JPH0114016B2 - - Google Patents
Info
- Publication number
- JPH0114016B2 JPH0114016B2 JP55107875A JP10787580A JPH0114016B2 JP H0114016 B2 JPH0114016 B2 JP H0114016B2 JP 55107875 A JP55107875 A JP 55107875A JP 10787580 A JP10787580 A JP 10787580A JP H0114016 B2 JPH0114016 B2 JP H0114016B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- film
- roll
- photosensitive material
- photosensitive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 63
- 239000000463 material Substances 0.000 claims description 37
- 238000010438 heat treatment Methods 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- 238000010030 laminating Methods 0.000 claims description 8
- 230000007246 mechanism Effects 0.000 description 37
- 230000001681 protective effect Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 5
- 238000003475 lamination Methods 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000009824 pressure lamination Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】
本発明は減圧雰囲気下あるいは常圧雰囲気下で
連続的に印刷配線板製造用基板（以下単に基板と
略す）上に可とう性支持体及び感光層からなるフ
イルム状感光材料を感光層中の揮発性成分の揮散
なく貼り合わせることのできる方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a photosensitive film consisting of a flexible support and a photosensitive layer that is continuously applied to a printed wiring board manufacturing substrate (hereinafter simply referred to as the substrate) under a reduced pressure atmosphere or a normal pressure atmosphere. The present invention relates to a method that allows materials to be bonded together without volatilization of volatile components in photosensitive layers.
印刷配線板等の凹凸面を有する固体板に気泡の
巻き込みなくフイルム状感光材料を貼り合わせる
装置としては特公昭53−31670号公報に記載され
る連続減圧貼り合わせ装置が非常に有用である。
しかしこの装置では基板へのフイルムの貼り合わ
せ性向上のための加熱が減圧雰囲気下で行なわれ
るため感光層中の揮発性成分を揮散するという問
題があることが知られるに至つている。また銅張
り積層板上にフイルム状感光材料を常圧雰囲気下
で加熱加圧積層する通常の貼り合わせ装置におい
ても、減圧雰囲気中の時よりは低いが感光層中の
揮発性成分の揮散がやはり問題となつている。す
なわちこれらの貼り合わせ装置では第１図又は第
２図に示される通り可とう性支持体１上の感光層
２が常圧雰囲気下あるいは減圧雰囲気下に露出さ
れたままの状態でホツトロール３あるいは加熱板
４により加熱されるため、感光層中の揮発性成分
がその表面より揮散する。５はラミネートロー
ル、６は基板である。 As a device for bonding a film-like photosensitive material to a solid plate having an uneven surface such as a printed wiring board without entraining air bubbles, a continuous vacuum bonding device described in Japanese Patent Publication No. 31670/1983 is very useful.
However, it has become known that this apparatus has a problem in that volatile components in the photosensitive layer are evaporated because heating is performed in a reduced pressure atmosphere to improve the adhesion of the film to the substrate. In addition, even in a normal laminating device that heats and presses and laminates a film-like photosensitive material on a copper-clad laminate under normal pressure, volatile components in the photosensitive layer still volatilize, although this is lower than in a reduced-pressure atmosphere. It's becoming a problem. In other words, in these bonding apparatuses, as shown in FIG. 1 or 2, the photosensitive layer 2 on the flexible support 1 is exposed to a normal pressure atmosphere or a reduced pressure atmosphere and then exposed to a hot roll 3 or heated. Since it is heated by the plate 4, volatile components in the photosensitive layer are evaporated from its surface. 5 is a laminating roll, and 6 is a substrate.
本発明者らはこの問題点を解決すべく種々検討
した結果本発明に到達した。本発明の目的はフイ
ルム状感光材料の揮発性成分の揮散を防止する連
続貼り合わせ方法を提供することにある。 The present inventors conducted various studies to solve this problem, and as a result, they arrived at the present invention. An object of the present invention is to provide a continuous bonding method that prevents volatile components of film-like photosensitive materials from volatilizing.
