JPH01113224A - Embossing method of thermoplastic resin film or sheet - Google Patents
Embossing method of thermoplastic resin film or sheetInfo
- Publication number
- JPH01113224A JPH01113224A JP26944687A JP26944687A JPH01113224A JP H01113224 A JPH01113224 A JP H01113224A JP 26944687 A JP26944687 A JP 26944687A JP 26944687 A JP26944687 A JP 26944687A JP H01113224 A JPH01113224 A JP H01113224A
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- temperature
- sheet
- electric field
- resin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 38
- 238000004049 embossing Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims abstract description 14
- 230000005684 electric field Effects 0.000 claims abstract description 25
- 230000009477 glass transition Effects 0.000 claims abstract description 19
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 238000000465 moulding Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 abstract description 21
- 238000001816 cooling Methods 0.000 abstract description 9
- 239000002826 coolant Substances 0.000 abstract 1
- 230000001788 irregular Effects 0.000 abstract 1
- 229920005668 polycarbonate resin Polymers 0.000 description 7
- 239000004431 polycarbonate resin Substances 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000003825 pressing Methods 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Landscapes
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、熱可塑性樹脂フィルム又はシートを用い、加
圧−加熱・冷却し、エンボス加工する、例えば光ディス
クや光カートの成形方法に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for molding, for example, optical discs and optical carts, using a thermoplastic resin film or sheet, applying pressure, heating, cooling, and embossing. be.
［従来の技術］
従来、光学特性、Ｊｍｍ時特性熱的特性に優れた熱可塑
性樹脂、例えばポリカーボネート樹脂フィルム又はシー
トを用い、表面にエンボス加工する方法は、一方の型板
の表面に凹凸状の溝が設けられた２枚の型板の間に、樹
脂フィルム又はシートを挟持し、加圧、加熱した後、冷
却することによって行なわれているが、この際凹凸形状
を転写するためには１６０℃以上に前記樹脂を加熱する
必要があった。又、前記ポリカーボネート樹脂を光ディ
スクや光カート等の光学材料として使用するためには、
材料の主分子鎖の配向に基づく複屈折を除去するために
、通常２００℃以上に加熱し、徐冷する必要があった。[Prior Art] Conventionally, a method of embossing the surface of a thermoplastic resin, such as a polycarbonate resin film or sheet, which has excellent optical properties, Jmm characteristics, and thermal properties, involves creating an uneven pattern on the surface of one template. This is done by sandwiching a resin film or sheet between two templates provided with grooves, applying pressure, heating, and then cooling. At this time, in order to transfer the uneven shape, the temperature must be 160°C or higher. It was necessary to heat the resin. In addition, in order to use the polycarbonate resin as an optical material for optical discs, optical carts, etc.
In order to remove birefringence based on the orientation of the main molecular chains of the material, it is usually necessary to heat the material to 200° C. or higher and slowly cool it.
［発明が解決しようとする問題点］
しかしながら、前記の様な従来例においては、エンボス
加工および複屈折を除去する際に、熱可塑性樹脂フィル
ム又はシートを２００℃以上の高温度に加熱するために
、冷却時において分子鎖の再配向が起こり、また熱収縮
に伴なう歪の発生を抑えることができず、エンボス加工
された成形品の複屈折のムラが大きくなるという欠点が
あった。又、それを取り除く為には、冷却に長時間かけ
徐冷する必要があった。[Problems to be Solved by the Invention] However, in the conventional examples as described above, in order to heat the thermoplastic resin film or sheet to a high temperature of 200°C or higher when embossing and removing birefringence, However, there were disadvantages in that the molecular chains reorientated during cooling, and the generation of distortion due to thermal contraction could not be suppressed, resulting in increased unevenness in birefringence of the embossed molded product. In addition, in order to remove it, it was necessary to slowly cool it down over a long period of time.
