JPH01165411A - Simple modification of recessed part of mold - Google Patents
Simple modification of recessed part of moldInfo
- Publication number
- JPH01165411A JPH01165411A JP32646487A JP32646487A JPH01165411A JP H01165411 A JPH01165411 A JP H01165411A JP 32646487 A JP32646487 A JP 32646487A JP 32646487 A JP32646487 A JP 32646487A JP H01165411 A JPH01165411 A JP H01165411A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- curing
- silicone resin
- resin
- recesses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012986 modification Methods 0.000 title abstract description 5
- 230000004048 modification Effects 0.000 title abstract description 5
- 229920002050 silicone resin Polymers 0.000 claims abstract description 46
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000002245 particle Substances 0.000 claims abstract description 7
- 239000000843 powder Substances 0.000 claims abstract description 5
- 230000007246 mechanism Effects 0.000 claims abstract description 4
- 238000009833 condensation Methods 0.000 claims abstract 2
- 230000005494 condensation Effects 0.000 claims abstract 2
- 238000000034 method Methods 0.000 claims description 21
- 239000000203 mixture Substances 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 239000003607 modifier Substances 0.000 abstract description 2
- 230000008439 repair process Effects 0.000 description 18
- 239000000463 material Substances 0.000 description 12
- 238000002347 injection Methods 0.000 description 9
- 239000007924 injection Substances 0.000 description 9
- 238000000465 moulding Methods 0.000 description 6
- 238000012937 correction Methods 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000002715 modification method Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004021 metal welding Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、金型凹部の簡易修正方法に関し。[Detailed description of the invention] [Industrial application field] The present invention relates to a simple method for repairing mold recesses.
更に詳しくは、例えば自動車用フロア−マット等の裏面
、あるいは、錐康器具等の表面のように複雑且つ多数の
小突起の形成を必要とする金型の修正に最適な金型凹部
の簡易修正方法に関する。More specifically, it is a simple modification of mold recesses that is ideal for modifying molds that require the formation of complex and numerous small protrusions, such as the back side of automobile floor mats, etc., or the surface of drilling tools, etc. Regarding the method.
［従来の技術および問題点］
従来、金型の補修剤としては、エポキシ四Ｌウレタン樹
脂など各種の熱硬化性樹脂が知られ、又、金属の溶接や
、半田を利用した補修方法などが知られている。[Prior art and problems] Conventionally, various thermosetting resins such as epoxy 4L urethane resin have been known as repair agents for molds, and repair methods using metal welding and solder have also been known. It is being
また、金型の充填、あるいは、修正材料としては、上記
の熱硬化性樹脂や金属材料以外にも、シリコンコーキン
グ材や焼石膏等の無機材料からなる充填剤が周知である
。In addition to the above-mentioned thermosetting resins and metal materials, fillers made of inorganic materials such as silicone caulking materials and calcined gypsum are well known as materials for filling or repairing molds.
これらの補修剤または充填剤を適宜選定することで、堅
固な金型修正が可能であり、半恒久的な修正には有用性
が高いと認められる。By appropriately selecting these repair agents or fillers, it is possible to firmly repair the mold, and it is recognized that it is highly useful for semi-permanent repairs.
しかしながら、上述の樹脂あるいは金属等の全てが、金
型との強固な接合により金型の修正を実現するものであ
り、修正部の除去には、研削、研廣、あるいは、焼却等
の手段を必要とし、その結果、金型の破損や変形、ある
いは、汚点を生じ、元の金型形状を再利用することが非
常に困難か、又は、実質的に復元が不可能になるという
欠点を有するものであった。However, all of the above-mentioned resins, metals, etc. realize modification of the mold through strong bonding with the mold, and means such as grinding, polishing, or incineration are used to remove the modified portion. As a result, the mold may be damaged, deformed, or stained, making it extremely difficult to reuse the original mold shape or making it virtually impossible to restore it. It was something.
