved by the Invention The purpose of the present invention is to eliminate the above-mentioned drawbacks, and to eliminate the need to stop the operation of the equipment during soldering, and to continue the process of soldering semiconductor lead wires in a half-full bath. This process does not change the temperature of the molten solder in the solder tank, improving work efficiency and saving energy, and allows the copper content that has melted into the molten solder to be precipitated and removed reliably while circulating. An object of the present invention is to provide an apparatus for removing copper from molten solder.
問題点を解決するための手段
本発明の溶融半田内の銅分除去装置は、半田槽と、前記
半田槽に連絡した半田循環槽とからなり、前記半田循環
槽内に前記半田槽の溶融半田を取出すと共に、前記半田
槽に溶融半田を戻す半田循環手段を設け、前記半田循環
槽に溶融半田を冷却する半田冷却手段を設けたことを特
徴とする構成を有するものである。Means for Solving the Problems The device for removing copper content in molten solder of the present invention comprises a solder tank and a solder circulation tank connected to the solder tank, and the molten solder in the solder tank is transferred into the solder circulation tank. The present invention is characterized in that a solder circulation means is provided for taking out the molten solder and returning the molten solder to the solder bath, and a solder cooling means for cooling the molten solder is provided in the solder circulation bath.
作用
半田槽に連絡した半田循環槽内に設けた半田循環手段が
半田槽の溶融半田を半田循環槽に取出すと共に、半田槽
に半田循環槽の溶融半田を戻して循環し、半田循環槽に
設けた半田冷却手段が半田循環槽内の循環する溶融半田
を徐々に冷却して溶解半田に溶は出した銅分を析出し、
溶融半田内の析出した銅分のみを取除く。A solder circulation means installed in a solder circulation tank connected to the solder tank takes out the molten solder in the solder tank to the solder circulation tank, and returns the molten solder in the solder circulation tank to the solder tank for circulation. The solder cooling means gradually cools the molten solder circulating in the solder circulation tank and precipitates the copper content that has melted into the molten solder.
Removes only the copper that has precipitated in the molten solder.
実施例
以下、本発明の実施例を図面に基づいて詳細に説明する
。Embodiments Hereinafter, embodiments of the present invention will be described in detail based on the drawings.
第１図及び第２図において、１は溶融した鉛とスズの合
金である半田を貯留する半田付は装置の半田槽であり、
半田ＷＪ１には半田槽１の溶融半田を循環する環状の半
田循環槽２が連結パイプ３゜４により連結され、半田循
環槽２内には半田槽１の溶融半田を連結パイプ３を介し
て取出すと共に、半田槽１に溶融半田を連結パイプ４を
介して戻す半田循環手段となるシロッコ型の耐熱性を有
するポンプ５が設けられ、半田循環ｌ１１２には溶融半
田を冷却する半田冷却手段となる複数の隔壁６が設けら
れている。In FIGS. 1 and 2, 1 is a solder tank of the device that stores solder, which is an alloy of molten lead and tin;
An annular solder circulation tank 2 that circulates molten solder from the solder tank 1 is connected to the solder WJ 1 by a connecting pipe 3.4, and the molten solder from the solder tank 1 is taken out into the solder circulation tank 2 through the connecting pipe 3. At the same time, a sirocco-type heat-resistant pump 5 is provided as a solder circulation means for returning molten solder to the solder bath 1 via a connecting pipe 4, and a solder circulation l112 is provided with a plurality of solder cooling means for cooling the molten solder. A partition wall 6 is provided.
半田循環槽２は円形の内周壁７と、内周壁７の外側に一
定の間隔を隔てて設けられた円形の外周壁８と、内周１
．７と外周壁８の底部を塞ぐ底壁９とからなり、半田循
環槽２は上方が開口されており、内周！！７と外周Ｗ８
との間には複数の隔ＷＩ６が上端と下端をそれぞれ交互
に開口して設けられ、半田循環槽２内には隔壁６により
半田通路１０が形成され、半田循環槽２の連結パイプ３
．４四に相当する位置には半田通路１０を仕切る区画壁
１１が設けられ、半田循環槽２の底壁９の下部には保温
手段となる断熱材１２が設けられている。The solder circulation tank 2 has a circular inner circumferential wall 7, a circular outer circumferential wall 8 provided outside the inner circumferential wall 7 at a constant interval, and an inner circumferential wall 1.
．． 7 and a bottom wall 9 that closes the bottom of the outer circumferential wall 8, the solder circulation tank 2 is open at the top, and the inner circumference! ! 7 and outer circumference W8
A plurality of partitions WI6 are provided between the solder circulation tank 2 and the connecting pipe 3 of the solder circulation tank 2.
