JPH01105420A - Touch panel - Google Patents
Touch panelInfo
- Publication number
- JPH01105420A JPH01105420A JP62218356A JP21835687A JPH01105420A JP H01105420 A JPH01105420 A JP H01105420A JP 62218356 A JP62218356 A JP 62218356A JP 21835687 A JP21835687 A JP 21835687A JP H01105420 A JPH01105420 A JP H01105420A
- Authority
- JP
- Japan
- Prior art keywords
- transparent
- thin film
- touch panel
- resin
- conducting layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 239000010409 thin film Substances 0.000 claims abstract description 16
- 229920000620 organic polymer Polymers 0.000 claims abstract description 14
- 239000010408 film Substances 0.000 abstract description 20
- 125000006850 spacer group Chemical group 0.000 abstract description 13
- 230000015556 catabolic process Effects 0.000 abstract description 6
- 239000013034 phenoxy resin Substances 0.000 abstract description 4
- 229920006287 phenoxy resin Polymers 0.000 abstract description 4
- 229920002050 silicone resin Polymers 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 abstract description 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 2
- 230000013011 mating Effects 0.000 abstract 2
- 229920000178 Acrylic resin Polymers 0.000 abstract 1
- 239000004925 Acrylic resin Substances 0.000 abstract 1
- 230000000994 depressogenic effect Effects 0.000 abstract 1
- 229920006337 unsaturated polyester resin Polymers 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 23
- 238000000034 method Methods 0.000 description 6
- -1 polyethylene terephthalate Polymers 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 238000001755 magnetron sputter deposition Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000007738 vacuum evaporation Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- WLAMNBDJUVNPJU-UHFFFAOYSA-N 2-methylbutyric acid Chemical compound CCC(C)C(O)=O WLAMNBDJUVNPJU-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- AZWHFTKIBIQKCA-UHFFFAOYSA-N [Sn+2]=O.[O-2].[In+3] Chemical compound [Sn+2]=O.[O-2].[In+3] AZWHFTKIBIQKCA-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000001659 ion-beam spectroscopy Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
- H01H13/703—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches characterised by spacers between contact carrying layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2209/00—Layers
- H01H2209/024—Properties of the substrate
- H01H2209/038—Properties of the substrate transparent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2209/00—Layers
- H01H2209/046—Properties of the spacer
- H01H2209/06—Properties of the spacer transparent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2209/00—Layers
- H01H2209/068—Properties of the membrane
- H01H2209/082—Properties of the membrane transparent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2211/00—Spacers
- H01H2211/026—Spacers without separate element
- H01H2211/032—Pressure sensitive layer on contacts
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、タッチパネルに関する。詳しくは、パネルに
触れることによりその位置を検出するタッチパネルスイ
ッチに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a touch panel. Specifically, the present invention relates to a touch panel switch that detects the position of a panel by touching it.
タッチパネルは、指、ペン等でＣＲＴ等のデイスプレィ
の画面に触れた時にその位置を検出できる透明なスイッ
チである。近年、タッチパネルは、銀行のＡＴＭ（現金
自動引き出し機）、オフィスオートメーション機器、列
車や航空機の座席予約等にコンピー−ターと人とのイン
ターフェースとして多く用いられている。A touch panel is a transparent switch that can detect the position of a CRT or other display screen when it is touched with a finger, pen, or the like. In recent years, touch panels have been widely used as interfaces between computers and people in bank ATMs (automated cash withdrawal machines), office automation equipment, seat reservations on trains and airplanes, and the like.
このようなタッチパネルは、接触抵抗膜方式、静電容量
方式、光ヤンサ一方式、音響方式、圧力検出方式などに
分けられるが、入力位置の確実性、耐熱性、耐水性、耐
塵挨性等の点で優れている接触抵抗膜方式が多く用いら
れている。Such touch panels can be divided into contact resistance film type, capacitive type, optical sensor type, acoustic type, pressure detection type, etc., but they have certain characteristics such as accuracy of input position, heat resistance, water resistance, dust resistance, etc. The contact resistance film method, which is superior in several points, is often used.
第２図は、従来、公知である接触抵抗膜方式のアナログ
型タッチパネルの縦断面図の一例である０
図中、／及びコは透明基板、３及び３′は透明導電層で
ｓｂ、この透明導電層３と３′とは電気絶縁性を有する
ドツトスペーサーＳにより隔離されている。透明基板の
一方、例えば／には可撓性をもった有機高分子フィルム
が用いられる。FIG. 2 is an example of a vertical cross-sectional view of a conventionally known contact resistive film type analog touch panel. The conductive layers 3 and 3' are separated by a dot spacer S having electrical insulation properties. For one of the transparent substrates, for example, a flexible organic polymer film is used.
