JPH01167247A - Method for cutting glass article - Google Patents

Method for cutting glass article

Info

Publication number
JPH01167247A
JPH01167247A JP62327707A JP32770787A JPH01167247A JP H01167247 A JPH01167247 A JP H01167247A JP 62327707 A JP62327707 A JP 62327707A JP 32770787 A JP32770787 A JP 32770787A JP H01167247 A JPH01167247 A JP H01167247A
Authority
JP
Japan
Prior art keywords
glass
cutting
laser beam
cut
glass article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62327707A
Other languages
Japanese (ja)
Inventor
Shinichi Araya
眞一 荒谷
Tadashi Noguchi
正 野口
Keiichi Shiokawa
塩川 慶一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Central Glass Co Ltd
Original Assignee
Central Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Central Glass Co Ltd filed Critical Central Glass Co Ltd
Priority to JP62327707A priority Critical patent/JPH01167247A/en
Publication of JPH01167247A publication Critical patent/JPH01167247A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • C03B33/091Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

PURPOSE:To enable good cutting especially even for glass, changing internal stress of a thick sheet, having poor flatness or varying plate thickness, by providing incidence of laser beams which are heating sources oblique at a specific angle in cutting a glass article utilizing the laser beams under thermal stress. CONSTITUTION:Laser beams are utilized to cut a glass article under thermal stress. In the method, at least one laser beam is provided to cut the glass article under the thermal stress while obliquely irradiating the glass article so as to provide an incidence angle of the laser beam within the range of 45-85 deg. to the glass surface.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、レーザビームを利用して種々の肉厚のガラス
物品、特にこれまで難しい切断をしいられている厚板、
なかでも板厚が10〜12鶴程度より厚い厚板ガラスを
熱応力切断する際極めて有用なガラス物品の切断方法に
関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention utilizes a laser beam to cut glass articles of various thicknesses, particularly thick plates, which have hitherto been difficult to cut.
In particular, the present invention relates to a method for cutting glass articles that is extremely useful when thermal stress cutting thick plate glass having a thickness of about 10 to 12 mm or more.

本発明は、住宅あるいは中高層ビル等の建築用窓ガラス
をはじめ、自動車あるいは鉄道車輌用窓ガラス、船舶用
窓ガラス、さらには各種内装材、家具調度品、調理用品
、電気電子部品用 ・基板、ガラス壜等のガラス物品に
幅広く採用し得るものである。
The present invention is applicable to architectural window glass for houses or mid-to-high-rise buildings, window glass for automobiles or railway vehicles, window glass for ships, and various interior materials, furniture, cooking utensils, electrical and electronic parts, substrates, It can be widely used in glass articles such as glass bottles.

〔従来の技術〕[Conventional technology]