本発明は、常圧雰囲気下又は減圧雰囲気下で可
とう性支持体及び感光層からなるフイルム状感光
材料を印刷配線板製造用基板上に積層させる連続
貼り合わせ方法を提供するものである。 The present invention provides a continuous bonding method in which a film-like photosensitive material consisting of a flexible support and a photosensitive layer is laminated on a substrate for manufacturing a printed wiring board under a normal pressure atmosphere or a reduced pressure atmosphere.
本発明は、可とう性支持体及び感光層からなる
フイルム状感光材料を印刷配線板製造用基板上に
貼り合わせるに際して、フイルム状感光材料の感
光層を感光層中の揮発性成分が揮散しない温度で
ガイドロールにより印刷配線板製造用基板上に接
触させ、しかるのち感光層が可とう性支持体及び
印刷配線板製造用基板によつてサンドイツチされ
シールされた状態で熱圧着ロールによりフイルム
状感光材料を印刷配線板製造用基板に加圧加熱積
層する連続貼り合せ方法に関する。 In the present invention, when a film-like photosensitive material consisting of a flexible support and a photosensitive layer is laminated onto a substrate for manufacturing a printed wiring board, the photosensitive layer of the film-like photosensitive material is heated at a temperature at which volatile components in the photosensitive layer do not volatilize. Then, the photosensitive layer is sandwiched between the flexible support and the printed wiring board manufacturing substrate, and the film-like photosensitive material is brought into contact with the printed wiring board manufacturing substrate using a guide roll. The present invention relates to a continuous bonding method for laminating under pressure and heat to a printed wiring board manufacturing substrate.
本発明に用いられるフイルム状感光材料は第３
図に示される通り、可とう性支持体１及び感光層
２よりなる。一時的に感光層を保護するために、
感光層上に保護膜７が設けられてもよく、この場
合保護膜７はフイルム状感光材料を貼り合わせる
際に剥離される。可とう性支持体の例としてはポ
リエステルフイルムが通常用いられ、また保護膜
の例としてはポリエチレンフイルム、ポリプロピ
レンフイルム等が通常用いられる。 The film-like photosensitive material used in the present invention is
As shown in the figure, it consists of a flexible support 1 and a photosensitive layer 2. To temporarily protect the photosensitive layer,
A protective film 7 may be provided on the photosensitive layer, and in this case, the protective film 7 is peeled off when the film-like photosensitive materials are bonded together. As an example of a flexible support, a polyester film is usually used, and as an example of a protective film, a polyethylene film, a polypropylene film, etc. are usually used.
本発明では第４図に示すように、可とう性支持
体及び感光層からなるフイルム状感光材料をまず
ガイドロール８により、感光層中の揮発性成分が
揮散しない温度（通常は80℃以下）で基板６上に
接着させずに接触させ、ついで感光層２が可とう
性支持体１及び基板６にサンドイツチされシール
された状態で熱圧着ロール９により該フイルム状
感光材料を該基板上に加熱加圧積層する。したが
つて本発明では加熱加圧積層時に感光層中の揮発
性成分の揮散を防止することができる。とりわけ
減圧雰囲気下での揮発性成分の揮散防止効果が大
である。 In the present invention, as shown in FIG. 4, a film-like photosensitive material consisting of a flexible support and a photosensitive layer is first moved by a guide roll 8 at a temperature (usually 80°C or less) at which volatile components in the photosensitive layer do not volatilize. Then, the photosensitive layer 2 is sandwiched between the flexible support 1 and the substrate 6, and in a sealed state, the film-like photosensitive material is heated onto the substrate using a thermocompression roll 9. Pressure lamination. Therefore, in the present invention, volatile components in the photosensitive layer can be prevented from volatilizing during heating and pressurizing lamination. It is especially effective in preventing volatilization of volatile components under a reduced pressure atmosphere.
本発明においてガイドロールは単にフイルム状
感光材料を均一に基板上に接触させるために用い
られ、フイルム状感光材料を基板上に接着させる
ための加熱加圧機構は必要とされない。 In the present invention, the guide roll is simply used to uniformly bring the film-like photosensitive material into contact with the substrate, and no heating and pressing mechanism is required to adhere the film-like photosensitive material onto the substrate.
