JPH01156494A - Method and device for electroplating - Google Patents
Method and device for electroplatingInfo
- Publication number
- JPH01156494A JPH01156494A JP31513487A JP31513487A JPH01156494A JP H01156494 A JPH01156494 A JP H01156494A JP 31513487 A JP31513487 A JP 31513487A JP 31513487 A JP31513487 A JP 31513487A JP H01156494 A JPH01156494 A JP H01156494A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- electrode
- metal strip
- tank
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 22
- 238000009713 electroplating Methods 0.000 title claims description 10
- 238000007747 plating Methods 0.000 claims abstract description 88
- 229910052751 metal Inorganic materials 0.000 claims description 38
- 239000002184 metal Substances 0.000 claims description 38
- 238000003756 stirring Methods 0.000 claims description 31
- 238000004070 electrodeposition Methods 0.000 abstract description 5
- 101700004678 SLIT3 Proteins 0.000 abstract description 2
- 102100027339 Slit homolog 3 protein Human genes 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 241000283690 Bos taurus Species 0.000 description 1
- 229910001335 Galvanized steel Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000008397 galvanized steel Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
産１上象租里公互
本発明は、いわゆる垂直型の電気メッキ方法及びそのた
めの装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a so-called vertical electroplating method and an apparatus therefor.
従来反■
金属条（ストリップ）の連続電気メッキ方法は、その金
属条の通板様式により、従来、次の３様式に大別されて
いる。Conventional methods for continuous electroplating of metal strips have conventionally been broadly classified into the following three types, depending on the method of threading the metal strip.
■金属条を水平にして、電極を水平に配置したメッキ槽
内を水平方向に通板させる“水平型”様式。■A “horizontal” style in which the metal strip is held horizontally and the electrodes are placed horizontally in the plating bath.
■金属条の幅方向を水平に長さ方向を垂直にして、電極
を垂直に配置したメッキ槽内を垂直方向に通板させる“
竪型”様式。この様式では金属条は上方向と下方向に交
互に繰返して通板される。■The width direction of the metal strip is horizontal and the length direction is vertical, and the metal strip is passed vertically through a plating tank with vertically arranged electrodes.
"Vertical" style. In this style, the metal strip is threaded repeatedly in an upward and downward direction.
■金属条の幅方向を垂直にして、電極を水平に配置した
メッキ槽内を水平方向に通板させる“垂直型”様式。■A "vertical" style in which the width of the metal strip is vertical and the electrodes are placed horizontally in the plating tank, where the strip is passed horizontally.
これらの様式のうち、■の水平型と、■の竪型では、金
属条の幅を広くでき、しかも高速通板が可能である。例
えば、１ｍ程度の幅の金属条を数百メートル７分の速度
で通板するのが一般的である。Among these styles, the horizontal type (■) and the vertical type (■) allow the width of the metal strip to be widened and high-speed threading is possible. For example, it is common to thread a metal strip with a width of about 1 meter at a speed of several hundred meters and seven minutes.
すなわち、上記両様式は大量のメッキ生産に適している
ため、鉄鋼業界における錫メッキ鋼板、亜鉛メッキ鋼板
及びその他の各種の合金メッキ鋼板に採用されている。That is, since both of the above methods are suitable for mass production of plating, they are employed in the steel industry for tin-plated steel sheets, galvanized steel sheets, and various other alloy-plated steel sheets.
そして、更にメッキの高効率化、特に高電流密度化を目
的とした、金属条と電極間のメッキ液の攪拌方法及びそ
のための装置が種々開発されており、現在下記に示すよ
うな方式が利用され、実用上の効果をもたらしている。Furthermore, various methods and devices for stirring the plating solution between the metal strip and the electrode have been developed with the aim of increasing the efficiency of plating, especially increasing the current density.Currently, the methods shown below are being used. and has brought about practical effects.