また、本発明に利用する常温硬化型シリコン樹脂は、電
ｌＩ！電子部品のポツティングや、注型用の原型等に、
優れた電機的特性やＭ’Ｍ性を利用して使用墾れる周知
の材、Ｆ４であるが、本発明のような金型修正剤として
利用したものは、現在見出せない。In addition, the room temperature curing silicone resin used in the present invention is a type of silicone resin used in the present invention. For potting electronic parts, prototypes for casting, etc.
Although F4 is a well-known material that can be used for its excellent electrical properties and M'M properties, it has not been found to be used as a mold modifier as in the present invention.
その理由は明らかではないが、常温硬化型シリコン樹脂
は本質的にｊＩｌ！ＩＩ性を有し、このために金型に接
合せず、しかも５通常の熱硬化性樹脂に比べて、硬度、
強度とも劣るため、金型修正材料としては、全く考慮さ
れなかつたものと想定される。The reason for this is not clear, but room temperature curing silicone resins are essentially jIl! It has a hardness of
Because of its inferior strength, it is assumed that it was not considered at all as a mold repair material.
従って１本発明は、従来のｉｌｌ修修正用の材料が有す
る前記の欠点を克服し、金型形状の復元、再利用を容易
且つ確実に実現できる修正方法を見出すことを目的とす
る。Accordingly, one object of the present invention is to overcome the above-mentioned drawbacks of conventional ill repair materials and to find a repair method that can easily and reliably realize the restoration and reuse of the mold shape.
〔問題を解決するための手段］
本発明は、硬化前の粘度が１０００乃至１０００００セ
ンチポイズで、硬化後のＪＩＳ硬度が４０乃至９０、引
張強度が少なくとも３０ｋｇ／ｃ＋ｍ”以上である、金
型との離型性を有する常温硬化型シリコン樹脂を、金型
の凹部に充填することを特徴とする金型凹部の簡易修正
方法に関し、更に最適には、常温硬（ＩＳ型シリコン樹
脂 １００重景重量対し、熱伝導性にｔ々れた平均粒径
が５乃至３０ミクロンのアルミナｒ；１（ｋをｌＯ乃至
５０重量部混合したものを金型修正材として利用するこ
とを特徴とする金型凹部の簡易修正方法に関する。[Means for Solving the Problems] The present invention provides a mold that has a viscosity of 1000 to 100000 centipoise before curing, a JIS hardness of 40 to 90 after curing, and a tensile strength of at least 30 kg/c+m''. Regarding a simple method for repairing mold recesses, which is characterized by filling the recesses of a mold with a room-temperature-curing silicone resin having mold releasability, more optimally, room-temperature-hardening (IS type silicone resin 100% weight) , alumina r;1(k) having a thermal conductivity and an average particle size of 5 to 30 microns is mixed with lO to 50 parts by weight, and is used as a mold repair material. Concerning simple correction methods.
［作用］
本発明は、１１々の材料についての検討を重すた結果、
従来においては金型修正と云う用途には全く利用も検討
もされなかった常温硬化型シリコン樹脂を利用すること
で、所望の金型修正が可能で、しかも、金型の復元が極
めて容易且つ確実に達成できることを見出し、完成され
たものである。促って、本発明に利用するシリコン樹脂
は、周知のシリコン樹脂主剤と硬化触媒からなる周知の
常温硬化型シリコン樹脂から任意に選定することが可能
で、特殊なものを全く必要としない。[Function] As a result of careful consideration of 11 materials, the present invention has the following features:
By using room-temperature curing silicone resin, which has never been used or considered for mold repair in the past, it is possible to make the desired mold repair, and the restoration of the mold is extremely easy and reliable. It has been completed by discovering what can be achieved. Therefore, the silicone resin used in the present invention can be arbitrarily selected from well-known room temperature curing silicone resins consisting of a well-known silicone resin main ingredient and a curing catalyst, and does not require any special material.
