JPH01147801A - Resistance paste - Google Patents
Resistance pasteInfo
- Publication number
- JPH01147801A JPH01147801A JP62307821A JP30782187A JPH01147801A JP H01147801 A JPH01147801 A JP H01147801A JP 62307821 A JP62307821 A JP 62307821A JP 30782187 A JP30782187 A JP 30782187A JP H01147801 A JPH01147801 A JP H01147801A
- Authority
- JP
- Japan
- Prior art keywords
- glass frit
- resistance
- resistance value
- thick
- resistance paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims abstract description 30
- 229910000484 niobium oxide Inorganic materials 0.000 claims abstract description 7
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 abstract description 6
- 239000012298 atmosphere Substances 0.000 abstract description 4
- 239000011230 binding agent Substances 0.000 abstract description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 abstract description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 abstract description 2
- 150000002148 esters Chemical class 0.000 abstract description 2
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 abstract 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- -1 aliphatic alcohols Chemical class 0.000 description 3
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 3
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000010955 niobium Substances 0.000 description 3
- 229940116411 terpineol Drugs 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000010665 pine oil Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- 229940088601 alpha-terpineol Drugs 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
- Paints Or Removers (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、アルミナ等の基板上に導電体としての銅等の
卑金属と共に厚膜抵抗体として形成可能な抵抗ペースト
、特にその組成に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a resistive paste that can be formed as a thick film resistor on a substrate such as alumina together with a base metal such as copper as a conductor, and in particular to its composition.
′来技術とその問題点
近年、厚膜電気回路基板の電極ないし導電パターンには
銅等の卑金属が多用きれる傾向にあり、銅と共に還元性
雰囲気中で焼成可能な抵抗ペーストが求められている。'Recent technology and its problems In recent years, base metals such as copper have been increasingly used in electrodes or conductive patterns of thick-film electrical circuit boards, and there is a need for a resistance paste that can be fired together with copper in a reducing atmosphere.
この種の抵抗ペーストは、基本的には、溶剤としての有
機ビヒクル中に導電成分としての金属六ホウ化物と結合
剤としてのガラスフリットを分散したものであり、還元
性雰囲気中で焼成して厚膜抵抗体とした際、良好な特性
を示すことが必要である。This type of resistance paste is basically a dispersion of metal hexaboride as a conductive component and glass frit as a binder in an organic vehicle as a solvent, and is baked in a reducing atmosphere to form a thick When used as a film resistor, it is necessary to exhibit good characteristics.
そこで、従来では、特公昭５９−６４８１号公報、特開
昭５５−２７７００号公報、特開昭５５−２９１９９号
公報等に２戦の如く、金属六ホウ化物と耐還元性ガラス
、例えば、ボウアルミン酸カルシウムガラス、ホウケイ
酸Ｂａ 、 Ｃａ系ガラスを含有した抵抗ペーストが提
案されている。Therefore, in the past, metal hexaborides and reduction-resistant glasses, such as bo-aluminum, have been proposed as described in Japanese Patent Publication No. 59-6481, Japanese Patent Application Publication No. 55-27700, and Japanese Patent Application Publication No. 55-29199. Resistance pastes containing calcium oxide glass, Ba borosilicate glass, and Ca-based glass have been proposed.
しかしながら、本発明者らが実際に以下の第１表ないし
第４表に示す組成からなる抵抗ペーストを製作し、その
面積抵抗値、温度抵抗係数（ＴＣＲ）を調べたところ、
以下の問題点が見出された。However, when the present inventors actually produced resistance pastes having the compositions shown in Tables 1 to 4 below and examined their sheet resistance values and temperature coefficient of resistance (TCR), they found that
The following problems were found.
［以 下金 白］
第１表（比較例１）
２５．００ ： ４ｔｉ、ｌυ：ｌＺ、８υ：ｌＺ、５
υ： １．ｕｕｍｏｌ第４表（比較例４）
以上の第１表ないし第４表で明らかな様に、従来使用袋
れている耐還元性ガラスでは導電成分との混合比の僅か
な変動により抵抗値の変動が大きく、再現性に欠け、抵
抗値を細かく設定することも困難である。しかも、ガラ
スフリットの混合比がｓｏｗｔ％を越えると急激に抵抗
値が上昇し、比較例１〜４のそれぞれに見られる様に、
ガラスフリットの混合比が６０ｗｔ％に達すると面積抵
抗値がＩＧΩを超えてしまい、回路素子の抵抗体として
機能しないという問題点を有している。[Hereinafter, gold and white] Table 1 (Comparative Example 1) 25.00: 4ti, lυ: lZ, 8υ: lZ, 5
υ: 1. uumol Table 4 (Comparative Example 4) As is clear from Tables 1 to 4 above, with the conventionally used reduction-resistant glass, the resistance value fluctuates due to slight fluctuations in the mixing ratio with the conductive component. is large, lacks reproducibility, and makes it difficult to finely set the resistance value. Moreover, when the mixing ratio of glass frit exceeds sowt%, the resistance value increases rapidly, as seen in each of Comparative Examples 1 to 4.