従来、ガラス物品の切断加工には種々の手段が用いられ
、極く通常には、ダイヤモンドもしくは超硬合金製チッ
プでできている尖端によりガラス表面に傷をつけた後、
このクランクを促進させて切断する方法が行われており
、クラックを促進する手段としては例えば、特開昭53
−88817号公報には押え込んでベンディングを起さ
せる機械的方法、特公昭4B−1686号公報には気体
圧を加える方法、特開昭53−28613号公報には高
圧液体ジェットを噴射させて行う方法、さらに特開昭4
8−102815号公報ならびに特開昭54−1497
20号公報にはガスバーナ等で局部的加熱を行う方法等
がそれぞれ開示され用いられており、また熱応力を利用
する切断方法としては、例えば特公昭55−29942
号公報にはガラス板の切断すべき表面において所定の切
断形状をなした電気抵抗線を設置し、次に前記電気抵抗
線に通電して切断すべき表面を加熱して、切断すべき断
面に熱応力を発生せしめ、次にそのガラス板の切断すべ
き何れか一方の端部に水滴を滴下して冷却することによ
りガラス板の端部に局部的クラックを発生させて、つい
で発生するクラックの進展によりガラス板を瞬間的に切
断する方法が開示されており、さらにレーザビームを利
用する方法としては、例えば特公昭46−24989号
公報には局部的の割れを発生するに充分なレーザビーム
を与えて熱衝撃で基板を分離する方法、特開昭54−1
06524号公報には機械的切断工具により基板表面に
溝を入れ溶融、蒸発させない程度のパワーを有するレー
ザビームを照射して機械的な歪みに熱的な歪みを加えて
分割する方法、特開昭57−209838号公報にはレ
ーザ光線をガラス表面に集束させてガラス厚みの一部分
を気化させ、同時に残余の厚さ部分を焼鈍温度以上に加
熱すると共にレーザ焦点部分をガスジェットで除いて溶
断するようにする方法ならびに特開昭60−25113
8号公報にはデイフォーカスしたレーザ光で予備加熱を
行い、次いで微小集光のレーザを照射して溶断する方法
、特開昭59−39734号公報にはガラス管を回転さ
せなからレーザビームを照射して狭い巾で急熱し、この
加熱部に冷却体等の熱的あるいは機械的衝撃を与えて切
断する方法ならびに特開昭49−75623号公報には
ガラス質またはガラス結晶質の体に少なくとも一つのレ
ーザビームを照射することにより切断する方法において
、レーザビームのうちの少なくとも一つはかかるレーザ
ビームのエネルギーの少なくとも10%が前記体に少な
くとも0.2mの深さまで侵入する如き波長または主要
波長を有するようにして切断する方法が開示され、異な
るレーザビームは異なる波長で相対変位を生ぜしめる手
段を用いることが記載されている等が知られている。
Traditionally, various means have been used to cut glass articles, most commonly by scratching the glass surface with a point made of a diamond or cemented carbide tip.
A method of accelerating this crank and cutting it is practiced, and as a means of accelerating cracking, for example, Japanese Patent Application Laid-Open No. 53
-88817 discloses a mechanical method of pressing down to cause bending, Japanese Patent Publication No. 4B-1686 discloses a method of applying gas pressure, and JP-A-53-28613 discloses a method of injecting a high-pressure liquid jet. method, and also JP-A-4
Publication No. 8-102815 and Japanese Unexamined Patent Publication No. 1497-1987
Publication No. 20 discloses and uses a method of locally heating with a gas burner, etc., and a cutting method using thermal stress is disclosed in, for example, Japanese Patent Publication No. 55-29942.
According to the publication, an electric resistance wire having a predetermined cutting shape is installed on the surface of the glass plate to be cut, and then electricity is applied to the electric resistance wire to heat the surface to be cut, so that the cross section to be cut is cut. A thermal stress is generated, and then a drop of water is dropped on one of the edges of the glass plate to be cut, and the glass plate is cooled to generate local cracks at the edge of the glass plate. As progress has been made, methods have been disclosed for instantaneously cutting glass plates, and as for methods that utilize laser beams, for example, Japanese Patent Publication No. 46-24989 discloses a method that uses a laser beam sufficient to cause local cracks. Method of separating substrates by applying thermal shock, JP-A-54-1
Publication No. 06524 discloses a method of cutting grooves on the surface of a substrate using a mechanical cutting tool and applying a thermal strain to the mechanical strain by irradiating the substrate with a laser beam having enough power to prevent melting or evaporation. No. 57-209838 discloses a method in which a laser beam is focused on the glass surface to vaporize a portion of the glass thickness, and at the same time, the remaining thickness is heated to a temperature higher than the annealing temperature, and the laser focal point is removed by a gas jet to be fused. method and JP-A-60-25113
Publication No. 8 discloses a method of preheating with a day-focused laser beam and then irradiating it with a finely focused laser beam for fusing, and Japanese Patent Application Laid-Open No. 59-39734 discloses a method of irradiating a glass tube with a laser beam without rotating it. JP-A-49-75623 discloses a method of rapidly heating a glassy or glass-crystalline body by irradiation and applying a thermal or mechanical shock using a cooling body or the like to the heated part to cut the heated part. In a method of cutting by irradiating one laser beam, at least one of the laser beams has a wavelength or a dominant wavelength such that at least 10% of the energy of such laser beam penetrates the body to a depth of at least 0.2 m. It is known to disclose a method of cutting the material so as to have the same wavelength, and to use means for producing a relative displacement using different laser beams at different wavelengths.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