本発明は常温硬化型シリコン樹脂の利用を特徴とし、該
シリコン樹脂は、金型との離型性に潰れるにもかかわら
ず、硬化収縮が極めて低いために、硬化時の金型凹部へ
の充填性と、金型への優れた密着性を有し、この結果、
金型凹部からシリコン樹脂が自然離脱することが全くな
い、つまり、金型凹部に密着充填されたシリコン樹脂は
、金型とゴムとの界面が完全に一致し、接着のような化
学的な力ではなく、真空吸着伴用、あるいは、金型表面
への投錨作用等のＩｆｌ械的な力により、脱離に対する
充分な低抗力を保持するものと考えられる０例えば、イ
ンジェクション成型に本発明の修正方法を適用した場合
には５シリコン樹脂の有する弾性が有利に作用し、イン
ジェクションの高圧により該ゴムが金型により圧接され
る結果となり、高圧下にもかかわらず金型から１４脱す
ることがなく、また、例えば。The present invention is characterized by the use of a room-temperature curing silicone resin, and even though the silicone resin collapses due to its releasability from the mold, it has extremely low curing shrinkage. It has excellent adhesion to the mold, and as a result,
There is no natural separation of silicone resin from the mold recess.In other words, the silicone resin tightly packed into the mold recess perfectly matches the interface between the mold and the rubber, and is free from chemical forces such as adhesion. Rather, it is thought that a sufficiently low resistance against detachment is maintained by vacuum suction or mechanical force such as anchoring on the mold surface.For example, the modification of the present invention is applied to injection molding. When this method is applied, the elasticity of the silicone resin works advantageously, and the high pressure of injection causes the rubber to be pressed against the mold, so that it does not come out of the mold even under high pressure. , also for example.
彫刻ロールを用いたロール金型に適用した場合にも、圧
力が低く剪断力が大きいという条件下でも、シリコン樹
脂が各種成型用樹脂とのＮ型性あるいは滑性に優れるた
め、金型との密着力が成型時の成型用樹脂との剪断力よ
りも大なるために、金型から離脱することがない。Even when applied to a roll mold using an engraved roll, even under conditions of low pressure and high shearing force, silicone resin has excellent N-type properties or lubricity with various molding resins, so it is difficult to bond with the mold. Since the adhesion force is greater than the shearing force with the molding resin during molding, it will not come off from the mold.
従って、本発明は各種の成型用金型の凹部の修正には幅
広く応用できるものであるが、凸部の修正に利用できる
ものではない。Therefore, although the present invention can be widely applied to correcting concave portions of various molds, it cannot be used to correct convex portions.
また、金型の利用後には、シリコン樹脂が本質的に有す
るｇｔ型性により、物理的に極めて容易に金型から除去
可能であることは言うまでもない。Moreover, it goes without saying that after the mold is used, it can be physically removed from the mold very easily due to the gt-type nature that silicone resin inherently has.
本発明に利用するシリコン樹脂は、上記のよう仁、金型
凹部への優れた充填性、密着による離脱に対する優れた
抵抗力、あるいは。The silicone resin used in the present invention has the above-mentioned properties, excellent ability to fill mold recesses, excellent resistance to detachment due to close contact, or.
金型を損傷しないで原型に復元するための離型性等、１
ｉ１々の優れた作用を有するものであるが、本発明のよ
うに金型の修正材料として最適に利用するためには、限
定された範囲の性質を有するシリコン樹脂を利用するこ
とが必要である。Mold releasability, etc. to restore the original shape without damaging the mold, 1
However, in order to use it optimally as a mold repair material as in the present invention, it is necessary to use a silicone resin that has properties within a limited range. .
