JPH01113910A - Thin film magnetic head - Google Patents
Thin film magnetic headInfo
- Publication number
- JPH01113910A JPH01113910A JP27008487A JP27008487A JPH01113910A JP H01113910 A JPH01113910 A JP H01113910A JP 27008487 A JP27008487 A JP 27008487A JP 27008487 A JP27008487 A JP 27008487A JP H01113910 A JPH01113910 A JP H01113910A
- Authority
- JP
- Japan
- Prior art keywords
- signal coil
- coil
- signal
- insulating layer
- magnetic layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims description 13
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 239000004020 conductor Substances 0.000 abstract description 18
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 54
- 239000010408 film Substances 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 238000007740 vapor deposition Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000992 sputter etching Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、ＶＴＲに好適な薄膜磁気ヘッドに関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a thin film magnetic head suitable for a VTR.
従来の薄膜磁気ヘッドは１例えば特開昭６１−１７７６
１４号公報記載のものがあげられる。これを第４図に断
面図で示しである。１は基板、２は下部磁性層で、この
下部磁性層２に設けられた溝２ａ内に信号コイル４が絶
縁層６を介して埋込まれている。さらに、絶縁層６及び
、下部磁性層２上には上部磁性層５が形成されている。The conventional thin film magnetic head is 1, for example, Japanese Patent Application Laid-Open No. 61-1776.
Examples include those described in Publication No. 14. This is shown in cross-section in FIG. 1 is a substrate, 2 is a lower magnetic layer, and a signal coil 4 is embedded in a groove 2a provided in the lower magnetic layer 2 with an insulating layer 6 interposed therebetween. Further, an upper magnetic layer 5 is formed on the insulating layer 6 and the lower magnetic layer 2.
この上部磁性層５は絶縁層６に穿けられたスルーホール
７．８によって、一方は磁気的に下部磁性層２に接続さ
れ、他方はギャップ用絶縁層３を介して接続されている
。この絶縁層３がギャップを形成している。One side of this upper magnetic layer 5 is magnetically connected to the lower magnetic layer 2 by a through hole 7.8 made in the insulating layer 6, and the other side is connected via the gap insulating layer 3. This insulating layer 3 forms a gap.
ところが、上記した従来の技術は、信号コイル４埋込用
に形成した溝２ａの平坦部しか信号コイル４の形成に利
用していなかったため、信号コイル４の低抵抗化に限界
があるという問題点があった。 ′
本発明の目的は、かかる問題点を解消し、溝の斜面部も
信号コイルを形成するスペースとして利用することによ
り、信号コイルの低抵抗化ができる薄膜磁気ヘッドを提
供することにある。However, the above-mentioned conventional technique has a problem in that only the flat part of the groove 2a formed for embedding the signal coil 4 is used for forming the signal coil 4, and therefore there is a limit to how low the resistance of the signal coil 4 can be made. was there. ' An object of the present invention is to provide a thin film magnetic head which solves this problem and allows the resistance of the signal coil to be reduced by utilizing the sloped portion of the groove as a space for forming the signal coil.
上記目的を達成するために１本発明は、非磁性基板上に
形成された下部磁性層に、絶縁層、信号コイルを積層し
、ギャップ用絶縁層を介して前記下部磁性層と接続され
る上部磁性層を形成して成る薄膜磁気ヘッドにおいて、
信号コイルの一部を、信号コイル埋込用に形成した溝の
斜面部にも形成した構成にしである。In order to achieve the above object, the present invention comprises laminating an insulating layer and a signal coil on a lower magnetic layer formed on a non-magnetic substrate, and an upper part connected to the lower magnetic layer via a gap insulating layer. In a thin film magnetic head formed by forming a magnetic layer,
A part of the signal coil is also formed on the sloped surface of the groove formed for embedding the signal coil.
