JPH0111372Y2 - - Google Patents
Info
- Publication number
- JPH0111372Y2 JPH0111372Y2 JP1981044490U JP4449081U JPH0111372Y2 JP H0111372 Y2 JPH0111372 Y2 JP H0111372Y2 JP 1981044490 U JP1981044490 U JP 1981044490U JP 4449081 U JP4449081 U JP 4449081U JP H0111372 Y2 JPH0111372 Y2 JP H0111372Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- axis
- chamfering
- spindle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 description 9
- 238000003754 machining Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 1
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- Milling Processes (AREA)
Description
【考案の詳細な説明】
本考案は、プリント基板、特に端子付きプリン
ト基板の両面取り加工機に関する。[Detailed Description of the Invention] The present invention relates to a double-sided cutting machine for printed circuit boards, particularly printed circuit boards with terminals.
端子付きプリント基板は、図面の第１図乃至第
３図に例示するように、プリント基板の１つない
し複数の側縁に端子Ｔを形成し、これを例えばバ
ツクボードなどのコネクタ（図示せず）に挿入接
続できるようにしたものである。かかる端子付き
プリント基板においては、コネクタへの挿抜を円
滑にするために側縁部の両面を第３図に符号S1，
S2で示す如く面取り加工する必要がある。 As illustrated in FIGS. 1 to 3 of the drawings, a printed circuit board with a terminal has a terminal T formed on one or more side edges of the printed circuit board, and is connected to a connector (not shown) such as a backboard. It is designed so that it can be inserted and connected to. In such a printed circuit board with terminals, both sides of the side edges are marked with symbols S 1 and 1 in FIG.
It is necessary to chamfer as shown in S 2 .
このようなプリント基板の面取り加工におい
て、従来は、往復移動可能なプリント基板保持テ
ーブルと１つの面取り加工用スピンドルとを有す
る面取り加工機を用いて、テーブルの往動時にそ
れぞれ片面ずつ面取り加工していた。この方式で
は一面側の面取り加工をした後、テーブルを初期
位置に復動させ、プリント基板を裏返しにセツト
し直した後に再びテーブルを往動させて反対面側
の面取り加工を行う必要がある。すなわち、両面
取り加工にテーブルを２往復させる必要があり、
しかも途中でプリント基板をセツトし直す手作業
が必要であり、作業能率が悪いという問題があ
る。また、プリント基板の形状には第１図に示す
山形形状や第２図に示す直線形状など種々の形状
があり、特に第１図の山形のような複雑な形状の
場合は最初のセツト時及びセツトし直すときの位
置合せが非常に面倒であり、更に能率が低下す
る。 Conventionally, in chamfering of such printed circuit boards, a chamfering machine having a reciprocating printed circuit board holding table and one chamfering spindle is used to chamfer one side of each side as the table moves forward. Ta. In this method, after chamfering one side, it is necessary to move the table back to the initial position, turn the printed circuit board over again, and then move the table forward again to chamfer the opposite side. In other words, it is necessary to move the table back and forth twice for double-sided machining.
Moreover, it is necessary to manually reset the printed circuit board midway through the process, resulting in a problem of poor work efficiency. In addition, there are various shapes of printed circuit boards, such as the chevron shape shown in Figure 1 and the linear shape shown in Figure 2. In particular, in the case of a complicated shape such as the chevron shape shown in Figure 1, it is difficult to Positioning when resetting is very troublesome, further reducing efficiency.
従つて本考案の目的は、これらの問題を解消す
ること、すなわち端子付きプリント基板の両面取
り加工を１回のプリント基板セツト作業及び１回
のテーブル往復動作によつて行うことのできるプ
リント基板の両面取り加工機を実現することにあ
る。 Therefore, the purpose of the present invention is to solve these problems, that is, to develop a printed circuit board that can perform double-sided machining of a printed circuit board with terminals by one operation of setting the printed circuit board and one reciprocating operation of the table. The goal is to realize a double-sided processing machine.
以下、本考案について実施例に基づき図面を参
照して詳細に説明する。 Hereinafter, the present invention will be described in detail based on embodiments with reference to the drawings.