ｉ）水平型における横サイドからの噴流方式ｉｉ）水平
型におけるライン方向からの噴流方式ｉｉｉ ）水平型
における下面及び上面からの噴流方式ｉｖ）竪型におけ
る浸漬と下面からの噴流方式Ｖ）竪型における浸漬と金
属条直前の噴流方式ｖｉ）竪型における浸漬と下面及び
上面からの噴流方式
一方、上記■の垂直型の様式では、金属条を垂直にして
通抜するためその広幅化及び高速通板が困難であり、一
般に３００ｍｍ以下の幅の金属条を数メートル乃至数十
メートル７分の通板速度でメッキを行っている。しかし
、この様式は、ラインの構造が比較的単純で、操作及び
保守も比較的容易であるため、多品種牛量産のメッキに
適している利点があり、例えば伸銅品のメッキ中心に利
用されている。i) Jet method from the side side in horizontal type ii) Jet method from the line direction in horizontal type iii) Jet method from the bottom and top surface in horizontal type iv) Immersion and jet method from the bottom surface in vertical type V) Vertical type vi) Immersion in a vertical type and jet flow from the bottom and top surfaces.On the other hand, in the vertical type method (ii) above, the metal strip is passed vertically, so it is widened and passes through at high speed. Since it is difficult to plate plates, metal strips with a width of 300 mm or less are generally plated at a running speed of several meters to several tens of meters and seven minutes. However, this method has a relatively simple line structure and is relatively easy to operate and maintain, so it has the advantage of being suitable for mass-producing multi-breed cattle.For example, it is used mainly for plating copper products. ing.
ところで、垂直型様式は、水平型並びに竪型に比べてメ
ッキの高効率化、高電流密度化の技術レベルが低く、従
来、その電流密度は高くても精々２０〜３０Ａ／ｄａ＋
”程度であった。そして、このことは、基本的には、金
属条と電極との間のメッキ液を有効に攪拌するための手
段が開発されていなかったことに因る。By the way, the vertical type has a lower technical level of high plating efficiency and high current density than the horizontal type and vertical type, and conventionally, the current density was at most 20 to 30 A/da +
This was basically because no means had been developed to effectively stir the plating solution between the metal strip and the electrode.
而して、垂直型様式は、上述した利点に加えて、金属条
の両面のメッキ品質差が少なく、特に水平に配設された
メッキ槽における金属条下面での発生ガスによるピンホ
ールや電着異常や金属条上面でのメッキ液中の不純物（
主として微粒子状物）のメッキ層中への共析がみられず
、更には、竪型メッキ槽にみられるメッキ液中に配設さ
れたロールとの接触に起因する液中不純物の押し込み等
のメッキネ良が起らないという実用上の利点がある。In addition to the above-mentioned advantages, the vertical type has fewer differences in plating quality on both sides of the metal strip, and is particularly susceptible to pinholes and electrodeposition caused by gas generated on the bottom surface of the metal strip in a horizontally arranged plating tank. Abnormalities and impurities in the plating solution on the top surface of the metal strip (
There was no eutectoid eutectoid (mainly fine particulate matter) into the plating layer, and furthermore, there was no evidence of push-in of impurities into the plating solution due to contact with rolls placed in the plating solution, which is seen in vertical plating tanks. There is a practical advantage that plating does not occur.
したがって、叙上のような利点を有する垂直型様式の電
気メッキ方式及びそのための装置の高効率化及び高電流
密度化の技術の向上と改善が強く要望されていた。Therefore, there is a strong need for improvements in vertical electroplating methods having the advantages described above, as well as techniques for increasing the efficiency and current density of the apparatus therefor.
が解ンしようとする課
本発明は、上述したごとき現状に鑑みなされたものであ
って、いわゆる垂直型様式による電気メッキ方法及びそ
のための装置における金属条と電極との間のメッキ液を
有効に攪拌させることにより、高電流密度化を可能にし
て高効率的にメッキを行うための電気メッキ方法及び装
置を提供することを課題とする。The present invention has been made in view of the above-mentioned current situation, and it provides a so-called vertical type electroplating method and an apparatus for effectively stirring the plating solution between the metal strip and the electrode. An object of the present invention is to provide an electroplating method and apparatus that enable high current density and perform plating with high efficiency.
以下本発明の詳細な説明する。The present invention will be explained in detail below.
課 を”ンするための
本発明に係る電気メッキ方法の特徴は、金属条の幅方向
を垂直にして、メッキ槽内に水平に配置した電極に沿っ
て水平方向に走行させ、その間上記電極の上方部もしく
は下方部に設けたノズルよりメッキ液を噴流させること
により、金属条と電極と間隙にメッキ液を攪拌させなが
ら充満させることにある。The feature of the electroplating method according to the present invention is that the width direction of the metal strip is vertical and the metal strip is run horizontally along the electrodes arranged horizontally in the plating bath, while The purpose is to fill the gap between the metal strip and the electrode with the plating solution while stirring by jetting the plating solution from a nozzle provided in the upper or lower part.
