JPH01165182A - Light emitting diode display device - Google Patents
Light emitting diode display deviceInfo
- Publication number
- JPH01165182A JPH01165182A JP62322718A JP32271887A JPH01165182A JP H01165182 A JPH01165182 A JP H01165182A JP 62322718 A JP62322718 A JP 62322718A JP 32271887 A JP32271887 A JP 32271887A JP H01165182 A JPH01165182 A JP H01165182A
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- windows
- led
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 4
- 238000004040 coloring Methods 0.000 abstract 2
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F27/00—Combined visual and audible advertising or displaying, e.g. for public address
- G09F27/008—Sun shades, shades, hoods or louvres on electronic displays to minimise the effect of direct sun light on the display
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は発光ダイオード（以下ＬＥＤと略称する）の発
光により発光表示を行なう発光ダイオード表示装置（以
下ＬＥＤ表示装置と略称する）に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a light emitting diode display device (hereinafter abbreviated as an LED display device) that performs light emitting display by light emission from a light emitting diode (hereinafter abbreviated as LED). .
［従来の技術］
従来のＬＥＤ表示装置は通常は市販のＬＥＤランプ、例
えば外部リードを接続したＬＥＤの半導体チップを樹脂
からレンズ状に成形したケース中に封入したものを発光
色が異なるものを複数組み合わせてプリント基板上に半
田付けにより実装し、ＬＥＤ表示装置の外装パネルに設
けた発光用の窓のそれぞれに対向して配置して構成され
る。[Prior Art] Conventional LED display devices usually include a plurality of commercially available LED lamps, such as LED semiconductor chips connected to external leads, sealed in a lens-shaped case made of resin, each emitting light of different colors. They are combined and mounted on a printed circuit board by soldering, and arranged to face each of the light emitting windows provided on the exterior panel of the LED display device.
そして発光用の窓により画成される発光面の形状、サイ
ズを任意のものにする場合はＬＥＤランプの発光を前記
の窓に導きその上面が発光面を構成する樹脂からなる言
わゆるＬＥＤレンズがＬＥＤランプと外装パネル間に設
けられる。If the shape and size of the light-emitting surface defined by the light-emitting window is to be arbitrary, a so-called LED lens made of resin that guides the light emitted from the LED lamp to the window and whose upper surface constitutes the light-emitting surface is used. Installed between the LED lamp and the exterior panel.
第４図はこのような従来のＬＥＤ表示装置の一例として
４箇所の発光面を有し、発光面の面積を広くするために
それぞれの発光面に対して２つのＬＥＤランプを設けた
例を示している。Figure 4 shows an example of such a conventional LED display device, which has four light emitting surfaces and two LED lamps are provided for each light emitting surface in order to increase the area of the light emitting surfaces. ing.
第４図において符号１はＬＥＤ表示装置の外装パネルで
あり、樹脂等から構成される装置ル１には発光面を画成
する窓（開口部）ｌａがこの場合４つ並設されている．
外装パネル１の内側面にはフックｌｂ，ｌｂが突設され
ており、このフックｌｂ，ｌｂを介してプリント基板２
が外装パネル１と対向して保持されている。In FIG. 4, reference numeral 1 is an exterior panel of the LED display device, and in this case, four windows (openings) la defining light-emitting surfaces are arranged in the device panel 1 made of resin or the like.
Hooks lb, lb are protruded from the inner surface of the exterior panel 1, and the printed circuit board 2 is connected via these hooks lb, lb.
is held facing the exterior panel 1.
プリント基板２において外装パネル１の窓１ａのそれぞ
れと対向する位置のそれぞれには上述したＬＥＤランブ
７がその外部リード７ａをプリント基板２に半田付けし
て２つづつ４組実装されている。Four sets of two of the above-mentioned LED lamps 7 are mounted on the printed circuit board 2 at positions facing each of the windows 1a of the exterior panel 1, with their external leads 7a soldered to the printed circuit board 2.