本発明は、この様な従来技術の欠点を除去するためにな
されたものであり、熱可塑性樹脂材料のガラス転移温度
以上で直流電界を印加しながら加圧成形することにより
、熱可塑性樹脂フィルム又はシートを複屈折のムラが非
常に小さくエンボス加工する方法を提供することを目的
とするものである。The present invention was made in order to eliminate such drawbacks of the prior art, and is capable of forming thermoplastic resin films or The object of the present invention is to provide a method for embossing a sheet with extremely small unevenness in birefringence.
［問題点を解決するための手段］
即ち、本発明は、一方の型板の表面に凹凸状の溝が設け
られた２枚の型板の間に、熱可塑性樹脂フィルム又はシ
ートを挟持し、加熱、加圧してエンボス加工する方法に
おいて、前記熱可塑性樹脂フィルム又はシートをガラス
転移温度以上の温度において直流電界を印加しながら加
圧成形することを特徴とする熱可塑性樹脂フィルム又は
シートのエンボス加工方法である。[Means for Solving the Problems] That is, the present invention involves sandwiching a thermoplastic resin film or sheet between two templates, one of which has uneven grooves on the surface, heating, A method for embossing a thermoplastic resin film or sheet by pressurizing the film or sheet, characterized in that the thermoplastic resin film or sheet is pressure-molded while applying a direct current electric field at a temperature higher than the glass transition temperature. be.
以下、本発明を図面に基ずいて説明する。Hereinafter, the present invention will be explained based on the drawings.
第１図は、本発明の熱可塑性樹脂フィルム又はシートの
エンボス加工方法に使用する装置の一例を示す構成図お
よび第２図はその要部の拡大構成図である。同図におい
て、１はプレス装置、２は金型取付板、３は断熱板、４
は加熱板と接し電極板、加熱板を冷却する冷却板、５は
電極板と接し型板と電極板を加熱する加熱板、６は型板
と接し直流電界を印加する電極板、７は２枚のうち一方
の表面に凹凸状の溝が設けられた型板、８は熱可塑性樹
脂フィルム又はシート、９は印加電界コントローラーで
ある。FIG. 1 is a block diagram showing an example of an apparatus used in the method of embossing a thermoplastic resin film or sheet of the present invention, and FIG. 2 is an enlarged block diagram of the main parts thereof. In the figure, 1 is a press device, 2 is a mold mounting plate, 3 is a heat insulating plate, and 4
5 is a heating plate in contact with the electrode plate and heats the template and the electrode plate; 6 is an electrode plate in contact with the template and applies a DC electric field; 7 is 2 A template 8 is a thermoplastic resin film or sheet, and 9 is an applied electric field controller.
次に、本発明のエンボス加工方法について説明すると、
前記第１図の装置の構成に示す様に、熱可塑性樹脂フィ
ルム又はシート８を型板７，７間に挟持して金型内にセ
ットし、プレス装置１で加圧する。加圧開始と同時に加
熱板５内の熱媒又はヒーターが作動し、型板７の温度を
上昇させる。Next, the embossing method of the present invention will be explained.
As shown in the configuration of the apparatus shown in FIG. 1, a thermoplastic resin film or sheet 8 is sandwiched between mold plates 7, 7, set in a mold, and pressed by a press device 1. Simultaneously with the start of pressurization, the heating medium or heater in the heating plate 5 is activated to raise the temperature of the template 7.
熱可塑性樹脂材料の温度がガラス転移温度になると、型
板７内に設けられた温度センサー（図示せず）が検知し
、印加電界コントローラー９により電極板６に所定の電
界を印加する。適当な温度まで加熱後、冷却板４内の冷
媒が作動し、型板を冷却させる。熱可塑性樹脂材料の温
度がガラス転移温度に冷却されると、印加電界が切られ
、さらに冷却後、成形品が取り出される。When the temperature of the thermoplastic resin material reaches the glass transition temperature, a temperature sensor (not shown) provided in the template 7 detects this, and a predetermined electric field is applied to the electrode plate 6 by the applied electric field controller 9. After heating to an appropriate temperature, the refrigerant in the cooling plate 4 is activated to cool the template. Once the temperature of the thermoplastic resin material has cooled to the glass transition temperature, the applied electric field is turned off, and after further cooling, the molded article is taken out.