その性質を以下に列記するが、まず第一には、硬化前の
液状のシリコンの粘度がｔｏｏｏ乃至ｔｏｏｏｏｏセン
チポイズ、より好適には５０００乃至５ｏｏｏｏセンチ
ポイズであることが望ましい。The properties are listed below, but first of all, it is desirable that the viscosity of the liquid silicone before curing is from too to too many centipoises, more preferably from 5000 to 5000 centipoises.
硬化前の粘度が１０００センチボイス未満の場合は、シ
リコン樹脂の流動性が高過ぎるので。If the viscosity before curing is less than 1000 cmVoice, the fluidity of the silicone resin is too high.
修正すべき金型の凹部が斜面や曲面に存在する場合に、
シリコン樹脂が凹部から流出し、修正が困難となり、ま
た、金型凹部が平面に存在する場合にも、修正部以外へ
の流出を防ぐために、硬化時に厳密なＩＩＦ 置を必要
とし作業性等に劣るので適当ではない、また、硬化前の
シリコン樹脂の粘度が１０００００センチボイスを越え
るような場合は、金型凹部への注入不良や、気泡の残存
、あるいは１表面の凹凸等が生しるため使用することは
困難である。When there are mold recesses to be corrected on slopes or curved surfaces,
Silicone resin flows out from the recesses, making it difficult to repair.Also, even if the mold recesses exist on a flat surface, strict IIF positioning is required during curing to prevent silicone resin from flowing out to areas other than the repaired parts, which affects workability, etc. In addition, if the viscosity of the silicone resin before curing exceeds 100,000 centimeters, it may cause poor injection into the mold cavity, residual air bubbles, or unevenness on the surface. It is difficult to use.
自動車用フロア−マットの裏面や１足踏み健康器具等の
直径が１乃至５−で、高さが２乃至１０ｍ−程度の突起
を形成するための金型凹部を修正するためには、 ５ｏ
ｏｏ乃至 ５００００センチポイズの粘度のシリコン樹
脂が、四部への充填性、金型への密着性、裏面の平滑性
等に優れるため、最も有利と考えられる。In order to modify the recessed part of the mold for forming protrusions with a diameter of 1 to 5 m and a height of 2 to 10 m on the back side of automobile floor mats, single-step health equipment, etc., 5 o.
A silicone resin having a viscosity of 0 to 50,000 centipoise is considered to be the most advantageous because it has excellent filling properties to the four parts, adhesion to the mold, smoothness of the back surface, etc.
第２に必要な特性としては、硬化後のシリ：ｌ ン８４
ｒ＆ノ硬ＫｈＣ，Ｊ Ｔ Ｓｉ！ｌテ４０乃至９０テあ
ることが、金型修正用材料として必要である。硬度が４
０未満の場合には、金型に高圧、あるいは、高剪断力が
かかる場合に、シリコン樹脂が変形を生じ、その結果不
良製品が発生する恐れがあり、また、！！度が９０を越
えるような場合は、弾力性に劣り、金型への密着不良が
生じる場合があるので不適当と考えられる。The second necessary property is silicone after curing: 84
r & no hard KhC, J T Si! It is necessary for the mold repair material to have a strength of 40 to 90 degrees. Hardness is 4
If it is less than 0, the silicone resin may be deformed when high pressure or high shear force is applied to the mold, resulting in defective products. ! If the degree exceeds 90, it is considered unsuitable because the elasticity is poor and poor adhesion to the mold may occur.
第３には、シリコン樹脂の硬化後の引張強度が、少なく
とも３０ｋｇ／ａｓ”以上であることが、主としてシリ
コン樹脂の脱型による金型の好適な再利用のために必要
である。引張強度が、３０ｋｇ／ａ−”未満の場合には
、シリコン樹脂の利用後の金型からの脱型時に、樹脂割
れを生じたり、脱型不良による金型内に破片が残存した
りするために不適当であると共に、修正利用時にも、高
圧等で樹脂の割れや摩耗が生しる恐れがあるので好まし
くない。Thirdly, it is necessary that the tensile strength of the silicone resin after curing be at least 30 kg/as'' or higher, mainly for suitable reuse of the mold by demolding the silicone resin. If the weight is less than 30 kg/a-'', it is unsuitable because the resin may crack when removed from the mold after use, or debris may remain in the mold due to poor removal. In addition, even during repair use, there is a risk that the resin may crack or wear due to high pressure, which is not preferable.