さらにＬＥＤランブ７上には上述したＬＥＤレンズ４が
設けられる，ＬＥＤレンズ４は透明な樹脂から全体を一
体成形されており、それぞれ４組のＬＥＤランブ７の発
光を外装パネル１の窓１ａのそれぞれに導き、その上端
面がＬＥＤ表示装置の発光面を構成する４連のレンズ本
体としての凸部４ａを連結した形状に形成されている。Furthermore, the above-mentioned LED lenses 4 are provided on the LED lamps 7. The LED lenses 4 are integrally molded as a whole from transparent resin, and each of the four sets of LED lamps 7 emits light from each of the windows 1a of the exterior panel 1. The upper end surface thereof is formed into a shape in which four convex portions 4a serving as lens bodies constituting the light emitting surface of the LED display device are connected.
そしてＬＥＤレンズ４はその両端の下部に設けられた溶
着部４ｂ，４ｂのそれぞれをプリント基板２に溶着して
プリント基板２上に固定される。凸部４ａのそれぞれは
外装パネル１の窓１ａのそれぞれに嵌合される。The LED lens 4 is fixed on the printed circuit board 2 by welding the welding parts 4b, 4b provided at the lower portions of both ends to the printed circuit board 2, respectively. Each of the protrusions 4a is fitted into each of the windows 1a of the exterior panel 1.
このような構造のもとに表示時には２つづつ４組のＬＥ
Ｄランブ７が選択的に通電されて点灯し、その発光がＬ
ＥＤレンズ４の凸部４ａを介し発光面を構成するその上
端面に導かれ、外部から目視される。Based on this structure, when displaying, four sets of two LEs are displayed.
The D lamp 7 is selectively energized and lights up, and its light emission is L.
The light is guided through the convex portion 4a of the ED lens 4 to its upper end surface constituting a light emitting surface, and is visually observed from the outside.
［発明が解決しようとする問題点］
ところが上述のような従来のＬＥＤ表示装置では以下の
ような多くの問題点があった。[Problems to be Solved by the Invention] However, the conventional LED display device as described above has many problems as described below.
即ちまず隣り合う窓１ａの発光面の間で互いに発光が漏
れることがあり、その場合ＬＥＤ表示装置の使用者は表
示の判別を誤る恐れがある。That is, first of all, the light emitted from the light emitting surfaces of adjacent windows 1a may leak to each other, and in this case, the user of the LED display device may misjudge the display.
また外観上の問題として一箇所の発光面に対して上記の
ように２つあるいはそれ以上のＬＥＤランブ７を使用す
る場合には、１つの発光面内においてＬＥＤランプ間の
境界線８が見えてしまい見苦しい．またこの場合１つの
発光面において各ランプの発色及び光量の微妙な差が出
てしまう。Also, as a problem in appearance, when two or more LED lamps 7 are used on one light emitting surface as described above, the boundary line 8 between the LED lamps is visible within one light emitting surface. It's ugly and unsightly. Furthermore, in this case, there will be subtle differences in the color and light amount of each lamp on one light emitting surface.
次に生産性の問題としてＬＥＤランブフの数が多くしか
も外部リード７ａの強度が弱いためプリント基板２上へ
のＬＥＤランブ７の実装作業は手間がかかり、ＬＥＤラ
ンプの高さ、位置を揃えるのが難しい。モしてＬＥＤラ
ンプの高さを揃えるため第４図に符号９で示すスペーサ
等が必要になり、さらに組み立て工数が多くなり、組み
立てコストが高くついてしまう。Next, as a productivity problem, since there are many LED lamps and the strength of the external leads 7a is weak, mounting the LED lamps 7 on the printed circuit board 2 is time-consuming, and it is difficult to align the height and position of the LED lamps. difficult. Furthermore, in order to align the heights of the LED lamps, a spacer, etc., shown by reference numeral 9 in FIG. 4 is required, which further increases the number of assembly steps and the assembly cost.
なおこれらの問題を解決する方法として２つのＬＥＤラ
ンブを一体化した特殊仕様のランプを使用することも考
えられるが、そのようなランプは高価であるためそれを
用いると製造コストがアップしてしまう。One way to solve these problems is to use a special lamp that integrates two LED lamps, but such a lamp is expensive, so using it will increase manufacturing costs. .