しかし必要に応じてガイドロールに加圧機構を
設けてもよい。またガイドロール内部にシーズヒ
ーターを設け感光層からの揮発性成分の揮散が無
視できる範囲内で加熱することも可能である。 However, if necessary, a pressure mechanism may be provided on the guide roll. It is also possible to provide a sheathed heater inside the guide roll and heat within a range where volatilization of volatile components from the photosensitive layer can be ignored.
本発明においては接着とは、フイルム状感光材
料が、露光、現像等の通常の一連の工程に耐え得
る程度のフイルム状感光材料の基板に対する密着
状態を意味し、接触とはこのような程度には達し
ていないフイルム状感光材料の基板に対する密着
状態を意味する。 In the present invention, adhesion refers to the state of close contact between the film-like photosensitive material and the substrate to the extent that the film-like photosensitive material can withstand a series of normal processes such as exposure and development, and contact refers to the state of close contact between the film-like photosensitive material and the substrate to such an extent that the film-like photosensitive material can withstand a series of normal processes such as exposure and development. means that the film-like photosensitive material is in close contact with the substrate.
本発明になる連続貼り合せ方法は減圧下で行な
うことが好ましい。 The continuous bonding method according to the present invention is preferably carried out under reduced pressure.
本発明においてフイルム状感光材料を基板上に
接触させるガイドロールはその表面にゴムライニ
ングが施されていることが好ましい。ゴムライニ
ングの厚さは２〜10mm、ゴム硬度はシヨアＡで30
〜70゜であることが好ましい。またガイドロール
はフイルムが接触される基板面に対して垂直方向
に可変でき、基板の厚さに応じて、ガイドロール
と基板間のギヤツプを自由に調節できる機構とす
ることが好ましい。 In the present invention, the guide roll for bringing the film-like photosensitive material into contact with the substrate preferably has a rubber lining on its surface. The thickness of the rubber lining is 2 to 10 mm, and the rubber hardness is Shore A 30.
The angle is preferably ~70°. Further, it is preferable that the guide roll is variable in the direction perpendicular to the surface of the substrate with which the film comes into contact, and that the gap between the guide roll and the substrate can be freely adjusted depending on the thickness of the substrate.
フイルム状感光材料を印刷配線板製造用基板に
加圧加熱積層する熱圧着ロールは内部にシーズヒ
ータが設けられ、またその表面にはゴムライニン
グが施されていることが好ましい。ゴムライニン
グの硬度はシヨアＡで30〜70゜また表面温度は80
〜250℃であることが望ましい。とりわけ150ない
し230℃が好ましい。本来、熱圧着における加熱
は感光層の流動性を増大せしめ、基板への接着性
を向上せしめるために行なわれ、より高温が好ま
しいのであるが、従来は揮発性成分の揮散の点か
ら150℃以上の加熱は通常行なわれていなかつた
のであるが、本発明によると高温加熱が良好に行
なえる。しかし250℃を越える加熱は感光層及び
支持体フイルムの熱劣化、貼り合せ時にしわ発生
等の問題が生ずるおそれがある。また少なくとも
一組の熱圧着ロールは基板の厚さに応じて、フイ
ルムが積層される基板面に対して垂直方向に可変
し、一定の圧力で基板を加圧する機構であること
が望ましい。加圧には通常のバネまたはエアシリ
ンダー方式を用いることができる。 It is preferable that a thermocompression roll for laminating a film-like photosensitive material under pressure and heat onto a substrate for manufacturing a printed wiring board is provided with a sheathed heater inside and a rubber lining is applied to the surface thereof. The hardness of the rubber lining is Shore A: 30~70°, and the surface temperature is 80°.