本発明の金型修正方法を更に好適なものとするためには
、平均粒径が５乃至３０ミクロンのアルミナ粉体を、シ
リコン樹脂 １００ｇＬ量部に対し、ｌＯ乃至５０ｉ
ｊｔ部混合することがａ奨される。これらのアルミナｒ
ｌ）体を混合することで、シリコン（］１脂の硬化収縮
が極めて少なくなり、充填密度が向上し、シリコン樹脂
の硬度等の性質もより向上すると共に５更に有利なこと
に、アルミナが有する優れた熱伝導性により、高温での
成型性、あるいは、冷却性等を高めることができる。In order to make the mold repair method of the present invention even more suitable, alumina powder having an average particle size of 5 to 30 microns is added to 100 gL of silicone resin in an amount of 10 to 50 μL.
It is recommended to mix the jt part. These alumina r
l) By mixing the silicone resin, the curing shrinkage of the silicone resin (1) is extremely reduced, the packing density is improved, and the properties such as hardness of the silicone resin are further improved. Due to its excellent thermal conductivity, moldability at high temperatures, cooling performance, etc. can be improved.
これらのアルミナ粉体の、粒径、及び、配合割合は任意
であるが、シリコンＦｊ４ＦＩの注入作業性、粘度、均
−分散性等の観点から、平均粒径が５乃至３０ミクロン
で、シリコン４１１１ｒ：１１００重量部に対して、ｌ
Ｏ乃至５０重承部の配合割合が適当と考えられる。The particle size and blending ratio of these alumina powders are arbitrary, but from the viewpoint of injection workability, viscosity, uniform dispersibility, etc. of silicon Fj4FI, silicon 4111r with an average particle size of 5 to 30 microns is preferred. :1100 parts by weight, l
A blending ratio of 0 to 50 heavy bearing parts is considered appropriate.
前述した通り、本発明に利用する常温硬化型シリコン樹
脂は、シリコンＲＴＶゴムとして周知の材料から任意に
選定できるものであるが、硬化安定性の面から、網台型
の硬化機構を有する樹脂を利用することが望ましく、ま
た、精密な凹部の充填修正には硬化時の線収縮率が０．
５％以下のものを利用することが適当である。As mentioned above, the room-temperature-curing silicone resin used in the present invention can be arbitrarily selected from materials well known as silicone RTV rubber, but from the viewpoint of curing stability, a resin with a net-type curing mechanism is used. It is desirable to use this method, and for precise filling correction of recesses, the linear shrinkage rate at the time of curing is 0.
It is appropriate to use 5% or less.
本発明の修正方法に用いる注型手段も任意に選定できる
が、空気圧を利用した、先端に針状のノズルオリフィス
を有する注射器型の中高粘度液体定量注入装置を利用す
ることが、各種形状の金型の細部にもち密な注入が可能
で、しかも、作業性に優れるため最適と考えられる。Although the casting means used in the correction method of the present invention can be arbitrarily selected, it is preferable to use a syringe-type metered injection device for medium-high viscosity liquids that uses air pressure and has a needle-like nozzle orifice at the tip. It is considered optimal because it allows for dense injection into the details of the mold and has excellent workability.
、 以下、本発明の金型凹部の簡易修正方法につ
いて、実施例に基づきより具体的に説明するが、本発明
はこれらの実施例に限定されるものではない。Hereinafter, the simple method for repairing a mold recess according to the present invention will be described in more detail based on examples, but the present invention is not limited to these examples.
