JPH01129873U - - Google Patents
Info
- Publication number
- JPH01129873U JPH01129873U JP2451488U JP2451488U JPH01129873U JP H01129873 U JPH01129873 U JP H01129873U JP 2451488 U JP2451488 U JP 2451488U JP 2451488 U JP2451488 U JP 2451488U JP H01129873 U JPH01129873 U JP H01129873U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- pad
- solder resist
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の第１の実施例による印刷配線
板のパツド部の平面図、第２図は第１図の点線枠
内の部分を拡大した平面図、第３図は本考案の第
２の実施例による印刷配線板のパツト部の平面図
、第４図は第１図のＡ―Ａ′線に沿つて切断した
断面図、第５図は従来の印刷配線板のパツド部の
平面図、第６図は第５図の１部の拡大平面図、第
７図は第３図に対する従来例の平面図、第８図は
第４図に対する従来例の断面図。
１……パターン、２……ソルダーレジスト、３
……パツド。
FIG. 1 is a plan view of a pad portion of a printed wiring board according to a first embodiment of the present invention, FIG. 2 is an enlarged plan view of the part within the dotted line frame in FIG. 1, and FIG. FIG. 4 is a cross-sectional view taken along line A-A' in FIG. 1, and FIG. 5 is a plan view of the pad portion of the conventional printed wiring board according to the second embodiment. 6 is an enlarged plan view of a part of FIG. 5, FIG. 7 is a plan view of the conventional example compared to FIG. 3, and FIG. 8 is a sectional view of the conventional example compared to FIG. 4. 1...Pattern, 2...Solder resist, 3
... Patsudo.
Claims (1)
品用のパツドを接続し、ソルダーレジストで前記
主表面を覆つた印刷配線板において、前記パツド
は、部分的に前記ソルダーレジストで覆われてい
ることを特徴とする印刷配線板。 In a printed wiring board in which a pad for a surface mount component is connected to a conductive pattern formed on a main surface and the main surface is covered with a solder resist, the pad is partially covered with the solder resist. Characteristic printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2451488U JPH01129873U (en) | 1988-02-25 | 1988-02-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2451488U JPH01129873U (en) | 1988-02-25 | 1988-02-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01129873U true JPH01129873U (en) | 1989-09-04 |
Family
ID=31244424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2451488U Pending JPH01129873U (en) | 1988-02-25 | 1988-02-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01129873U (en) |
-
1988
- 1988-02-25 JP JP2451488U patent/JPH01129873U/ja active Pending