JPH01107129U - - Google Patents

Info

Publication number
JPH01107129U
JPH01107129U JP1988001579U JP157988U JPH01107129U JP H01107129 U JPH01107129 U JP H01107129U JP 1988001579 U JP1988001579 U JP 1988001579U JP 157988 U JP157988 U JP 157988U JP H01107129 U JPH01107129 U JP H01107129U
Authority
JP
Japan
Prior art keywords
cleaning brush
substrate surface
rotating
cleaning
descended
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988001579U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988001579U priority Critical patent/JPH01107129U/ja
Priority to KR1019890000131A priority patent/KR920010691B1/ko
Publication of JPH01107129U publication Critical patent/JPH01107129U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係る当接緩衝装置の一実施例
を示す機能説明用側面図、第２図はその装置の斜
視図、第３図は従来の装置の側面図である。 １……揺動アーム、２……洗浄ブラシ、５……
アーム支軸、７……アーム荷重受止板、１１……
回転駆動手段、１７……昇降駆動手段、２１……
錘載置板、２２……錘り、２５……両腕てこ、３
１……減速手段（減速シリンダ）、３２……スト
ツパ、４１……基板、４２……チヤツク。

Claims (1)

  1. 【実用新案登録請求の範囲】 基板表面と垂直に当接する洗浄ブラシを回転さ
    せながら、回転する基板表面の中心から周縁方向
    に移動させて基板表面を洗浄するようにした洗浄
    装置において、 洗浄ブラシが所定位置まで下降したことをセン
    サにより検知して洗浄ブラシを回転させるととも
    に、洗浄ブラシの下降速度を減速するように構成
    した、洗浄ブラシの当接緩衝装置。
JP1988001579U 1988-01-08 1988-01-08 Pending JPH01107129U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1988001579U JPH01107129U (ja) 1988-01-08 1988-01-08
KR1019890000131A KR920010691B1 (ko) 1988-01-08 1989-01-07 접촉완충장치 부착 세정장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988001579U JPH01107129U (ja) 1988-01-08 1988-01-08

Publications (1)

Publication Number Publication Date
JPH01107129U true JPH01107129U (ja) 1989-07-19

Family

ID=11505425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988001579U Pending JPH01107129U (ja) 1988-01-08 1988-01-08

Country Status (2)

Country Link
JP (1) JPH01107129U (ja)
KR (1) KR920010691B1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0352228A (ja) * 1989-07-20 1991-03-06 Tokyo Electron Ltd 洗浄装置
JPH07323266A (ja) * 1994-05-31 1995-12-12 Nisshin Steel Co Ltd 金属帯表面の付着塵埃の吸引除去方法および装置
JPH08141518A (ja) * 1994-09-20 1996-06-04 Dainippon Screen Mfg Co Ltd 回転式基板洗浄装置
JP2021019130A (ja) * 2019-07-22 2021-02-15 株式会社荏原製作所 基板洗浄装置および基板洗浄方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100403517B1 (ko) * 2000-12-29 2003-10-30 (주)케이.씨.텍 웨이퍼 세정 장치
CN111002164B (zh) * 2019-12-09 2020-11-17 国网智能科技股份有限公司 一种变电站触头打磨机构、打磨机器人、***及方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0352228A (ja) * 1989-07-20 1991-03-06 Tokyo Electron Ltd 洗浄装置
JPH07323266A (ja) * 1994-05-31 1995-12-12 Nisshin Steel Co Ltd 金属帯表面の付着塵埃の吸引除去方法および装置
JPH08141518A (ja) * 1994-09-20 1996-06-04 Dainippon Screen Mfg Co Ltd 回転式基板洗浄装置
JP2021019130A (ja) * 2019-07-22 2021-02-15 株式会社荏原製作所 基板洗浄装置および基板洗浄方法

Also Published As

Publication number Publication date
KR890012358A (ko) 1989-08-26
KR920010691B1 (ko) 1992-12-12

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