［実施例１］
金型凹部の修正材料として、粘度が８０００セ・ ン
チボイズの常温硬化型シリコン樹脂（信越化学工業（株
）製、品名ｒＫＥ−１１２Ｊ）を用いて、硬化触媒を配
合した後、減圧脱泡を行った。[Example 1] A room-temperature curing silicone resin (manufactured by Shin-Etsu Chemical Co., Ltd., product name rKE-112J) with a viscosity of 8,000 cm was used as a material for repairing mold recesses, and a curing catalyst was added thereto. Degassing was performed under reduced pressure.
修正すべき金型としては、自動車用フロア−マットの成
型に使用する。底辺の径が１−閣、開口部の径が３■■
、高さが５ｍｍの円錐台形の凹部を全面に多数有する平
板状のインジェクション成型金型を利用して試験を実施
した。The mold to be modified is used for molding automobile floor mats. The diameter of the base is 1-kaku, the diameter of the opening is 3■■
The test was conducted using a flat injection mold having many truncated cone-shaped recesses with a height of 5 mm on the entire surface.
前記の脱泡処理を行った修正用のシリコン樹脂を、先端
に内径 ０．５ｍｍのオリフィスを有する空気圧式注入
器に入れ、前記成型金型に所定の自動車の床デザインに
合致するように注入した後、２４時間室温で放置し硬化
せしめた。The above-mentioned defoamed silicone resin for repair was placed in a pneumatic injector having an orifice with an inner diameter of 0.5 mm at the tip, and injected into the mold to match the predetermined car floor design. Thereafter, it was left to stand at room temperature for 24 hours to harden.
硬化後のシリコンゴムの硬度は約６５、別に測定用に作
成した同一組成、同一条件で硬化せしめた試験片の引張
強度は約４５ｋｇ１０ｓ’であった。The hardness of the silicone rubber after curing was approximately 65, and the tensile strength of a test piece prepared separately for measurement with the same composition and cured under the same conditions was approximately 45 kg 10 s'.
この修正された金型をインジェクション装置に設置し、
成型用の樹脂として軟質塩化ビニルを射出成型したとこ
ろ、シリコン樹脂の金型からの離脱は皆無であり、所定
の床形状に適合するように、突起の存在部と非存在部が
形成され１品位の高い自動車用フロア−マットが得られ
た。Install this modified mold into the injection device,
When soft vinyl chloride was injection molded as the molding resin, there was no separation of the silicone resin from the mold, and parts with and without protrusions were formed to fit the predetermined floor shape, resulting in a one-grade product. An automobile floor mat with high heat resistance was obtained.
また、このものを１週間使用した後、元の原型に復元す
るに際し、細手のドライバーや、先端に小さい爪を有す
る取り出し治具で、極めて容易に金型凹部から離型され
、凹部内の残渣も認められなかった。In addition, after using this product for a week, when restoring it to its original shape, it is extremely easy to release the mold from the mold recess using a thin screwdriver or a removal jig with a small claw at the tip. No residue was observed either.
従って、本発明の修正方法は、ＩＦ［ｌの金型で、種々
の形状や大きさの自動車の床に適合するフロア−マット
を、形状変、化せしめて経遅し形成できるものであり、
高価な金型を、極めて有効に利用できる経済性に優れた
修正方法であった。Therefore, the modification method of the present invention allows floor mats that are suitable for automobile floors of various shapes and sizes to be formed over time using an IF [l mold] by changing the shape and changing the shape.
It was an economical modification method that made use of expensive molds extremely effectively.
〔実施例２〕
シリコン樹脂として、粘度が約 ５ｏｏｏｏセンチポイ
ズのシリコン樹脂を用い、所定量の硬化触媒と共に、シ
リコン樹脂 １００！！量部に対し、平均粒径が約１０
ミクロンのアルミナ粉末を３０重量靜配きし、粘度が約
１０００００センチポイズの配合液を作成した。[Example 2] A silicone resin having a viscosity of about 500 centipoise was used as the silicone resin, and a predetermined amount of a curing catalyst was used. ! The average particle size is approximately 10
A liquid mixture having a viscosity of about 100,000 centipoise was prepared by distributing 30 micron alumina powder by weight.