また、本発明は、上記方法を有効に行うための装置とし
て、電極を水平に配置した槽に金属条の幅方向を垂直に
して導入するように形成したメッキ槽において、該槽内
の電極の上方部もしくは下方部にメッキ液を噴流させる
ためのノズルを備えた撹拌セルをメッキ槽内に配設した
メッキ装置を採用する。更に、本発明は、上記メッキ装
置において、上記攪拌セルの前部及び後部に噴流ヘッダ
ーを設けたメッキ装置も包含するものである。Further, the present invention provides a device for effectively carrying out the above method, in which a plating tank is formed so that the width direction of the metal strip is vertically introduced into the tank in which the electrodes are arranged horizontally. A plating device is used in which a stirring cell equipped with a nozzle for jetting the plating solution into the upper or lower part is arranged in the plating tank. Furthermore, the present invention also includes the plating apparatus described above, in which jet headers are provided at the front and rear parts of the stirring cell.
以下、本発明に係るメッキ装置を例示した添付図面に基
いて本発明に係るメッキ方法と装置を具体的に説明する
。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the plating method and apparatus according to the present invention will be specifically explained based on the accompanying drawings illustrating the plating apparatus according to the present invention.
第１図は、本発明に係る装置の概略図を例示したもので
あり、第２図は本装置内に配設した攪拌セルの中心部の
正断面図を、第３図は攪拌セルの平面図をそれぞれ示し
たものである。FIG. 1 is a schematic diagram of the device according to the present invention, FIG. 2 is a front cross-sectional view of the center of a stirring cell installed in the device, and FIG. 3 is a plan view of the stirring cell. The figures are shown in each figure.
第１図において、１はメッキ槽、２は被メッキ材である
金属条であって、該金属条２は、メッキ槽１の供給端に
設けたスリット３より垂直にしてメッキ槽１内に導入さ
れる。メッキ槽１内には第２図に示す攪拌セル４が配設
されていて、該攪拌セルには電極７が水平に配置されて
いる。メッキ槽１内に導入された金属条２は電極７に沿
って水平方向にメッキ液中を通板される。In FIG. 1, 1 is a plating tank, and 2 is a metal strip that is a material to be plated, and the metal strip 2 is vertically introduced into the plating tank 1 through a slit 3 provided at the supply end of the plating tank 1. be done. A stirring cell 4 shown in FIG. 2 is disposed within the plating bath 1, and an electrode 7 is arranged horizontally in the stirring cell. The metal strip 2 introduced into the plating tank 1 is passed horizontally through the plating solution along the electrode 7.
上記攪拌セル４内には電極７の上方部もしくは下方部に
はノズル８をそれぞれ備えていて、メッキ液を該ノズル
８から金属条２と電極７の間に所望の流速で噴流するよ
うになっている。このメッキ液の噴流によりメッキ液が
攪拌されて金属条２の電着面の液撹拌が行われるので、
高電流密度化が可能となり、また、電着面で発生した水
素ガスの気泡も有効に除去される。The stirring cell 4 is provided with a nozzle 8 above or below the electrode 7, and the plating solution is jetted from the nozzle 8 between the metal strip 2 and the electrode 7 at a desired flow rate. ing. This jet of plating solution stirs the plating solution and agitates the electrodeposited surface of the metal strip 2.
A high current density can be achieved, and hydrogen gas bubbles generated on the electrodeposition surface can also be effectively removed.
ただし、上記ノズル８は、金属条２の進行方向で均一な
流速が得られるように設計する。However, the nozzle 8 is designed so that a uniform flow velocity can be obtained in the direction in which the metal strip 2 moves.
因に、上記攪拌セル４内では、金属条２を陰極とし、電
極７を陽極として通電されることにより、金属条２の表
面に所望の金属メッキが電析される。Incidentally, in the stirring cell 4, electricity is applied using the metal strip 2 as a cathode and the electrode 7 as an anode, so that a desired metal plating is electrodeposited on the surface of the metal strip 2.
