JPH01128438A - Sealing material - Google Patents
Sealing materialInfo
- Publication number
- JPH01128438A JPH01128438A JP28777087A JP28777087A JPH01128438A JP H01128438 A JPH01128438 A JP H01128438A JP 28777087 A JP28777087 A JP 28777087A JP 28777087 A JP28777087 A JP 28777087A JP H01128438 A JPH01128438 A JP H01128438A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealing
- sealing resin
- melt viscosity
- poise
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003566 sealing material Substances 0.000 title claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 94
- 229920005989 resin Polymers 0.000 claims abstract description 94
- 238000007789 sealing Methods 0.000 claims abstract description 76
- 239000000155 melt Substances 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 abstract description 24
- 239000003822 epoxy resin Substances 0.000 abstract description 11
- 229920000647 polyepoxide Polymers 0.000 abstract description 11
- 239000000203 mixture Substances 0.000 abstract description 10
- 239000000758 substrate Substances 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000565 sealant Substances 0.000 description 4
- 238000004382 potting Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、半導体素子上に載置して加熱するだけで溶
融し半導体素子を被覆密封封止する封止材に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a sealing material that melts simply by placing it on a semiconductor element and heating it to cover and hermetically seal the semiconductor element.
トランジスタ、ＩＣ，ＬＳＩ等の半導体素子は、基板上
に搭載されワイヤーボンド等がなされた後、半導体素子
やワイヤー等を保護する目的で封止用樹脂によって樹脂
封止される。このような樹脂封止には、一般に、液状樹
脂または粉末状樹脂の溶融物をポツティングして行われ
ている。このようなボッティングは、通常、つぎのよう
にして行われる。すなわち、■基板上の半導体素子の上
に溶融樹脂を滴下して被覆し、樹脂の広がりを樹脂自体
の粘性を利用して抑制する。■半導体素子の外周部に封
止枠体を設置し、その枠体内に樹脂をボッティングする
。■半導体素子の外周部に樹脂を枠状に転写印刷し、こ
の枠内に樹脂をボッティングする。という３種類の方法
がある。これらの方法は、封止の対象となる半導体素子
およびその周辺部も含め、必要最少部分にのみ樹脂を流
すことを狙いとするものである。BACKGROUND ART Semiconductor elements such as transistors, ICs, and LSIs are mounted on a substrate and wire-bonded, etc., and then sealed with a sealing resin for the purpose of protecting the semiconductor elements, wires, and the like. Such resin sealing is generally performed by potting a melted liquid resin or powdered resin. Such botting is usually performed as follows. That is, (1) molten resin is dropped onto the semiconductor element on the substrate to cover it, and the spread of the resin is suppressed by using the viscosity of the resin itself. ■A sealing frame is installed around the outer periphery of the semiconductor element, and resin is potted into the frame. ■Transfer printing of resin in a frame shape on the outer periphery of the semiconductor element, and botting the resin within this frame. There are three methods. These methods aim to flow resin only to the minimum necessary area, including the semiconductor element to be sealed and its surrounding area.
しかしながら前記■の方法は、樹脂の粘性を利用して広
がりを防止するものであり、使用する樹脂としてはかな
り高粘度のものを使用する必要がある。しかしながら高
粘度のものは半導体素子やワイヤーならびに基板との温
性が悪く、ボッティングの際に空気を巻き込むことが多
い。しかも−旦巻き込んだ空気は、樹脂の粘性のために
内部に閉じ込められ、封止樹脂中にボイドとして残り、
それによって半導体素子の信頼性が大幅に損なわれると
いう難点を有している。また上記■の方法では、確実に
ポツティング面積を規制することができるため、上記■
の方法の欠点は解消できるものの、封止枠体の位置決め
穴を基板上に設ける必要があり、また、封止枠体という
別部品を必要とするため、部品数が増え電子部品の実装
コストの大幅な上昇をもたらす。さらに、上記■の方法
によれば、上記■の方法のような封止用枠体は不要とな
るが、印刷工程が必要となるため、工数の削減にはなら
ず、やはり実装コストの上昇を招く。However, method (2) above utilizes the viscosity of the resin to prevent spreading, and it is necessary to use a resin with a fairly high viscosity. However, those with high viscosity have poor thermal properties with semiconductor elements, wires, and substrates, and air is often drawn in during botting. Moreover, the air that is once drawn in is trapped inside due to the viscosity of the resin and remains as voids in the sealing resin.