尚、上記配合から形成した硬化後のシリコン樹脂試験片
は、ＪＩＳ硬度が約９０、引張強度が約６５ｋｇ／ａｍ
”であった。The cured silicone resin test piece formed from the above formulation has a JIS hardness of approximately 90 and a tensile strength of approximately 65 kg/am.
"Met.
この配合液を、実施例１と同様に脱泡処理し、オリフィ
ス内径が ０．９−噂で実施例１と同一の注入器を用い
て、半径が約４゛−■の半球状の突起が形成できる凹部
をｉ！続して有する内部冷却可能な金属ロールの凹部に
所定形状に注入し、実施例１と同様に硬化せしめた。This mixed solution was degassed in the same manner as in Example 1, and using the same syringe as in Example 1 with an orifice inner diameter of 0.9, a hemispherical protrusion with a radius of approximately 4゛-■ was formed. i! Subsequently, the mixture was injected into the recesses of an internally coolable metal roll in a predetermined shape, and cured in the same manner as in Example 1.
冷却水が各々通された、該＆属ロールと平滑ロール間を
加圧しながら、溶融したポリオレフィン系樹脂を連続通
過せしめて、成ｆｆｉ凝固せしめたところ、ロールから
シリコン樹脂の離脱は認められず、また、長時間の連ｔ
２運転にも牽耗がなく、シかも、アルミナによる良熱伝
導性のため、修正部の冷却も充分で、成型品の品質は極
めて優秀であった。When the molten polyolefin resin was continuously passed through the molten polyolefin resin while applying pressure between the rolls and the smooth rolls through which cooling water was passed, and the silicone resin was solidified, no separation of the silicone resin from the rolls was observed. Also, long-term continuous
There was no wear and tear during the second run, and due to the good thermal conductivity of alumina, cooling of the repaired parts was sufficient, and the quality of the molded product was extremely excellent.
また、利用後のＮ型性に関しては、実施例１と同様全く
問題がなかった。Furthermore, as in Example 1, there was no problem with N-type properties after use.
［効果］
本発明の修正方法は、以上詳述した通り、従来には全く
想定されなかった確実で、しかも、極めて容易な方法で
あり、その効果について以下列記する。[Effects] As described in detail above, the correction method of the present invention is a reliable and extremely easy method that has not been anticipated in the past, and its effects will be listed below.
まず、第１には、周知のＩｆ ｆｉを用いて、非常に広
々ルな範囲で！１川できるため、インジェクション、ロ
ール２プレス等、金型を利１０“るあらゆる種類の成型
に逍するという汎用性を有する。First of all, using the well-known If fi, in a very wide range! Since it can be used in one process, it has the versatility of being applicable to all types of molding that utilize molds, such as injection and two-roll presses.
しかも、従来においては、員かな寸法通いやデザインの
違いにおいて、その都度金型の新規作成が必要であった
が、本発明の修正方法を用いることで、１ ｆｉ Ｊ、
１１の金型から、多種の成型体を得ることができるため
、非常に高価な金型代の大幅な節約となり、経済効果は
多大なものである。Moreover, in the past, it was necessary to create a new mold each time due to differences in dimensions or design, but by using the modification method of the present invention, 1 fi J,
Since a wide variety of molded bodies can be obtained from 11 molds, the cost of very expensive molds can be greatly reduced, and the economic effect is significant.