［問題点を解決するための手段］
このような問題点を解決するため本発明による発光ダイ
オード表示装置においては、発光用の窓を複数並設した
外装パネルと、該パネルと対向して設けられ前記複数の
窓と対向する位置のそれぞれに発光ダイオードの半導体
チップが実装されたプリント基板と、該基板と前記外装
パネルの間に設けられ前記半導体チップの発光を前記窓
に導くレンズと、隣り合う前記窓どうしの間の遮光を行
なう遮光壁を備え、該遮光壁は前記外装パネルの内側面
に突設され前記レンズを貫通し前記プリント基板に挿し
込まれるように構成された構造を採用した。[Means for Solving the Problems] In order to solve the above problems, the light emitting diode display device according to the present invention includes an exterior panel in which a plurality of light emitting windows are arranged in parallel, and an exterior panel provided opposite to the panel. A printed circuit board having a semiconductor chip of a light emitting diode mounted thereon at a position facing the plurality of windows, and a lens provided between the circuit board and the exterior panel and guiding light emitted from the semiconductor chip to the window, adjacent to each other. A structure is adopted in which a light-shielding wall is provided for shielding light between the windows, and the light-shielding wall is configured to protrude from the inner surface of the exterior panel, penetrate the lens, and be inserted into the printed circuit board.
［作 用］
このような構造によれば上記の遮光壁を介して隣り合う
窓どうしの遮光が完全に行なわれる。[Function] According to such a structure, light is completely blocked between adjacent windows through the above-mentioned light blocking wall.
また１つの発光面において従来の場合のようにＬＥＤラ
ンプのケースの境界線が目視されるようなことはない。Further, the boundary line of the LED lamp case is not visible on one light emitting surface as in the conventional case.
またプリント基板上への発光ダイオードの半導体チップ
の実装はＩＣ製造技術に用いられるワイヤボンディング
などにより自動釣に行なえる。Further, the semiconductor chip of the light emitting diode can be mounted on the printed circuit board automatically by wire bonding or the like used in IC manufacturing technology.
［実施例］ 以下、図を参照して本発明の実施例の詳細を説明する。[Example] Hereinafter, details of embodiments of the present invention will be described with reference to the drawings.
第１図から第３図は本発明の実施例として４つの発光面
を有するＬＥＤ表示装置の構造を説明するものであり、
第１図はＬＥＤ表示装置全体の側断面を示し、第２図は
プリント基板上の構成を示し、第３図は外装パネルの内
側面を示している。FIGS. 1 to 3 illustrate the structure of an LED display device having four light emitting surfaces as an embodiment of the present invention.
FIG. 1 shows a side cross section of the entire LED display device, FIG. 2 shows the structure on the printed circuit board, and FIG. 3 shows the inner surface of the exterior panel.
但し第３図において第１図中のフックｔｂ、ｔｂは図示
していない。これらの図において先述した従来例の第４
図中と対応する部分には対応する符号が付しである。However, the hooks tb and tb in FIG. 1 are not shown in FIG. 3. In these figures, the fourth example of the conventional example mentioned earlier is shown.
Portions corresponding to those in the figure are given corresponding symbols.
第１図から第３図の構造において先ずＬＥＤ表示装置の
外装パネル１は樹脂から形成され、前述の従来例と同様
にこの場合４つの発光用の窓１ａが並設され、内側面に
はフックｌｂ、ｌｂが突設されている。そしてフックｉ
ｂ、ｔｂを介してプリント基板２が外装パネル１と対向
して保持される。In the structure shown in FIGS. 1 to 3, the exterior panel 1 of the LED display device is first formed of resin, and as in the conventional example described above, four light-emitting windows 1a are arranged in parallel in this case, and hooks are provided on the inside surface. lb and lb are provided protrudingly. and hook i
The printed circuit board 2 is held facing the exterior panel 1 via b and tb.