This has the disadvantage that the reliability of the semiconductor device is significantly impaired. In addition, the above method (■) can reliably control the potting area, so the above method (■)
Although the disadvantages of the above method can be overcome, it is necessary to provide a positioning hole for the sealing frame on the board, and a separate part called the sealing frame is required, which increases the number of parts and reduces the mounting cost of electronic components. bring about a significant increase. Furthermore, according to the method (■) above, a sealing frame is not required as in the method (■) above, but since a printing process is required, it does not reduce the number of man-hours and still increases the mounting cost. invite
またこの方法は、ポツティング樹脂の粘度が低い時には
、その流れを確実に規制することができないという難点
も有している。This method also has the disadvantage that when the viscosity of the potting resin is low, its flow cannot be reliably regulated.
二の発明はこのような事情に鑑みなされたもので、残留
空気による信頼性の低下や実装コストの上昇を招くこと
な（確実に樹脂封止することができる封止材の提供を目
的とする。The second invention was made in view of these circumstances, and aims to provide a sealing material that can reliably perform resin sealing without reducing reliability or increasing mounting costs due to residual air. .
上記の目的を達成するため、この発明の封止材は、第１
の封止用樹脂と、これより溶融粘度の高い第２の封止用
樹脂を備え、上記第２の封止用樹脂で枠体部が形成され
、その枠体部の枠で囲われた空間に上記第１の封止用樹
脂が充填されているという構成をとる。In order to achieve the above object, the sealing material of the present invention has a first
a sealing resin and a second sealing resin having a higher melt viscosity than the second sealing resin, a frame portion is formed of the second sealing resin, and a space surrounded by the frame of the frame portion. is filled with the first sealing resin.
すなわち、この封止材は、第１の封止用樹脂と第２の封
止用樹脂からなっていて、全体が小板状になっており、
それを半導体素子上に載置し、加熱して溶融させるだけ
で封止することができる。That is, this sealing material consists of a first sealing resin and a second sealing resin, and has a plate-like shape as a whole,
It can be sealed by simply placing it on a semiconductor element and heating and melting it.
したがって、従来のボッティングのような煩雑な作用を
必要とせず、半導体素子の実装の際におけるコストアッ
プの低減を実現することができる。Therefore, it is possible to reduce the cost increase in mounting semiconductor elements without requiring complicated operations such as conventional botting.
その上、溶融粘度の異なる第１の封止用樹脂と第２の封
止用樹脂とからなり、溶融の際に、第１の封止用樹脂よ
りも溶融粘度の高い第２の封止用樹脂が、堰となって第
１の封止用樹脂の広がりを阻止するため、最少面積で確
実に半導体素子の封止をなすことができる。また、溶融
樹脂が徐々に半導体素子の周囲の空気と置換して封止を
するため、残留空気によるボイドの発生も阻止しうるよ
うになる。Furthermore, the first sealing resin and the second sealing resin have different melt viscosities, and when melted, the second sealing resin has a higher melt viscosity than the first sealing resin. Since the resin acts as a dam and prevents the first sealing resin from spreading, it is possible to reliably seal the semiconductor element with a minimum area. Furthermore, since the molten resin gradually replaces the air around the semiconductor element and seals it, it is also possible to prevent the generation of voids due to residual air.
この発明の封止材は、第１の封止用樹脂とこれよりも溶
融粘度の高い第２の封止用樹脂とを用いて得られる。The sealing material of the present invention is obtained using a first sealing resin and a second sealing resin having a higher melt viscosity than the first sealing resin.