しかも、特殊な技１なを全く必要としないため、誰にで
も極めて容易に作業が実施できる優れた作業性を具備し
、しかも、通常のシリコン樹脂は無害であり、修正時に
も溶剤や高熱を全く使用しないため、極めて、安全性の
高い方法である。In addition, it does not require any special skills, so it has excellent workability that anyone can perform the work extremely easily.In addition, ordinary silicone resin is harmless and does not require solvents or high heat when repairing. It is an extremely safe method as it does not require any use.
従って、本発明の金型凹部の閃Ｓ修正方法は、作業性、
経済性、安全性等の全てに優れた全く新規且つ画期的な
修正方法である。Therefore, the method for correcting flash S in mold recesses according to the present invention improves workability,
This is a completely new and innovative repair method that is excellent in terms of economy and safety.
特許出願人 日本バイリーン株式会社Patent applicant Nippon Vilene Co., Ltd.
Claims (3)
ポイズで、硬化後のＪＩＳ硬度が４０乃至９０、引張強
度が少なくとも３０ｋｇ／ｃｍ＾２以上である、金型と
の離型性を有する常温硬化型シリコ ン樹脂を、金型の凹部に充填することを特 徴とする金型凹部の簡易修正方法。(1) Room-temperature curing silicone that has a viscosity before curing of 1,000 to 100,000 centipoise, a JIS hardness of 40 to 90 after curing, and a tensile strength of at least 30 kg/cm^2 or more, and has mold releasability. A simple method for repairing mold recesses, the method comprising filling the mold recesses with resin.
均粒径が５乃至３０ミクロンのアルミナ粉体を１０乃至
５０重量部混合したものを、金型の凹部に充填すること
を特徴とする特 許請求の範囲第１項記載の金型凹部の簡易 修正方法。(2) A patent characterized in that the recesses of the mold are filled with a mixture of 10 to 50 parts by weight of alumina powder with an average particle size of 5 to 30 microns to 100 parts by weight of room-temperature curing silicone resin. A simple method for correcting a mold recess according to claim 1.
化機構であり、硬化時の線収縮率 が０．５％以下である特許請求の範囲第１項記載の金型
凹部の簡易修正方法。(3) A simple method for repairing mold recesses according to claim 1, wherein the curing mechanism of the room temperature curing silicone resin is a condensation type curing mechanism, and the linear shrinkage rate during curing is 0.5% or less. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32646487A JPH01165411A (en) | 1987-12-22 | 1987-12-22 | Simple modification of recessed part of mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32646487A JPH01165411A (en) | 1987-12-22 | 1987-12-22 | Simple modification of recessed part of mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01165411A true JPH01165411A (en) | 1989-06-29 |
Family
ID=18188101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32646487A Pending JPH01165411A (en) | 1987-12-22 | 1987-12-22 | Simple modification of recessed part of mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165411A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1034907A1 (en) * | 1999-03-10 | 2000-09-13 | Le Moule Alimentaire European | Process of molding thermal hardenable products, molds and mold clamp therefor and vulcanisable elastomer composition |
| US9752007B2 (en) | 2012-07-30 | 2017-09-05 | Dow Corning Corporation | Thermally conductive condensation reaction curable polyorganosiloxane composition and methods for the preparation and use of the composition |
-
1987
- 1987-12-22 JP JP32646487A patent/JPH01165411A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1034907A1 (en) * | 1999-03-10 | 2000-09-13 | Le Moule Alimentaire European | Process of molding thermal hardenable products, molds and mold clamp therefor and vulcanisable elastomer composition |
| FR2790700A1 (en) * | 1999-03-10 | 2000-09-15 | Le Moule Alimentaire Europ | PROCESS FOR MOLDING THERMALLY CURED PRODUCTS, VULCANIZABLE ELASTOMER COMPOSITION, MOLDS AND MOLDING CLIP FOR USE THEREOF |
| US9752007B2 (en) | 2012-07-30 | 2017-09-05 | Dow Corning Corporation | Thermally conductive condensation reaction curable polyorganosiloxane composition and methods for the preparation and use of the composition |
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