第４図は本考案によるプリント基板の両面取り
加工機（以下単に「加工機」と称する）の概略平
面図であり、第５図は第４図の矢印Ａ方向からみ
た概略側面図である。この加工機は、基本的に
は、プリント基板Ｐを保持するテーブル１と、そ
れぞれ先端に専用の面取り工具を取り付けた２つ
のスピンドル２，３とから成つている。プリント
基板Ｐはテーブル１上に、面取り加工すべき側縁
５をテーブル端から突き出した状態でセツトさ
れ、クランプ４によつて固定保持される。テーブ
ル１はプリント基板側縁５に平行なＸ軸及びＸ軸
に直角でプリント基板面に平行なＹ軸の方向へそ
れぞれ往復移動可能である。これにより後述する
ように種々の形状のプリント基板側縁をスピンド
ル２，３の先端工具に沿つて移動させることがで
きる。この場合、テーブル１の移動は、プリント
基板側縁と同形状のカム板に倣わせる倣い方式に
よつて容易に且つ正確に行うことができる。 FIG. 4 is a schematic plan view of a double-sided processing machine for printed circuit boards (hereinafter simply referred to as "processing machine") according to the present invention, and FIG. 5 is a schematic side view as viewed from the direction of arrow A in FIG. 4. This processing machine basically consists of a table 1 that holds a printed circuit board P, and two spindles 2 and 3 each having a dedicated chamfering tool attached to its tip. The printed circuit board P is set on the table 1 with the side edge 5 to be chamfered protruding from the edge of the table, and is fixedly held by the clamp 4. The table 1 is capable of reciprocating in the directions of the X axis parallel to the side edge 5 of the printed circuit board and the Y axis perpendicular to the X axis and parallel to the surface of the printed circuit board. This allows the side edges of printed circuit boards of various shapes to be moved along the tip tools of the spindles 2 and 3, as will be described later. In this case, the table 1 can be easily and accurately moved by a tracing method in which the table 1 is traced by a cam plate having the same shape as the side edge of the printed circuit board.
一方、スピンドル２，３はＸ軸の方向へ配設さ
れ、それぞれスピンドル台６及び７（第５図）で
支承されている。図から明らかなように、スピン
ドル２，３の軸線２ａ，３ａはいずれもＸ軸およ
びＹ軸のなすＸ−Ｙ平面内で見てＸ軸およびＹ軸
の各々に対して45度の角度をなし（第４図）、か
つＸ−Ｙ平面に対して所要の面取り角度に相当す
る角度をなしており（第５図）、且つ両軸線２ａ，
３ａは左右（第４図）及び上下（第５図）におい
て逆向きとなつている。この配置構造は、工具の
特性及びスピンドルの回転方向を考慮したもので
あり、これについては後述する。スピンドル台
６，７は２つのシリンダ８（図示は１つのみ）に
よつてそれぞれ別個にＹ軸方向へ移動することが
でき、これによりスピンドル２，３は第４図に示
すようにそれぞれ実線で示す面取り加工位置２，
３と点線で示す待機位置２′，３′との間を移動す
ることができる。尚、第５図においては、図示の
都合上、両スピンドル２，３を面取り加工位置に
図示してある。 On the other hand, the spindles 2 and 3 are arranged in the direction of the X-axis and supported by spindle stands 6 and 7 (FIG. 5), respectively. As is clear from the figure, the axes 2a and 3a of the spindles 2 and 3 form an angle of 45 degrees with respect to each of the X and Y axes when viewed within the X-Y plane formed by the X and Y axes. (Fig. 4), and forms an angle corresponding to the required chamfering angle with respect to the X-Y plane (Fig. 5), and both axes 2a,
3a is oriented in opposite directions on the left and right (FIG. 4) and on the top and bottom (FIG. 5). This arrangement takes into account the characteristics of the tool and the direction of rotation of the spindle, which will be described later. The spindle stands 6 and 7 can be moved independently in the Y-axis direction by two cylinders 8 (only one is shown), and the spindles 2 and 3 are thereby moved as indicated by solid lines in FIG. Chamfering position 2 shown
3 and standby positions 2' and 3' indicated by dotted lines. In FIG. 5, for convenience of illustration, both spindles 2 and 3 are shown in the chamfering position.
次に上記の加工機によるプリント基板の面取り
加工について説明する。 Next, chamfering of a printed circuit board using the above processing machine will be explained.