第３図は前記成形工程中の熱可塑性樹脂材料の温度と直
流電界との関係を示すグラフであり、Ｔｇは材料のガラ
ス転移温度、ＴＩは所定の最高温度、Ｅｌは印加電界値
である。FIG. 3 is a graph showing the relationship between the temperature of the thermoplastic resin material and the DC electric field during the molding process, where Tg is the glass transition temperature of the material, TI is the predetermined maximum temperature, and El is the applied electric field value.
本発明において用いられる熱可塑性樹脂フィルム又はシ
ートは熱可塑性樹脂材料からなるものであればよく、例
えばポリカーボネート樹脂、ポリメチルメタクリレート
樹脂、ポリエチレンテレフタレート樹脂、ポリ塩化ビニ
ル樹脂、ポリスチレン樹脂等が挙げられる。The thermoplastic resin film or sheet used in the present invention may be made of a thermoplastic resin material, and examples thereof include polycarbonate resin, polymethyl methacrylate resin, polyethylene terephthalate resin, polyvinyl chloride resin, polystyrene resin, and the like.
これ等の熱可塑性樹脂はエンボス加工する際にガラス転
移温度以上に加熱されるが、ガラス転移温度Ｔｇは材料
の種類により異なるが、最高温度Ｔ■はガラス転移温度
Ｔｇより５０℃高い温度以下の範囲が好ましい０例えば
、ポリカーボネート樹脂においては、Ｔｇ１４５℃〜Ｔ
ｍ１６０℃の範囲が好ましい、ガラス転移温度未満では
強い電界を印加しても分子が動かず（配向せず）、その
結果複屈折コントロールができないため好ましくない。These thermoplastic resins are heated above their glass transition temperature during embossing, but the glass transition temperature Tg varies depending on the type of material, but the maximum temperature T is 50°C higher than the glass transition temperature Tg. The preferred range is 0. For example, in polycarbonate resin, Tg145℃~Tg
A temperature in the range of 160° C. is preferable. If the temperature is lower than the glass transition temperature, the molecules do not move (do not align) even if a strong electric field is applied, and as a result, birefringence cannot be controlled, which is not preferable.
また、印加される直流電界の値は熱可塑性樹脂材料の種
類により異なるが、通常５ＫＶ／ｃｍ以上、好ましくは
ｌ０ＫＶ／ｃ■〜３０ＫＶ／ａｍの範囲が望ましい。Further, the value of the applied DC electric field varies depending on the type of thermoplastic resin material, but it is usually 5 KV/cm or more, preferably in the range of 10 KV/c to 30 KV/am.
第４図は印加電界の大きさと成形品の複屈折の大きさと
の関係を示すグラフであり、δａは成形前に材料がすで
に持っている複屈折の値である。FIG. 4 is a graph showing the relationship between the magnitude of the applied electric field and the magnitude of birefringence of the molded article, where δa is the value of birefringence that the material already has before molding.
同図から明らかな様に、本発明においては印加する直流
電界の大きさにより複屈折の値を制御するすることがで
きる。As is clear from the figure, in the present invention, the value of birefringence can be controlled by the magnitude of the applied DC electric field.
［作用］
本発明によれば、フィルム又はシート状の熱可塑性樹脂
材料の温度がガラス転移温度以上でガラス転移温度より
５０℃高い温度以下の範囲において直流゛上界を印加し
ながら加圧成形することことにより、熱可塑性樹脂材料
の極性分子を均一に配向させ、その状態でエンボス加工
を行ない固化させるために、熱可塑性樹脂材料の複屈折
は印加電界に比例して一定の値をとり、前記従来例の欠
点であった複屈折のムラを非常に小さくすることができ
る。[Function] According to the present invention, the thermoplastic resin material in the form of a film or sheet is pressure-molded while applying a direct current upper limit in a range where the temperature is above the glass transition temperature and below 50°C higher than the glass transition temperature. In particular, in order to orient the polar molecules of the thermoplastic resin material uniformly, and then perform embossing and solidification in that state, the birefringence of the thermoplastic resin material takes a constant value in proportion to the applied electric field. The unevenness of birefringence, which was a drawback of the conventional example, can be greatly reduced.
