JPH01129678U - - Google Patents
Info
- Publication number
- JPH01129678U JPH01129678U JP2018288U JP2018288U JPH01129678U JP H01129678 U JPH01129678 U JP H01129678U JP 2018288 U JP2018288 U JP 2018288U JP 2018288 U JP2018288 U JP 2018288U JP H01129678 U JPH01129678 U JP H01129678U
- Authority
- JP
- Japan
- Prior art keywords
- magnetic sensor
- exposed portion
- electrode exposed
- wiring pattern
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 7
- 238000000605 extraction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Measuring Magnetic Variables (AREA)
Description
第1図は本考案の一実施例になる磁気センサー
プローブの斜視図、第2図は本考案になる第2実
施例の要部を示す斜視図、第3図aは従来のホー
ル素子を用いた一般的な磁気センサープローブ1
0斜視図、同図bは同図aのホール素子の斜視図
、第4図は他の従来例の磁気センサープローブの
組立説明図である。
11……磁気センサー、12〜15……端子、
30……磁気センサープローブ、31,51……
配線基板、32……第1の基板、33〜36,5
2〜55……引き出し電極、37……第2の基板
、38,56……凹状スペース。
Fig. 1 is a perspective view of a magnetic sensor probe according to an embodiment of the present invention, Fig. 2 is a perspective view showing main parts of a second embodiment of the present invention, and Fig. 3a is a perspective view of a magnetic sensor probe using a conventional Hall element. General magnetic sensor probe 1
FIG. 4 is a perspective view of the Hall element shown in FIG. 11...Magnetic sensor, 12-15...Terminal,
30... Magnetic sensor probe, 31, 51...
Wiring board, 32...first board, 33-36,5
2-55...Extraction electrode, 37...Second substrate, 38, 56...Concave space.
Claims (1)
パターン面を有する配線基板の先端部に搭載し、
前記電極露出部と配線パターンとを電気的に接続
してなる磁気センサープローブにおいて、前記配
線基板先端部に磁気センサーの厚さに等しい深さ
を有する凹部を形成し、前記磁気センサーを前記
電極露出面と前記配線パターン面とが同一面とな
る如く前記凹部に設けてなることを特徴とする磁
気センサープローブ。 A magnetic sensor having an electrode exposed portion on one side is mounted on the tip of a wiring board having a wiring pattern surface,
In the magnetic sensor probe in which the electrode exposed portion and the wiring pattern are electrically connected, a recessed portion having a depth equal to the thickness of the magnetic sensor is formed at the tip of the wiring board, and the magnetic sensor is connected to the electrode exposed portion. A magnetic sensor probe, characterized in that the probe is provided in the recess so that the surface and the wiring pattern surface are flush with each other.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018288U JPH01129678U (en) | 1988-02-18 | 1988-02-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018288U JPH01129678U (en) | 1988-02-18 | 1988-02-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01129678U true JPH01129678U (en) | 1989-09-04 |
Family
ID=31236328
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018288U Pending JPH01129678U (en) | 1988-02-18 | 1988-02-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01129678U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009180596A (en) * | 2008-01-30 | 2009-08-13 | Hamamatsu Koden Kk | Magnetic field probe |
US8957678B2 (en) | 2010-03-12 | 2015-02-17 | Denso Corporation | Sensor unit and magnetic flux concentrating module |
US11079446B2 (en) | 2016-04-27 | 2021-08-03 | Infineon Technologies Ag | Compact sensor package |
-
1988
- 1988-02-18 JP JP2018288U patent/JPH01129678U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009180596A (en) * | 2008-01-30 | 2009-08-13 | Hamamatsu Koden Kk | Magnetic field probe |
US8957678B2 (en) | 2010-03-12 | 2015-02-17 | Denso Corporation | Sensor unit and magnetic flux concentrating module |
US11079446B2 (en) | 2016-04-27 | 2021-08-03 | Infineon Technologies Ag | Compact sensor package |
US11506728B2 (en) | 2016-04-27 | 2022-11-22 | Infineon Technologies Ag | Compact sensor package |