前述したような従来の特開昭53−88817号公報等
のカッターを用いる切断方法では肉厚の厚い特に10〜
12tm厚以上のものになると切断が難しく、種々の補
助手段を組合せてもガラス表面に切込線を刻設すること
にかわりなく必ずしも確実できれいなギザギザのないま
た凹凸状のカケ、切断計画線ハズレのない切断、切断縁
あるいは切断面を得ることはほとんどできないものであ
り、例えばガラス表裏面に直角な切断面を得ることが難
しいものであり、加えて板厚の変動や応力の不均一にも
敏感に左右されて前記切断不良を生じやすくしかも厚い
小物あるいは板の中央でない場合等では切断が極めて困
難であり、切粉などによるガラス表面のキズ・汚れを発
生しやすいものである。また特公昭55−29942号
公報に記載の方法ではガラス内の応力分布が不均一な場
合等では切断線がその計画線からズレを生じやすいもの
である。さらに特公昭46−24989号公報に記載の
方法では薄い肉厚のものは切断し得ても厚板の切断には
特開昭54−106524号公報に記載のように機械的
切断工具によって溝を表面に入れるかはたまた特開昭5
7−209838号公報ならびに特開昭60−2511
38号公報に記載のようにレーザビームの容量アップを
して時間をかけて溶断することとなり、その切断面は切
断時の溶融物の付着等もあってギザギザになってきわめ
てきたなく場合によっては照射の熱衝撃で予期せぬ方向
に切断されることまた再溶着等があって、厚さ等のファ
クターを総合的に精密にかつ安定的に制御する必要があ
り、厚物の切断にこれらを用いることは極めて難しい方
法である。さらにまた特開昭49−75623号公報に
記載の方法では、所謂結晶化ガラスの結晶の変化を起さ
せないように、一方のものがガラスに非常に強く吸収さ
れ他方のものがガラス内部層へ侵入するようにした二つ
のレーザビームを衝突するガラスリボン上の点が相互に
一致するようにまたは非常に接近するよう照射すること
により、ガラスの厚さの中央部で切断応力を生ぜしめる
ようにしようとするものであるが、応力分布が不均一な
ものでは切断計画線とはズレを生じゃすく切断面等が必
ずしもきれいにならないものである。
The conventional cutting method using a cutter such as that disclosed in JP-A No. 53-88817, as mentioned above, is difficult to cut when the wall thickness is particularly large.
If the thickness is 12 tm or more, it is difficult to cut, and even if various auxiliary means are used in combination, it will not be possible to cut the cut line on the glass surface reliably and neatly without burrs, uneven chips, or missed cutting lines. It is almost impossible to obtain a cut, a cut edge, or a cut surface that is free from scratches, for example, it is difficult to obtain a cut surface that is perpendicular to the front and back surfaces of the glass. It is very sensitive and tends to cause cutting defects as described above, and it is extremely difficult to cut thick small items or when the plate is not in the center, and the glass surface is likely to be scratched or smudged by chips. Furthermore, in the method described in Japanese Patent Publication No. 55-29942, the cutting line tends to deviate from the planned line when the stress distribution within the glass is uneven. Furthermore, although it is possible to cut thin plates using the method described in Japanese Patent Publication No. 46-24989, when cutting thick plates, grooves are cut using a mechanical cutting tool as described in Japanese Patent Publication No. 54-106524. Is it possible to put it on the surface?
Publication No. 7-209838 and JP-A-60-2511
As described in Publication No. 38, the capacity of the laser beam is increased and the cutting process takes time, and the cut surface becomes extremely jagged due to the adhesion of molten material during cutting. Thermal shock of irradiation can cause cutting in unexpected directions, re-welding, etc., and it is necessary to comprehensively control factors such as thickness accurately and stably. This is an extremely difficult method to use. Furthermore, in the method described in Japanese Patent Application Laid-Open No. 49-75623, one substance is very strongly absorbed by the glass and the other substance penetrates into the inner layer of the glass in order to prevent changes in the so-called crystals of crystallized glass. By irradiating the two laser beams so that the points on the glass ribbon they collide with coincide or are very close to each other, a cutting stress is created in the middle of the glass thickness. However, if the stress distribution is uneven, there may be deviations from the cutting plan line, and the cut surface etc. will not necessarily be clean.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は、従来のかかる問題点に鑑みてなしたものであ
って、加熱源であるレーザビームの入射を斜めに特定の
角度をもたせることにより、クラックの先端基における
熱応力の発生量を制御することができ、厚肉物、特に厚
板の内応力が変化するガラスや平面度が悪く板厚が変化
するガラスに対しても良好な切断縁および面を得ること
ができるガラス物品の切断方法を提供するものである。
The present invention has been made in view of the above-mentioned conventional problems, and the amount of thermal stress generated at the tip of a crack is controlled by making the incidence of a laser beam, which is a heating source, obliquely at a specific angle. A method for cutting glass articles that can obtain good cutting edges and surfaces even for thick-walled objects, especially glass whose internal stress changes or whose flatness is poor and whose thickness changes. It provides:

すなわち、本発明はレーザビームを利用してガラス物品
を熱応力切断する方法において、少なくとも一つのレー
ザビームを有し、かつ該レーザビームの入射角度がガラ
ス表面から45〜85度の範囲になるよう斜めに照射し
つつ熱応力切断することを特徴とするガラス物品の切断
方法を提供するものである。
That is, the present invention provides a method for thermally stress cutting a glass article using a laser beam, which includes at least one laser beam, and the incident angle of the laser beam is in the range of 45 to 85 degrees from the glass surface. The present invention provides a method for cutting a glass article, which is characterized in that thermal stress cutting is performed while irradiating obliquely.

ここで、少なくとも一つのレーザビームを有し、その入
射角度がガラス表面から45〜85度の範囲になるよう
斜めに照射するのは、ガラス内の歪量すなわち残留応力
が製造条件によりあるいはその場所によりまた板厚の不
均一等によっても異なっているのをレーザビームの出力
のみによらず調整し均一化して切断計画線のまわりの残
留応力をバランスさせつつ熱応力切断するものであり、
すなわち入射角度をもったレーザビームは原則的に切断
計画線上で切断クラックの前を走行するようにしてガラ
ス内の応力状態のアンバランスをその入射角度、走行速
度あるいはビームの出力等を変えながら補正しながら熱
応力切断を行うものである。また前記走行速度は切断さ
れるガラスの残留応力の大きさによって異なるのである
が、好ましくは0.01〜5.0m/secであり、一
方ガラスの応力分布によっては入射角度を45〜85度
の範囲で切断計画線方向に斜め照射するレーザビームを
切断計画線上に当てつつ切断計画線の直角方向にふって
板厚方向に入射するにしたがって切断計画線からすれる
ようにし、不均一な応力分布を調整しバランスさすこと
もできるものであり、例えば耳付きガラス板において耳
部に平行して切断計画線を設定し熱応力切断する場合計
画線よりズして切断されることが生じやすく、これに対
処するためには、前記ズレの角度分だけ見掛は上の計画
線を中央部側へふって斜めレーザビームを照射してやる
ことも必要であって、これにより、切断計画線通りの熱
応力切断ができるものである。さらに入射角度を45〜
85度の範囲としたのは、45度未満ではガラスの残留
応力に対して鋭敏に反応するのが難しく、85度を超え
ると内層までレーザビームが届きすぎ適切な引張応力を
得ることが難しいためであり、好ましくは60〜80度
である。
Here, the reason for having at least one laser beam and irradiating it obliquely so that the incident angle is in the range of 45 to 85 degrees from the glass surface is because the amount of strain in the glass, that is, the residual stress, depends on the manufacturing conditions or the location. This method not only adjusts and equalizes the differences caused by uneven plate thickness, etc., but also the output of the laser beam, and performs thermal stress cutting while balancing the residual stress around the cutting plan line.
In other words, a laser beam with an incident angle is basically made to travel in front of the cutting crack on the cutting plan line, and the imbalance in the stress state within the glass is corrected by changing the incident angle, traveling speed, beam output, etc. This method performs thermal stress cutting while Further, the traveling speed varies depending on the magnitude of residual stress in the glass to be cut, but is preferably 0.01 to 5.0 m/sec, while the incident angle is set at 45 to 85 degrees depending on the stress distribution of the glass. A laser beam that is irradiated obliquely in the direction of the cutting plan line is irradiated on the cutting plan line, and the laser beam is swung perpendicular to the cutting plan line so that it slips away from the cutting plan line as it enters the plate thickness direction, resulting in non-uniform stress distribution. For example, when cutting a glass plate with ears and setting a cutting plan line parallel to the ears and performing thermal stress cutting, it is likely that the cut will be deviated from the planned line. In order to deal with this, it is necessary to irradiate the laser beam obliquely by moving the apparent upper plan line toward the center by the angle of the deviation, thereby reducing the thermal stress according to the cutting plan line. It can be cut. Furthermore, increase the incident angle to 45~
The reason for choosing the 85 degree range is that if it is less than 45 degrees, it is difficult to react sensitively to the residual stress in the glass, and if it exceeds 85 degrees, the laser beam will reach too far into the inner layer, making it difficult to obtain an appropriate tensile stress. and preferably 60 to 80 degrees.