プリント基板２において外装パネル１の窓１ａのそれぞ
れと対向する位置のそれぞれには従来例のＬＥＤランプ
の代わりにＬＥＤの半導体チップ（以下ＬＥＤチップと
呼ぶ）３がこの場合２つづつ４組実装されている。この
ＬＥＤチップ３はＩＣ製造技術に用いられるワイヤボン
ディングによりプリント基板２上に実装される。また４
組のＬＥＤチップ３のそれぞれは発光色（波長）の異な
るものを使用することにより、異なる機能表示を明確に
行なえる。In this case, four sets of two LED semiconductor chips (hereinafter referred to as LED chips) 3 are mounted on the printed circuit board 2 at positions facing each of the windows 1a of the exterior panel 1, instead of the conventional LED lamps. ing. This LED chip 3 is mounted on the printed circuit board 2 by wire bonding used in IC manufacturing technology. Also 4
By using LED chips 3 of the set that emit light of different colors (wavelengths), different functions can be clearly displayed.
またプリント基板２上でＬＥＤチップ３上にはＡＢＳ樹
脂またはアクリル樹脂等の透明な合成樹脂から成るＬＥ
Ｄレンズ４が設けられる。ＬＥＤレンズ４は４組のＬＥ
Ｄチップ３のそれぞれの発光を外装パネル１の窓１ａの
それぞれに導きその上端面が発光面を構成する４つのレ
ンズ本体部分としての凸部４ａを連結した形状に形成さ
れている。そしてＬＥＤレンズ４は従来例の場合と同様
に両端の下部に設けらねた溶着部４ｂ、４ｂをプリント
基板２に溶着してプリント基板上に固定され、凸部４ａ
のそれぞれは外装パネル１の窓１ａのそれぞれに嵌合さ
れる。Moreover, on the printed circuit board 2, on the LED chip 3, there is an LED made of transparent synthetic resin such as ABS resin or acrylic resin.
A D lens 4 is provided. LED lens 4 has 4 sets of LEDs
The light emitted from each of the D chips 3 is guided to each of the windows 1a of the exterior panel 1, and the upper end surface thereof is formed in a shape in which convex portions 4a as four lens body portions constituting a light emitting surface are connected. As in the case of the conventional example, the LED lens 4 is fixed on the printed circuit board 2 by welding the welded parts 4b provided at the lower part of both ends to the printed circuit board 2, and the convex part 4a
are fitted into each of the windows 1a of the exterior panel 1.
さらに第２図に示すようにプリント基板２上には各ＬＥ
Ｄチップ３の駆動電流を導く電流制限用の抵抗５やコネ
クタ６等が設けられる。Furthermore, as shown in FIG. 2, each LE is placed on the printed circuit board 2.
A current-limiting resistor 5, a connector 6, etc. for guiding the drive current of the D-chip 3 are provided.
ところで本実施例では特に従来と異なる点として隣り合
う発光用の窓１ａどうしの間の遮光を行なう遮光壁ＩＣ
が外装パネル１と一体成形されて同パネル１の内側面に
突設される。そして遮光壁ＩＣは４つの窓１ａの内の中
央の２つの四方を囲むように設けられ、ＬＥＤレンズ４
を貫通しプリント基板２に挿し込まれて隣り合う窓１ａ
どうしの間で外装パネル１の本体部分からプリント基板
２までの間の全領域を隙間なく遮光するように構成され
る。By the way, this embodiment is different from the conventional one in that a light-shielding wall IC is used to shield light between adjacent light-emitting windows 1a.
is integrally molded with the exterior panel 1 and protrudes from the inner surface of the panel 1. The light-shielding wall IC is provided so as to surround the two central sides of the four windows 1a, and the LED lens 4
Adjacent windows 1a are inserted into the printed circuit board 2 through the
The entire area from the main body part of the exterior panel 1 to the printed circuit board 2 is shielded from light without any gap between them.
このためにＬＥＤレンズ４において隣り合う凸部４ａ間
の連結部分には遮光壁ＩＣの隣り合う窓１ａ間の側板１
ｄのそれぞれを貫通させるための穴４Ｃが形成されてい
る。またプリント基板２にも遮光壁ＩＣの側板１ｄのそ
れぞれを挿し込むための穴２ａが形成される。For this purpose, the side plate 1 between the adjacent windows 1a of the light-shielding wall IC is provided at the connecting portion between the adjacent convex portions 4a of the LED lens 4.