この透明基板ｌを押圧すると、透明導電層３は透明基板
／と共に内側に撓み、相対する透明基板−の上の透明導
電層３′に接触する。この押圧した位置は、透明電極３
に予め印加した電圧と、この接触点を通して透明電極３
′に電流が流れた際に透明電極３′に発生する出力電圧
との比から検出される。When this transparent substrate 1 is pressed, the transparent conductive layer 3 bends inward together with the transparent substrate 1, and comes into contact with the transparent conductive layer 3' on the opposing transparent substrate. This pressed position is the transparent electrode 3
A voltage previously applied to the transparent electrode 3 is applied through this contact point.
It is detected from the ratio with the output voltage generated at the transparent electrode 3' when a current flows through the transparent electrode 3'.
第２図のような接触抵抗膜方式のアナログ型タッチパネ
ルは、押圧しない状態において透明導電層３と３′とが
接触しないようにその間にドツトスペーサー５を分散配
置している。ドツトスペーサー５は絶縁物質、例えばポ
リエステル樹脂やシリコン樹脂が用いられる。In the contact resistive film type analog touch panel as shown in FIG. 2, dot spacers 5 are dispersed between the transparent conductive layers 3 and 3' so that they do not come into contact with each other when they are not pressed. The dot spacer 5 is made of an insulating material such as polyester resin or silicone resin.
そのため、可撓性透明基板／を押圧したとしても、ドツ
トスペーサー５の位置では透明導電層３と３′とは接触
しないので、その位置は検出されない。Therefore, even if the flexible transparent substrate is pressed, the transparent conductive layers 3 and 3' do not come into contact at the position of the dot spacer 5, so that position is not detected.
タッチパネルの用途であるＡＴＭや列車、航空機等の座
席予約機等では１分解能は低くても差し支えないが、オ
フィスオートメーション機器、例えばＣＡＤ／ＣＡＭに
於けるデータの入力装置の一つであるタブレットで、手
書きの文字又は複雑な線図を入力するときは高い分解能
が要求される。A lower resolution of 1 is acceptable for touch panels such as ATMs, seat reservation machines for trains, airplanes, etc., but for office automation equipment such as tablets, which are one of the data input devices in CAD/CAM, High resolution is required when inputting handwritten characters or complex diagrams.
しかしながら、上記のように接触抵抗膜方式のアナログ
型タッチパネルではドツトスペーサーの個所は検出され
ないので線が途切れるという問題点があった。また、ド
ツトスペーサーがあるため、製品である透明タッチパネ
ル上に該スペーサーの影が写シ、これが目ざわシであっ
た０
〔問題点を解決するための手段〕
本発明者らは、上記問題点を克服し、高い分解能を有す
るタッチパネルを鋭意検討した結果、少なくとも片面に
透明導電層を有する一枚の透明基板を、透明導電層が対
向するように配置し、該対向面が塗膜形成能を有する有
機高分子よりなる薄膜を介して接触させたものをタッチ
バネルとすることによシ、常態では体積抵抗値が１０１
５Ω・ｍ以下であるが、その表面を一定圧力で押圧した
場合には、電気破壊が起シ、その抵抗値がｉｏ６Ω・ｍ
以下となシ、しかも、押圧を止めると元通シに回復する
ことを見出だし本発明を完成した。However, as mentioned above, in the contact resistive film type analog touch panel, the dot spacer is not detected, so there is a problem that the line is interrupted. In addition, since there is a dot spacer, the shadow of the spacer is cast on the transparent touch panel that is the product, which is annoying. [Means for solving the problem] The present inventors have solved the above problem As a result of intensive research into a touch panel with high resolution and overcoming this problem, we discovered that a single transparent substrate having a transparent conductive layer on at least one side is arranged so that the transparent conductive layers face each other, and the facing surface has the ability to form a coating film. By using a touch panel that is contacted through a thin film made of an organic polymer, the volume resistance value under normal conditions is 101.
5Ω・m or less, but if the surface is pressed with a constant pressure, electrical breakdown will occur, and the resistance value will be io6Ω・m.
The present invention was completed by discovering the following, and furthermore, when the pressure is stopped, the product returns to its original state.