次に、本発明では、上記攪拌セル４の前部及び後部には
、第３図に示すように、噴流ヘッダー９が設けられてお
り、該噴流ヘッダー９より金属条２に向けてメッキ液を
噴流することにより、上記ノズル８よりのメッキ液流を
前後方向に逃がさないようにシールするようになってい
る。Next, in the present invention, jet headers 9 are provided at the front and rear parts of the stirring cell 4 as shown in FIG. 3, and the plating liquid is directed from the jet headers 9 toward the metal strip 2. By jetting, the plating liquid flow from the nozzle 8 is sealed to prevent it from escaping in the front-rear direction.
すなわち、上記ノズル８より、金属条２の上方もしくは
下方から噴流されたメッキ液は、攪拌セル４の前後から
それぞれ前方向及び後方向へ流出して攪拌セル４内にお
ける上方もしくは下方への所望の流速が得られ難くなる
とともに、金属条２の進行方向で攪拌の不均一化が生ず
るおそれがある。ところが、上記噴流ヘッダー９を攪拌
セル４の前後部に設けて、メッキ液を上記のように噴流
することにより、メッキ液流のシールが行われて上記攪
拌の不均一化が防止される。That is, the plating liquid jetted from above or below the metal strip 2 from the nozzle 8 flows out from the front and back of the stirring cell 4 in the front and rear directions, respectively, and reaches the desired upward or downward direction in the stirring cell 4. It becomes difficult to obtain a sufficient flow rate, and there is a possibility that stirring may become non-uniform in the direction of movement of the metal strip 2. However, by providing the jet header 9 at the front and rear of the stirring cell 4 and jetting the plating liquid as described above, the flow of the plating liquid is sealed and the agitation is prevented from becoming uneven.
なお、メッキ液は攪拌セル４上方へ吹き上げられるので
、メッキ槽１内のメッキ液面を攪拌セル４の上面より適
当に高い位置に保持するか、遮蔽板１０（第２図参照）
を設置することによりメッキ液の吹き上げを防止すると
よい。Note that since the plating solution is blown upwards into the stirring cell 4, the level of the plating solution in the plating tank 1 must be maintained at an appropriately higher level than the top surface of the stirring cell 4, or the shielding plate 10 (see Fig. 2) must be maintained.
It is recommended to prevent the plating solution from blowing up by installing a
また、メッキ槽１内の液面の高さは、メッキ槽１の底部
に設けた噴流ヘッダー９へのメッキ液供給ポンプ６ （
適数個設置）とスリット３からの流出液を循環槽又は受
皿より循環ポンプ５によりメッキ槽１内へ循環すること
により一定に保持される。In addition, the height of the liquid level in the plating tank 1 is determined by the plating liquid supply pump 6 (
The liquid flowing out from the slits 3 is kept constant by circulating it into the plating tank 1 from a circulation tank or a saucer using a circulation pump 5.
以上述べたとおり、本発明に係るメッキ装置を用いてメ
ッキ液を有効に攪拌することにより高電流密度化による
メッキが可能となるので、垂直型様式によるメッキの実
用化が一層促進される利点がある。As described above, by effectively stirring the plating solution using the plating apparatus according to the present invention, plating can be performed with high current density, which has the advantage of further promoting the practical application of vertical plating. be.
以下実施例により本発明のメッキ方法を具体的に説明す
る。The plating method of the present invention will be specifically explained below using Examples.
実施例１
厚さ０．３ｍｍ、幅２００ｍｍを有する銅条を、第１図
に示したメッキ装置に１０１／ｌｌ１ｉｎの通板速度で
供給し、５０℃の温度、５０Ａ／ｄ＋＋＋”の陰極電流
密度で下記によりメッキを行った。Example 1 A copper strip having a thickness of 0.3 mm and a width of 200 mm was supplied to the plating apparatus shown in FIG. 1 at a threading speed of 101/1/1 inch, at a temperature of 50° C., and at a cathode current density of 50 A/d+++”. Plating was performed as follows.
メッキ浴は下記組成の液を用い、電極（陽極）として白
金メッキチタン板を用い、極間距離を１０ｍｍにした。A plating bath having the following composition was used, a platinum-plated titanium plate was used as an electrode (anode), and the distance between the electrodes was 10 mm.
また、攪拌セル内の電極下方部に設けたノズルよりメッ
キ液を平均１ｍ／ｓｅｃの速度で噴流させた。Further, the plating solution was jetted at an average speed of 1 m/sec from a nozzle provided below the electrode in the stirring cell.