また熱応力切断するための熱応力の発生は電気抵抗線、
レーザビーム等のばか種々の加熱素子をガラス表面の切
断計画線に沿って表裏両面もしくはいずれか一方の面に
配設し熱エネルギーを与えることにより行うものである
。なお場合によっては切断計画線の近傍にも加熱素子を
配設してもよいことは言うまでもない。
In addition, the generation of thermal stress for thermal stress cutting is an electric resistance wire,
This is done by disposing various heating elements such as laser beams on the front and back surfaces or either surface along the cutting plan line of the glass surface and applying thermal energy to the glass surface. It goes without saying that the heating element may be disposed near the cutting plan line depending on the case.

さらに切断の開始は、ダイヤモンドカッターあるいは冷
たい刃物等の先を接触さす機械的な手段または水滴等に
よる熱的手段を用いて切断計画線上のガラス板の端部等
より行うのがよいものである。
Furthermore, it is preferable to start cutting from the edge of the glass plate on the cutting plan line using a mechanical means such as contacting the tip of a diamond cutter or a cold blade, or a thermal means using water droplets or the like.

さらにまた、ガラス内応力については、例えば鋭敏色板
等通常使用されている方法で知り、これによって前記レ
ーザビームにおける前記の種々の因子を制御するように
すればよりよいものである。
Furthermore, it is better to know the stress in the glass by a commonly used method, such as a sensitive color plate, and use this to control the various factors mentioned above in the laser beam.

〔作用〕[Effect]

前述したように、本発明のガラス物品の切断方法によっ
て、発生させる熱応力の大きさをその場所ごとに自由に
選ぶことができ、ガラス内応力が変化しているガラスあ
るいは板厚等が極端な変化をし平面度が悪いガラス、例
えばフロートガラス製造直後の切断されていない耳部付
きガラスにおいては、熱応力を利用しても良好な切断面
を得ることが難しかったが、ガラスの局所的な残留応力
の変化を補正することができるので、適正な熱応力を付
与することができ、良好な切断面を得ることができるも
のである。
As mentioned above, the method for cutting glass articles of the present invention allows the magnitude of the thermal stress to be generated to be freely selected for each location, and it is possible to freely select the magnitude of the thermal stress to be generated for each location, and it is possible to With glass that changes and has poor flatness, such as glass with ears that have not been cut immediately after float glass manufacture, it is difficult to obtain a good cut surface even by using thermal stress. Since changes in residual stress can be corrected, appropriate thermal stress can be applied and a good cut surface can be obtained.