一例として、第２図に示すような側縁が直線形
状のプリント基板の場合について説明する。この
場合は、直線形状のカム板を用いてテーブル１を
倣い運動させる。加工開始に当り、まず第１スピ
ンドル２を面取り加工位置に前進させ、第２スピ
ンドル３は待機位置３′へ後退させておく。この
状態でテーブル１が第６図ａで矢印X1方向へ往
動（第４図で左方向）すると、第１スピンドル２
の先端工具によりプリント基板側縁部５の下面側
の面取り加工S2（第３図参照）が行われる。次に、
第１スピンドル２を面取り加工位置から待機位置
２′に後退させ、第２スピンドル３を待機位置
３′から面取り加工位置へ前進させる。この状態
でテーブル１が第６図ｂで矢印X2方向へ復動
（第４図で右方向）すると、第２スピンドル３の
先端工具によつてプリント基板側縁５の上面側の
面取り加工S1（第３図参照）が行われる。このよ
うにして、テーブル１のＸ軸方向への１往復動作
によつて両面取り加工S1，S2が行われる。テーブ
ル復動時の面取り加工S1を行う際、プリント基板
Ｐを裏返しにセツトし直す必要はない。尚、面取
り加工S1，S2の面取り量は基本的にはプリント基
板Ｐのセツト位置によつて決まるが、スピンドル
２，３を第５図において上下方向に調整すること
によつて面取り量を調整することができる。な
お、スピンドル２，３の回転方向は第６図に符号
Ｎで示すようにいずれも工具先端側から見て同じ
反時計方向であり、面取り加工具はそれぞれプリ
ント基板Ｐの往動方向X1および復動方向X2に倣
う方向に回転してプリント基板の側縁を面取り加
工する。このような面取り加工は、プリント基板
の切削面を削り下げる（ダウンカツト）ものであ
り、バリが発生しにくく、また基板上の端子の剥
がれが生じにくいという特長がある。 As an example, a case of a printed circuit board with straight side edges as shown in FIG. 2 will be described. In this case, the table 1 is moved in a tracing manner using a linear cam plate. Before starting machining, first the first spindle 2 is advanced to the chamfering position, and the second spindle 3 is retreated to the standby position 3'. In this state, when the table 1 moves forward in the direction of arrow X1 in Figure 6a (leftward in Figure 4), the first spindle 2
A chamfering process S 2 (see FIG. 3) is performed on the lower surface side of the printed circuit board side edge 5 using the tip tool. next,
The first spindle 2 is moved back from the chamfering position to the standby position 2', and the second spindle 3 is advanced from the standby position 3' to the chamfering position. In this state, when the table 1 moves back in the direction of arrow X 2 (rightward in FIG. 4) as shown in FIG. 1 (see Figure 3) is performed. In this way, double-sided chamfering processes S 1 and S 2 are performed by one reciprocating movement of the table 1 in the X-axis direction. When performing the chamfering process S1 when the table moves back, there is no need to turn the printed circuit board P over again. The amount of chamfering in the chamfering processes S 1 and S 2 is basically determined by the set position of the printed circuit board P, but the amount of chamfering can be adjusted by adjusting the spindles 2 and 3 in the vertical direction as shown in FIG. Can be adjusted. The rotational directions of the spindles 2 and 3 are the same counterclockwise direction when viewed from the tool tip side, as shown by the symbol N in FIG. 6, and the chamfering tools are rotated in the forward movement direction Rotate in the direction following the backward movement direction X 2 to chamfer the side edges of the printed circuit board. This type of chamfering involves cutting down the cut surface of the printed circuit board (down cutting), and has the advantage that burrs are less likely to occur and terminals on the board are less likely to peel off.
第二の例として、第１図に示すような側縁が山
形形状のプリント基板Ｐの場合について説明す
る。この場合は基本的には上記第１例の場合と同
様であり、相違点は側縁が山形であるからこれと
同一の形状のカム板を用いてテーブル１を倣い運
動させる点だけである。このように、種々の形状
のプリント基板側縁をそれと相応する形状のカム
板を用いることによつて全く同様の工程で面取り
加工を行うことができる。 As a second example, a case will be described in which the printed circuit board P has side edges having a chevron shape as shown in FIG. This case is basically the same as the first example, and the only difference is that since the side edges are chevron-shaped, a cam plate of the same shape is used to move the table 1 in a tracing manner. In this way, the side edges of printed circuit boards of various shapes can be chamfered in exactly the same process by using cam plates of corresponding shapes.
上記のような本考案の面取り加工機によれば、
以下のような効果が得られる。 According to the chamfering machine of the present invention as described above,
The following effects can be obtained.
