JPH01106612A - Circuit board mounting surface acoustic wave element - Google Patents
Circuit board mounting surface acoustic wave elementInfo
- Publication number
- JPH01106612A JPH01106612A JP26505787A JP26505787A JPH01106612A JP H01106612 A JPH01106612 A JP H01106612A JP 26505787 A JP26505787 A JP 26505787A JP 26505787 A JP26505787 A JP 26505787A JP H01106612 A JPH01106612 A JP H01106612A
- Authority
- JP
- Japan
- Prior art keywords
- resin layer
- acoustic wave
- surface acoustic
- wave element
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 230000035939 shock Effects 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 4
- 229920001721 polyimide Polymers 0.000 claims abstract description 3
- 239000009719 polyimide resin Substances 0.000 claims abstract description 3
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 abstract 4
- 239000011247 coating layer Substances 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は表面弾性波素子（以下ＳＡＷと呼ぶ）を回路の
一部に組み込んだＳＡＷ回路素子の構成に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to the configuration of a SAW circuit element in which a surface acoustic wave element (hereinafter referred to as SAW) is incorporated into a part of the circuit.
（従来の技術）
ＳＡＷ素子をフィルタなどセンサ機能として回路パター
ンを有する基板に組み込んだＳＡＷ回路素子がある。(Prior Art) There is a SAW circuit element in which a SAW element is incorporated into a substrate having a circuit pattern as a sensor function such as a filter.
ＳＡＷ素子は一般的に圧電性材料であるニオブ酸リチウ
ムやタンタル酸リチウムの薄い単結晶板上にクシ型電極
を加工して構成される。A SAW element is generally constructed by processing a comb-shaped electrode on a thin single crystal plate of lithium niobate or lithium tantalate, which are piezoelectric materials.
（発明が解決ようとする問題点）
従来この種のニオブ酸リチウム基板を搭載するには、絶
縁性接着剤を塗布し接合を行い、アルミニウム細線を超
音波接合して取り付けるが、このニオブ酸リチウム基板
は極めて脆弱なため、落下などの衝撃あるいは回路基板
との熱膨張差により破損し易い欠点を有している。(Problem to be solved by the invention) Conventionally, in order to mount this type of lithium niobate substrate, an insulating adhesive is applied and bonded, and thin aluminum wires are attached by ultrasonic bonding. Since the board is extremely fragile, it has the disadvantage that it is easily damaged by impact such as dropping or by a difference in thermal expansion with the circuit board.
第２図は、従来の実施例の説明図で、銀パラジウム等に
よる厚膜材料を印刷、焼成して回路５を形成し、アルミ
ニウムワイヤ失を・ボンディングするパッド部にボンデ
ィング可能な処理をほどこしたセラミック基板ｌとＳＡ
Ｗ素子２間に絶縁接着剤３を塗布し圧接後昇温し絶縁接
着剤を硬化させている。FIG. 2 is an explanatory diagram of a conventional embodiment, in which a thick film material such as silver palladium is printed and fired to form a circuit 5, and a bonding process is applied to the pad portion to which the aluminum wire is bonded. Ceramic substrate l and SA
An insulating adhesive 3 is applied between the W elements 2, and after pressure bonding, the temperature is raised to harden the insulating adhesive.
その後、アルミニウムワイヤ４を超音波で接合しＳＡＷ
回路素子を構成する。After that, the aluminum wire 4 is joined using ultrasonic waves and SAW
Configure circuit elements.
この際、絶縁接着剤３の晴のコントロールがむずかしく
、少ない場合は絶縁接着剤３が薄くなりすぎＳＡＷ素子
２全面に絶縁接着剤３が廻わり込まず、衝撃吸収が著し
く弱くなる。又絶縁接着剤３が多い場合はＳＡＷ素子２
からはみ出し、アルミニウムワイヤ４の接合部分である
バット上まで流れ出し、アルミニウムワイヤ４の超音波
接合が不可能となる不具合があった。At this time, it is difficult to control the thickness of the insulating adhesive 3, and if there is too little, the insulating adhesive 3 becomes too thin and cannot be spread over the entire surface of the SAW element 2, resulting in significantly weakened shock absorption. Also, if there is a lot of insulating adhesive 3, SAW element 2
There was a problem in that the aluminum wires 4 were not able to be ultrasonically bonded because they protruded from the surface and flowed onto the butt where the aluminum wires 4 were to be bonded.
（問題点を解決するための手段）
本発明は、これらの欠点を解決するため、あらかじめＳ
ΔＷ素子の裏面に衝撃吸収の為の樹脂皮膜層を全面に厚
さ１０８ｍから２０μｍの範囲で設けることを特徴とし
、その目的は均一な樹脂皮膜層を有することにより、衝
撃に強い回路素子を提供するにある。(Means for solving the problems) In order to solve these drawbacks, the present invention
The feature is that a resin film layer for shock absorption is provided on the back side of the ΔW element with a thickness ranging from 108 m to 20 μm over the entire surface, and the purpose is to provide a circuit element that is resistant to impact by having a uniform resin film layer. There is something to do.