A hole 4C is formed to pass through each hole d. Holes 2a are also formed in the printed circuit board 2, into which the side plates 1d of the light shielding wall IC are inserted.
そして遮光壁ＩＣの側板１ｄの高さは外装パネル！の内
側面からプリント基板２の内側面に突出する高さとされ
ており、さらに側板１ｄの両端部にはＬＥＤレンズ４の
下部をまたぐための切り欠き部！ｅが形成されている。And the height of the side plate 1d of the light shielding wall IC is the exterior panel! The side plate 1d has a height that projects from the inner surface to the inner surface of the printed circuit board 2, and the side plate 1d has a notch at both ends to straddle the lower part of the LED lens 4! e is formed.
このような構造の遮光壁ＩＣを介して第１図に示すよう
に隣り合う窓ｌａどうしの間において外装パネル１とプ
リント基板２の間の上から下までの全領域が遮光される
。As shown in FIG. 1, the entire area between the exterior panel 1 and the printed circuit board 2 from top to bottom is shielded from light through the light shielding wall IC having such a structure, as shown in FIG.
このような構造のもとに表示時には２つづつ４組のＬＥ
Ｄチップ３が選択的に通電されて点灯し、その発光がＬ
ＥＤレンズ４の凸部４ａを介して窓１ａの発光面、即ち
各凸部４ａの上端面に導かれ、外部から目視される。Based on this structure, when displaying, four sets of two LEs are displayed.
The D chip 3 is selectively energized and lights up, and its light emission is L.
The light is guided through the convex portion 4a of the ED lens 4 to the light emitting surface of the window 1a, that is, the upper end surface of each convex portion 4a, and is visually observed from the outside.
以上のような本実施例によれば上述のように外装パネル
１の発光面を画成する隣り合う窓１ａどうしの間で外装
パネル１、プリント基板２間の全領域が遮光壁ＩＣを介
して隙間なく遮光されるので、隣り合う窓ｌａどうしの
発光面に互いの発光が漏れることがない。According to this embodiment as described above, the entire area between the exterior panel 1 and the printed circuit board 2 between the adjacent windows 1a that define the light-emitting surface of the exterior panel 1 is connected via the light-shielding wall IC. Since the light is blocked without any gaps, the light emitted from each other does not leak to the light emitting surfaces of adjacent windows la.
また前述の従来の場合のように１つの発光面において、
複数のＬＥＤランプのケースの間の境界線が見えるよう
なこともない。また１つの発光面に対して２つのＬＥＤ
チップ３の発光が従来の場合のようにそれぞれのケース
を介さずにＬＥＤレンズ４のみを介して導かれるので１
つの発光面における発光、発色がより均一に、なり、さ
らに外観が美しく良好になる。Also, as in the conventional case described above, in one light emitting surface,
There are no visible boundaries between the cases of multiple LED lamps. Also, two LEDs per light emitting surface.
1 because the light emitted from the chip 3 is guided only through the LED lens 4 without going through each case as in the conventional case.
The light emission and color development on each light emitting surface becomes more uniform, and the appearance becomes more beautiful and good.
なお上記の実施例のようにプリント基板２に対して遮光
壁１ｃを挿し込まずに当接させるだけではどうしても遮
光壁ＩＣとプリント基板２の間に隙間が生じてしまい、
その隙間を介して隣り合う窓１ａの発光面にＬＥＤチッ
プ３の発光が漏れてしまう。モしてＬＥＤ表示装置を特
に薄暗い部屋で使用した場合にはその漏れた光かはフき
りと目視されてしまう。特に金メツキされたプリント基
板２にＬＥＤチップ３をワイヤボンディングして実装す
るとその金属部分により９プリント基板２の表面が光を
反射し易く、前記のように遮光壁をプリント基板２に当
接して遮光を完全にするためには遮光壁をプリント基板
に接着するか、または遮光壁とプリント基板の隙間にゴ
ムやスポンジなどの弾性体を入れるなど他の手段を追加
しなければならない。これでは組み立て工数が増えたり
部品点数が増したりしてその分コストが高くついてしま
う。Note that if the light shielding wall 1c is simply brought into contact with the printed circuit board 2 without inserting it as in the above embodiment, a gap will inevitably be created between the light shielding wall IC and the printed circuit board 2.