本発明の薄膜磁気ヘッドは、上記のように信号コイル埋
込用に形成された溝の斜面図にも信号コイルを形成する
ことによって、上記従来例と比べ信号コイルを形成する
スペースが広くなる。したがって、上記従来例と同じ導
体膜厚、ターン数であっても、コイル幅を大きくできる
ので、コイル抵抗は低下する。また、このようにコイル
幅を大きくできるので、抵抗値を変えることなく導体膜
厚を減らすことができ、信号コイルのエツチングを高精
度に行なうことができる。In the thin film magnetic head of the present invention, the signal coil is formed also in the oblique view of the groove formed for embedding the signal coil as described above, so that the space for forming the signal coil is larger than that of the conventional example. Therefore, even if the conductor film thickness and number of turns are the same as in the conventional example, the coil width can be increased, and the coil resistance is reduced. Furthermore, since the coil width can be increased in this way, the conductor film thickness can be reduced without changing the resistance value, and the signal coil can be etched with high precision.
以下、本発明の実施例を図面によって説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第１図は本発明による薄膜磁気ヘッドの一実施例を示す
斜視図であって、４ａはコイル導体の最外周部、４ｂは
コイル導体の最内周部、９は埋込用絶縁層であり、第４
図に対応する部分には同一符号をつけている。なお、第
１図では、コイル導体用絶縁層６，２層目の信号コイル
４．及び上部磁性層５は省略している。FIG. 1 is a perspective view showing an embodiment of the thin film magnetic head according to the present invention, in which 4a is the outermost circumference of the coil conductor, 4b is the innermost circumference of the coil conductor, and 9 is an insulating layer for embedding. , 4th
Parts corresponding to the figures are given the same reference numerals. In FIG. 1, the coil conductor insulating layer 6, the second layer signal coil 4. and the upper magnetic layer 5 are omitted.
第２図は第１図中Ａ方向から見た断面図であって、第１
図に対応する部分には同一符号をつけている。FIG. 2 is a sectional view seen from direction A in FIG.
Parts corresponding to the figures are given the same reference numerals.
第３図は本発明による薄膜磁気ヘッドの一実施例の製造
方法を説明する断面図であって、第１図に対応する部分
には同一符号をつけている。FIG. 3 is a sectional view illustrating a method of manufacturing an embodiment of a thin film magnetic head according to the present invention, and parts corresponding to those in FIG. 1 are given the same reference numerals.
第１図において、非磁性基板１上には下部磁性層２が形
成されており、この下部磁性層２は埋込用絶縁層９によ
り埋込まれている。この下部磁性層２には信号コイル埋
込用溝２ａが形成され、この溝２ａにコイル導体から成
る信号コイル４．及びコイル導体用絶縁層６が積層され
ている。さらに、絶縁層６及び、下部磁性層２上には上
部磁性層５が形成されている。この上部磁性層５は絶縁
層６に設けられたスルーホール８により下部磁性層２と
磁気的に接続されている。また、絶縁層６に設けられた
スルーホール７により上部磁性層５と下部磁性層２はギ
ャップ用絶縁層３を介して接続され、ギャップを形成し
である。In FIG. 1, a lower magnetic layer 2 is formed on a non-magnetic substrate 1, and this lower magnetic layer 2 is embedded with an insulating layer 9 for embedding. A signal coil embedding groove 2a is formed in the lower magnetic layer 2, and a signal coil 4 made of a coil conductor is formed in this groove 2a. and a coil conductor insulating layer 6 are laminated. Further, an upper magnetic layer 5 is formed on the insulating layer 6 and the lower magnetic layer 2. This upper magnetic layer 5 is magnetically connected to the lower magnetic layer 2 through a through hole 8 provided in an insulating layer 6. Further, the upper magnetic layer 5 and the lower magnetic layer 2 are connected via the gap insulating layer 3 by a through hole 7 provided in the insulating layer 6, thereby forming a gap.
本実施例においては、信号コイル４の最外周部４ａと最
内周部４ｂが、信号コイル形成用に設けられた溝２ａの
斜面部２ｂ、２ｂに接するように形成されている。In this embodiment, the outermost peripheral part 4a and the innermost peripheral part 4b of the signal coil 4 are formed so as to be in contact with the slope parts 2b, 2b of the groove 2a provided for forming the signal coil.
このように構成した上記実施例の製造方法を第３図に基
づいて次に説明する。The manufacturing method of the above-mentioned embodiment configured in this way will be explained below with reference to FIG.