［実施例］ 以下、実施例を示し本発明をさらに具体的に説明する。[Example] Hereinafter, the present invention will be explained in more detail with reference to Examples.
実施例１
厚さ０．４ｍ諺のポリカーボネート樹脂フィルムをな、
一方の型板の表面に溝の深さ０．２終■、溝の巾３終１
、ピッチ１０１２ｇｍの凹凸状の溝が設けられた２枚の
型板の間に挟持して、第１図に示す装置にセットし、プ
レス装置で６０Ｋｇｆ／ｃ■２で加圧した。Example 1 A polycarbonate resin film with a thickness of 0.4 m was
The depth of the groove on the surface of one template is 0.2 mm, the width of the groove is 3 mm and 1 mm.
The sample was sandwiched between two templates provided with uneven grooves with a pitch of 1012 gm, set in the apparatus shown in FIG. 1, and pressurized at 60 Kgf/c<2> with a press.
加圧開始と同時に加熱板内の電気ヒーターに通電し、型
板の温度を上昇させた。ポリカーボネート樹脂フィルム
の温度がガラス転移温度Ｔｇの１４５℃になると、型板
内に設けられた温度センサーが検知し、印加電界コント
ローラーにより電極板に３０ＫＶ／ａｍの大きさの電界
を印加した。その後、２０秒で１６０℃まで加熱した後
、冷却板内の冷媒を作動させ、型板を冷却した。ポリカ
ーボネート樹脂フィルムの温度がガラス転移温度Ｔｇ１
４５℃迄に低下した後、印加電界の印加を止め、さらに
５０°Ｃまで冷却した後、成形品を取り出した。Simultaneously with the start of pressurization, the electric heater inside the heating plate was energized to raise the temperature of the template. When the temperature of the polycarbonate resin film reached the glass transition temperature Tg of 145° C., a temperature sensor provided in the template detected it, and an electric field of 30 KV/am was applied to the electrode plate by an applied electric field controller. Then, after heating to 160° C. in 20 seconds, the refrigerant in the cooling plate was activated to cool the template. The temperature of the polycarbonate resin film is the glass transition temperature Tg1
After the temperature decreased to 45°C, the application of the electric field was stopped, and after further cooling to 50°C, the molded product was taken out.
得られた成形品は、良好なエンボス加工が施され、偏光
板と波長８３０ｎｍの半導体レーザーで観察した結果、
複屈折のムラが非常に小さいことか認められた。The obtained molded product had good embossing, and as a result of observation with a polarizing plate and a semiconductor laser with a wavelength of 830 nm,
It was observed that the unevenness of birefringence was extremely small.
［発明の効果］
以上説明したように、本発明によれば、熱可塑性樹脂フ
ィルム又はシートな熱可塑性樹脂材料のガラス転移温度
以上で直流電界を印加しながら加圧成形することにより
、複屈折のムラが非常に小さいエンボス加工された成形
品を得ることが可能である。[Effects of the Invention] As explained above, according to the present invention, birefringence can be reduced by pressure forming a thermoplastic resin film or sheet while applying a DC electric field at a temperature higher than the glass transition temperature of the thermoplastic resin material. It is possible to obtain embossed molded articles with very small irregularities.
第１図は本発明の熱可塑性樹脂フィルム又はシートのエ
ンボス加工方法に使用する装置の一例を示す構成図およ
び第２図はその要部の拡大構成図、第３図は熱可塑性樹
脂材料温度と印加電界の関係を示すグラフおよび第４図
は印加電界と複屈折の関係を示すグラフである。
ｌ・・・プレス装２２ ２・・・金型取付板３・・・
断熱板 ４・・・冷却板５・・・加熱板
６・・・電極板７・・・型板
８・・・熱可塑性樹脂フィルム又はシート９・・・印加
電界コントローラーFig. 1 is a block diagram showing an example of the apparatus used in the embossing method of thermoplastic resin film or sheet of the present invention, Fig. 2 is an enlarged block diagram of the main parts thereof, and Fig. 3 is a diagram showing the temperature and temperature of the thermoplastic resin material. A graph showing the relationship between applied electric field and FIG. 4 is a graph showing the relationship between applied electric field and birefringence. l... Press equipment 22 2... Mold mounting plate 3...