~250°C is desirable. Particularly preferred is 150 to 230°C. Originally, heating in thermocompression bonding is carried out to increase the fluidity of the photosensitive layer and improve its adhesion to the substrate, and higher temperatures are preferable, but in the past, heating at temperatures of 150°C or higher was used in order to volatilize volatile components. However, according to the present invention, high-temperature heating can be performed satisfactorily. However, heating in excess of 250° C. may cause problems such as thermal deterioration of the photosensitive layer and support film and the generation of wrinkles during bonding. Further, it is preferable that at least one set of thermocompression rolls is configured to be variable in the direction perpendicular to the surface of the substrate on which the film is laminated, depending on the thickness of the substrate, and to apply a constant pressure to the substrate. A conventional spring or air cylinder system can be used for pressurization.
本発明のフイルム状感光材料を基板上に接触さ
せるガイドロール機構は連続減圧貼り合わせ装置
においてとくに重要である。 A guide roll mechanism for bringing the film-like photosensitive material of the present invention into contact with a substrate is particularly important in a continuous vacuum bonding apparatus.
以下、連続減圧貼り合わせ装置を例に本発明を
説明する。 The present invention will be explained below using a continuous reduced pressure bonding apparatus as an example.
本発明の適用される好ましい連続減圧貼り合わ
せ装置の主な機構は
(1) 装置内部を減圧するための排気機構
(2) 積層板を製造するための貼り合わせ機構（こ
の機構は
(a) 装置内部でフイルム状感光材料を基板上に
接触させるための少なくとも一組のガイドロ
ール
(b) 装置内部でフイルム状感光材料と基板を加
圧加熱し積層板とするための少なくとも一組
の熱圧着ロール
(c) 基板を装置外部から内部に供給するための
装置壁とすり合わせ機構とした少なくとも一
組の基板供給ロール
および
(d) 熱圧着ロールによりフイルム状感光材料を
基板に加圧加熱して得られる積層板を装置内
部から外部に取り出すための装置壁とすり合
わせ構造とした少なくとも一組の積層板取出
ロールを含んでいる。）
および
(3) 上記のロールのうち少なくとも一つと連結し
た駆動機構である。 The main mechanisms of a preferable continuous vacuum bonding device to which the present invention is applied are (1) an exhaust mechanism for reducing the pressure inside the device, (2) a bonding mechanism for manufacturing laminates (this mechanism is comprised of (a) the device at least one set of guide rolls for bringing the film-like photosensitive material into contact with the substrate inside the device; (b) at least one set of thermocompression rolls for pressurizing and heating the film-like photosensitive material and the substrate to form a laminate inside the device; (c) at least one set of substrate supply rolls with a mechanism for rubbing against the walls of the apparatus for supplying the substrate from the outside to the inside of the apparatus; and (d) a film-like photosensitive material obtained by pressurizing and heating the substrate with a thermocompression roll. and (3) a drive mechanism connected to at least one of the rolls mentioned above. .
これらの機構は、排気機構により減圧されてい
る装置内に、基板供給ロールを通して基板を装置
内部に供給し、ガイドロールにより基板表面にフ
イルム状感光材料を接触させ、ついで熱圧着ロー
ルにより基板上にフイルムを加圧加熱積層して得
られた積層板は積層板取出ロールを通して装置外
部に取り出されるように組み合わされている。ま
た本発明の装置において基板供給ロール、積層板
取出ロール、ガイドロール、熱圧着ロールのうち
少なくとも一つのロールは駆動機構と連結してい
る。基板供給ロールおよび積層板取出ロールはそ
れぞれ駆動機構と連結しているが、駆動機構と連
結しているロールと連結して連動するようにする
のが好ましい。 In these mechanisms, a substrate is fed into the device through a substrate supply roll into a device whose pressure is reduced by an exhaust mechanism, a film-like photosensitive material is brought into contact with the surface of the substrate by a guide roll, and then a film-like photosensitive material is placed on the substrate by a thermocompression roll. The laminates obtained by laminating films under pressure and heat are assembled so as to be taken out of the apparatus through a laminate take-out roll. Furthermore, in the apparatus of the present invention, at least one of the substrate supply roll, laminate take-out roll, guide roll, and thermocompression roll is connected to the drive mechanism. Although the substrate supply roll and the laminate take-out roll are each connected to a drive mechanism, it is preferable that they are connected and interlocked with the roll connected to the drive mechanism.