まず、面取り加工用スピンドルを２つ具備し、
プリント基板の往動および復動ごとにそれぞれの
スピンドルで片面ずつ面取りするので、プリント
基板側縁の両面取り加工をプリント基板保持テー
ブルの１往復動作によつて行うことができる。し
かも、この間、途中の往動と復動の転換時にプリ
ント基板をセツトし直す必要がない。従つて加工
時間が短く且つ作業が簡略化されるので非常に能
率的である。特に第１図に示す山形形状のプリン
ト基板においては、面倒な位置合わせを必要とす
るテーブルへのセツトが簡略化されるので、能率
がより向上する。 First, it is equipped with two spindles for chamfering,
Since each spindle chamfers one side each time the printed circuit board moves forward and backward, chamfering on both sides of the printed circuit board side edge can be performed by one reciprocating movement of the printed circuit board holding table. Moreover, during this time, there is no need to reset the printed circuit board when switching between forward and backward movements. Therefore, the machining time is short and the work is simplified, making it very efficient. Particularly in the case of the chevron-shaped printed circuit board shown in FIG. 1, the setting on the table, which requires troublesome positioning, is simplified, so efficiency is further improved.
また、プリント基板の往動および復動ごとにそ
れぞれのスピンドルで片面ずつ面取りする点に
は、品質の良い面取り加工が得られ、しかも構造
の簡略化が図れるという利点がある。つまり、面
取り加工用スピンドルを２つ使用する場合には、
例えば往動時に両スピンドルを同時駆動して両面
を同時に面取りする方法が考えられるが、この方
法では、両面ともに前述のようなダウンカツトの
面取り加工を行つてバリや端子の剥がれを生じに
くくするためには、両方のスピンドルの回転方向
を互いに逆にする必要があり、従つてそれぞれの
スピンドルの駆動系や工具チヤツクなどの構造を
同じにできないという問題がある。これに対し
て、本考案では、プリント基板の往動および復動
ごとにそれぞれのスピンドルで片面ずつ面取りす
ることにより、上記のように２つのスピンドルの
回転方向を互いに同じにして、なおかつ両面とも
ダウンカツトの面取り加工を行うことが可能であ
ることから、バリや端子の剥がれが発生しにく
く、品質の良い面取り加工が得られ、しかも駆動
系や工具チヤツクなどの構造を全く同じにできて
加工機の設計およびコストの点でも非常に有利で
ある。 Further, chamfering one side by each spindle each time the printed circuit board moves forward and backward has the advantage that high-quality chamfering can be obtained and the structure can be simplified. In other words, when using two spindles for chamfering,
For example, it is possible to simultaneously drive both spindles during forward movement to chamfer both sides at the same time, but in this method, both sides are down-cut chamfered as described above to prevent burrs and terminal peeling. In this case, it is necessary to reverse the rotation directions of both spindles, and therefore there is a problem that the structures of the drive systems and tool chucks of the respective spindles cannot be made the same. In contrast, in the present invention, by chamfering one side with each spindle for each forward and backward movement of the printed circuit board, the rotation direction of the two spindles can be made the same as described above, and both sides can be down-cut. Because it is possible to perform chamfering on the machine, burrs and terminal peeling are less likely to occur, and high-quality chamfering can be obtained.Furthermore, the structure of the drive system and tool chuck can be made exactly the same, making it easier to use the processing machine. It is also very advantageous in terms of design and cost.
更に、２つのスピンドルをプリント基板側縁に
対し、それぞれの軸線がＸ軸およびＹ軸のなすＸ
−Ｙ平面内で見てＸ軸およびＹ軸の各々に対して
45度の角度をなし、かつＸ−Ｙ平面に対して所要
の面取り角度に相当する角度をなす状態で配設し
てあることから、面取り加工時におけるプリント
基板側縁の端子Ｐの基板からの剥がれを更に一層
低減しうるという効果が得られる。つまり、例え
ばスピンドルをその軸線がＸ軸に直角で、Ｙ軸に
対してのみ面取り角度に相当する角度をなしてい
る構造の場合、プリント基板送り方向において後
行側のプリント基板端子縁部がアツプカツト状態
となり、基板からの剥がれが生じ易い。しかるに
本考案の場合、Ｘ−Ｙ平面（第４図の図紙面）内
で見てＸ軸およびＹ軸に対して45の角度をなして
いることから、上記のようなアツプカツト状態が
緩和され、基板からの端子の剥がれが生じにくく
なる。 Furthermore, place the two spindles against the side edges of the printed circuit board, so that their respective axes are aligned with the
- for each of the X and Y axes when viewed within the Y plane
Since it is arranged at an angle of 45 degrees and at an angle corresponding to the required chamfering angle with respect to the X-Y plane, the terminal P on the side edge of the printed circuit board is easily The effect of further reducing peeling can be obtained. In other words, for example, if the spindle has a structure in which its axis is perpendicular to the condition, and peeling from the substrate is likely to occur. However, in the case of the present invention, since it forms an angle of 45 with respect to the X and Y axes when viewed within the X-Y plane (the plane of the drawing in FIG. The terminal is less likely to peel off from the board.