〔実施例〕〔Example〕

以下、本発明の一実施例について説明する。 An embodiment of the present invention will be described below.

実施例1 大きさ2000X 500 ** ’″、厚さ15mm
の耳付きフロートガラス板の中央部を耳部に平行して切
断するに際し、該切断計画線部分の内応力を光弾性測定
法の一種であるセナルモン法によって測定し、その後1
.8m径のニクロム線を切断計画線の裏側のガラス表面
に接触させ約27Aの電流を40秒間流して加熱した後
、加熱を継続しながらガラス表側面の前記切断計画線部
に約60度の入射角度に傾けたCO2レーザビームをそ
の内応力の大きさに合せて0.01〜5 m / se
cの範囲のなかで照射しながら走行をはじめるが、その
前に前記切断計画線上のレーザビーム照射開始側ガラス
板端面部に照射後約1分間経過して注射針から水滴を落
下させて切断を開始し、そのクラック伝ばが前記レーザ
ビーム照射の後を追従して行くようにして全ガラス板中
の切断を完了させた。
Example 1 Size 2000X 500 ** ''', thickness 15mm
When cutting the central part of the float glass plate with ears in parallel to the ears, the internal stress at the cutting plan line part was measured by the Senarmont method, which is a type of photoelastic measurement method, and then 1.
.. A nichrome wire with a diameter of 8 m is brought into contact with the glass surface on the back side of the cutting plan line, heated by passing a current of about 27 A for 40 seconds, and then heated at an angle of about 60 degrees to the cutting plan line on the front side of the glass while continuing heating. A CO2 laser beam tilted at an angle is adjusted to the magnitude of its internal stress to a speed of 0.01 to 5 m/se.
The laser beam starts traveling while irradiating within the range c, but before that, water droplets are dropped from the syringe needle onto the end surface of the glass plate on the laser beam irradiation start side on the cutting plan line about 1 minute after irradiation, and cutting is performed. The crack propagation started and the crack propagation followed the laser beam irradiation, and the cutting in the entire glass plate was completed.

この結果、耳付きガラス板で耳付き側の周端部において
は板厚ならびに内応力が大きく変化しているにもかかわ
らず、250mmと25011に完全な直線ができ、ツ
ノ等の凹凸ギザギザがなくきれいな良好な切断面を得る
ことができた。
As a result, even though the plate thickness and internal stress vary greatly at the peripheral edge of the lug side of the lug glass plate, a perfect straight line is created between 250mm and 25011, and there are no irregularities such as horns or jagged edges. A clean and good cut surface was obtained.

実施例2 大きさ2000X 450鶴2、厚さ19鶴の耳付きフ
ロートガラス板について、レーザビームの入射角度を約
75度と、 1.8tm径のニクロム線の電流値を約2
.9Aとして約55秒間流したほかは実施例1と同様な
手法で実施した。
Example 2 For a float glass plate with ears of size 2000 x 450 mm and thickness of 19 mm, the incident angle of the laser beam was approximately 75 degrees, and the current value of the nichrome wire with a diameter of 1.8 tm was approximately 2.
.. The same method as in Example 1 was carried out except that the water was flowed at 9A for about 55 seconds.

この結果、200mm (耳側)と 250鶴に実施例
1と同様に良好な切断面で切断することができた。
As a result, it was possible to cut 200 mm (ear side) and 250 mm with good cutting surfaces as in Example 1.

比較例1 実施例1と同様に実施したが、レーザビームの入射角度
のみ約90度としたところ、ギザギザな切縁となる等良
好な切断面を得ることはできなかった。
Comparative Example 1 The same procedure as in Example 1 was carried out, but only the incident angle of the laser beam was set to about 90 degrees. However, it was not possible to obtain a good cut surface, such as a jagged incisal edge.