メッキ浴組成：
硫酸ニッケル ２４０ｇ＃
塩化ニッケル ４５ｇ／ｊ！
ホウ酸 ３５ｇ／ｌ
上記により、厚さ２μｍの均一なニッケルメッキ銅条が
得られ、メッキ面にはピンホール、コゲ等の電着異常は
認められなかった。Plating bath composition: Nickel sulfate 240g# Nickel chloride 45g/j! Boric acid 35 g/l As a result of the above, a uniform nickel-plated copper strip with a thickness of 2 μm was obtained, and no electrodeposition abnormalities such as pinholes or burnt were observed on the plated surface.
実施例２
実施例１において、攪拌セルの前部と後部に設けた噴流
ヘッダー（ヘッダーのノズル断面は５ｎｖ（Ｗ） Ｘ
２５０１Ｉ１ｍ （ｗ） 、流量は７５ Ｉｔ ／ｍｉ
ｎ、ノズル）から初速１ｍ／ｓｅｃでメッキ液を噴流さ
せ、更に陰極電流密度を７０Ａ／ｄｍ”にしたほかは、
実施例１に記載したと同様の手順によりメッキを行った
。Example 2 In Example 1, jet headers were installed at the front and rear of the stirring cell (the nozzle cross section of the header was 5nv (W)
2501I1m (w), flow rate is 75 It/mi
The plating solution was jetted from the nozzle at an initial velocity of 1 m/sec, and the cathode current density was set to 70 A/dm.
Plating was performed using the same procedure as described in Example 1.
得られたニッケルメッキ銅条は外観が均一で、ピンホー
ル、コゲ等の電着異常は認められなかった。The obtained nickel-plated copper strip had a uniform appearance, and no electrodeposition abnormalities such as pinholes or burnt were observed.
なお、比較として、実施例１において攪拌セル内のノズ
ルよりメッキ液を噴流させないことを除いては、実施例
１と同様にしてメッキを行ったところ、メッキ面の全面
にコゲが発生した。For comparison, when plating was performed in the same manner as in Example 1 except that the plating solution was not jetted from the nozzle in the stirring cell, burnt occurred on the entire plated surface.
第１図は、本発明に係るメッキ装置の概略図を例示した
ものであり、第２図のｔａ＋は本装置のメッキ槽内に配
設した攪拌セルの中心部の正断面図であって、電極の上
方部にノズルを設けた場合を例示したものであり、第２
図の山）は同じく正断面図であって、電極の下方部にノ
ズルを設けた場合を例示したものである。
第３図は攪拌セルの平面図を示す。
図において、
１・・・−・・・−・メッキ槽
２・−・−・−〜−−−・金属条
３・−・・・−・スリット
４・−・・−・・−攪拌セル
アー・・・−・・電極
８−・−・・−ノズル
９−・−・−・噴流ヘッダ−FIG. 1 illustrates a schematic diagram of a plating apparatus according to the present invention, and ta+ in FIG. 2 is a front sectional view of the center of a stirring cell disposed in a plating tank of this apparatus, This is an example of a case where a nozzle is provided above the electrode, and the second
The crest) in the figure is also a front sectional view, illustrating the case where a nozzle is provided below the electrode. FIG. 3 shows a plan view of the stirring cell. In the figure, 1...--...--Plating tank 2-----Metal strip 3---Slit 4--Stirring cellar--・・・・Electrode 8−・−・・−Nozzle 9−・−・−・Jet header−
Claims (3)
を通し、かつ該メッキ槽内に水平に配置した電極に沿つ
て水平方向に走行させ、その間上記メッキ槽内の電極の
上方部もしくは下方部に設けたノズルよりメッキ液を噴
流させることにより、金属条と電極との間隙にメッキ液
を撹拌させながら充満させることを特徴とする電気メッ
キ方法。(1) A metal strip is passed through a slit in a plating tank with its width direction vertical, and is run horizontally along electrodes arranged horizontally in the plating tank, while An electroplating method characterized in that the gap between the metal strip and the electrode is filled with the plating solution while stirring by jetting the plating solution from a nozzle provided in the lower part.