さらに本発明の適用される装置において、フイ
ルム状感光材料が保護膜を有する場合には保護膜
を巻き取るためのロールを装置内に取り付けるこ
とができる。 Furthermore, in the apparatus to which the present invention is applied, if the film-like photosensitive material has a protective film, a roll for winding up the protective film can be installed in the apparatus.
本発明の適用される好ましい連続貼り合せ装置
は、装置内部を減圧にするための排気機構、装置
内に備えられた可とう性支持体及び感光層からな
るフイルム状感光材料の供給機構基板を装置外部
から内部に供給する少なくとも一組の基板供給ロ
ール、該フイルム状感光材料を基板上に接触させ
るための少なくとも一組のガイドロール、基板上
に接触されたフイルム状感光材料を加圧加熱し積
層板とするための少なくとも一組の熱圧着ロール
および積層板を装置内部から外部に取り出す少な
くとも一組の積層板取り出しロールを備え基板の
装置外部から内部への供給及び積層板の装置内部
から外部への取り出しがそれぞれ装置壁とすり合
わせ構造としたゴムライニングされた少なくとも
一組の基板供給ロール及び積層板取出ロールで行
なわれ、これらロールの少なくとも一つが駆動機
構と連結された構造とした連続貼り合せ装置であ
る。 A preferable continuous bonding apparatus to which the present invention is applied includes an exhaust mechanism for reducing the pressure inside the apparatus, a supply mechanism for film-like photosensitive material consisting of a flexible support and a photosensitive layer provided in the apparatus, and a substrate. At least one set of substrate supply rolls for supplying the film from the outside to the inside; at least one set of guide rolls for bringing the film-like photosensitive material into contact with the substrate; and laminating the film-like photosensitive material that has been brought into contact with the substrate by applying pressure and heating. At least one set of thermocompression bonding rolls for forming a board and at least one set of laminate take-out rolls for taking out the laminate from the inside of the device to the outside, for supplying the substrate from the outside of the device to the inside, and for feeding the laminate from the inside of the device to the outside. A continuous bonding device, in which at least one pair of rubber-lined substrate supply rolls and laminate take-out rolls each have a structure that rubs against the device wall, and at least one of these rolls is connected to a drive mechanism. It is.
次に本発明を図面により説明する。 Next, the present invention will be explained with reference to the drawings.
第５図は本発明の一実施例に係わる連続減圧貼
り合わせ装置の側面図であり、貼り合わせ機構１
０、架台１１、上チエンバー１２、下チエンバー
１３、駆動機構１４および排気機構１５よりな
る。貼り合わせ機構１０は上チエンバー１２及び
下チエンバー１３により密閉されており、排気機
構１５により内部は減圧にされる。上チエンバー
１２、下チエンバー１３は定滑車１６を通してワ
イヤ１７で吊り下げられ、動滑車１８，１９及び
補助軸２２にガイドされ上下に開閉する。駆動機
構１４はチエイン２０により貼り合わせ機構１０
内の基板供給ロールに連結されている。貼り合わ
せ機構内の基板供給ロール、熱圧着ロール及び積
層板取出ロールはチエイン２１により連結されて
いる。第６図は第５図の装置の貼り合わせ機構の
側断面図である。 FIG. 5 is a side view of a continuous reduced pressure bonding apparatus according to an embodiment of the present invention, and the bonding mechanism 1
0, a frame 11, an upper chamber 12, a lower chamber 13, a drive mechanism 14, and an exhaust mechanism 15. The bonding mechanism 10 is hermetically sealed by an upper chamber 12 and a lower chamber 13, and the inside is reduced in pressure by an exhaust mechanism 15. The upper chamber 12 and the lower chamber 13 are suspended by a wire 17 through a fixed pulley 16, and are guided by movable pulleys 18, 19 and an auxiliary shaft 22 to open and close up and down. The drive mechanism 14 connects the bonding mechanism 10 with a chain 20.
connected to the substrate supply roll inside. A substrate supply roll, a thermocompression roll, and a laminate take-out roll in the bonding mechanism are connected by a chain 21. 6 is a side sectional view of the bonding mechanism of the apparatus of FIG. 5. FIG.
