JPH0111729Y2 - - Google Patents
Info
- Publication number
- JPH0111729Y2 JPH0111729Y2 JP5267985U JP5267985U JPH0111729Y2 JP H0111729 Y2 JPH0111729 Y2 JP H0111729Y2 JP 5267985 U JP5267985 U JP 5267985U JP 5267985 U JP5267985 U JP 5267985U JP H0111729 Y2 JPH0111729 Y2 JP H0111729Y2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- tank
- stripping
- plating solution
- endless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 77
- 239000007788 liquid Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000005086 pumping Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- -1 nickel metals Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【考案の詳細な説明】
「産業上の利用分野」
この考案は、IC用リードフレーム等を連続的
にメツキする装置に関するものである。[Detailed description of the invention] "Industrial application field" This invention relates to a device for continuously plating lead frames for ICs, etc.
「従来の技術」
従来の自動メツキ装置としては、例えば第２図
に示すようなものがある。これにおいては、リー
ドフレームＦが搬送ローラ２１上に移動する間
に、メツキ槽２２に溢れるメツキ液Ｌに浸漬さ
れ、かつ電極リング２３に接触する。電極リング
２３には電源Ｓから陰極バー２４、摺動電極２５
を経て電流が伝えられる。メツキ槽２２内には、
電源Ｓにつながる陽極板２６が設けられている。
しかしてリードフレームＦは、搬送ローラ２１上
を移動する間にメツキされて送り出される。"Prior Art" As a conventional automatic plating device, there is one shown in FIG. 2, for example. In this case, while the lead frame F moves onto the conveying roller 21, it is immersed in the plating liquid L overflowing into the plating tank 22 and comes into contact with the electrode ring 23. The electrode ring 23 is connected from the power source S to the cathode bar 24 and the sliding electrode 25.
Electric current is transmitted through the Inside the plating tank 22,
An anode plate 26 connected to a power source S is provided.
Thus, the lead frame F is plated while moving on the conveyance roller 21 and sent out.
「考案が解決しようとする問題点」
上記従来のメツキ装置にあつては、電極リング
２３が常時メツキ液Ｌに浸漬されているため、同
時にメツキされてしまい、使用の継続により太く
なり、また表面に凹凸ができ、接触するリードフ
レームＦの表面を傷付けたり変形させたりするの
で、ひんぱんな交換を要するという問題点があ
る。この考案は従来の以上のような問題点を解決
しようとするものである。``Problems to be solved by the invention'' In the conventional plating device described above, the electrode ring 23 is constantly immersed in the plating liquid L, so it is plated at the same time, becomes thicker with continued use, and the surface There is a problem in that the surface of the lead frame F with which it comes in contact is damaged or deformed, requiring frequent replacement. This invention is an attempt to solve the above-mentioned conventional problems.
「問題点を解決するための手段」
この考案においては、上記従来の問題点を解決
するため、メツキ液Ｌを夫々容するメツキ槽２と
剥離槽３とを区分して設け、両槽２，３間に搬送
用の金属無端帯７を循環させ、メツキ槽２内にお
いては無端帯７を陰極性、陽極板８を陽極性とす
る一方、剥離槽３内においては無端帯７を陽極
性、陰極板９を陰極性として、メツキ槽２内にお
いて無端帯７に付着したメツキを剥離槽３内にお
いて溶解除去するようにした。"Means for Solving the Problems" In this invention, in order to solve the above-mentioned conventional problems, a plating tank 2 and a stripping tank 3 each containing plating liquid L are provided separately, and both tanks 2, An endless metal strip 7 for conveyance is circulated between the plating tank 2 and the anode plate 8, while in the plating tank 2 the endless strip 7 is cathodic and the anode plate 8 is anode. The cathode plate 9 is made cathodic, and the plating adhering to the endless strip 7 in the plating tank 2 is dissolved and removed in the peeling tank 3.
「作用」
無端帯７は、メツキ槽２内において、メツキ対
象であるリードフレームＦをメツキ液Ｌに浸漬さ
せながら搬送し、同時にメツキする。この間無端
帯７もメツキされるが、その後剥離槽３に入つて
無端帯７は、陰極板９に対して陽極性を付与され
るから、その表面のメツキ層が溶解し、陰極板９
に付着する。"Operation" The endless band 7 transports the lead frame F to be plated in the plating tank 2 while immersing it in the plating liquid L, and plating it at the same time. During this time, the endless strip 7 is also plated. After that, the endless strip 7 enters the peeling tank 3 and is given an anodic property to the cathode plate 9, so that the plating layer on its surface is dissolved and the cathode plate 9
Attach to.