．． A partition wall 11 that partitions the solder passage 10 is provided at a position corresponding to 44, and a heat insulating material 12 serving as a heat retaining means is provided below the bottom wall 9 of the solder circulation tank 2.
半田循環槽２の区画壁１１と連結パイプ４寄りの隔壁６
との間には内部にポンプ５を収納するポンプ収納ｖ１３
が形成され、半田槽１と半田循環槽２の外周Ｗ８との間
には区画壁１１に対するポンプ５の反対側に半田通、路
１０と連通ずる吸込口１４を有する連結パイプ３が設け
られると共に、半田槽１と半田循環槽２の外周壁８との
間の区画壁１１に対するポンプ５側にはポンプ収納室１
３と連通ずる吐出口１５を有する連結パイプ４が連結パ
イプ３と平行に設けられている。Partition wall 11 of solder circulation tank 2 and partition wall 6 near connecting pipe 4
There is a pump storage v13 that stores the pump 5 inside between the
A connecting pipe 3 is provided between the solder tank 1 and the outer periphery W8 of the solder circulation tank 2, and has a suction port 14 communicating with the solder passageway 10 on the opposite side of the pump 5 to the partition wall 11. , a pump storage chamber 1 is provided on the pump 5 side with respect to the partition wall 11 between the solder tank 1 and the outer peripheral wall 8 of the solder circulation tank 2.
A connecting pipe 4 having a discharge port 15 communicating with the connecting pipe 3 is provided parallel to the connecting pipe 3.
半田循環槽２のポンプ収納室１３には上端を閉塞する土
壁１６が一体に形成され、ポンプ収納室１３内には通孔
１７を有する仕切壁１８が設けられ、仕切壁１８の下部
には下部半田通路１９が形成され、半田通路１０と下部
半田通路１９間に位置する隔壁６の下端寄り一側にはシ
ャッター２０が上下方向に移動自在に設けられている。The pump storage chamber 13 of the solder circulation tank 2 is integrally formed with an earthen wall 16 that closes the upper end, and the pump storage chamber 13 is provided with a partition wall 18 having a through hole 17. A lower solder passage 19 is formed, and a shutter 20 is provided on one side near the lower end of the partition wall 6 located between the solder passage 10 and the lower solder passage 19 so as to be movable in the vertical direction.
ポンプ収納室１３の仕切壁１８の上部には通孔１７に相
当する位置にポンプ５の囲壁２１が設けられ、囲壁２１
内には複数の羽根板２２を有する羽根車２３が回動自在
に設けられている。A surrounding wall 21 for the pump 5 is provided at the upper part of the partition wall 18 of the pump storage chamber 13 at a position corresponding to the through hole 17.
An impeller 23 having a plurality of blade plates 22 is rotatably provided therein.
ポンプ収納室１３の上壁１６の上部には支持板２４．２
４を介してモータ取付板２５が設けられ、モータ取付板
２５の下面には拘束あるいはゆっくりと回転している時
に力を発生する原動機となるトルクモータＭが装着され
、トルクモータＭのモータ軸２６の先端には駆動プーリ
ー２７が一体に固着され、モータ取付板２５にはトルク
モータＭの側部に回転支持体２８が設けられ、回転支持
体２８には回転軸２９が回動自在に軸支され、回転軸２
９の上端には従動プーリー３０が一体に固着され、駆動
プーリー２７と従動プーリー３０との間には回転伝達手
段となる伝達ベルト３１が張架され、回転軸２９の下端
にはポンプ５の羽根車２３が一体に固着され、回転軸２
９の下端寄りがｌ！１！！１２１の−ＥＷＪに軸受３２
を介し１回動自在に軸支されている。A support plate 24.2 is provided on the upper part of the upper wall 16 of the pump storage chamber 13.
4, a motor mounting plate 25 is installed on the lower surface of the motor mounting plate 25, and a torque motor M, which is a prime mover that generates force when the motor is restrained or rotates slowly, is mounted on the lower surface of the motor mounting plate 25. A driving pulley 27 is integrally fixed to the tip of the motor mounting plate 25, and a rotating support 28 is provided on the side of the torque motor M. A rotating shaft 29 is rotatably supported on the rotating support 28. and rotation axis 2
A driven pulley 30 is integrally fixed to the upper end of the rotating shaft 29, a transmission belt 31 serving as a rotation transmission means is stretched between the driving pulley 27 and the driven pulley 30, and the blades of the pump 5 are attached to the lower end of the rotating shaft 29. A wheel 23 is fixed integrally with the rotating shaft 2.
