JPH01135664U - - Google Patents
Info
- Publication number
- JPH01135664U JPH01135664U JP3123188U JP3123188U JPH01135664U JP H01135664 U JPH01135664 U JP H01135664U JP 3123188 U JP3123188 U JP 3123188U JP 3123188 U JP3123188 U JP 3123188U JP H01135664 U JPH01135664 U JP H01135664U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- flat lead
- electrode
- substrate
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Description
第１図はこの考案の実施例である偏平リード端
子の取り付け構造を表す斜視図、第２図Ａ〜Ｃは
回路基板に対して偏平リード端子を取り付ける手
順を表す図、第３図および第４図Ａ，Ｂは従来の
偏平リード端子の取り付け構造を表す図であり、
第３図は斜視図、第４図Ａ，Ｂは取り付け後にお
ける変形状態を表す断面図である。
１……偏平リード端子、２……回路基板、１２
ａ，１２ｂ……突起部。
Fig. 1 is a perspective view showing the mounting structure of a flat lead terminal as an embodiment of this invention, Figs. 2 A to C are diagrams showing the procedure for attaching the flat lead terminal to a circuit board, and Figs. Figures A and B are diagrams showing the mounting structure of conventional flat lead terminals.
FIG. 3 is a perspective view, and FIGS. 4A and 4B are sectional views showing the deformed state after installation. 1...Flat lead terminal, 2...Circuit board, 12
a, 12b... Protrusion.
Claims (1)
ードの端子を取り付ける構造であつて、 前記電極の一部に貫通孔を設けるとともに、前
記偏平リードの端子に回路基板を挟みこんで前記
貫通孔の位置で基板上下から嵌合する突起部を形
成し、前記電極と前記端子とを導電性接合材で接
合したことを特徴とする偏平リード端子の取り付
け構造。[Claims for Utility Model Registration] A structure in which a terminal of a flat lead is attached to an electrode formed near an end of a circuit board, a through hole is provided in a part of the electrode, and a circuit is attached to the terminal of the flat lead. A structure for attaching a flat lead terminal, characterized in that a protrusion is formed to sandwich the substrate and fit from above and below the substrate at the position of the through hole, and the electrode and the terminal are bonded with a conductive bonding material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3123188U JPH01135664U (en) | 1988-03-09 | 1988-03-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3123188U JPH01135664U (en) | 1988-03-09 | 1988-03-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01135664U true JPH01135664U (en) | 1989-09-18 |
Family
ID=31256944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3123188U Pending JPH01135664U (en) | 1988-03-09 | 1988-03-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01135664U (en) |
-
1988
- 1988-03-09 JP JP3123188U patent/JPH01135664U/ja active Pending