The light emitted from the LED chip 3 leaks through the gap to the light emitting surface of the adjacent window 1a. However, if the LED display device is used in a particularly dimly lit room, the leaked light will be clearly visible. In particular, when the LED chip 3 is mounted on a gold-plated printed circuit board 2 by wire bonding, the surface of the printed circuit board 2 tends to reflect light due to the metal part. In order to completely block light, it is necessary to glue the light-shielding wall to the printed circuit board, or add other means such as inserting an elastic material such as rubber or sponge into the gap between the light-shielding wall and the printed circuit board. This increases the number of assembly steps and the number of parts, leading to higher costs.
これに対して本実施例では上述のように遮光壁ＩＣをプ
リント基板２に挿し込むこと゛により安価に実施で籾る
構造により遮光を完全に行なえる。In contrast, in this embodiment, by inserting the light shielding wall IC into the printed circuit board 2 as described above, complete light shielding can be achieved with a structure that can be implemented at low cost.
また本実施例ではＬＥＤチップ３のプリント基板２に対
する実装は前述のようにワイヤボンディングにより自動
的な工程で安価に行なえる。そして従来必要としていた
スペーサなども不要になり、全体として部品点数が少な
く簡単な工程で組み立てられ、製造コストを低減するこ
とができる。Furthermore, in this embodiment, the LED chip 3 can be mounted on the printed circuit board 2 automatically and inexpensively by wire bonding as described above. Furthermore, spacers and the like that were required in the past are no longer necessary, and the overall number of parts is small and assembly can be performed in a simple process, reducing manufacturing costs.
なお本実施例では１つの発光面に対して２つのＬＥＤチ
ップ３を使用したが、使用個数はもちろん２個に限られ
るものではなく、発光面の面積や形状等に対応して適当
な数を選択するとともにその配置を選択することにより
所望の発光面の明るさ均一さを得ることができる。また
発光面の数も４つに限らないことも勿論である。In this embodiment, two LED chips 3 are used for one light emitting surface, but the number of LED chips 3 used is of course not limited to two, and may be an appropriate number depending on the area and shape of the light emitting surface. By selecting and arranging them, it is possible to obtain the desired uniform brightness of the light emitting surface. Moreover, it goes without saying that the number of light emitting surfaces is not limited to four.
またＬＥＤレンズ４は完全に透明に構成すると発光時に
ＬＥＤチップ３自体の輝度が高くて見る角度によっては
発光面の明るさが変わってしまうことがある。これに対
してＬＥＤレンズ４の樹脂に拡散材料を混入してＬＥＤ
レンズ４を半透明に構成すれば、その発光面全体がより
均一に発光、発色し、さらに外観が美しく良好になる。Furthermore, if the LED lens 4 is configured to be completely transparent, the brightness of the LED chip 3 itself will be high when emitting light, and the brightness of the light emitting surface may change depending on the viewing angle. In contrast, by mixing a diffusion material into the resin of the LED lens 4, the LED
If the lens 4 is made semitransparent, the entire light emitting surface will emit light and color more uniformly, and the appearance will be more beautiful and good.
