JPH01164093A - Drawing apparatus - Google Patents

Drawing apparatus

Info

Publication number
JPH01164093A
JPH01164093A JP32312587A JP32312587A JPH01164093A JP H01164093 A JPH01164093 A JP H01164093A JP 32312587 A JP32312587 A JP 32312587A JP 32312587 A JP32312587 A JP 32312587A JP H01164093 A JPH01164093 A JP H01164093A
Authority
JP
Japan
Prior art keywords
nozzle
paste
driving source
controlled
piezoelectric actuator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP32312587A
Other languages
Japanese (ja)
Other versions
JP2553602B2 (en
Inventor
Nobuhiko Muraoka
信彦 村岡
Kurahei Tanaka
田中　倉平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP32312587A priority Critical patent/JP2553602B2/en
Publication of JPH01164093A publication Critical patent/JPH01164093A/en
Application granted granted Critical
Publication of JP2553602B2 publication Critical patent/JP2553602B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To execute a vibration-free high-speed scanning drawing operation by a method wherein a nozzle used to discharge a paste is vibrated in a direction nearly perpendicular to an advance direction for the drawing operation by using a driving source which is independent of a driving source used to move the nozzle. CONSTITUTION:While a holder 11 holding a nozzle 6 is moved in a (+) direction of Y, the nozzle 6 is vibrated in a direction perpendicular to its advance direction by using a piezoelectric actuator 9 as a driving source used to vibrate the nozzle. When a robot equipped wits the holder 11 is moved only in the (+) direction of Y, a resistor 16 with a drawing width W can be drawn. When a voltage E<v> to be impressed on the piezoelectric actuator is controlled on the basis of a data, an amplitude of the nozzle 6 is controlled and the drawing width W is controlled arbitrarily.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、厚膜回路を形成するための吐出式の描画装置
に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a discharge type drawing apparatus for forming thick film circuits.

従来の技術 従来の描画装置の一例を第３図に示す。図において１は
内部にペーストを有するタンク、２はタンクと一体にな
ってペーストを吐出するノズル、３は基板、４は基板３
上に形成された導体パターンの一部、６は導体間に形成
される抵抗体であり、吐出されたペーストにより描かれ
る。2. Description of the Related Art An example of a conventional drawing apparatus is shown in FIG. In the figure, 1 is a tank with paste inside, 2 is a nozzle that is integrated with the tank and discharges the paste, 3 is a substrate, and 4 is a substrate 3
A part of the conductor pattern formed above, 6, is a resistor formed between the conductors, and is drawn by the discharged paste.

−例として、いま＠Ｗの抵抗体をランド間キョリＬの部
分に形成するとき、タンク１と一体になったノズル２（
以下ノズル２とだけ記す）はＸおよびＹ方向に移動する
ことができるようＸ−Ｙ直交ロボットに取りついている
ものとすると、ノズル２はＸ方向にＷの振幅で動作しな
がら（以下スキャン動作という）、Ｙの方向に（Ｌ＋２
ａ）だけ進む。これによシランドロおよび７の間に幅が
Ｗの抵抗体が描かれる。振幅であるところのＸ方向の動
作幅Ｗを任意に変えることにより種々の寸法の抵抗体を
形成する。- As an example, when forming the resistor @W in the part of the hole L between the lands, the nozzle 2 integrated with the tank 1 (
Assuming that nozzle 2 (hereinafter referred to simply as nozzle 2) is attached to an X-Y orthogonal robot so that it can move in the X and Y directions, nozzle 2 moves in the X direction with an amplitude of W (hereinafter referred to as scan operation). ), in the Y direction (L+2
Proceed by a). This draws a resistor with a width of W between Silandro and 7. By arbitrarily changing the operating width W in the X direction, which is the amplitude, resistors of various sizes can be formed.

発明が解決しようとする問題点 上記従来の装置では当然のことながらスキャン動作のた
めノズル２の移動キョリが長くなる。このため描画時間
が長くかかり生産性が著しく低い。Problems to be Solved by the Invention In the conventional apparatus described above, it goes without saying that the movement of the nozzle 2 is long due to the scanning operation. For this reason, drawing time is long and productivity is extremely low.

また生産性を向上させる為、ノズル２の移動速度を速く
すれば方向反転時の精度が確保されない、あるいは動作
時の振動が悪影響をおよぼし、抵抗値精度が悪くなる。Furthermore, in order to improve productivity, if the moving speed of the nozzle 2 is increased, the accuracy at the time of direction reversal may not be ensured, or vibrations during operation may have an adverse effect, resulting in poor resistance value accuracy.