When the mixing ratio of glass frit reaches 60 wt %, the area resistance value exceeds IGΩ, and there is a problem that it does not function as a resistor of a circuit element.
そこで、本発明は、有機ビヒクル中の固体成分（導電成
分とガラスフリット）の混合比に応じて、厚膜抵抗体と
したとき、一定の抵抗値を再現でき、かつ、ガラスフリ
ットの混合比が増加しても比較的安定した一定の抵抗値
を保持する抵抗ペーストを提供することを目的とする。Therefore, the present invention is capable of reproducing a constant resistance value when used as a thick film resistor according to the mixing ratio of the solid components (conductive component and glass frit) in the organic vehicle, and that the mixing ratio of the glass frit is It is an object of the present invention to provide a resistive paste that maintains a relatively stable constant resistance value even when the resistance value increases.
λ唄Ω璽ス
本発明に係る抵抗ペーストは、有機ビヒクル中に金属穴
ホウ化物とガラスフリットを分散し、ガラスフリットと
してホウケイ酸アルカリ土類酸化物に酸化ニオブ（Ｎｂ
、ｏｉ）を約０．５〜５．０ｍｏｌ％添加したものを使
用した。The resistance paste according to the present invention has metal hole boride and glass frit dispersed in an organic vehicle, and niobium oxide (Nb) is added to borosilicate alkaline earth oxide as the glass frit.
, oi) was added in an amount of about 0.5 to 5.0 mol %.
有機ビヒクルは溶剤として使用される不活性液体である
。使用しうる有機ビヒクルの例は、脂肪族アルコール、
その様なアルコールのエステル例えばアセテート及びプ
ロピオネート、テルペン例えば松根油、テルピネオール
その他、溶媒例えば松根油及びエチレングリコールモノ
アセテートのモノブチルエーテル中の樹脂例えば低級ア
ルコールのポリメタクリレートの溶液又はエチルセルロ
ースの溶液である。アクリル系樹脂をα−テレピネオー
ルで溶解したものが特に好ましい。ビヒクルは基板への
塗布後退速な硬化を促進させるための揮発性液体を含有
していても良い。Organic vehicles are inert liquids used as solvents. Examples of organic vehicles that can be used are aliphatic alcohols,
Esters of such alcohols such as acetate and propionate, terpenes such as pine oil, terpineol, etc., solutions of resins such as polymethacrylates of lower alcohols or solutions of ethylcellulose in solvents such as pine oil and monobutyl ether of ethylene glycol monoacetate. Particularly preferred is an acrylic resin dissolved in α-terpineol. The vehicle may contain a volatile liquid to facilitate rapid curing of the coating onto the substrate.
本発明に係る抵抗ペースト中における固体成分に対する
有機ビヒクルの比率は、固体成分の分散方法や使用され
るビヒクルの種類によって必ずしも一定ではない。The ratio of organic vehicle to solid components in the resistance paste of the present invention is not necessarily constant depending on the method of dispersing the solid components and the type of vehicle used.
金属穴ホウ化物は導電成分として使用され、例えばＬａ
Ｂｇ 、 ＹＢｓ ＋ ＣａＢｓ 、 ＢａＢｓ 、
５ｒＢｓ等を含む。Metal hole borides are used as conductive components, e.g. La
Bg, YBs + CaBs, BaBs,
Including 5rBs etc.
ガラスフリットは焼成時の導電成分ないしは基板への結
合剤として使用され、それ自体絶縁性を有し、ＢｚＯｍ
ｒ Ｓｉｎｇ 、 ＢａＯ、ＣａＯ、ＫｇＯ＊ Ｍｇ
Ｏ、ＳｒＯ。Glass frit is used as a conductive component during firing or as a bonding agent to the substrate, and has an insulating property itself, and BzOm
r Sing , BaO, CaO, KgO* Mg
O, SrO.
