JPH01102133U - - Google Patents
Info
- Publication number
- JPH01102133U JPH01102133U JP19891887U JP19891887U JPH01102133U JP H01102133 U JPH01102133 U JP H01102133U JP 19891887 U JP19891887 U JP 19891887U JP 19891887 U JP19891887 U JP 19891887U JP H01102133 U JPH01102133 U JP H01102133U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- hole
- support
- base plate
- supported
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Furnace Charging Or Discharging (AREA)
Description
第１図は本実施例に係る集積回路用敷板を構成
するモリブデン板の正面図、第２図は、本実施例
に係る集積回路用敷板の一構成図、第３図は、本
実施例に係る集積回路基板用敷板の使用例を示す
概略図である。
１…モリブデン敷板、２…貫通孔、２０…モリ
ブデン棒、３０…台板、３１…スペーサ、３２…
敷板、３３…磁器化材料。
FIG. 1 is a front view of a molybdenum plate constituting a bottom plate for an integrated circuit according to this embodiment, FIG. 2 is a configuration diagram of a bottom plate for an integrated circuit according to this embodiment, and FIG. It is a schematic diagram showing an example of use of such a bottom plate for an integrated circuit board. DESCRIPTION OF SYMBOLS 1... Molybdenum base plate, 2... Through hole, 20... Molybdenum rod, 30... Base plate, 31... Spacer, 32...
Floor plate, 33...porcelain material.
Claims (1)
デン板と、前記貫通孔を貫通させるための支柱と
、該支柱の一端を固定するための台板とを備え、
前記貫通された支柱により前記モリブデン板を支
持することを特徴とする集積回路基板用敷板。 A molybdenum plate in which at least one through hole is bored, a support for passing the through hole, and a base plate for fixing one end of the support,
A base plate for an integrated circuit board, characterized in that the molybdenum plate is supported by the supported pillars.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19891887U JPH0410196Y2 (en) | 1987-12-28 | 1987-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19891887U JPH0410196Y2 (en) | 1987-12-28 | 1987-12-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01102133U true JPH01102133U (en) | 1989-07-10 |
| JPH0410196Y2 JPH0410196Y2 (en) | 1992-03-13 |
Family
ID=31489398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19891887U Expired JPH0410196Y2 (en) | 1987-12-28 | 1987-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0410196Y2 (en) |
-
1987
- 1987-12-28 JP JP19891887U patent/JPH0410196Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0410196Y2 (en) | 1992-03-13 |
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