比較例2 実施例2と同様に実施したが、レーザビームの入射角度
のみ約40度としたところ、切断計画線からスレを生じ
た上、良好な切断面をも得ることができなかった。
Comparative Example 2 The same procedure as in Example 2 was carried out, but only the incident angle of the laser beam was set to about 40 degrees, which caused scratches from the cutting plan line and also made it impossible to obtain a good cut surface.

〔発明の効果〕〔Effect of the invention〕

以上、前述したことから明らかなように本発明によれば
、ガラス物品、特に10〜12tm以上の厚みをもった
ガラス板の切断に関し、従来の方法ではなし得なかった
板厚差のあるあるいは不均一内応力を有する厚板ガラス
、例えば耳付きガラス板においても切断計画線に沿って
予定通り、きれいな切断面で表裏方向における切断面傾
きも防止し得て良好な切断ができるものである。本発明
は板ガラス以外にも電子材料基板、ガラス壜等のガラス
物品の切断にも広(適用できるものである。
As is clear from the above, according to the present invention, glass articles, especially glass plates with a thickness of 10 to 12 tm or more, can be cut with thickness differences or defects that could not be achieved with conventional methods. Even thick glass plates having uniform internal stress, such as glass plates with ears, can be cut neatly along the cutting plan line as planned, with the inclination of the cut plane in the front and back directions prevented. The present invention is widely applicable to cutting glass articles such as electronic material substrates and glass bottles in addition to sheet glass.

Claims (1)

【特許請求の範囲】[Claims] レーザビームを利用してガラス物品を熱応力切断する方
法において、少なくとも1つのレーザビームを有し、か
つ該レーザビームの入射角度がガラス表面から45〜8
5度の範囲になるよう斜めに照射しつつ熱応力切断する
ことを特徴とするガラス物品の切断方法。
A method for thermally stress cutting a glass article using a laser beam, the method comprising at least one laser beam, and the incident angle of the laser beam being 45 to 88 mm from the glass surface.
A method for cutting glass articles characterized by performing thermal stress cutting while irradiating obliquely within a range of 5 degrees.
JP62327707A 1987-12-24 1987-12-24 Method for cutting glass article Pending JPH01167247A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62327707A JPH01167247A (en) 1987-12-24 1987-12-24 Method for cutting glass article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62327707A JPH01167247A (en) 1987-12-24 1987-12-24 Method for cutting glass article

Publications (1)

Publication Number Publication Date
JPH01167247A true JPH01167247A (en) 1989-06-30

Family

ID=18202086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62327707A Pending JPH01167247A (en) 1987-12-24 1987-12-24 Method for cutting glass article

Country Status (1)

Country Link
JP (1) JPH01167247A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008273837A (en) * 1995-06-26 2008-11-13 Corning Inc Method for manufacturing flat glass sheet and method for dividing glass substrate
JP2010090010A (en) * 2008-10-10 2010-04-22 Mitsuboshi Diamond Industrial Co Ltd Method for cutting brittle material substrate and cutting device
JP2012126642A (en) * 1995-06-26 2012-07-05 Corning Inc Method for manufacturing flat glass sheet and method for dividing glass substrate
JP2018537389A (en) * 2015-11-25 2018-12-20 コーニング インコーポレイテッド How to separate a glass web
JP2020117438A (en) * 2008-10-31 2020-08-06 コーニング インコーポレイテッド Method of manufacturing glass sheet

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008273837A (en) * 1995-06-26 2008-11-13 Corning Inc Method for manufacturing flat glass sheet and method for dividing glass substrate
JP2012126642A (en) * 1995-06-26 2012-07-05 Corning Inc Method for manufacturing flat glass sheet and method for dividing glass substrate
JP2010090010A (en) * 2008-10-10 2010-04-22 Mitsuboshi Diamond Industrial Co Ltd Method for cutting brittle material substrate and cutting device
JP2020117438A (en) * 2008-10-31 2020-08-06 コーニング インコーポレイテッド Method of manufacturing glass sheet
JP2018537389A (en) * 2015-11-25 2018-12-20 コーニング インコーポレイテッド How to separate a glass web

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