JP7499814B2 - 振動装置及びこれを含むディスプレイ装置 - Google Patents
振動装置及びこれを含むディスプレイ装置 Download PDFInfo
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- JP7499814B2 JP7499814B2 JP2022151747A JP2022151747A JP7499814B2 JP 7499814 B2 JP7499814 B2 JP 7499814B2 JP 2022151747 A JP2022151747 A JP 2022151747A JP 2022151747 A JP2022151747 A JP 2022151747A JP 7499814 B2 JP7499814 B2 JP 7499814B2
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- vibration modules
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/15—Transducers incorporated in visual displaying devices, e.g. televisions, computer displays, laptops
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
- H04R7/045—Plane diaphragms using the distributed mode principle, i.e. whereby the acoustic radiation is emanated from uniformly distributed free bending wave vibration induced in a stiff panel and not from pistonic motion
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- Signal Processing (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- General Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Description
(PbA-BCB)((Mg1/3Nb2/3)a(Ni1/3Nb2/3)bZrcTid)O3
200:振動装置
210:振動アレイ
210A、210B、210C、210D:振動モジュール
211:圧電層
211a:第1部分
211b:第2部分
212:第1接着層
213、218:第1保護部材
214:第2接着層
215、219:第2保護部材
216:プレート
217:カバー部材
220:フレキシブルケーブル
221:ベース部材
223:導電体層
225:絶縁層
300:支持部材
400:パネル連結部材
600:パーティション
Claims (28)
- 第1保護部材と第2保護部材との間にある複数の振動モジュールを含むように構成されたタイリング振動フィルム、および
前記複数の振動モジュールのそれぞれの側面の間に配置された接着層を含み、
前記複数の振動モジュールのそれぞれは、
第1電極層、
第2電極層、および
前記第1電極層と前記第2電極層との間にある圧電複合部を含み、
前記複数の振動モジュールのそれぞれの前記第1電極層は、同一平面上で前記第1保護部材に共通して連結されて、
前記複数の振動モジュールのそれぞれの前記第2電極層は、同一平面上で前記第2保護部材に共通して連結された、振動装置。 - 前記接着層は、前記複数の振動モジュールのそれぞれを囲むように構成された、請求項1に記載の振動装置。
- 前記圧電複合部は、1-3振動モードの圧電特性を有する1-3複合体または2-2振動モードの圧電特性を有する2-2複合体を含むように構成された、請求項1に記載の振動装置。
- 前記接着層は、
前記複数の振動モジュールのそれぞれの側面と前面を囲むように構成された第1接着層、および
前記複数の振動モジュールのそれぞれの側面と背面を囲むように構成された第2接着層を含む、請求項1に記載の振動装置。 - 前記複数の振動モジュールは、前記第1接着層と前記第2接着層との間に埋め込まれた、請求項4に記載の振動装置。
- 前記第1接着層と前記第2接着層は、前記複数の振動モジュールの側面の間で互いに連結されるように構成された、請求項4に記載の振動装置。
- 前記第1保護部材は、前記第1接着層を媒介として前記複数の振動モジュールのそれぞれの第1面に共通して連結されて、
前記第2保護部材は、前記第2接着層を媒介として前記複数の振動モジュールのそれぞれの第2面に共通して連結された、請求項4に記載の振動装置。 - 前記接着層は、
前記複数の振動モジュールのそれぞれの前記第1電極層と前記第1保護部材との間にある前記第1接着層、および
前記複数の振動モジュールのそれぞれの前記第2電極層と前記第2保護部材との間にある前記第2接着層を含む、請求項7に記載の振動装置。 - 前記第1接着層と前記第2接着層は、前記複数の振動モジュールのそれぞれの側面との間で互いに連結されるように構成された、請求項8に記載の振動装置。
- 前記第1保護部材または前記第2保護部材の上にあるプレートをさらに含む、請求項7に記載の振動装置。
- 前記プレートは、金属材質を含む、請求項10に記載の振動装置。
- 前記第1および第2保護部材のうちのいずれか一つは、金属材質を含み、
前記第1および第2保護部材のうちの他の一つは、プラスチック材質を含む、請求項7に記載の振動装置。 - 前記複数の振動モジュールのそれぞれに電気的に連結されたフレキシブルケーブルをさらに含み、