「実施例」
第１図において、ケース１の上部にはメツキ液
Ｌを容するメツキ槽２が、また下部には同じメツ
キ液Ｌを容する剥離槽３が設けられている。両槽
２，３は揚液管１０によりポンプＰを介して連通
し、剥離槽３から常時メツキ槽２へメツキ液Ｌを
汲み上げてメツキ槽２から溢出させている。メツ
キ槽２から溢れ出たメツキ液Ｌは、メツキ槽下部
両側の樋４を通つて剥離槽３へ戻される。Embodiment In FIG. 1, a plating tank 2 containing a plating solution L is provided in the upper part of a case 1, and a stripping tank 3 containing the same plating solution L is provided in the lower part. Both tanks 2 and 3 are connected to each other via a pump P by a liquid lifting pipe 10, and the plating liquid L is constantly pumped up from the stripping tank 3 to the plating tank 2 and overflows from the plating tank 2. The plating liquid L overflowing from the plating tank 2 is returned to the stripping tank 3 through the gutter 4 on both sides of the lower part of the plating tank.
メツキ槽２の上部両側には、駆動スプロケツト
５と受動スプロケツト６とが設けられ、これに、
メツキ対象であるリードフレームＦを載せるため
の金属製の搬送用無端帯７が掛回されている。こ
の搬送用無端帯７は、下部が垂るんで、樋４を通
して剥離槽３に漬つている。搬送用無端帯７の上
部は、リードフレームＦと共に常時メツキ槽２か
ら溢れ出るメツキ液Ｌに浸漬されている。 A driving sprocket 5 and a passive sprocket 6 are provided on both sides of the upper part of the plating tank 2.
An endless belt 7 made of metal for transportation is wrapped around the lead frame F on which the lead frame F to be plated is placed. The endless belt 7 for conveyance has a hanging lower part and is immersed in the peeling tank 3 through the gutter 4. The upper part of the endless conveying belt 7, together with the lead frame F, is immersed in the plating liquid L constantly overflowing from the plating tank 2.
メツキ槽２内にはメツキ材料となる陽極板８が
設けられ、これが直流メツキ用電源S1の陽極側に
接続されている。そしてこのメツキ用電源S1の陰
極側にスプロケツト５が接続され、従つて、メツ
キ槽２内において、陽極板８が陽極性、無端帯７
が陰極性となる。 An anode plate 8 serving as a plating material is provided in the plating tank 2, and this is connected to the anode side of the DC plating power source S1 . A sprocket 5 is connected to the cathode side of this plating power supply S 1 , and therefore, in the plating tank 2 , the anode plate 8 is anode and the endless strip 7 is connected to the plating tank 2 .
becomes negative polarity.
一方剥離槽３内には、陰極板９が設けられ、剥
離用電源S2の陰極側に接続され、この剥離用電源
S2の陽極側にスプロケツト５が接続されている。
従つて、剥離槽２内において、無端帯７が陽極
性、陰極板９が陰極性となる。 On the other hand, a cathode plate 9 is provided in the stripping tank 3, and is connected to the cathode side of the stripping power source S2 .
Sprocket 5 is connected to the anode side of S2 .
Therefore, in the stripping tank 2, the endless strip 7 is anode and the cathode plate 9 is cathode.
なお、無端帯７としては、銅、銀、亜鉛メツキ
を青化浴で行う場合にはステンレス鋼製がよく、
ニツケルメツキの場合にはチタン製がよい。 In addition, the endless band 7 is preferably made of stainless steel when copper, silver, or zinc plating is performed in a bluing bath.
In the case of nickel metals, titanium is better.
このメツキ装置において、無端帯７上にリード
フレームＦの如きメツキ対象を載せてメツキ槽２
内のメツキ液中を移動させ、次々と連続的にメツ
キ作業を行うことができる。メツキ槽２内におい
てメツキが付着した無端帯７は、剥離槽３内のメ
ツキ液中において、陽極性を付与させるためにメ
ツキを溶解させ、再びリードフレームＦを載せて
搬送しつつメツキを行う。 In this plating device, a plating object such as a lead frame F is placed on the endless band 7 and the plating tank 2 is
The plating work can be performed continuously by moving the plating liquid inside the machine. The endless strip 7 to which the plating has adhered in the plating tank 2 is dissolved in a plating solution in the peeling tank 3 in order to give it anodic properties, and then the lead frame F is placed on it again and the endless strip 7 is plated while being transported.