また、描画動作がすべてＸ−Ｙの直交ロボットの動作と
なるため、動作プログラムが複雑化するという問題があ
った。Furthermore, since all drawing operations are performed by an XY orthogonal robot, there is a problem in that the operation program becomes complicated.

本発明は上記の点に鑑み、振動の無い高速ヌキャン描画
ができるようにした描画装置を提供するものである。In view of the above points, the present invention provides a drawing device that is capable of high-speed drawing without vibration.

問題点を解決するための手段 そこで本発明は、ペーストを吐出するノズルを、このノ
ズルの移動のための駆動源とは別の駆動源により、描画
のための進行方向に対して略直角方向に振動せしめる構
成としたものである。Means for Solving the Problems Therefore, the present invention moves the nozzle for discharging paste in a direction substantially perpendicular to the direction of movement for drawing using a drive source different from the drive source for moving the nozzle. It is configured to vibrate.

作　　用 本発明は、上記構成によりノズルの描画のための進行方
向に対して、直角方向に振動し、その振幅を任意に制御
することにより、描画幅を任意に変えることができる。Function: According to the present invention, the nozzle vibrates in a direction perpendicular to the drawing direction of the nozzle with the above configuration, and by arbitrarily controlling the amplitude, the drawing width can be arbitrarily changed.

実施例 以下、本発明の実施について説明する。第１図および第
２図において８はペーストを吐出するノズル、９はノズ
ル８を任意の振幅で高速に振動させるだめの駆動部、１
ｏはノズル８を描画のための進行方向に対して直角に振
動させるためのガイドロッド、１１はこれら８，９．１
０のノズル振動系を保持するホルダーであり、このホル
ダー１１が直交ロボットにとりつけられ、描画位置の移
動およびノズル８の描画のための移動をする。１２は基
板、１３は基板１２上に形成された導体パターンの一部
、１４および１６は導体パターンの一部であり電極とな
るランドである。EXAMPLES The implementation of the present invention will be described below. In FIGS. 1 and 2, 8 is a nozzle that discharges paste, 9 is a drive unit that vibrates the nozzle 8 at high speed with an arbitrary amplitude, and 1
o is a guide rod for vibrating the nozzle 8 perpendicular to the direction of movement for drawing, 11 is these 8, 9.1
This holder 11 is attached to an orthogonal robot to move the drawing position and move the nozzle 8 for drawing. 12 is a substrate, 13 is a part of a conductive pattern formed on the substrate 12, and 14 and 16 are lands which are part of the conductive pattern and serve as electrodes.

基板１２が固定されている。ノズル８を保持したホルダ
ー１１がＹの（＋）方向へ移動しつつ同時にノズル８は
ノズルを振動させる駆動源であるところの圧電アクチュ
エータ９によシ進行方向に対して直角方向に振動させら
れる。これによりホルダ　′−１１がとりつけられてい
るロボットはＹの（＋）方向への移動のみで、描画幅Ｗ
の抵抗体１６が描かれる。本実施例においてはノズル８
を振動させる駆動源９には圧電アクチュエータを用いて
いるが、この部分の詳細図を第２図に示す。この圧電ア
クチュエータに印加する電圧Ｅ　をデータにより制御す
ることによりノズル８の振幅を制御し、描画幅Ｗを任意
に制御する。A substrate 12 is fixed. While the holder 11 holding the nozzle 8 moves in the (+) direction of Y, the nozzle 8 is simultaneously vibrated in a direction perpendicular to the direction of movement by a piezoelectric actuator 9 which is a driving source for vibrating the nozzle. As a result, the robot to which holder '-11 is attached can only move in the (+) direction of Y, and the drawing width W
A resistor 16 is drawn. In this embodiment, nozzle 8
A piezoelectric actuator is used as the drive source 9 that vibrates, and a detailed view of this part is shown in FIG. By controlling the voltage E applied to this piezoelectric actuator using data, the amplitude of the nozzle 8 is controlled, and the drawing width W is arbitrarily controlled.

なお、上記実施例では描画位置の移動はＸＹの直交ロボ
ットとしたが、多関節系のロボット等でもよい。またノ
ズル８の振動系９に圧電アクチュエータを用いたが、精
密小型ボールネジとモータによるもののように振動をさ
せることができ、かつ振幅を任意に制御できるものであ
ればなんでもよい。In the above embodiment, an XY orthogonal robot is used to move the drawing position, but a multi-jointed robot or the like may be used. Furthermore, although a piezoelectric actuator is used for the vibration system 9 of the nozzle 8, any type of actuator may be used as long as it can vibrate and control the amplitude arbitrarily, such as one using a small precision ball screw and a motor.

