JPH01104047U - - Google Patents
Info
- Publication number
- JPH01104047U JPH01104047U JP19583687U JP19583687U JPH01104047U JP H01104047 U JPH01104047 U JP H01104047U JP 19583687 U JP19583687 U JP 19583687U JP 19583687 U JP19583687 U JP 19583687U JP H01104047 U JPH01104047 U JP H01104047U
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- connection
- wiring
- integrated circuit
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010292 electrical insulation Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Fuses (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例の集積回路用パツケ
ージの正面図、第２図はその部分断面図である。
１……セラミツク基板、４……低融点金属から
なる配線。
FIG. 1 is a front view of an integrated circuit package according to an embodiment of the present invention, and FIG. 2 is a partial sectional view thereof. 1... Ceramic substrate, 4... Wiring made of low melting point metal.
Claims (1)
と接続するための電極と、集積回路チツプ内の電
極と接続するための電極と、電極間を電気的に接
続するための配線からなる集積回路用パツケージ
において、配線の一部に温度フユーズを設けたこ
とを特徴とする集積回路用パツケージ。 An integrated circuit consisting of a substrate with high electrical insulation resistance, electrodes for connection to an external circuit, electrodes for connection to electrodes within the integrated circuit chip, and wiring for electrical connection between the electrodes. A package for integrated circuits, characterized in that a temperature fuse is provided in a part of the wiring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19583687U JPH01104047U (en) | 1987-12-25 | 1987-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19583687U JPH01104047U (en) | 1987-12-25 | 1987-12-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01104047U true JPH01104047U (en) | 1989-07-13 |
Family
ID=31486492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19583687U Pending JPH01104047U (en) | 1987-12-25 | 1987-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01104047U (en) |
-
1987
- 1987-12-25 JP JP19583687U patent/JPH01104047U/ja active Pending
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