上記第１の封止用樹脂は、特に制限するものではないが
、通常エポキシ樹脂を主体とし、フェノール樹脂硬化剤
を配合し、さらに充填剤等を配合したエポキシ樹脂組成
物が用いられる。このようなエポキシ樹脂組成物は、１
５０℃における溶融粘度が１０ポイズ以下であることが
好ましい。The first sealing resin is not particularly limited, but usually an epoxy resin composition containing an epoxy resin as a main ingredient, a phenol resin curing agent, and a filler etc. is used. Such an epoxy resin composition has 1
It is preferable that the melt viscosity at 50° C. is 10 poise or less.
また、第１の封止用樹脂よりも溶融粘度の高い第２の封
止用樹脂も、通常、第１の封止用樹脂と同様の組成のエ
ポキシ樹脂組成物が用いられる。Further, as the second sealing resin having a higher melt viscosity than the first sealing resin, an epoxy resin composition having the same composition as the first sealing resin is usually used.
二の場合、溶融粘度の調節は、使用するエポキシ樹脂の
分子量を高めたり、溶融粘度の高い他の種類の樹脂を使
−用したりすることによって行われる。このような第２
の封止用樹脂は、１５０℃における溶融粘度が５０ポイ
ズ以上であることが効果の点から好ましい。In the second case, the melt viscosity is adjusted by increasing the molecular weight of the epoxy resin used or by using another type of resin with a high melt viscosity. A second like this
The sealing resin preferably has a melt viscosity of 50 poise or more at 150° C. from the viewpoint of effectiveness.
このように、この発明においては、第１の封止用樹脂お
よび第２の封止用樹脂は、単独の樹脂ではなくエポキシ
樹脂組成物のような樹脂組成物を意味するのであるが、
単独の樹脂を用いても差支えはない。Thus, in this invention, the first sealing resin and the second sealing resin do not mean a single resin but a resin composition such as an epoxy resin composition.
There is no problem even if a single resin is used.
上記のような第２の封止用樹脂で枠体部が形成され、第
１の封止用樹脂がその枠体部内部空間に充填されている
構造の封止材は、上記第１および第２の封止用樹脂粉末
の冷間成形等によって製造するることができる。A sealing material having a structure in which a frame part is formed of the second sealing resin as described above, and the inner space of the frame part is filled with the first sealing resin, It can be manufactured by cold molding of the sealing resin powder described in No. 2.
つぎに、実施例について説明する。Next, examples will be described.
〔実施例］ 第１図は、この発明の一実施例を示している。〔Example] FIG. 1 shows an embodiment of the invention.
図において、■は第１の封止用樹脂であり、１５０℃に
おける溶融粘度が１０ポイズ以下、好適には３〜１０ポ
イズのエポキシ樹脂組成物によって構成されている。２
は第２の封止用樹脂であり、１５０℃における溶融粘度
が５０ポイズ以上、好適には５０〜２００ポイズのエポ
キシ樹脂組成物を用いて構成されている。In the figure, ■ is the first sealing resin, which is composed of an epoxy resin composition having a melt viscosity at 150° C. of 10 poise or less, preferably 3 to 10 poise. 2
is the second sealing resin, and is constructed using an epoxy resin composition having a melt viscosity at 150° C. of 50 poise or more, preferably 50 to 200 poise.
この封止材１ａを用いて半導体素子を封止する場合には
、第２図に示すように、基板３上に固定された半導体素
子４の上に封止材１ａを位置決めし、ついで半導体素子
４の上に一点鎖線のように降下させ載置する。第２図に
おいて、５は接着剤層、６はワイヤーである。この場合
、あらかじめ上記基板３をホットプレート上で１００〜
１５０℃に加熱しておくか、もしくは封止材１ａを半導
体素子４上に載置した後、１００〜１５０℃に設定され
た恒温槽に入れて加熱することが行われる。これにより
、封止材１ａが溶融流動して、第３図に示すように、半
導体素子４とワイヤー６とを完全に被覆し図示のように
半球状に盛り上がった状態となる。つぎに、これを再度
加熱することにより、封止用樹脂が三次元熱硬化し封止
が完了する。When sealing a semiconductor element using this sealant 1a, as shown in FIG. 2, the sealant 1a is positioned over the semiconductor element 4 fixed on the substrate 3, and then the semiconductor element is sealed. Place it on top of 4 as shown in the dashed line. In FIG. 2, 5 is an adhesive layer and 6 is a wire. In this case, the substrate 3 is placed on a hot plate in advance at a temperature of 100~
Either the sealing material 1a is heated to 150.degree. C., or the sealing material 1a is placed on the semiconductor element 4 and then placed in a constant temperature bath set at 100 to 150.degree. C. for heating. As a result, the sealing material 1a melts and flows, completely covering the semiconductor element 4 and the wire 6, and rises into a hemispherical shape as shown in the figure, as shown in FIG. Next, by heating this again, the sealing resin is three-dimensionally thermosetted and sealing is completed.
