JPH01123349U - - Google Patents
Info
- Publication number
- JPH01123349U JPH01123349U JP1905588U JP1905588U JPH01123349U JP H01123349 U JPH01123349 U JP H01123349U JP 1905588 U JP1905588 U JP 1905588U JP 1905588 U JP1905588 U JP 1905588U JP H01123349 U JPH01123349 U JP H01123349U
- Authority
- JP
- Japan
- Prior art keywords
- case
- hybrid
- chambers
- divided
- partition wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004382 potting Methods 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000005192 partition Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ないし第３図はこの考案の一実施例を示
すもので、第１図はハイブリツドＩＣを挿入した
状態のケースを一部切欠いて内部も示した斜視図
、第２図はポツテイング樹脂を注入した状態の縦
断面図、第３図はケースの別の使い方を示す説明
図、第４図および第５図は従来例を示し、第４図
は従来のケースの斜視図、第５図は同じく縦断面
図である。
２１，３１…ケース、２２，３２…隔壁、２３
，３３…ポツテイング樹脂注入室、２３ａ…注入
口、２４，３４…ハイブリツドＩＣ挿入室、２４
ａ…挿入口、２５…連通部、２８，３８…ハイブ
リツドＩＣ、２９，３９…ポツテイング樹脂。
Figures 1 to 3 show an embodiment of this invention. Figure 1 is a perspective view of the case with a hybrid IC inserted, partially cut away to show the inside, and Figure 2 shows the potting resin. FIG. 3 is an explanatory diagram showing another way to use the case, FIGS. 4 and 5 show a conventional example, FIG. 4 is a perspective view of the conventional case, and FIG. 5 is a longitudinal sectional view of the injected state. It is also a vertical cross-sectional view. 21, 31... Case, 22, 32... Partition wall, 23
, 33... Potting resin injection chamber, 23a... Injection port, 24, 34... Hybrid IC insertion chamber, 24
a... Insertion port, 25... Communication portion, 28, 38... Hybrid IC, 29, 39... Potting resin.
Claims (1)
脂コーテイングを施す際に使用するハイブリツド
ＩＣ用ケースにおいて、上部を開放したケース内
を隔壁により２室に分割するとともにケースの底
部側で前記分割された２室を互いに連通させたこ
とを特徴とするハイブリツドＩＣ用ケース。 In a hybrid IC case used when applying resin coating to a hybrid IC using the case potting method, the inside of the case with an open top is divided into two chambers by a partition wall, and the two divided chambers are connected to each other on the bottom side of the case. A hybrid IC case characterized by communication.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1905588U JPH01123349U (en) | 1988-02-16 | 1988-02-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1905588U JPH01123349U (en) | 1988-02-16 | 1988-02-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01123349U true JPH01123349U (en) | 1989-08-22 |
Family
ID=31234228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1905588U Pending JPH01123349U (en) | 1988-02-16 | 1988-02-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01123349U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005204413A (en) * | 2004-01-15 | 2005-07-28 | Yaskawa Electric Corp | Vacuum-impregnating casting device for armature winding |
| WO2008010261A1 (en) * | 2006-07-18 | 2008-01-24 | Panasonic Corporation | Substrate structure, and mobile terminal |
-
1988
- 1988-02-16 JP JP1905588U patent/JPH01123349U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005204413A (en) * | 2004-01-15 | 2005-07-28 | Yaskawa Electric Corp | Vacuum-impregnating casting device for armature winding |
| JP4636226B2 (en) * | 2004-01-15 | 2011-02-23 | 株式会社安川電機 | Vacuum impregnation casting apparatus for armature winding and method for manufacturing armature winding |
| WO2008010261A1 (en) * | 2006-07-18 | 2008-01-24 | Panasonic Corporation | Substrate structure, and mobile terminal |
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