Heat insulation plate 4...Cooling plate 5...Heating plate
6... Electrode plate 7... Template 8... Thermoplastic resin film or sheet 9... Applied electric field controller
Claims (2)
の型板の間に、熱可塑性樹脂フィルム又はシートを挟持
し、加熱、加圧してエンボス加工する方法において、前
記熱可塑性樹脂フィルム又はシートをガラス転移温度以
上の温度において直流電界を印加しながら加圧成形する
ことを特徴とする熱可塑性樹脂フィルム又はシートのエ
ンボス加工方法。(1) A method in which a thermoplastic resin film or sheet is sandwiched between two templates each having uneven grooves on the surface of one of the templates, and embossing is performed by heating and pressurizing the thermoplastic resin. 1. A method for embossing a thermoplastic resin film or sheet, which comprises press-molding the film or sheet at a temperature equal to or higher than the glass transition temperature while applying a direct current electric field.
度以上でガラス転移温度より５０℃高い温度以下の範囲
において加圧成形する特許請求の範囲第１項記載のエン
ボス加工方法。(2) The embossing method according to claim 1, wherein the thermoplastic resin film or sheet is pressure-molded at a temperature not lower than the glass transition temperature but not higher than the glass transition temperature by 50°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26944687A JPH01113224A (en) | 1987-10-27 | 1987-10-27 | Embossing method of thermoplastic resin film or sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26944687A JPH01113224A (en) | 1987-10-27 | 1987-10-27 | Embossing method of thermoplastic resin film or sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01113224A true JPH01113224A (en) | 1989-05-01 |
Family
ID=17472545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26944687A Pending JPH01113224A (en) | 1987-10-27 | 1987-10-27 | Embossing method of thermoplastic resin film or sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01113224A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE1013246A3 (en) * | 2000-01-24 | 2001-11-06 | Internat Brain System S A | Method and device for processing crystalline polymers or semi-crystalline. |
| US7187644B2 (en) | 2001-09-27 | 2007-03-06 | Nissei Plastic Industrial Co., Ltd. | Optical recording substrate, optical recording medium, and manufacturing method thereof |
| US7569173B2 (en) | 2000-01-24 | 2009-08-04 | International Brain System S.A. | Method and device for transforming crystalline or semicrystalline polymers |
| JP2013530066A (en) * | 2010-05-07 | 2013-07-25 | アンスティチュ ナショナル デ シアンス アプリケ トゥールーズ | Topographic and electrical nanostructuring method of electret polymer thin film and resulting electret polymer thin film |
-
1987
- 1987-10-27 JP JP26944687A patent/JPH01113224A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE1013246A3 (en) * | 2000-01-24 | 2001-11-06 | Internat Brain System S A | Method and device for processing crystalline polymers or semi-crystalline. |
| WO2001053060A3 (en) * | 2000-01-24 | 2002-01-17 | Internat Brain System S A | Method and device for transforming crystalline or semicrystalline polymers |
| US7569173B2 (en) | 2000-01-24 | 2009-08-04 | International Brain System S.A. | Method and device for transforming crystalline or semicrystalline polymers |
| US7187644B2 (en) | 2001-09-27 | 2007-03-06 | Nissei Plastic Industrial Co., Ltd. | Optical recording substrate, optical recording medium, and manufacturing method thereof |
| JP2013530066A (en) * | 2010-05-07 | 2013-07-25 | アンスティチュ ナショナル デ シアンス アプリケ トゥールーズ | Topographic and electrical nanostructuring method of electret polymer thin film and resulting electret polymer thin film |
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