この封止材１ａは、第１の封止用樹脂Ｉを上記のような
溶融粘度に設定し、第２の封止用樹脂２を上記のような
溶融粘度に設定しているため、空気を巻き込むことなく
しかも樹脂の流れる範囲を小さくして、完全な封止をな
すことができる。すなわち、本発明者らの検討した結果
によれば、−定の狭い範囲で封止用樹脂の流動を止める
には、１５０″Ｃの溶融粘度が５０ポイズ以上である必
要がある。他方、封止された樹脂中に空気を巻き込まず
、また空気を巻き込んだ場合でも、加熱中にその空気が
樹脂中を浮揚し、樹脂表面から外気中に抜は出すために
は、１５０ ’Ｃの溶融粘度が１０ポイズ以下である必
要がある。この発明の封止材１ａは、先に述べたように
第１および第２の封止用樹脂１，２を用い、熔融粘度の
低い第１の封止用樹脂１が半導体素子４とワイヤー６周
辺に流動して被覆することにより、空気を巻き込まず、
仮りに空気を巻き込んでも外へ逃がして封止でき、同時
に溶融粘度の高い第２の封止用樹脂が堰となり上記第１
の封止用樹脂の溶融時の広がりを止めるため、溶融樹脂
の流動面積が比較的狭く規制されるようになる。したが
って、封止用樹脂の面積を小さくして完全な封止を達成
できるようになる。In this sealing material 1a, the first sealing resin I is set to the melt viscosity as described above, and the second sealing resin 2 is set to the melt viscosity as described above. Complete sealing can be achieved without getting involved and by reducing the area in which the resin flows. That is, according to the results of the studies conducted by the present inventors, in order to stop the flow of the sealing resin within a narrow range of -150"C, the melt viscosity at 150"C needs to be 50 poise or more. A melt viscosity of 150'C is required to prevent air from being drawn into the frozen resin, and even if air is drawn into the resin, in order for the air to float through the resin during heating and be released from the resin surface into the outside air. The sealant 1a of the present invention uses the first and second sealing resins 1 and 2 as described above, and the first sealant has a low melt viscosity. The resin 1 flows around the semiconductor element 4 and the wire 6 to cover it, thereby preventing air from being drawn in.
Even if air is trapped, it can escape and seal, and at the same time, the second sealing resin with high melt viscosity acts as a weir.
In order to prevent the sealing resin from spreading when melted, the flow area of the molten resin is regulated to be relatively narrow. Therefore, complete sealing can be achieved by reducing the area of the sealing resin.
なお、上記の封止材１ａは、先に述べたようにエポキシ
樹脂組成物を粉末化し、これを圧縮成形して製造するこ
とができるが、それ以外にそれを溶融させ型に流し込ん
で成形することによっても得ることができる。さらに、
第１の封止用樹脂１を核としてその周囲に第２の封止用
樹脂２を設けて製造してもよいし、その逆の工程で製造
してもよい。そしてその形状は、第１図のような円板状
だけでなく、第４図に示すような角板状であってもよい
。さらに、第１の封止用樹脂と第２の封止用樹脂は同種
の樹脂である必要がなく、異なる種類の樹脂を用いても
差支えはない。The above-mentioned sealing material 1a can be manufactured by powdering the epoxy resin composition and compression molding it as described above, but it can also be manufactured by melting it and pouring it into a mold. It can also be obtained by moreover,
The first sealing resin 1 may be used as a core and the second sealing resin 2 may be provided around the core, or the second sealing resin 2 may be produced using the reverse process. The shape thereof is not limited to a disk shape as shown in FIG. 1, but may be a rectangular plate shape as shown in FIG. Furthermore, the first sealing resin and the second sealing resin do not need to be the same type of resin, and there is no problem even if different types of resins are used.