ＺｒＯ，等のホウケイ酸アルカリ土類酸化物を含み、特
に、酸化ニオブ（Ｎｂ＊Ｏｓ）が約０．５〜５．０ｍｏ
ｌ％添加したものが使用される。Ｎｂ＊Ｏｓの添加によ
り、本発明に係る抵抗ペーストは厚膜として基板上に還
元性雰囲気中で焼成した際、以下の第５表、第６表、第
７表に示す様に、厚膜抵抗体の抵抗値の増加を抑える作
用を奏する。添加量が約５．Ｏｍｏ１％を超えるとガラ
ス成分として存在せず析出して結晶化してしまい、目的
とする効果を奏しなくなる。Contains borosilicate alkaline earth oxides such as ZrO, especially about 0.5 to 5.0 mo of niobium oxide (Nb*Os)
1% is used. Due to the addition of Nb*Os, when the resistor paste according to the present invention is fired as a thick film on a substrate in a reducing atmosphere, it becomes a thick film resistor as shown in Tables 5, 6, and 7 below. It has the effect of suppressing the increase in body resistance. The amount added is about 5. If Omo exceeds 1%, it will not exist as a glass component and will precipitate and crystallize, failing to achieve the desired effect.
また、添加量が約０．５ｍｏ１％以下では目的とする効
果を達成できない。Further, if the amount added is less than about 0.5 mo1%, the desired effect cannot be achieved.
金属六ホウ化物とガラスフリットの混合比は、必要とさ
れる抵抗値に応じて任意の値をとることができ、絶縁性
を有するガラスフリットの比率が高まる程抵抗値が増加
する。The mixing ratio of the metal hexaboride and the glass frit can take any value depending on the required resistance value, and the resistance value increases as the ratio of the insulating glass frit increases.
火盲忽
以下、本発明に係る抵抗ペーストの実施例につき、詳説
する。Examples of the resistance paste according to the present invention will be described in detail below.
以下の第５表、第６表、第７表に示す実施例１゜２．３
の抵抗ペーストは、溶剤としてのアクリル系樹脂−α−
テレピネオールからなる有機ビヒクル中に導電成分とし
てのｔ、ａＢ＠と結合剤としてのガラスフリット（組成
は各表欄外に示す）を分散したものである。ＬａＢａと
ガラスフリットの混合比は各実施例１〜３番こつき、５
０：５０〜１０：９０までの１０単位ごとに５例ずつ製
作した。Example 1゜2.3 shown in Tables 5, 6 and 7 below
The resistance paste uses acrylic resin -α- as a solvent.
t and aB@ as conductive components and glass frit as a binder (the composition is shown outside each table) are dispersed in an organic vehicle consisting of terpineol. The mixing ratio of LaBa and glass frit was the same as that of Examples 1 to 3 and 5.
Five samples were produced for each 10 units from 0:50 to 10:90.
［以下金 白コ
第５表（実施例１）
第６表（実施例２）
３６、０５ ： ３１．６７ ： １８．０２ ： ９
．２６ ： ５．００ｍｏｌ第７表（実施例３）
具体的には、まず、６表に示すガラスフリットを構成す
る原料を各混合比に応じて混合し、この混合原料を白金
るつぼ中で溶融させ、冷水中に投入し、湿式ボールミル
により粉砕してフリット化する。[See below for gold and white Table 5 (Example 1) Table 6 (Example 2) 36,05: 31.67: 18.02: 9
．． 26: 5.00 mol Table 7 (Example 3) Specifically, first, the raw materials constituting the glass frit shown in Table 6 were mixed according to each mixing ratio, and this mixed raw material was melted in a platinum crucible. , poured into cold water, and ground in a wet ball mill to form a frit.
また、ＬａＢａについては、振動ミル処理で平均粒径５
μｍとした。In addition, for LaBa, the average particle size was 5 by vibration mill treatment.
It was set as μm.
以上の１．ａＢ ｓとガラスフリットとを６表に示す混
合比に応じてツーパーミル処理することによって有機ビ
ヒクル中に分散させてペースト形態とする。Above 1. ABS and glass frit are dispersed in an organic vehicle by two-per-mill treatment according to the mixing ratio shown in Table 6 to form a paste.
有機ビヒクルは、各実施例において、８５ｗｔ％のα−
テレピネオール溶液中に、１５ｗｔ％のアクリル系樹脂
を溶解したものを使用した。この有機ビヒクルは固体成
分に対して２８ｗｔ％である。The organic vehicle is 85 wt% α-
A terpineol solution containing 15 wt % of an acrylic resin was used. The organic vehicle is 28% by weight based on solids.