The lower end of 9 is l! 1! ! Bearing 32 on -EWJ of 121
It is pivotally supported for one rotation.
３３は循環半田槽２内の溶融半ｕ１の温度を測定する温
度計である。33 is a thermometer for measuring the temperature of the molten half U1 in the circulating solder bath 2.
半田槽１内の溶融半田の温度は３００℃とされ、半田循
環１ｆｆ２のポンプ収納室１３内のポンプ５の作動によ
り半田槽１内の溶融半田が連結パイプ３の吸込口１４よ
り半田循ＩＨｆｆ２に取出されると共に、半田循環［２
で銅を取除かれた純粋の溶融半田が連結パイプ４の吐出
口１５より再び半田槽１に戻される。半田循環槽２では
複数の隔壁６に沿って半田通路１０を上下に流動しなが
ら溶融半田の温度が２５０℃まで徐々に冷却され、半田
循環槽２の底壁９の下部に設けた断熱材１２により半田
循環槽２内の溶融半田の温度が２５０℃に保温される。The temperature of the molten solder in the solder tank 1 is set to 300°C, and the operation of the pump 5 in the pump storage chamber 13 of the solder circulation 1ff2 causes the molten solder in the solder tank 1 to flow through the suction port 14 of the connecting pipe 3 to the solder circulation IHff2. At the same time, the solder is circulated [2
The pure molten solder from which the copper has been removed is returned to the solder bath 1 through the outlet 15 of the connecting pipe 4. In the solder circulation tank 2, the temperature of the molten solder is gradually cooled to 250° C. while flowing up and down in the solder passages 10 along the plurality of partition walls 6. As a result, the temperature of the molten solder in the solder circulation tank 2 is maintained at 250°C.
第１図及び第２図の矢印は半田循環Ｎ２における溶融半
田の流動方向を示す。The arrows in FIGS. 1 and 2 indicate the flow direction of the molten solder in the solder circulation N2.
次に、この実施例の作用について説明する。Next, the operation of this embodiment will be explained.
まず始めに、モータ取付板２５の下面に設けたトルクモ
ータＭを作動すると、トルクモータＭのモータ軸２６が
回転し、モータ軸２６の先端に一体に固着した駆動プー
リー２７が回転し、駆動プーリー２７の回転が伝達ベル
ト３１を介して従動プーリー３０に伝達され、従動プー
リー３０の回転により、モータ取付板２５に設けた回転
支持体２８に回動自在に軸支した回転軸２９が回動し、
回転軸２９のＦ端に一体に固着したポンプ５の羽根車２
２が回転することにより、半田循環槽２のポンプ収納室
１３内に設けたポンプ５が作動する。First, when the torque motor M provided on the lower surface of the motor mounting plate 25 is activated, the motor shaft 26 of the torque motor M rotates, the drive pulley 27 fixed integrally to the tip of the motor shaft 26 rotates, and the drive pulley 27 is transmitted to the driven pulley 30 via the transmission belt 31, and the rotation of the driven pulley 30 rotates the rotating shaft 29 rotatably supported on the rotating support 28 provided on the motor mounting plate 25. ,
The impeller 2 of the pump 5 is integrally fixed to the F end of the rotating shaft 29
2 rotates, the pump 5 provided in the pump storage chamber 13 of the solder circulation tank 2 is activated.
そして、ポンプ５の作動により半導体のリード線の材質
である銅分を含んだ半田槽１内の３００℃の温度の溶融
半田を連結パイプ３の吸込口１４より半田循環槽２に取
出し、半田循環槽２に設けた複数の隔壁６に沿って半田
通路１ｏを上下に流動しながら溶融半田の温度を２５０
℃まで徐々に冷却し、半田通路１０を流動する間の冷却
作用により溶融半田内の銅分を固体として析出し、半田
循環槽２内の溶融した半田の比重よりも軽い比重の銅３
４が固体となって溶融半田の上層に浮き上がり、半田循
環槽２の開口する上部より溶融半田に析出して浮き上が
ってきた銅３４を人手により取除き、半田循環槽２の底
壁９の下部に設けた断熱材１２により溶融半田の温度を
２５０℃に保温する。Then, by operating the pump 5, the molten solder at a temperature of 300°C in the solder bath 1 containing copper, which is the material of semiconductor lead wires, is taken out from the suction port 14 of the connecting pipe 3 to the solder circulation bath 2, and the solder is circulated. While flowing up and down the solder passage 1o along the plurality of partition walls 6 provided in the tank 2, the temperature of the molten solder is increased to 250°C.