前記フレキシブルケーブルは、
端子部を有する胴体部、および
前記胴体部から突出された複数のラインを含み、前記複数のラインは、前記第1保護部材と前記第2保護部材との間にある、請求項7から12のいずれか一項に記載の振動装置。 - 前記複数のラインのうちのいくつかは、前記複数の振動モジュールのそれぞれの前記第1電極層と電気的に連結され、
前記複数のラインのうちの残りは、前記複数の振動モジュールのそれぞれの前記第2電極層と電気的に連結された、請求項13に記載の振動装置。 - 前記複数の振動モジュールのそれぞれに電気的に連結したフレキシブルケーブルをさらに含み、
前記フレキシブルケーブルは、
第1方向と交差する第2方向に沿って配置され、前記第2方向と平行な同じ列に配置された前記複数の振動モジュールのうちのいくつかの振動モジュールの前記第1電極層と電気的に連結された第1ライン、
前記第2方向に沿って配置され、前記複数の振動モジュールのうちの前記いくつかの振動モジュールの前記第2電極層と電気的に連結された第2ライン、
前記第1ラインから前記第1方向に沿って延長され、前記複数の振動モジュールのそれぞれの前記第1電極層と電気的に連結された第3ライン、および
前記第2ラインから前記第1方向に沿って延長され、前記複数の振動モジュールのそれぞれの前記第2電極層と電気的に連結された第4ラインを含む、請求項1から12のいずれか一項に記載の振動装置。 - 前記複数の振動モジュールは、各々独立して駆動されず、一つの単一体として駆動される単一の振動装置として実現された、請求項1から15のいずれか一項に記載の振動装置。
- 前記圧電複合部は、
圧電特性を有する複数の無機物質部、および
前記複数の無機物質部の間に配置された有機物質部を含む、請求項1から16のいずれか一項に記載の振動装置。 - 複数の前記有機物質部のそれぞれの大きさは、前記圧電複合部の中間部分から両端部分の方にいくほど徐々に減少する、請求項17に記載の振動装置。
- 前記複数の無機物質部のそれぞれは、ライン形状、円形状、楕円形状、および多角形状のうちのいずれか一つ以上の形状を有する、請求項17に記載の振動装置。
- 前記複数の振動モジュールは、同一平面上に互いに交差する第1方向および第2方向にi×j(iは2以上の自然数であり、jはiと同じか、1以上の自然数)の形態で配置された、請求項1から12のいずれか一項に記載の振動装置。
- 前記複数の振動モジュールは、前記第1方向および前記第2方向のそれぞれに沿って0.1mm以上3cm未満の間隔で互いに離隔された、請求項20に記載の振動装置。
- 前記第1方向および前記第2方向を基準に、前記複数の振動モジュール間の間隔は、0.1mm~5mmである、請求項20に記載の振動装置。
- 映像を表示するように構成された表示パネル、および
前記表示パネルの背面にあり、前記表示パネルを振動させるように構成された少なくとも一つの振動アレイを含むように構成された請求項1から22のいずれか一項に記載の振動装置を含む、ディスプレイ装置。 - 前記表示パネルは、表示領域と重畳する第1領域および第2領域を含み、前記表示領域は、 映像を表示するように構成され、
前記振動装置は、
前記第1領域にある第1振動アレイ、および
前記第2領域にある第2振動アレイを含む、請求項23に記載のディスプレイ装置。 - 前記表示パネルの背面にある支持部材、
前記表示パネルの背面と前記支持部材との間にあり、前記第1振動アレイを囲む第1エンクロージャー、および
前記表示パネルの背面と前記支持部材との間にあり、前記第2振動アレイを囲む第2エンクロージャーをさらに含む、請求項24に記載のディスプレイ装置。 - 前記表示パネルは、表示領域と重畳する第1領域および第2領域を含み、前記表示領域は、 映像を表示するように構成され、
前記振動装置は、
前記第1領域にある第1振動アレイ、
前記第2領域にある第2振動アレイ、
前記第1振動アレイとは別に配置され、前記第1領域にある第3振動アレイ、および
前記第2振動アレイとは別に配置され、前記第2領域にある第4振動アレイを含む、請求項23に記載のディスプレイ装置。 - 前記表示パネルの背面にある支持部材、
前記表示パネルの背面と前記支持部材との間にあり、前記第1および第3振動アレイを囲む第1エンクロージャー、および
前記表示パネルの背面と前記支持部材との間にあり、前記第2および第4振動アレイを囲む第2エンクロージャーをさらに含む、請求項26に記載のディスプレイ装置。 - 前記第1振動アレイと前記第3振動アレイは、対角線方向に互い違いに配置され、
前記第2振動アレイと前記第4振動アレイは、対角線方向に互い違いに配置される、請求項27に記載のディスプレイ装置。
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009514765A (ja) | 2005-11-04 | 2009-04-09 | セラコンプ カンパニー, リミテッド | 圧電単結晶及びその製造方法、並びにその圧電単結晶を利用した圧電応用部品及び誘電応用部品 |
WO2010005045A1 (ja) | 2008-07-09 | 2010-01-14 | Hiroshige Hatsunori | 薄型マイクロフォン及びマイクロフォン付きヘルメット |
CN203057505U (zh) | 2012-12-13 | 2013-07-10 | 瑞声声学科技(常州)有限公司 | 压电陶瓷阵列薄膜 |
WO2017069055A1 (ja) | 2015-10-21 | 2017-04-27 | 富士フイルム株式会社 | 映像音響システム |
JP2018093469A (ja) | 2016-11-30 | 2018-06-14 | エルジー ディスプレイ カンパニー リミテッド | パネル振動型音響発生表示装置 |