以下、本発明を添付図面に沿って詳細に説明する。The present invention will be described in detail below with reference to the accompanying drawings.
第１図は、本発明のタッチパネルの一例を示す断面図で
あり、図中、／及び２は透明基板、３及び３′は透明導
電層、ｌは有機高分子よりなる薄膜である。FIG. 1 is a cross-sectional view showing an example of the touch panel of the present invention, in which / and 2 are transparent substrates, 3 and 3' are transparent conductive layers, and l is a thin film made of an organic polymer.
透明基板／及びコとしては、透明性、耐熱性、寸法安定
性のある無機或は有機の基板が使用でき、例えばガラス
、或はポリエチレンテレフタレート、ポリエチレンナフ
タレート、ポリブチレンテレフタレート、ポリカーボネ
ート、ポリエーテルサルホン、ポリサルホン等の合成樹
脂が使用できる。特に、透明性、寸法安定性及び機械的
強度の観点からポリエチレンテレフタレ一トが好ましい
。透明基板ｌ及びコの厚さは通常、ＳＯ〜３００μｍで
ある。また、透明基板の少なくとも一方は可撓性を有す
ることが必要である。As the transparent substrate, an inorganic or organic substrate having transparency, heat resistance, and dimensional stability can be used, such as glass, polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polycarbonate, polyether salt, etc. Synthetic resins such as carbon, polysulfone, etc. can be used. In particular, polyethylene terephthalate is preferred from the viewpoints of transparency, dimensional stability, and mechanical strength. The thickness of the transparent substrates 1 and 2 is usually SO~300 μm. Furthermore, at least one of the transparent substrates needs to have flexibility.
透明導電層３及び３′は通常酸化インジウム及び／又は
酸化スズを主体とするもの、又はパラジウム、金などの
金属あるいは酸化物などであり、通常、スパッタリング
法又は真空蒸着法によシ形成させることができる。透明
導電層３及び３′の形成は通常、基材の表面抵抗値が７
０〜７０５０７口であり、また、基材の可視光透過率（
ｙｔＯｎｍ）が３０％以上、好ましくはｓ。The transparent conductive layers 3 and 3' are usually made mainly of indium oxide and/or tin oxide, or metals or oxides such as palladium or gold, and are usually formed by sputtering or vacuum evaporation. Can be done. The transparent conductive layers 3 and 3' are usually formed when the surface resistance value of the base material is 7.
0 to 70507 mouths, and the visible light transmittance of the base material (
ytOnm) is 30% or more, preferably s.
係以上となるように調節するのが好ましい。この透明導
電層３及び３′の厚さは通常、ＳＯ〜３ｏｏｏ＾程度で
ある。また、透明導電層３及び３′の形成に先だって、
必要に応じて、透明基板／及びコの表面に例えば、シリ
コン系樹脂、ウレタン系樹脂、エポキシ樹脂などの熱硬
化性樹脂を下塗りしても差し支えない。It is preferable to adjust it so that it is equal to or higher than 100%. The thickness of the transparent conductive layers 3 and 3' is usually about SO~3ooo^. Furthermore, prior to forming the transparent conductive layers 3 and 3',
If necessary, the surface of the transparent substrate may be undercoated with a thermosetting resin such as silicone resin, urethane resin, or epoxy resin.
なお、スパッタリング法とは減圧槽中に窒素、アルゴン
等の不活性ガスを封入し、該不活性ガスをイオン化して
ターゲットに照射し、ターゲットを原子または分子状態
で飛散させ、該蒸発したターゲット物質を基板表面に沈
着させる方法であり、グロー放電スパッタリング法、マ
グネトロンスパンタリング法、イオンビームスパッタリ
ング法等の方式がある。The sputtering method involves filling a vacuum tank with an inert gas such as nitrogen or argon, ionizing the inert gas, and irradiating the target with the ionized gas, scattering the target in an atomic or molecular state, and releasing the evaporated target material. This is a method of depositing on the surface of a substrate, and methods include glow discharge sputtering, magnetron sputtering, and ion beam sputtering.
また、真空蒸着法とは高真空中で蒸着材料を加熱蒸発さ
せ、この蒸発粒子を基板上に沈着させる方法でｓｂ、加
熱方式によって、抵抗加熱法、アーク蒸発法、レーザー
加熱法、高周波加熱法、電子ビーム加熱法等がある。Vacuum evaporation is a method in which the evaporation material is heated and evaporated in a high vacuum, and the evaporated particles are deposited on the substrate. , electron beam heating method, etc.