フイルムはフイルム供給ロール２３に巻きつけ
られ、該フイルムに保護膜があるときは保護膜は
保護膜巻取ロール２４に巻き取られる。基板は基
板供給ロール２５により装置内部に供給され、さ
らに基板ガイドロール２６によりガイドロール８
に誘導され、基板表面にフイルムが接触される。
次に熱圧着ロールによりフイルムが基板に貼り合
わされ、得られた積層板は基板ガイドロール２
７，２８、積層板取出ロール２９により装置外部
に誘導される。各々の機構（基板供給機構、フイ
ルムを基板に積層する機構、積層板取出機構）に
ついては特公昭53−31670号公報等に記載される
公知技術であり説明は省略する。 The film is wound around a film supply roll 23, and if the film has a protective film, the protective film is wound onto a protective film take-up roll 24. The substrate is supplied into the apparatus by a substrate supply roll 25, and further transferred to the guide roll 8 by a substrate guide roll 26.
The film is brought into contact with the substrate surface.
Next, the film is bonded to the substrate using a thermocompression roll, and the resulting laminate is placed on the substrate guide roll 2.
7, 28, and guided to the outside of the apparatus by the laminate take-out roll 29. Each mechanism (substrate supply mechanism, mechanism for laminating films on substrates, and laminate take-out mechanism) is a known technique described in Japanese Patent Publication No. 53-31670, etc., and a description thereof will be omitted.
以上より明らかなように本発明により常圧雰囲
気下又は減圧雰囲気下でフイルム状感光材料の揮
発性成分の揮散なく、基板上にフイルム状感光材
料を加圧加熱積層することができる。 As is clear from the above, according to the present invention, a film-like photosensitive material can be laminated under pressure and heat on a substrate under a normal pressure atmosphere or a reduced-pressure atmosphere without volatilization of the volatile components of the film-like photosensitive material.
第１図は従来の熱圧着ロール方式の貼り合せ機
構の略図、第２図は従来の加熱板加熱方式の貼り
合せ機構の略図、第３図はフイルム状感光材料の
構造を示す略図、第４図は本発明における貼り合
せ機構の略図、第５図は本発明の一実施例になる
連続貼り合せ装置の側面図および第６図は第５図
の貼り合せ機構の略図である。
符号の説明、１……可とう性支持体、２……感
光層、３……ホツトロール、４……加熱板、５…
…ラミネートロール、６……印刷配線板製造用基
板、７……保護膜、８……ガイドロール、９……
熱圧着ロール、１０……貼り合わせ機構、１１…
…架台、１２……上チエンバー、１３……下チエ
ンバー、１４……駆動機構、１５……排気機構、
１６……定滑車、１７……ワイヤ、１８……動滑
車、１９……動滑車、２０……チエイン、２１…
…チエイン、２２……補助軸、２３……フイルム
供給ロール、２４……保護膜巻取ロール、２５…
…基板供給ロール、２６……基板ガイドロール、
２７……基板ガイドロール、２８……基板ガイド
ロール、２９……積層板取出ロール。
Figure 1 is a schematic diagram of a conventional thermocompression roll type bonding mechanism, Figure 2 is a schematic diagram of a conventional hot plate heating type bonding mechanism, Figure 3 is a schematic diagram showing the structure of a film-like photosensitive material, and Figure 4 is a schematic diagram of a conventional hot plate heating type bonding mechanism. 5 is a side view of a continuous bonding apparatus according to an embodiment of the present invention, and FIG. 6 is a schematic diagram of the bonding mechanism of FIG. 5. Explanation of symbols, 1... Flexible support, 2... Photosensitive layer, 3... Hot roll, 4... Heating plate, 5...
... Lamination roll, 6 ... Printed wiring board manufacturing substrate, 7 ... Protective film, 8 ... Guide roll, 9 ...
Thermocompression roll, 10... Bonding mechanism, 11...
... Frame, 12... Upper chamber, 13... Lower chamber, 14... Drive mechanism, 15... Exhaust mechanism,
16... Fixed pulley, 17... Wire, 18... Moving pulley, 19... Moving pulley, 20... Chain, 21...