以上の如く製造された抵抗ペーストを、アルミナ基板上
に予備焼成した銅電極間にスクリーン印刷し、１２０°
Ｃで１０分間乾燥許せた後焼成した。焼成は９００°Ｃ
で窒素雰囲気炉内で行なった。The resistor paste produced as described above was screen printed on an alumina substrate between pre-fired copper electrodes, and
After being allowed to dry at C for 10 minutes, it was fired. Firing at 900°C
The test was carried out in a nitrogen atmosphere furnace.
各実施例中のＬａＢ、 ：フリット組成に対応する面積
抵抗値とＴＣＲは第５表、第６表、第７表に示す通りで
あり、ガラスフリットの混合比が増加するにつれて面積
抵抗値も増加する。しかし、前述した比較例と比べてガ
ラスフリットの混合比が５０％を超えても抵抗値が急激
に増加してＩＧΩを超える様なことはなく、十分実用可
能な厚膜抵抗体を得ることができる。換言すれば、Ｌａ
Ｂ、とガラスフリットの混合比を任意に選択することに
より、必要とする抵抗値を有する抵抗ペーストを再現性
良く得ることが可能である。LaB in each example: The sheet resistance value and TCR corresponding to the frit composition are shown in Tables 5, 6, and 7, and as the mixing ratio of glass frit increases, the sheet resistance value also increases. do. However, compared to the comparative example described above, even if the glass frit mixing ratio exceeds 50%, the resistance value does not suddenly increase and exceed IGΩ, making it difficult to obtain a sufficiently practical thick film resistor. can. In other words, La
By arbitrarily selecting the mixing ratio of B and glass frit, it is possible to obtain a resistive paste having a desired resistance value with good reproducibility.
なお、本発明に係る抵抗ペーストは前記各実施例に限定
するものではなく、有機ビヒクル、金属力ホウ化物、ガ
ラスフリットの主成分としてのホウケイ酸アルカリ土類
酸化物は本発明の要旨の範囲内で種々のものを選択でき
、またその組成比率も任意である。Note that the resistance paste according to the present invention is not limited to the above-mentioned examples, and the organic vehicle, metal boride, and borosilicate alkaline earth oxide as the main component of the glass frit are within the scope of the present invention. Various types can be selected, and their composition ratios are also arbitrary.
発明の効果
以上の説明で明らかな様に、本発明によれば、結合剤と
してのガラスフリット中に約０．５〜５．０ｍｏｌ％の
酸化ニオブを添加する様にしたため、固体成分中のガラ
スフリットの混合比に応じて厚膜抵抗体として十分実用
可能な抵抗値を有するものを再現性良く得ることができ
る。Effects of the Invention As is clear from the above explanation, according to the present invention, approximately 0.5 to 5.0 mol% of niobium oxide is added to the glass frit as a binder, so that the glass in the solid component is Depending on the mixing ratio of the frits, it is possible to obtain a thick film resistor having a resistance value sufficient for practical use with good reproducibility.
特許出願人 株式会社村田製作所Patent applicant: Murata Manufacturing Co., Ltd.
Claims (1)
トを分散した抵抗ペーストにおいて、前記ガラスフリッ
トが、ホウケイ酸アルカリ土類酸化物に酸化ニオブを約
０．５〜５．０ｍｏｌ％添加したものであること、を特
徴とする抵抗ペースト。(1) A resistance paste in which a metal hexaboride and a glass frit are dispersed in an organic vehicle, wherein the glass frit is a borosilicate alkaline earth oxide to which about 0.5 to 5.0 mol% of niobium oxide is added. A resistance paste characterized by:
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62307821A JPH01147801A (en) | 1987-12-04 | 1987-12-04 | Resistance paste |
| US07/279,529 US4985176A (en) | 1987-12-04 | 1988-12-02 | Resistive paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62307821A JPH01147801A (en) | 1987-12-04 | 1987-12-04 | Resistance paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01147801A true JPH01147801A (en) | 1989-06-09 |
Family
ID=17973614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62307821A Pending JPH01147801A (en) | 1987-12-04 | 1987-12-04 | Resistance paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01147801A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5787007A (en) * | 1980-09-15 | 1982-05-31 | Philips Nv | Ink for printing screen |
| JPS60145949A (en) * | 1984-01-06 | 1985-08-01 | 昭栄化学工業株式会社 | Resistor composition |
-
1987
- 1987-12-04 JP JP62307821A patent/JPH01147801A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5787007A (en) * | 1980-09-15 | 1982-05-31 | Philips Nv | Ink for printing screen |
| JPS60145949A (en) * | 1984-01-06 | 1985-08-01 | 昭栄化学工業株式会社 | Resistor composition |
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