［発明の効果］
以上の説明から明らかなように本発明による発光ダイオ
ード表示装置においては、発光用の窓を複数並設した外
装パネルと、該パネルと対向して設けられ前記複数の窓
と対向する位置のそれぞれに発光ダイオードの半導体チ
ップが実装されたプリント基板と、該基板と前記外装パ
ネルの間に設けられ前記半導体チップの発光を前記窓に
導くレンズと、隣り合う前記窓どうしの間の遮光を行な
う遮光壁を備え、該遮光壁は前記外装パネルの内側面に
突設され前記レンズを貫通し前記プリント基板に挿し込
まれるように構成された構造を採用したので、隣り合う
発光用の窓の発光面への光漏れがなく、発光面の発光、
発色が均一で美しい良好な外観が得られ、また構造が簡
単で部品点数が少なく簡単な工程で組み立てられ、製造
コストを低減できるなどの優れた効果がある。[Effects of the Invention] As is clear from the above description, the light emitting diode display device according to the present invention includes an exterior panel in which a plurality of windows for light emission are arranged side by side, and an exterior panel provided opposite to the panel and facing the plurality of windows. a printed circuit board on which a semiconductor chip of a light emitting diode is mounted at each position; a lens provided between the board and the exterior panel to guide the light emitted from the semiconductor chip to the window; and a lens between the adjacent windows. A light-shielding wall for blocking light is provided, and the light-shielding wall is constructed so as to protrude from the inner surface of the exterior panel, penetrate the lens, and be inserted into the printed circuit board. There is no light leakage to the light emitting surface of the window, and the light emitting surface emits light.
It has excellent effects such as uniform color development, a beautiful and good appearance, a simple structure, a small number of parts, and a simple assembly process, which reduces manufacturing costs.
第１図は本発明の実施例によるＬＥＤ表示装置の構造を
示す側断面図、第２図は第１図中のプリント基板上の構
成を示す斜視図、第３図は第１図中の外装パネルの内側
面を示す斜視図、第４図は従来のＬＥＤ表示装置の構造
を示す側断面図である。
１・・・外装パネル ＩＣ・・・遮光壁２・・・プ
リント基板 ３・・・ＬＥＤチップ４・・・ＬＥＤレ
ンズ ５・・・抵抗６・・・コネクタFIG. 1 is a side cross-sectional view showing the structure of an LED display device according to an embodiment of the present invention, FIG. 2 is a perspective view showing the structure on the printed circuit board in FIG. 1, and FIG. 3 is the exterior in FIG. 1. FIG. 4 is a perspective view showing the inner surface of the panel, and a side sectional view showing the structure of a conventional LED display device. 1... Exterior panel IC... Light shielding wall 2... Printed circuit board 3... LED chip 4... LED lens 5... Resistor 6... Connector
Claims (1)
と対向して設けられ前記複数の窓と対向する位置のそれ
ぞれに発光ダイオードの半導体チップが実装されたプリ
ント基板と、 該基板と前記外装パネルの間に設けられ前記半導体チッ
プの発光を前記窓に導くレンズと、隣り合う前記窓どう
しの間の遮光を行なう遮光壁を備え、 該遮光壁は前記外装パネルの内側面に突設され前記レン
ズを貫通し前記プリント基板に挿し込まれるように構成
されたことを特徴とする発光ダイオード表示装置。 ２）前記遮光壁は前記外装パネルと一体に構成されたこ
とを特徴とする特許請求の範囲第１項に記載の発光ダイ
オード表示装置。[Scope of Claims] 1) An exterior panel with a plurality of light-emitting windows arranged side by side, and a print that is provided facing the panel and has semiconductor chips of light-emitting diodes mounted on each of the positions facing the plurality of windows. a substrate; a lens provided between the substrate and the exterior panel that guides light emitted from the semiconductor chip to the window; and a light-shielding wall that blocks light between adjacent windows, the light-shielding wall being connected to the exterior panel. 1. A light emitting diode display device, characterized in that the light emitting diode display device is configured to protrude from an inner surface of the display device, penetrate the lens, and be inserted into the printed circuit board. 2) The light emitting diode display device according to claim 1, wherein the light-shielding wall is constructed integrally with the exterior panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62322718A JP2524372B2 (en) | 1987-12-22 | 1987-12-22 | Light emitting diode display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62322718A JP2524372B2 (en) | 1987-12-22 | 1987-12-22 | Light emitting diode display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01165182A true JPH01165182A (en) | 1989-06-29 |