まず、非磁性基板１上に下部磁性層２を、第３図（ａ）
に示すように、ウェットエツチング、イオンエツチング
法などによって形成する。次に、蒸着法、スパッタリン
グ法などによって下部磁性層２を絶縁層９で埋込み、ラ
ップにより平坦化した後、信号コイル形成用の溝２ａを
形成する（第３図（ｂ）参照）。次に、コイル導体用絶
縁層６を蒸着法、あるいはスパッタリング法で形成した
後、蒸着法、あるいはスパッタリング法によりコイル導
体として比抵抗の小さいＣｕやＡｕを形成して信号コイ
ル４となす、このとき、ＣｕやＡｕの付着力を高めるた
めに接着層としてＣｒを用い、Ｃｒ ／ Ｃｕ ／ Ｃ
ｒやＣｒ ／ Ａ ｕ ／ Ｃｒなどのような三層構造
としてもよい、さらに、信号コイル４をラップにより平
坦化した後、イオンエツチング等によりコイル状に形成
する（第３図（ｃ）参照）。First, a lower magnetic layer 2 is placed on a non-magnetic substrate 1 as shown in FIG. 3(a).
As shown in FIG. 2, it is formed by wet etching, ion etching, or the like. Next, the lower magnetic layer 2 is filled with an insulating layer 9 by a vapor deposition method, a sputtering method, etc., and after flattening by lapping, a groove 2a for forming a signal coil is formed (see FIG. 3(b)). Next, after forming the insulating layer 6 for the coil conductor by a vapor deposition method or a sputtering method, Cu or Au having a low specific resistance is formed as a coil conductor by a vapor deposition method or a sputtering method to form the signal coil 4. , Cr is used as an adhesive layer to increase the adhesion of Cu and Au, and Cr/Cu/C
It may be a three-layer structure such as R, Cr/Au/Cr, etc. Furthermore, after the signal coil 4 is flattened by lapping, it is formed into a coil shape by ion etching or the like (see Fig. 3(c)). .
次に、コイル導体用絶縁層６、信号コイル４．コイル導
体用絶縁層６を順次積層し、スルーホール７．８を形成
する（第３図（ｄ）参照）。次に、ギャップ用絶縁層３
を蒸着法やスパッタリング法により形成した後、上部磁
性層５を蒸着法やスパッタリング法により形成し、イオ
ンエツチングによって所望の形状を得る（第３図（ｅ）
参照）。Next, a coil conductor insulating layer 6, a signal coil 4. The coil conductor insulating layers 6 are sequentially laminated to form through holes 7.8 (see FIG. 3(d)). Next, the gap insulation layer 3
After forming the upper magnetic layer 5 by vapor deposition or sputtering, the upper magnetic layer 5 is formed by vapor deposition or sputtering, and the desired shape is obtained by ion etching (Fig. 3(e)).
reference).
なお、上記実施例の製造方法では、下部磁性層２を蒸着
法もしくはスパッタリング法によって膜形成後、イオン
エツチング等によって所望の形状を得、その後、絶縁層
６で埋込むという方法をとったが、下部磁性層２はただ
膜形成するだけで。In the manufacturing method of the above embodiment, the lower magnetic layer 2 was formed by vapor deposition or sputtering, and then the desired shape was obtained by ion etching, etc., and then the insulating layer 6 was filled. The lower magnetic layer 2 is simply formed as a film.
その後のイオンエツチング、絶縁層６を形成する工程を
省き、上部磁性層５でトラック幅を決定するという方法
でもよい。It is also possible to omit the subsequent steps of ion etching and forming the insulating layer 6 and to determine the track width using the upper magnetic layer 5.
このように構成した上記実施例にあっては、信号コイル
４埋込用に形成された溝２ａの斜面部２ｂにも信号コイ
ル４を形成することによって、上記従来例と比べ信号コ
イル４を形成するスペースが広くなる。したがって、従
来例と同じ導体膜厚ターン数であっても、コイル幅を大
きくできるのでコイル抵抗は低下する。また、コイル幅
が大きくなることにより抵抗値を変えることなく導体膜
厚を減らすことができ、信号コイル４のエツチングを高
精度に行なうことができる。In the above-described embodiment configured in this way, the signal coil 4 is formed also on the slope portion 2b of the groove 2a formed for embedding the signal coil 4, compared to the above-mentioned conventional example. There will be more space to do so. Therefore, even if the conductor film thickness and number of turns are the same as in the conventional example, the coil width can be increased and the coil resistance is reduced. Further, by increasing the coil width, the conductor film thickness can be reduced without changing the resistance value, and the signal coil 4 can be etched with high precision.