以下図面を用いて詳細に説明する。This will be explained in detail below using the drawings.
（実施例）
第１図は本発明の説明図で、上記欠点を解決するためＳ
ＡＷ索Ｙｒ２の裏面にあらかじめ１０８ｍから２０μｍ
の衝撃吸収樹脂層６を全面に形成しておくことにより、
絶縁接着剤３が薄くても樹脂層６が衝撃を吸収し、安定
した衝撃吸収が可能となる。(Example) Fig. 1 is an explanatory diagram of the present invention.
108m to 20μm on the back side of AW cable Yr2 in advance.
By forming the shock absorbing resin layer 6 on the entire surface,
Even if the insulating adhesive 3 is thin, the resin layer 6 absorbs the impact, making stable impact absorption possible.
この衝撃吸収樹脂層６は低膨張のポリイミド樹脂を選ぶ
ことにより熱膨張差によるＳＡＷ素子の破損を防止する
ことか、可能である。By selecting a low-expansion polyimide resin for the shock-absorbing resin layer 6, it is possible to prevent damage to the SAW element due to a difference in thermal expansion.
（発明の効果）
以上説明したように、本発明によれば衝撃吸収樹脂層を
ＳＡＷ素子裏面にあらかじめ均一に形成することによっ
て、極めて脆弱なＳＡＷ素子を搭載したＳＡＷ回路の衝
撃、熱膨張差による損傷を大幅に防止することが出来る
。(Effects of the Invention) As explained above, according to the present invention, by uniformly forming a shock-absorbing resin layer on the back surface of a SAW element in advance, it is possible to reduce the impact and thermal expansion difference of a SAW circuit equipped with an extremely fragile SAW element. Damage can be largely prevented.
第１図は本発明のＳＡＷ回路素子の要部断面図、第２図
は従来のＳＡＷ回路素子の断面図を示す。
ｌ・・・セラミック基板、２・・・ＳＡＷ素子、３・・
・絶縁接着剤、４・・・アルミニラ１１ワイヤ、５・・
・回路、６・・・衝撃吸収樹脂層。
特許出願人 日本無線株式会社
ｘｉ図
第２図FIG. 1 is a sectional view of a main part of a SAW circuit element of the present invention, and FIG. 2 is a sectional view of a conventional SAW circuit element. l...ceramic substrate, 2...SAW element, 3...
・Insulating adhesive, 4... Aluminum 11 wire, 5...
・Circuit, 6...Shock absorbing resin layer. Patent applicant Japan Radio Co., Ltd. xi Figure 2
Claims (3)
基板とする表面弾性波素子を搭載した回路基板において
、該表面弾性波素子の裏面に衝撃吸収樹脂層を接合した
ことを特徴とする表面弾性波素子を搭載した回路基板。(1) A circuit board on which a surface acoustic wave element having a piezoelectric material as a substrate is mounted via a circuit pattern and an insulating adhesive, characterized in that a shock absorbing resin layer is bonded to the back surface of the surface acoustic wave element. A circuit board equipped with a surface acoustic wave element.
リイミド樹脂で構成したことを特徴とする表面弾性波素
子を搭載した回路基板。(2) A circuit board on which a surface acoustic wave element is mounted, characterized in that the shock absorbing resin layer according to claim 1 is made of polyimide resin.
層の厚さを１０μｍから２０μｍとしたことを特徴とす
る表面弾性波素子を搭載した回路基板。(3) A circuit board equipped with a surface acoustic wave element, characterized in that the impact-absorbing resin layer according to claims 1 and 2 has a thickness of 10 μm to 20 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26505787A JPH01106612A (en) | 1987-10-20 | 1987-10-20 | Circuit board mounting surface acoustic wave element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26505787A JPH01106612A (en) | 1987-10-20 | 1987-10-20 | Circuit board mounting surface acoustic wave element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01106612A true JPH01106612A (en) | 1989-04-24 |
Family
ID=17411984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26505787A Pending JPH01106612A (en) | 1987-10-20 | 1987-10-20 | Circuit board mounting surface acoustic wave element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01106612A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6892441B2 (en) * | 2001-04-23 | 2005-05-17 | Appleton Papers Inc. | Method for forming electrically conductive pathways |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5366139A (en) * | 1976-11-26 | 1978-06-13 | Toshiba Corp | Elastic surface wave device |
| JPS5413793A (en) * | 1977-07-04 | 1979-02-01 | Toshiba Corp | Elastic surface wave device |
-
1987
- 1987-10-20 JP JP26505787A patent/JPH01106612A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5366139A (en) * | 1976-11-26 | 1978-06-13 | Toshiba Corp | Elastic surface wave device |
| JPS5413793A (en) * | 1977-07-04 | 1979-02-01 | Toshiba Corp | Elastic surface wave device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6892441B2 (en) * | 2001-04-23 | 2005-05-17 | Appleton Papers Inc. | Method for forming electrically conductive pathways |
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