本発明における金属成分のスパッタリング又は真空蒸着
は常法に従って、例えば、直流マグネトロン式スパッタ
リング装置又はイオンビーム蒸着装置を用いて、必要に
応じて、少量の醗素を含有する不活性ガス中において、
ＳＯ〜ｉｓｏ℃、好ましくは７０〜１００℃の温度で１
０−’ 〜１Ｏ−２ｔｏｒｒ、好ましくは／ ０− ”
ｔｏｒｒ台の減圧下で実施することができる。Sputtering or vacuum evaporation of the metal component in the present invention is carried out in accordance with a conventional method, for example, using a DC magnetron sputtering device or an ion beam evaporation device, if necessary, in an inert gas containing a small amount of fluorine.
1 at a temperature of SO~iso℃, preferably 70~100℃
0-'~1O-2torr, preferably /0-''
It can be carried out under reduced pressure on the order of torr.
本発明に於いて最も大きな特徴は、上記のようにして透
明導電層を形成した透明基板を透明導電層が対向するよ
うに配置し、該対向面に有機高分子よりなる薄膜を設け
たことにある。The most significant feature of the present invention is that the transparent substrates on which the transparent conductive layers are formed as described above are arranged so that the transparent conductive layers face each other, and a thin film made of an organic polymer is provided on the opposing surfaces. be.
有機高分子よりなる薄膜ｑは、透明基板を押圧しない状
態では、透明導電層３と３′とを電気的に絶縁している
。The thin film q made of organic polymer electrically insulates the transparent conductive layers 3 and 3' when the transparent substrate is not pressed.
透明基板の一方の表面を、例えば、コ□Ｅ／ｄ以上の圧
力で押圧すると、その部分の有機高分子よりなる薄膜ダ
は絶縁破壊を起こし透明導電層３と３′とを電気的に接
続する。また、この有機高分子よりなる薄膜は、透明導
電層３と３′との接着層としても働く。For example, if one surface of the transparent substrate is pressed with a pressure of more than □E/d, the thin film made of organic polymer in that area will undergo dielectric breakdown and the transparent conductive layers 3 and 3' will be electrically connected. do. Furthermore, this thin film made of organic polymer also functions as an adhesive layer between the transparent conductive layers 3 and 3'.
薄膜ダを形成する有機高分子は、塗膜形成能を有するも
のであり、通常、フェノキシ樹脂。The organic polymer that forms the thin film has the ability to form a coating film, and is usually a phenoxy resin.
ウレタン系樹脂、エポキシ系樹脂、シリコン系また、こ
の薄膜ｑの厚さは、上述したようなパネル表面の抑圧に
よる絶縁破壊の効果を得るためには、θ、２〜ｏ、ｑμ
ｍ１好ましくはｏ、３〜ｏ、ｇμｍ１更に好ましくはθ
、ｌｌ−（１）、’７ ｔｔｍ であることが必要で
ある。厚さがＯｌ、２μｍよシ薄いと電気絶縁性が悪く
なるとともに、電気絶縁状態と押圧したときの絶縁破壊
状態の繰シ返しの再現性が悪くなる。厚さがｏ、ｑμｍ
よシ厚いと押圧しても電気絶縁破壊状態が得られ渥＜く
なる。In addition, the thickness of this thin film q should be θ, 2~o, qμ in order to obtain the effect of dielectric breakdown due to suppression of the panel surface as described above.
m1 preferably o, 3 to o, gμm1 more preferably θ
, ll-(1), '7 ttm. If the thickness is as thin as 2 μm, the electrical insulation will be poor, and the repeatability of the electrical insulation state and the dielectric breakdown state when pressed will be poor. Thickness is o, qμm
If it is too thick, even if it is pressed, an electrical insulation breakdown state will be obtained, resulting in a crack.
そして、この薄膜ダを介在させることにより、タッチパ
ネルの常態での体積抵抗値を１０１３Ω・ｍ以上、好ま
しくは１０１５Ω・ｍ以上とし、且つ表面を一２０１１
／ｃｒ１以上の圧力で押圧した際の体積抵抗値を１０６
Ω・ｍ以下、好ましくは１０’Ω・ｍ以下に調整するこ
とができる。By interposing this thin film, the volume resistance value of the touch panel in the normal state is set to 1013 Ω·m or more, preferably 1015 Ω·m or more, and the surface becomes 12011 Ω·m or more.