第１図及び第２図はプリント板の形状例を示す
図、第３図はプリント基板の側縁の面取り加工を
示す端面図、第４図は本考案によるプリント基板
の両面取り加工機の一実施例の概略平面図、第５
図は第４図の矢印Ａ方向から見た概略側面図、第
６図は往動時および復動時の面取り加工の説明図
である。
Ｐ……プリント基板、Ｔ……端子、S1，S2……
面取り、１……プリント基板保持テーブル、２，
３……スピンドル、４……クランプ、５……プリ
ント基板側縁、６，７……スピンドル台、８……
シリンダ。
1 and 2 are diagrams showing an example of the shape of a printed circuit board, FIG. 3 is an end view showing chamfering of the side edges of a printed circuit board, and FIG. 4 is an illustration of a double-sided chamfering machine for printed circuit boards according to the present invention. Schematic plan view of the embodiment, fifth
The figure is a schematic side view seen from the direction of arrow A in FIG. 4, and FIG. 6 is an explanatory diagram of chamfering during forward movement and backward movement. P...Printed circuit board, T...terminal, S1 , S2 ...
Chamfering, 1... Printed circuit board holding table, 2,
3... Spindle, 4... Clamp, 5... Side edge of printed circuit board, 6, 7... Spindle stand, 8...
Cylinder.
Claims (1)
り加工すべき側縁に平行なＸ軸およびＸ軸に直角
でプリント基板面に平行なＹ軸に沿つてそれぞれ
往復移動可能なプリント基板保持テーブルと、 Ｘ軸に沿つて配設され、それぞれが別個に面取
り加工位置と待機位置との間をＹ軸方向へ移動可
能に支持されると共に、それぞれの軸線が前記Ｘ
軸およびＹ軸のなすＸ−Ｙ平面内で見てＸ軸およ
びＹ軸の各々に対して45度の角度をなし、かつＸ
−Ｙ平面に対して所要の面取り角度に相当する角
度をなす状態で配設された２つの面取り加工用ス
ピンドルとを含んでなり、 プリント基板保持テーブルのＸ軸方向における
往動時に一方のスピンドルによつてプリント基板
側縁の一面側の面取り加工を行い、プリント基板
保持テーブルのＸ軸方向における復動時に他方の
スピンドルによつてプリント基板側縁の反対面側
の面取り加工を行うように構成されたことを特徴
とするプリント基板の両面取り加工機。[Claims for Utility Model Registration] Holds a printed circuit board and is capable of reciprocating movement along the X axis parallel to the side edge of the printed circuit board to be double-sided chamfered and the Y axis perpendicular to the X axis and parallel to the surface of the printed circuit board. a printed circuit board holding table disposed along the X-axis, each of which is supported so as to be movable in the Y-axis direction between a chamfering position and a standby position, and each axis is aligned with the X-axis.
It forms an angle of 45 degrees with respect to each of the X-axis and Y-axis when viewed within the X-Y plane formed by the axis and the Y-axis, and
- two chamfering spindles arranged at an angle corresponding to the required chamfering angle with respect to the Y plane; Therefore, one side of the side edge of the printed circuit board is chamfered, and when the printed circuit board holding table moves back in the X-axis direction, the other spindle chamfers the opposite side of the side edge of the printed circuit board. A double-sided processing machine for printed circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981044490U JPH0111372Y2 (en) | 1981-03-31 | 1981-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981044490U JPH0111372Y2 (en) | 1981-03-31 | 1981-03-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57157412U JPS57157412U (en) | 1982-10-02 |
| JPH0111372Y2 true JPH0111372Y2 (en) | 1989-04-03 |
Family
ID=29841413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981044490U Expired JPH0111372Y2 (en) | 1981-03-31 | 1981-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0111372Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5113490A (en) * | 1974-07-24 | 1976-02-02 | Ishikawajima Zosen Kakoki Kk | Anaakebuno mentorisochi |
| JPS5459679A (en) * | 1977-10-19 | 1979-05-14 | Nec Corp | Chamfering method and its device |
-
1981
- 1981-03-31 JP JP1981044490U patent/JPH0111372Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5113490A (en) * | 1974-07-24 | 1976-02-02 | Ishikawajima Zosen Kakoki Kk | Anaakebuno mentorisochi |
| JPS5459679A (en) * | 1977-10-19 | 1979-05-14 | Nec Corp | Chamfering method and its device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57157412U (en) | 1982-10-02 |
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