℃, the copper content in the molten solder is precipitated as a solid by the cooling effect while flowing through the solder passage 10, and copper 3 having a specific gravity lower than that of the molten solder in the solder circulation tank 2 is produced.
The copper 34 becomes solid and floats on the upper layer of the molten solder, and the copper 34 that has precipitated on the molten solder and floats up from the open upper part of the solder circulation tank 2 is removed by hand, and placed in the lower part of the bottom wall 9 of the solder circulation tank 2. The temperature of the molten solder is maintained at 250° C. by the heat insulating material 12 provided.
さらに、半田循環槽２のポンプ収納室１３内のポンプ５
の作動により、半田循環槽２で銅３４が取除かれた２５
０℃の温度の純粋の溶融半田が下部半田通路１９．仕切
壁１８の通孔１７．ポンプ収納室１３及び連結パイプ４
の吐出口１５を通って再び半田槽１に戻される。Furthermore, the pump 5 in the pump storage chamber 13 of the solder circulation tank 2
Copper 34 was removed in solder circulation tank 2 by the operation of 25
Pure molten solder at a temperature of 0°C flows through the lower solder passage 19. Through hole 17 in partition wall 18. Pump storage chamber 13 and connecting pipe 4
is returned to the solder bath 1 again through the discharge port 15.
半田循環槽２から半田槽１に戻された銅３４が完全に取
除かれた純粋の溶融半田はその温度が再び３００’ｃま
で上昇される。The pure molten solder from which the copper 34 has been completely removed is returned from the solder circulation tank 2 to the solder tank 1, and its temperature is raised again to 300'C.
溶融半田が半田槽１と半田循環槽２とを循環する動作を
ポンプ５により繰返して行なう。The operation of circulating the molten solder between the solder tank 1 and the solder circulation tank 2 is repeatedly performed by the pump 5.
なお、半田循環槽内の溶融半田の析出して浮き上がって
きた銅を人手でなく自動的に取除くことも可能である。Incidentally, it is also possible to remove the copper that has come up as a result of precipitation of molten solder in the solder circulation tank automatically rather than manually.
なお、半田循環槽に設けた複数の隔壁を中空に形成し、
隔壁の中空に冷却風を送って強ｉｌｌ的に半田循環槽を
循環する溶融半田を冷却することも可能である。In addition, the multiple partition walls provided in the solder circulation tank are formed hollow,
It is also possible to forcefully cool the molten solder circulating in the solder circulation tank by sending cooling air into the hollow space of the partition wall.
発明の効果
以上に述べたように、本発明の溶融半田内の銅分除去装
置によれば、半田槽と、半田槽に連絡した半田循環槽と
からなり、半田循環槽内に半田槽の溶融半田を取出すと
共に、半田槽に溶融半田を戻す半田循環手段を設け、半
田循環槽に溶融半田を冷却する半田冷却手段を設けたこ
とにより、半田付は装置の稼働を停止する必要がなく、
半田槽での半導体のリード線等への半田付は工程を継続
して行なうことができ、半田槽の溶融半田の温度に変化
を与えることがなく、作業能率が良く、エネルギーの節
約となり、半田冷却手段が半田循環槽内の溶融半田を循
環しながら徐々に冷却し、溶融半田に溶は出した銅分を
析出して確実に取除くことができる。Effects of the Invention As described above, the device for removing copper content in molten solder of the present invention is composed of a solder tank and a solder circulation tank connected to the solder tank, and the copper content removal device in molten solder of the present invention is composed of a solder tank and a solder circulation tank connected to the solder tank. By providing a solder circulation means for taking out the solder and returning the molten solder to the solder bath, and providing a solder cooling means for cooling the molten solder in the solder circulation bath, there is no need to stop the operation of the device for soldering.
The process of soldering semiconductor lead wires, etc. in a solder tank can be carried out continuously, and the temperature of the molten solder in the solder tank does not change, improving work efficiency and saving energy. The cooling means gradually cools down the molten solder in the solder circulation tank while circulating it, and the copper content melted into the molten solder can be precipitated and reliably removed.