The volume resistance value when pressed with a pressure of /cr1 or more is 106
It can be adjusted to Ω·m or less, preferably 10'Ω·m or less.
薄膜ｌの形成方法としては、特に限定されるものではな
いが、常法に従って、ローラー又はバーコーターによシ
所望の膜厚に塗布することができる。また、通常、塗□
布に際しては、適宜の有機溶剤に有機高分子を溶解し、
この溶液を塗布するのが好ましい。塗布後は通常、引き
続き両透明基板を貼合し、これを乾燥することによシ本
発明のタッチパネルを得ることができる。The method for forming the thin film 1 is not particularly limited, but it can be coated to a desired thickness using a roller or bar coater according to a conventional method. Also, usually painted □
For fabrics, dissolve organic polymers in an appropriate organic solvent,
Preferably, this solution is applied. After coating, the touch panel of the present invention can be obtained by usually subsequently bonding the two transparent substrates together and drying this.
本発明のタッチパネルは透明であって、ドツトスペーサ
ーもなく構成が簡単であるので種々の分野に利用するこ
とができる。例えば、アナログ型タッチパネルに応用し
た場合には、全面にわたって入力が可能であり、連続し
た線をＣＲＴ上に描くことができる。また、本発明のタ
ッチパネルは、勿論、マトリックス型タッチパネルに応
用した場合でも、パネル上にドツトスペーサーの影が写
らないので、全面均一な美しいものとなる。The touch panel of the present invention is transparent, has no dot spacers, and has a simple structure, so it can be used in various fields. For example, when applied to an analog touch panel, input can be made over the entire surface, and continuous lines can be drawn on the CRT. Furthermore, even when the touch panel of the present invention is applied to a matrix type touch panel, the shadow of the dot spacer does not appear on the panel, so that the entire surface is uniform and beautiful.
次に、本発明を実施例を挙げて更に詳細に説明するが、
本発明はその要旨を越えない限シ実施例によって限定さ
れるものではない。Next, the present invention will be explained in more detail with reference to examples.
The present invention is not limited to the embodiments unless it goes beyond the gist thereof.
実施例１
厚さ１００μｍのポリエチレンテレフタレートフィルム
の片面に、酸化インジウム−酸化スズを直流マグネトロ
ンスパッタリング装置を用いて、３ Ｘ ／ ０−３ｔ
ｏｒｒの減圧下、アルゴンガス中にてスパッタリングを
行ない、導電層を形成させた。このフィルムの表面固有
抵抗は３×１０２Ω／口であり、透過率（ｙｙＯｎｍ）
は、？、？％であった。Example 1 Indium oxide-tin oxide was deposited on one side of a 100 μm thick polyethylene terephthalate film using a direct current magnetron sputtering device at 3X/0-3t.
A conductive layer was formed by sputtering in argon gas under reduced pressure. The surface resistivity of this film is 3 x 102Ω/mouth, and the transmittance (yyOnm)
teeth,? ,? %Met.
このフィルムを切断して２０Ｘ２０ｃｍのサイズのフィ
ルムをコ枚作成し、この一方のフィルムの導電層側に、
フェノキシ樹脂〔東部化成■製、商品名エポトー） Ｙ
Ｐ！０ＥＫ３！〕をメチルエチルケトンと酢酸−コーメ
トキシエチル混合溶剤（／：／）の溶液としてバーコー
ターで塗布した後、この上面に他方のフィルムを導電層
側が対向するように貼合し、次いで、これを熱風乾燥機
にて／ｌ／、０℃の温度で７０分間乾燥した。なお、こ
こで得られた積層フィルムにおけるフェノキシ樹脂層の
厚さは０．５μｍであった。Cut this film to make 20 x 20 cm films, and on the conductive layer side of one of the films,
Phenoxy resin [manufactured by Tobu Kasei, trade name: Epoto] Y
P! 0EK3! ] was coated with a bar coater as a solution of methyl ethyl ketone and acetic acid-comethoxyethyl mixed solvent (/:/), and then the other film was laminated on top of this with the conductive layer side facing, and then this was dried with hot air. It was dried in a machine at a temperature of 0° C. for 70 minutes. In addition, the thickness of the phenoxy resin layer in the laminated film obtained here was 0.5 μm.