US20200059733A1 (en) | 2018-08-20 | 2020-02-20 | Lg Display Co., Ltd. | Display apparatus including flexible vibration module and method of manufacturing the flexible vibration module |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH084359B2 (ja) | 1987-12-02 | 1996-01-17 | 日本電波工業株式会社 | 超音波探触子 |
JP2000324598A (ja) | 1999-05-14 | 2000-11-24 | Hitachi Metals Ltd | 圧電スピーカの製造方法 |
JP2001223556A (ja) | 2000-02-14 | 2001-08-17 | Ueda Japan Radio Co Ltd | 圧電振動子及びアレイ型圧電振動子 |
CN103155590B (zh) | 2010-11-01 | 2016-05-04 | 日本电气株式会社 | 振荡设备和便携设备 |
JP2014072339A (ja) | 2012-09-28 | 2014-04-21 | Sumitomo Electric Ind Ltd | 圧電デバイス |
KR102229137B1 (ko) | 2014-05-20 | 2021-03-18 | 삼성디스플레이 주식회사 | 표시장치 |
WO2016157491A1 (ja) * | 2015-04-02 | 2016-10-06 | 富士通株式会社 | 電子機器、座標検出ユニット、及び、接着部材 |
US10129646B2 (en) | 2016-03-28 | 2018-11-13 | Lg Display Co., Ltd. | Panel vibration type sound generating display device |
KR102320360B1 (ko) * | 2017-07-18 | 2021-11-01 | 엘지디스플레이 주식회사 | 표시 장치 |
KR101919454B1 (ko) * | 2017-07-31 | 2018-11-16 | 엘지디스플레이 주식회사 | 디스플레이 장치 및 이를 이용한 컴퓨팅 장치 |
US10757808B2 (en) * | 2018-01-16 | 2020-08-25 | Samsung Display Co., Ltd. | Display device and method of fabricating the same |
KR20200039508A (ko) | 2018-10-07 | 2020-04-16 | 유종현 | 차량용 이동방지모듈 |
-
2020
- 2020-03-31 KR KR1020200039508A patent/KR20210121979A/ko unknown
-
2021
- 2021-03-31 JP JP2021062244A patent/JP7148668B2/ja active Active
- 2021-03-31 US US17/218,605 patent/US11671750B2/en active Active
- 2021-03-31 EP EP21166375.2A patent/EP3890351A1/en active Pending
- 2021-03-31 CN CN202110347038.6A patent/CN113467634B/zh active Active
-
2022
- 2022-09-22 JP JP2022151747A patent/JP7499814B2/ja active Active
-
2023
- 2023-04-21 US US18/304,790 patent/US20230262380A1/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009514765A (ja) | 2005-11-04 | 2009-04-09 | セラコンプ カンパニー, リミテッド | 圧電単結晶及びその製造方法、並びにその圧電単結晶を利用した圧電応用部品及び誘電応用部品 |
WO2010005045A1 (ja) | 2008-07-09 | 2010-01-14 | Hiroshige Hatsunori | 薄型マイクロフォン及びマイクロフォン付きヘルメット |
CN203057505U (zh) | 2012-12-13 | 2013-07-10 | 瑞声声学科技(常州)有限公司 | 压电陶瓷阵列薄膜 |
WO2017069055A1 (ja) | 2015-10-21 | 2017-04-27 | 富士フイルム株式会社 | 映像音響システム |
JP2018093469A (ja) | 2016-11-30 | 2018-06-14 | エルジー ディスプレイ カンパニー リミテッド | パネル振動型音響発生表示装置 |
US20200059733A1 (en) | 2018-08-20 | 2020-02-20 | Lg Display Co., Ltd. | Display apparatus including flexible vibration module and method of manufacturing the flexible vibration module |
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