第１図は、本発明の実施例の溶融半田内の銅分除去装置
の平面図、
第２図は、第１図の半田循環槽を展開した状態の要部ｔ
Ｉｉｌｌｉ面図である。
１・・・半田槽、２・・・半田循環槽、３，４・・・連
結パイプ、５・・・ポンプ、６・・・隔壁、７・・・内
周壁、８・・・外周壁、９・・・底壁、１０・・・半田
通路、１１・・・区画壁、１２・・・断熱材、１３・・
・ポンプ収納室、１４・・・吸込口、１５・・・吐出口
、１６−・・上壁、１７・・・通孔、１８・・・仕切壁
、１９・・・下部半田通路、２０・・・シャッター、２
１・・・囲壁、２２・・・羽根板、２３・・・羽根車、
２４・・・支持板、２５・・・モータ取付板、２６・・
・モータ軸、２７・・・駆動プーリー、２８・・・回転
支持体、２９・・・回転軸、３０・・・従動プーリー、
３１・・・伝達ベルト、３２・・・軸受、３３・・・温
度計、３４−・・銅、Ｍ・・・トルクモータ。
第 １ 口FIG. 1 is a plan view of a device for removing copper from molten solder according to an embodiment of the present invention. FIG. 2 is a main part of the solder circulation tank shown in FIG. 1 in an expanded state.
It is a side view. DESCRIPTION OF SYMBOLS 1... Solder tank, 2... Solder circulation tank, 3, 4... Connection pipe, 5... Pump, 6... Partition wall, 7... Inner peripheral wall, 8... Outer peripheral wall, 9...Bottom wall, 10...Solder passage, 11...Dividing wall, 12...Insulating material, 13...
・Pump storage chamber, 14...Suction port, 15...Discharge port, 16-...Upper wall, 17...Through hole, 18...Partition wall, 19...Lower solder passage, 20...・Shutter, 2
1... Surrounding wall, 22... Vane board, 23... Impeller,
24... Support plate, 25... Motor mounting plate, 26...
- Motor shaft, 27... Drive pulley, 28... Rotating support body, 29... Rotating shaft, 30... Driven pulley,
31...Transmission belt, 32...Bearing, 33...Thermometer, 34-...Copper, M...Torque motor. 1st mouth
Claims (1)
、前記半田循環槽内に前記半田槽の溶融半田を取出すと
共に、前記半田槽に溶融半田を戻す半田循環手段を設け
、前記半田循環槽に溶融半田を冷却する半田冷却手段を
設けたことを特徴とする溶融半田内の銅分除去装置。It consists of a solder tank and a solder circulation tank connected to the solder tank, and a solder circulation means is provided in the solder circulation tank to take out the molten solder from the solder tank and return the molten solder to the solder tank, and the solder circulation An apparatus for removing copper content in molten solder, characterized in that a tank is provided with a solder cooling means for cooling molten solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32519987A JPH01168826A (en) | 1987-12-24 | 1987-12-24 | Method for removing copper component in molten solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32519987A JPH01168826A (en) | 1987-12-24 | 1987-12-24 | Method for removing copper component in molten solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01168826A true JPH01168826A (en) | 1989-07-04 |
Family
ID=18174125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32519987A Pending JPH01168826A (en) | 1987-12-24 | 1987-12-24 | Method for removing copper component in molten solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01168826A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5388756A (en) * | 1993-12-27 | 1995-02-14 | At&T Corp. | Method and apparatus for removing contaminants from solder |
| EP0920947A3 (en) * | 1997-12-04 | 1999-07-21 | Shipley Company LLC | Solder skimmer system |
| WO2008072330A1 (en) * | 2006-12-14 | 2008-06-19 | Nihon Superior Sha Co., Ltd. | Apparatus for precipitation/separation of excess copper in lead-free solder |
| US9228247B2 (en) | 2013-09-11 | 2016-01-05 | Antaya Technologies Corporation | Solder recovery unit |
-
1987
- 1987-12-24 JP JP32519987A patent/JPH01168826A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5388756A (en) * | 1993-12-27 | 1995-02-14 | At&T Corp. | Method and apparatus for removing contaminants from solder |
| EP0920947A3 (en) * | 1997-12-04 | 1999-07-21 | Shipley Company LLC | Solder skimmer system |
| US5948312A (en) * | 1997-12-04 | 1999-09-07 | Shipley Company, L.L.C. | Skimmer system |
| WO2008072330A1 (en) * | 2006-12-14 | 2008-06-19 | Nihon Superior Sha Co., Ltd. | Apparatus for precipitation/separation of excess copper in lead-free solder |
| US8147746B2 (en) | 2006-12-14 | 2012-04-03 | Nihon Superior Sha Co., Ltd. | Apparatus for precipitation/separation of excess copper in lead-free solder |
| JP5030304B2 (en) * | 2006-12-14 | 2012-09-19 | 株式会社日本スペリア社 | Precipitation separator for excess copper in lead-free solder |
| US9228247B2 (en) | 2013-09-11 | 2016-01-05 | Antaya Technologies Corporation | Solder recovery unit |
| US9744611B2 (en) | 2013-09-11 | 2017-08-29 | Antaya Technologies Corporation | Solder recovery unit |
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