−ヒ述の積層フィルムを用いて、上面フィルムと下面フ
ィルムの導電層に各々、電極を接続しタッチパネルとし
、このタッチパネルの電極間に５Ｖの電圧を印加し、両
極間の抵抗を測定したところ、常態での接触抵抗値は／
×７０９Ω以上（体積抵抗値コ×／θ１３Ω・ｍ以上）
であったが、表面を３０９１ｃｒｌで押圧したときの抵
抗値は１０Ω（体積抵抗値コ×１０５Ω・ｍ）であり、
また、押圧を止めたときの抵抗値は元通シのものであっ
た。なお、この抵抗値はフィルムのは・ ぼ全面にわた
シ類似の値を示した。- Using the laminated film described above, electrodes were connected to the conductive layers of the top film and the bottom film to form a touch panel, a voltage of 5V was applied between the electrodes of this touch panel, and the resistance between the two electrodes was measured. The contact resistance value under normal conditions is /
×709Ω or more (volume resistance value x/θ13Ω・m or more)
However, when the surface was pressed with 3091crl, the resistance value was 10Ω (volume resistance value × 105Ω・m),
Furthermore, the resistance value when the pressure was stopped was that of the original. Note that this resistance value showed a similar value over almost the entire surface of the film.
本発明によれば、特にアナログ型タッチパネルに於て、
ドツトスペーサーを使用しないので、製造が簡単であり
製造コストも安価である。また、高分解能を有し、複雑
な線図等の入力のときも線が途切れることはない。According to the present invention, especially in an analog touch panel,
Since dot spacers are not used, manufacturing is simple and manufacturing costs are low. It also has high resolution, so lines will not be interrupted even when inputting complex diagrams.
そのため本発明のタッチパネルは、ＡＴＭはもとよシ高
分解能が要求されるオフィスオートメーション機器にも
適用でき、その利用価値は大きい。Therefore, the touch panel of the present invention can be applied not only to ATMs but also to office automation equipment that requires high resolution, and has great utility value.
第１図は、本発明の実施例を示すタッチパネルの一例の
縦断面図であり、第２図は、従来用いられていたアナロ
グ型タッチパネルの縦断面図である。ｌ及びコは透明基
板、３及び３′は透明導電層、ｑは有機高分子よりなる
薄膜、Ｓはドツトスペーサーを示す０FIG. 1 is a vertical sectional view of an example of a touch panel showing an embodiment of the present invention, and FIG. 2 is a vertical sectional view of a conventionally used analog type touch panel. l and ko are transparent substrates, 3 and 3' are transparent conductive layers, q is a thin film made of an organic polymer, and S is a dot spacer.
Claims (3)
基板を透明導電層が対向するように配置し、該対向面が
塗膜形成能を有する有機高分子よりなる薄膜を介して接
触していることを特徴とするタッチパネル。(1) Two transparent substrates having a transparent conductive layer on at least one side are arranged so that the transparent conductive layers face each other, and the opposing surfaces are in contact with each other through a thin film made of an organic polymer having film-forming ability. A touch panel characterized by:
第１項記載のタッチパネル。(2) The touch panel according to claim 1, in which one of the transparent substrates is flexible.
であり、且つ表面を２０ｇ／ｃｍ＾２以上の圧力で押圧
した際の体積抵抗値が１０＾６Ω・ｃｍ以下である特許
請求の範囲第１項記載のタッチパネル。(3) A patent in which the volume resistivity in normal state is 10^1^5 Ω・cm or more, and the volume resistivity when the surface is pressed with a pressure of 20 g/cm^2 or more is 10^6 Ω・cm or less A touch panel according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62218356A JPH01105420A (en) | 1987-09-01 | 1987-09-01 | Touch panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62218356A JPH01105420A (en) | 1987-09-01 | 1987-09-01 | Touch panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01105420A true JPH01105420A (en) | 1989-04-21 |
Family
ID=16718599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62218356A Pending JPH01105420A (en) | 1987-09-01 | 1987-09-01 | Touch panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01105420A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03105816A (en) * | 1989-09-18 | 1991-05-02 | Nitto Denko Corp | Touch-panel switch |
| JP2012038288A (en) * | 2010-08-11 | 2012-02-23 | Samsung Electro-Mechanics Co Ltd | Touch screen device |
-
1987
- 1987-09-01 JP JP62218356A patent/JPH01105420A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03105816A (en) * | 1989-09-18 | 1991-05-02 | Nitto Denko Corp | Touch-panel switch |
| JP2012038288A (en) * | 2010-08-11 | 2012-02-23 | Samsung Electro-Mechanics Co Ltd | Touch screen device |
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