以上のように、この発明の封止材は、第１の封止用樹脂
と、これより溶融粘度の高い第２の封止用樹脂を備え、
上記第２の封止用樹脂で枠体部が形成され、その枠体部
の枠で囲われた空間に上記第１の封止用樹脂が充填され
ているため、第１の封止用樹脂により空気を巻き込むこ
となく半導体素子の封止ができ、第２の封止用樹脂の作
用により樹脂全体の流動面積を規制し、高密度実装に対
応しうるようになる。その上、従来のボッティングのよ
うに煩雑な工程を必要としないため対土工程が簡単にな
り、しかも封止用枠体等が不必要になるため、部品数や
工数が削減でき、その結果実装コストの大幅低減をも実
現しうるようになる。As described above, the sealing material of the present invention includes a first sealing resin and a second sealing resin having a higher melt viscosity than the first sealing resin,
A frame portion is formed of the second sealing resin, and the space surrounded by the frame of the frame portion is filled with the first sealing resin. This allows the semiconductor element to be sealed without entraining air, and the second sealing resin controls the flow area of the entire resin, making it possible to handle high-density packaging. In addition, it does not require complicated processes like conventional botting, which simplifies the soil installation process, and also eliminates the need for a sealing frame, reducing the number of parts and man-hours. It will also be possible to realize a significant reduction in implementation costs.
の実施例の警視図である。It is a police drawing of an example.
１ａ・・・封止材 １・・・第１の封止用樹脂 ２・・
・第２の封止用樹脂1a... Sealing material 1... First sealing resin 2...
・Second sealing resin
Claims (2)
２の封止用樹脂を備え、上記第２の封止用樹脂で枠体部
が形成され、その枠体部の枠で囲われた空間に上記第１
の封止用樹脂が充填されて構成されていることを特徴と
する封止材。(1) A first sealing resin and a second sealing resin having a higher melt viscosity than the first sealing resin, a frame portion is formed of the second sealing resin, and a frame of the frame portion is provided. In the space surrounded by
A sealing material characterized in that it is filled with a sealing resin.
が１０ポイズ以下のものであり、第２の封止用樹脂が、
１５０℃における溶融粘度が５０ポイズ以上のものであ
る特許請求の範囲第１項記載の封止材。(2) The first sealing resin has a melt viscosity of 10 poise or less at 150°C, and the second sealing resin has a
The sealing material according to claim 1, which has a melt viscosity of 50 poise or more at 150°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28777087A JPH01128438A (en) | 1987-11-12 | 1987-11-12 | Sealing material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28777087A JPH01128438A (en) | 1987-11-12 | 1987-11-12 | Sealing material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01128438A true JPH01128438A (en) | 1989-05-22 |
Family
ID=17721526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28777087A Pending JPH01128438A (en) | 1987-11-12 | 1987-11-12 | Sealing material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01128438A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6262513B1 (en) * | 1995-06-30 | 2001-07-17 | Kabushiki Kaisha Toshiba | Electronic component and method of production thereof |
| US6399004B1 (en) * | 1996-11-29 | 2002-06-04 | Nedcard B.V. | Method for encapsulating a chip on a carrier |
-
1987
- 1987-11-12 JP JP28777087A patent/JPH01128438A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6262513B1 (en) * | 1995-06-30 | 2001-07-17 | Kabushiki Kaisha Toshiba | Electronic component and method of production thereof |
| US6628043B2 (en) | 1995-06-30 | 2003-09-30 | Kabushiki Kaisha Toshiba | Electronic component and method of production thereof |
| US6754950B2 (en) | 1995-06-30 | 2004-06-29 | Kabushiki Kaisha Toshiba | Electronic component and method of production thereof |
| US6399004B1 (en) * | 1996-11-29 | 2002-06-04 | Nedcard B.V. | Method for encapsulating a chip on a carrier |
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