以上説明したように１本発明によれば、信号コイル形成
のスペースが広くなり、コイル幅を大きくすることがで
きるので、信号コイルの抵抗低減をできる。そして、信
号コイルの抵抗を低減できるので、抵抗値を変えること
なく導体膜厚を減らせ、信号コイルのエツチングも高精
度に行なうことが可能になる。As explained above, according to the present invention, the space for forming the signal coil becomes larger and the coil width can be increased, so that the resistance of the signal coil can be reduced. Since the resistance of the signal coil can be reduced, the conductor film thickness can be reduced without changing the resistance value, and the signal coil can be etched with high precision.
第１図は本発明による薄膜磁気ヘッドの一実施例を示す
斜視図、第２図は第１図中の入方向から見た断面図、第
３図（ａ）〜（ｅ）は本発明による薄膜磁気ヘッドの製
造方法の各工程を示す断面図、第４図は従来の薄膜磁気
ヘッドの一例を示す断面図である。
１・・・非磁性基板、２・・・下部磁性層、３・・・ギ
ャップ用絶縁層、４・・・信号コイル、５・・・上部磁
性層。
６・・・導体用絶縁層、７，８・・・スルーホール。
萬２ 圏
Ｚｂ ｌ ４ＣＬ ４ ２（ｚ＋ｂ萬３ 口
（α）
（ｄ）FIG. 1 is a perspective view showing an embodiment of the thin film magnetic head according to the present invention, FIG. 2 is a sectional view seen from the entrance direction in FIG. 1, and FIGS. 3(a) to (e) are according to the present invention. FIG. 4 is a cross-sectional view showing each step of a method for manufacturing a thin-film magnetic head, and FIG. 4 is a cross-sectional view showing an example of a conventional thin-film magnetic head. DESCRIPTION OF SYMBOLS 1...Nonmagnetic substrate, 2...Lower magnetic layer, 3...Gap insulating layer, 4...Signal coil, 5...Upper magnetic layer. 6... Insulating layer for conductor, 7, 8... Through hole.萬2 area Zb l 4CL 4 2(z+b 萬3 口(α) (d)
Claims (1)
信号コイルを積層し、ギャップ用絶縁層を介して前記下
部磁性層と接続される上部磁性層を形成して成る薄膜磁
気ヘッドにおいて、前記信号コイルの一部を、信号コイ
ル埋込用に形成した溝の斜面部に形成したことを特徴と
する薄膜磁気ヘッド。1. An insulating layer on the lower magnetic layer formed on the non-magnetic substrate,
In a thin film magnetic head comprising stacked signal coils and an upper magnetic layer connected to the lower magnetic layer via a gap insulating layer, a part of the signal coil is formed for embedding the signal coil. A thin film magnetic head characterized in that it is formed on the slope of a groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27008487A JPH01113910A (en) | 1987-10-28 | 1987-10-28 | Thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27008487A JPH01113910A (en) | 1987-10-28 | 1987-10-28 | Thin film magnetic head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01113910A true JPH01113910A (en) | 1989-05-02 |
Family
ID=17481308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27008487A Pending JPH01113910A (en) | 1987-10-28 | 1987-10-28 | Thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01113910A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6025977A (en) * | 1994-12-30 | 2000-02-15 | International Business Machines Corporation | Combined magnetoresistive (MR) read and inductive write head with sunken write coil |
| JP2007220539A (en) * | 2006-02-17 | 2007-08-30 | Toshiba Lighting & Technology Corp | Lighting fixture |
-
1987
- 1987-10-28 JP JP27008487A patent/JPH01113910A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6025977A (en) * | 1994-12-30 | 2000-02-15 | International Business Machines Corporation | Combined magnetoresistive (MR) read and inductive write head with sunken write coil |
| US6156375A (en) * | 1994-12-30 | 2000-12-05 | International Business Machines Corporation | Method of making read/write magnetoresistive (MR) head with sunken components |
| JP2007220539A (en) * | 2006-02-17 | 2007-08-30 | Toshiba Lighting & Technology Corp | Lighting fixture |
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