「考案の効果」
この考案においては、メツキ槽２内を通過する
間にメツキを付着させた無端帯７が、剥離槽３内
においてメツキを溶解させるので、連続運転によ
つても無端帯７がメツキの積層により変形するこ
とがなく、従つて長期にわたり良好なメツキ作業
を行うことができるという効果を有する。"Effect of the invention" In this invention, the endless strip 7 to which the plating was attached while passing through the plating tank 2 dissolves the plating in the peeling tank 3, so that the endless strip 7 can be removed even during continuous operation. There is no deformation due to the lamination of plating, so it has the effect that good plating work can be performed for a long period of time.
第１図は本考案の断面図、第２図は従来例の断
面図である。
１……ケース、２……メツキ槽、３……剥離
槽、５……駆動スプロケツト、６……受動スプロ
ケツト、７……搬送用無端帯、８……陽極板、９
……陰極板、１０……揚液管、Ｆ……リードフレ
ーム、Ｌ……メツキ液、Ｐ……ポンプ、S1……メ
ツキ用電源、S2……剥離用電源。
FIG. 1 is a sectional view of the present invention, and FIG. 2 is a sectional view of a conventional example. DESCRIPTION OF SYMBOLS 1... Case, 2... Plating tank, 3... Peeling tank, 5... Drive sprocket, 6... Passive sprocket, 7... Endless belt for conveyance, 8... Anode plate, 9
... Cathode plate, 10 ... Lifting tube, F ... Lead frame, L ... Plating liquid, P ... Pump, S 1 ... Power supply for plating, S 2 ... Power supply for stripping.
Claims (1)
て設けられた同じメツキ液を容する剥離槽と、
メツキ槽と剥離槽のメツキ液中を順次通過して
循環するようにスプロケツトに掛回されメツキ
槽内においてはメツキ対象を載せてメツキ液中
を搬送可能な金属製の搬送用無端帯と、メツキ
槽内のメツキ液中に設けられた陽極板と、剥離
槽内のメツキ液中に設けられた陰極板と、メツ
キ槽内において無端帯に陰極性を陽極板に陽極
性電位を付与するメツキ電源と、剥離槽内にお
いて無端帯に陽極性を陰極板に陰極性電位を付
与する剥離用電源とを具備し、メツキ槽におい
て無端帯に付着したメツキを剥離槽において溶
解除去することを特徴とする自動メツキ装置。 (2) 前記剥離槽が、前記メツキ槽から溢出するメ
ツキ液を受けるようにメツキ槽の下部に設けら
れ、剥離槽からメツキ液を汲み上げてメツキ槽
から常時溢出させるように両槽は揚液管により
ポンプを介して連通され、メツキ槽の上部両側
には前記スプロケツトが１対設けられ、このス
プロケツトに無端帯が掛回され、それの下部は
剥離槽内のメツキ液中に垂下している実用新案
登録請求の範囲第(1)項に記載の自動メツキ装
置。[Scope of Claim for Utility Model Registration] (1) A plating tank containing a plating solution, and a stripping tank provided adjacent to the plating tank containing the same plating solution,
An endless belt for conveying metal, which is hung around a sprocket so as to pass sequentially through the plating solution in the plating tank and the stripping tank and circulate in the plating solution, and in the plating tank, the plating object can be placed on it and transported through the plating solution. An anode plate provided in the plating solution in the plating tank, a cathode plate provided in the plating solution in the stripping tank, and a plating power supply that applies a cathodic potential to the endless band and an anodic potential to the anode plate in the plating tank. and a stripping power supply that applies an anodic potential to the endless strip and a cathodic potential to the cathode plate in the stripping tank, and dissolves and removes plating attached to the endless strip in the stripping tank. Automatic plating device. (2) The stripping tank is provided at the bottom of the plating tank so as to receive the plating solution overflowing from the plating tank, and both tanks are provided with pumping pipes so that the plating solution is pumped up from the stripping tank and constantly overflowing from the plating tank. A pair of sprockets are provided on both sides of the upper part of the plating tank, and an endless band is wrapped around the sprocket, the lower part of which hangs down into the plating liquid in the stripping tank. An automatic plating device according to claim (1) of patent registration.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5267985U JPH0111729Y2 (en) | 1985-04-09 | 1985-04-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5267985U JPH0111729Y2 (en) | 1985-04-09 | 1985-04-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61168171U JPS61168171U (en) | 1986-10-18 |
| JPH0111729Y2 true JPH0111729Y2 (en) | 1989-04-06 |
Family
ID=30572847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5267985U Expired JPH0111729Y2 (en) | 1985-04-09 | 1985-04-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0111729Y2 (en) |
-
1985
- 1985-04-09 JP JP5267985U patent/JPH0111729Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61168171U (en) | 1986-10-18 |
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