端とにスリットを設けて金属条の幅方向を垂直にして槽
内に導入するように形成したメッキ槽において、該槽内
の電極の上方部もしくは下方部にメッキ液を噴流させる
ためのノズルを備えた攪拌セルをメッキ槽内に配設した
ことを特徴とする電気メッキ装置。(2) In a plating tank in which slits are provided at the supply end and discharge end of a plating tank in which electrodes are arranged horizontally, and the metal strip is introduced into the tank with the width direction perpendicular, the electrodes in the tank are An electroplating apparatus characterized in that a stirring cell equipped with a nozzle for jetting a plating solution into an upper or lower part is disposed in a plating tank.
端とにスリットを設けて金属条を垂直にして槽内に導入
するようにしたメッキ槽において、該槽内の電極の上方
部もしくは下方部にメッキ液を噴流させるためのノズル
を備えた攪拌セルをメッキ槽内に配設し、かつ該撹拌セ
ルの前部及び後部に噴流ヘッダーを設けたことを特徴と
する電気メッキ装置。(3) In a plating tank in which slits are provided at the supply end and discharge end of the plating tank in which the electrodes are arranged horizontally so that the metal strip is vertically introduced into the tank, the upper part of the electrode in the tank or An electroplating apparatus characterized in that a stirring cell equipped with a nozzle for jetting a plating solution at the lower part is disposed in a plating tank, and jet headers are provided at the front and rear parts of the stirring cell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31513487A JPH01156494A (en) | 1987-12-15 | 1987-12-15 | Method and device for electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31513487A JPH01156494A (en) | 1987-12-15 | 1987-12-15 | Method and device for electroplating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01156494A true JPH01156494A (en) | 1989-06-20 |
Family
ID=18061815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31513487A Pending JPH01156494A (en) | 1987-12-15 | 1987-12-15 | Method and device for electroplating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01156494A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2755702A1 (en) * | 1996-11-13 | 1998-05-15 | Lorraine Laminage | PROCESS FOR THE CONTINUOUS APPLICATION OF AN ORGANIC COATING ON A SCALING METALLURGICAL PRODUCT AND DEVICE FOR IMPLEMENTING IT |
| WO2008072403A1 (en) * | 2006-12-14 | 2008-06-19 | Nichiyo Engineering Corporation | Apparatus and method for non-contact liquid sealing |
| JP2014065949A (en) * | 2012-09-26 | 2014-04-17 | Furukawa Electric Co Ltd:The | Composite plating material, manufacturing method thereof, electrical and electronic parts, fitting terminal and connector, sliding or rotating contact and switch |
| US10858748B2 (en) | 2017-06-30 | 2020-12-08 | Apollo Energy Systems, Inc. | Method of manufacturing hybrid metal foams |
-
1987
- 1987-12-15 JP JP31513487A patent/JPH01156494A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2755702A1 (en) * | 1996-11-13 | 1998-05-15 | Lorraine Laminage | PROCESS FOR THE CONTINUOUS APPLICATION OF AN ORGANIC COATING ON A SCALING METALLURGICAL PRODUCT AND DEVICE FOR IMPLEMENTING IT |
| EP0842709A1 (en) * | 1996-11-13 | 1998-05-20 | Sollac S.A. | Process for continuously coating a metallurgical product in continuous motion with an organic coating and apparatus therefor |
| US5935658A (en) * | 1996-11-13 | 1999-08-10 | Sollac | Process for continuous application of an organic coating on a moving metallurgical product and apparatus for its implementation |
| WO2008072403A1 (en) * | 2006-12-14 | 2008-06-19 | Nichiyo Engineering Corporation | Apparatus and method for non-contact liquid sealing |
| JPWO2008072403A1 (en) * | 2006-12-14 | 2010-03-25 | 日陽エンジニアリング株式会社 | Non-contact liquid sealing apparatus and method |
| JP2014065949A (en) * | 2012-09-26 | 2014-04-17 | Furukawa Electric Co Ltd:The | Composite plating material, manufacturing method thereof, electrical and electronic parts, fitting terminal and connector, sliding or rotating contact and switch |
| US10858748B2 (en) | 2017-06-30 | 2020-12-08 | Apollo Energy Systems, Inc. | Method of manufacturing hybrid metal foams |
| US11274376B2 (en) | 2017-06-30 | 2022-03-15 | Apollo Energy Systems, Inc. | Device for manufacturing hybrid metal foams |
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