| JP2524372B2 JP2524372B2 (en) | 1996-08-14 |
Family
ID=18146848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62322718A Expired - Fee Related JP2524372B2 (en) | 1987-12-22 | 1987-12-22 | Light emitting diode display |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2524372B2 (en) |
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| JP2008071919A (en) * | 2006-09-14 | 2008-03-27 | Sharp Corp | Light leakage preventive structure of led and display unit |
| JP2008096745A (en) * | 2006-10-12 | 2008-04-24 | Pioneer Electronic Corp | Lens group having several light guide lenses connected |
| JP2008532300A (en) * | 2005-02-28 | 2008-08-14 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Lighting device |
| CN101645221A (en) * | 2009-08-12 | 2010-02-10 | 苏州市春和电器有限公司 | Display module with induction buttons |
| US7926987B2 (en) | 2007-02-08 | 2011-04-19 | Fujitsu Limited | Electronic apparatus with light emitting diode |
| CN103354068A (en) * | 2013-07-02 | 2013-10-16 | 王鹏 | Method for manufacturing LED displayer and LED displayer |
| CN104952372A (en) * | 2014-03-28 | 2015-09-30 | 聚积科技股份有限公司 | Display structure |
| CN107152614A (en) * | 2017-07-06 | 2017-09-12 | 山东中微光电子有限公司 | A kind of LED area light source |
| WO2017198492A1 (en) * | 2016-05-17 | 2017-11-23 | Osram Opto Semiconductors Gmbh | Module for a video wall |
| US9829178B2 (en) | 2010-11-29 | 2017-11-28 | Rtc Industries, Inc. | LED lighting assembly and method of lighting for a merchandise display |
| WO2020213556A1 (en) * | 2019-04-15 | 2020-10-22 | 日本精機株式会社 | Waterproof mechanism and electronic apparatus |
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-
1987
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|---|---|---|---|---|
| JP2008532300A (en) * | 2005-02-28 | 2008-08-14 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Lighting device |
| JP2013070082A (en) * | 2005-02-28 | 2013-04-18 | Osram Opto Semiconductors Gmbh | Illumination device |
| US8525206B2 (en) | 2005-02-28 | 2013-09-03 | Osram Opto Semiconductor Gmbh | Illumination device |
| JP2008071919A (en) * | 2006-09-14 | 2008-03-27 | Sharp Corp | Light leakage preventive structure of led and display unit |
| JP2008096745A (en) * | 2006-10-12 | 2008-04-24 | Pioneer Electronic Corp | Lens group having several light guide lenses connected |
| US7926987B2 (en) | 2007-02-08 | 2011-04-19 | Fujitsu Limited | Electronic apparatus with light emitting diode |
| CN101645221A (en) * | 2009-08-12 | 2010-02-10 | 苏州市春和电器有限公司 | Display module with induction buttons |
| US11274808B2 (en) | 2010-06-17 | 2022-03-15 | Rtc Industries, Inc. | LED lighting assembly and method of lighting for a merchandise display |
| US10619824B2 (en) | 2010-06-17 | 2020-04-14 | Rtc Industries, Inc. | LED lighting assembly and method of lighting for a merchandise display |
| US9829178B2 (en) | 2010-11-29 | 2017-11-28 | Rtc Industries, Inc. | LED lighting assembly and method of lighting for a merchandise display |
| CN103354068A (en) * | 2013-07-02 | 2013-10-16 | 王鹏 | Method for manufacturing LED displayer and LED displayer |
| CN104952372A (en) * | 2014-03-28 | 2015-09-30 | 聚积科技股份有限公司 | Display structure |
| US10607969B2 (en) | 2016-05-17 | 2020-03-31 | Osram Oled Gmbh | Module for a video wall with retaining pins |
| WO2017198492A1 (en) * | 2016-05-17 | 2017-11-23 | Osram Opto Semiconductors Gmbh | Module for a video wall |
| CN107152614A (en) * | 2017-07-06 | 2017-09-12 | 山东中微光电子有限公司 | A kind of LED area light source |
| WO2020213556A1 (en) * | 2019-04-15 | 2020-10-22 | 日本精機株式会社 | Waterproof mechanism and electronic apparatus |
| JPWO2020213556A1 (en) * | 2019-04-15 | 2020-10-22 |
Also Published As
| Publication number | Publication date |
|---|---|
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