...Chain, 22...Auxiliary shaft, 23...Film supply roll, 24...Protective film winding roll, 25...
...Substrate supply roll, 26...Substrate guide roll,
27...Substrate guide roll, 28...Substrate guide roll, 29...Laminated board take-out roll.
Claims (1)
状感光材料を印刷配線板製造用基板上に貼り合わ
せるに際して、フイルム状感光材料の感光層を感
光層中の揮発性成分が揮散しない温度でガイドロ
ールにより印刷配線板製造用基板上に接触させ、
しかるのち感光層が可とう性支持体及び印刷配線
板製造用基板によつてサンドイツチされシールさ
れた状態で熱圧着ロールによりフイルム状感光材
料を印刷配線板製造用基板に加圧加熱積層するこ
とを特徴とする連続貼り合せ方法。 ２ 減圧下で行なう特許請求の範囲第１項記載の
連続貼り合せ方法。[Scope of Claims] 1. When laminating a film-like photosensitive material consisting of a flexible support and a photosensitive layer onto a substrate for manufacturing a printed wiring board, the photosensitive layer of the film-like photosensitive material is It is brought into contact with a printed wiring board manufacturing substrate using a guide roll at a temperature that does not volatilize.
Thereafter, the photosensitive layer is sandwiched between the flexible support and the substrate for producing printed wiring boards, and the film-like photosensitive material is laminated by pressure and heating onto the substrate for producing printed wiring boards using a thermocompression roll. Characteristic continuous bonding method. 2. The continuous bonding method according to claim 1, which is carried out under reduced pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10787580A JPS5734947A (en) | 1980-08-05 | 1980-08-05 | Continuous pasting-together method and its device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10787580A JPS5734947A (en) | 1980-08-05 | 1980-08-05 | Continuous pasting-together method and its device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5734947A JPS5734947A (en) | 1982-02-25 |
| JPH0114016B2 true JPH0114016B2 (en) | 1989-03-09 |
Family
ID=14470297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10787580A Granted JPS5734947A (en) | 1980-08-05 | 1980-08-05 | Continuous pasting-together method and its device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5734947A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61280916A (en) * | 1985-06-07 | 1986-12-11 | Somar Corp | Laminator |
-
1980
- 1980-08-05 JP JP10787580A patent/JPS5734947A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5734947A (en) | 1982-02-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3562468B2 (en) | Laminating apparatus and laminating method | |
| TW466177B (en) | Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board | |
| KR20010050220A (en) | Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board | |
| JPS6255659A (en) | Apparatus which cuts photoresist tape into photoresist sheets in fixed size and laminates said photoresist sheets on flexible and firm carrier material accurately and free from wrinkle | |
| JPH07186419A (en) | Device for producing image forming element | |
| JPS6252552A (en) | Method and device for vacuum sticking | |
| GB1388317A (en) | Delaminating process and apparatus | |
| JPH0114016B2 (en) | ||
| KR20080103058A (en) | Laminating method and apparatus | |
| JP3694119B2 (en) | Laminator for film sheet on substrate surface | |
| JP3042970B2 (en) | Dry resist film lamination method | |
| JPH11320682A (en) | Apparatus and method for vacuum laminating | |
| JP4006746B2 (en) | Lamination method | |
| JP2001162757A (en) | Method for lamination | |
| JPH02226793A (en) | Manufacture of flexible printed board | |
| JP2000135739A (en) | Laminator and laminate holding method | |
| JPH08281678A (en) | Apparatus for producing laminated sheet | |
| JP2024057521A (en) | Film application device | |
| JP4182379B2 (en) | Lamination method | |
| JP4305694B2 (en) | Lamination method | |
| JP3802101B2 (en) | Color filter transfer device | |
| JPS637931A (en) | Overlay laminating apparatus | |
| JP2002271021A (en) | Vacuum laminating device and laminating method | |
| TW200922786A (en) | Apparatus and method for manufacturing a photosensitive laminated body | |
| JP2001328171A (en) | Film laminating apparatus |