発明の効果 以上のように、本発明によれば、振動等の悪影響を受け
ずに高速で任意の幅の描画が容易に実現できる。Effects of the Invention As described above, according to the present invention, drawing of an arbitrary width can be easily realized at high speed without being affected by adverse effects such as vibration.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例における描画装置の斜視図、
第２図は同一部の部分詳細平面図、第３図は従来の描画
装置の斜視図である。 １・・・・・・タンク、２，８・・・・・・ノズル、３
．１２・・・・・・基板、８，７，１４．１６・・・・
・・導体のランド。FIG. 1 is a perspective view of a drawing device in an embodiment of the present invention;
FIG. 2 is a partial detailed plan view of the same part, and FIG. 3 is a perspective view of the conventional drawing device. 1... Tank, 2, 8... Nozzle, 3
．． 12... Board, 8, 7, 14. 16...
...Conductor land.

Claims (3)

【特許請求の範囲】[Claims] （１）内部にペースト状の材料を有したタンクと、この
タンク先端にあってペースト吐出口を有するノズルと、
このノズルよりペースト状の材料を吐出する手段と、前
記ノズルを任意に移動させる手段とを有し、任意の位置
において描画動作をする際、前記ノズルを描画方向に相
対的に移動させる手段と、この描画方向に対して直角方
向に該ノズルを振動させる手段とを有し、この振動の振
幅を任意に制御可能なよう構成したことを特徴とする描
画装置。(1) A tank having a paste-like material inside, a nozzle having a paste discharge port at the tip of the tank,
means for discharging a paste-like material from the nozzle, and means for arbitrarily moving the nozzle, and means for relatively moving the nozzle in the drawing direction when performing a drawing operation at an arbitrary position; A drawing device comprising means for vibrating the nozzle in a direction perpendicular to the drawing direction, and configured such that the amplitude of the vibration can be arbitrarily controlled. （２）ノズルを基板の任意の位置に移動する手段と、描
画方向に前記ノズルを移動する手段とが同一である特許
請求の範囲第１項記載の描画装置。(2) The drawing apparatus according to claim 1, wherein the means for moving the nozzle to an arbitrary position on the substrate and the means for moving the nozzle in the drawing direction are the same. （３）内部にペーストを有するタンクと、ペースト吐出
口を有するッズルが一体となっている特許請求の範囲第
１項記載の描画装置。(3) The drawing apparatus according to claim 1, wherein a tank containing paste therein and a zzzzle having a paste discharge port are integrated.
JP32312587A 1987-12-21 1987-12-21 Drawing equipment Expired - Lifetime JP2553602B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32312587A JP2553602B2 (en) 1987-12-21 1987-12-21 Drawing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32312587A JP2553602B2 (en) 1987-12-21 1987-12-21 Drawing equipment

Publications (2)

Publication Number Publication Date
JPH01164093A true JPH01164093A (en) 1989-06-28
JP2553602B2 JP2553602B2 (en) 1996-11-13

Family

ID=18151364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32312587A Expired - Lifetime JP2553602B2 (en) 1987-12-21 1987-12-21 Drawing equipment

Country Status (1)

Country Link
JP (1) JP2553602B2 (en)

Also Published As

Publication number Publication date
JP2553602B2 (en) 1996-11-13

Similar Documents

Publication Publication Date Title
KR100514991B1 (en) A vibration cutting machine
JPH01164093A (en) Drawing apparatus
JP2930378B2 (en) Electronic component mounting equipment
JP2004089762A (en) Apparatus and method for applying liquid material
JP2668537B2 (en) Resist processing apparatus and resist processing method
JP7224000B2 (en) LIQUID MATERIAL SUPPLY DEVICE AND LIQUID MATERIAL SUPPLY METHOD
JP2002001617A (en) Electrical discharge machining method and electrical discharging machining apparatus
TWI760131B (en) Pattern forming apparatus, pattern forming method, and discharge data generating method
JP2639686B2 (en) Vibrating parts alignment device
JPS62114828A (en) Wire-cut electro-discharge machining and device thereof
JP2002033340A (en) Device and method for applying bonding paste
JPH1170792A (en) Marking apparatus
JP2800682B2 (en) Resin coating device and application method for slit TAB tape
JPH04111490A (en) Direct drawer
JP2001102794A5 (en)
JPH05262A (en) Adhesive applicator
JP2598662B2 (en) Vibration tilting device and component alignment device
JPH0446695B2 (en)
JPH0894780A (en) X-y-theta fine movement stage
JP4136784B2 (en) Processing method and processing apparatus
KR0135466B1 (en) Component Recognition Method of Electronic Component Mounter
JP2001024396A (en) Component mounting equipment and method
JPH03295698A (en) Printing device
JP2005118647A (en) Method of forming fine pattern and apparatus for the same
JP2001285002A (en) Frequency-adjustsing method for electronic component