JP7442385B2 - LED light emitting device - Google Patents
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- JP7442385B2 JP7442385B2 JP2020084572A JP2020084572A JP7442385B2 JP 7442385 B2 JP7442385 B2 JP 7442385B2 JP 2020084572 A JP2020084572 A JP 2020084572A JP 2020084572 A JP2020084572 A JP 2020084572A JP 7442385 B2 JP7442385 B2 JP 7442385B2
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- 239000003566 sealing material Substances 0.000 description 8
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- 229910052751 metal Inorganic materials 0.000 description 3
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- 238000004519 manufacturing process Methods 0.000 description 2
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
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- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
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Description
本発明は、円形の発光部に多数のＬＥＤダイを実装したＬＥＤ発光装置に関する。 The present invention relates to an LED light emitting device in which a large number of LED dies are mounted in a circular light emitting section.
熱伝導率が高く平板状の実装基板を備え、この実装基板の上面に円形の発光部が設けられたＣＯＢタイプのＬＥＤ発光装置が知られている。通常、この発光部では、多数のＬＥＤダイが実装され、封止材がＬＥＤダイ全体を一体的に被覆している。このとき、ＬＥＤダイは、複数の直列回路（以下「ＬＥＤ列」という。）を構成し、さらに、このＬＥＤ列は、並列接続する。なお、「ＣＯＢ」とは、「Ｃｈｉｐ ｏｎ Ｂｏａｒｄ」の略称である。 2. Description of the Related Art A COB type LED light emitting device is known, which includes a flat mounting board with high thermal conductivity and a circular light emitting section provided on the top surface of the mounting board. Usually, in this light emitting part, a large number of LED dies are mounted, and the entire LED die is integrally covered with a sealing material. At this time, the LED dies constitute a plurality of series circuits (hereinafter referred to as "LED strings"), and the LED strings are connected in parallel. Note that "COB" is an abbreviation for "Chip on Board."
例えば、特許文献１の図３には、セラミックからなる実装基板に円形の発光部を備えたＬＥＤ発光装置が示されている。発光部では、複数のＬＥＤダイが直並列回路を構成している。そこで、特許文献１の図３を、本願に添付した図面の図３に引用し、図３に示されたＬＥＤ発光装置１１０（発光装置）について説明する。なお、（）には、特許文献１における用語を示す。引用にあたり、符号を変更した。さらに、ダムを示す引き出し線と符号を追加した。 For example, FIG. 3 of Patent Document 1 shows an LED light emitting device including a circular light emitting portion on a mounting board made of ceramic. In the light emitting section, a plurality of LED dies constitute a series/parallel circuit. Therefore, the LED light emitting device 110 (light emitting device) shown in FIG. 3 will be described with reference to FIG. 3 of Patent Document 1 and FIG. 3 of the drawings attached to the present application. Note that () indicates terms in Patent Document 1. When quoting, the sign has been changed. Furthermore, a leader line and a symbol indicating the dam were added.
図３は、従来例として示すＬＥＤ発光装置１１０の内部構造を示す平面図である。図３に示すように、ＬＥＤ発光装置１１０は、実装基板１１１（基板）上に円環状のダム１１５が形成されている。ダム１１５の内側の領域は発光部となり、この発光部に多数のＬＥＤダイ１１２（ＬＥＤチップ）が実装されている。さらに、この発光部では、図示していない封止材（封止部材）が充填され、この封止材が全てのＬＥＤダイ１１２を一体的に被覆している。また、実装基板１１１上には、電極１１６ａ及び電極１１６ａに接続する配線１１６、並びに電極１１６ｂ及び電極１１６ｂに接続する配線１１６が形成されている。電極１１６ａに接続する配線１１６の一部分は、ダム１１５の一方の部分（図の左上隅側の部分）に覆われている。同様に、電極１１６ｂに接続する配線１１６の一部分は、ダム１１５の他方の部分（図の右下隅側の部分）に覆われている。 FIG. 3 is a plan view showing the internal structure of an LED light emitting device 110 shown as a conventional example. As shown in FIG. 3, in the LED light emitting device 110, an annular dam 115 is formed on a mounting board 111 (substrate). The area inside the dam 115 becomes a light emitting section, and a large number of LED dies 112 (LED chips) are mounted in this light emitting section. Further, this light emitting portion is filled with a sealing material (sealing member) not shown, and this sealing material integrally covers all the LED dies 112. Further, on the mounting board 111, an electrode 116a and a wiring 116 connected to the electrode 116a, and an electrode 116b and a wiring 116 connected to the electrode 116b are formed. A portion of the wiring 116 connected to the electrode 116a is covered by one portion of the dam 115 (the portion on the upper left corner side in the figure). Similarly, a portion of the wiring 116 connected to the electrode 116b is covered by the other portion of the dam 115 (the portion on the lower right corner side in the figure).
また、図３に示すように、発光部に含まれる６０個のＬＥＤダイ１１２は、１２個ずつ直列接続して５本のＬＥＤ列を構成し、さらにこのＬＥＤ列が並列接続している。すなわち、各ＬＥＤ列の一方の端部のＬＥＤダイ１１２は、電極１１６ａに接続する配線１１６と接続し、他方の端部のＬＥＤダイは、電極１１６ｂに接続する配線１１６と接続している。なお、図の上側と下側のＬＥＤ列は、９個のＬＥＤダイ１１２からなる部分ＬＥＤ列と３個のＬＥＤダイからなる部分ＬＥＤに分解され、これらを中継配線で接続することにより、１２個のＬＥＤダイからなるＬＥＤ列を構成している。 Further, as shown in FIG. 3, the 60 LED dies 112 included in the light emitting section are connected in series, 12 each, to form five LED rows, and these LED rows are further connected in parallel. That is, the LED die 112 at one end of each LED row is connected to the wiring 116 connected to the electrode 116a, and the LED die at the other end is connected to the wiring 116 connected to the electrode 116b. Note that the LED rows on the upper and lower sides of the figure are separated into a partial LED row consisting of 9 LED dies 112 and a partial LED row consisting of 3 LED dies, and by connecting these with relay wiring, 12 The LED array is made up of LED dies.
なお、図３に示されたＬＥＤ発光装置１１０は、ダム１１５から封止材が染み出すことがないように、Ｒで示す領域にバッファ層１１４を設けている。 Note that in the LED light emitting device 110 shown in FIG. 3, a buffer layer 114 is provided in a region indicated by R so that the sealing material does not seep out from the dam 115.
円形の発光部を均一に発光させるには、発光部においてＬＥＤダイを均等に配置するこ
とが望まれる。つまり、発光領域の中心線（図３ではＩＶ－ＩＶ線が相当する。）から離れるにしたがって、中心線と平行な配列に含まれるＬＥＤダイの数が減少すると良い。しかしながら、ＬＥＤ発光装置１１０では、中心線に沿うＬＥＤダイ１１２の配列と、これに隣接する２本のＬＥＤダイ１１２の配列は、共に１２個のＬＥＤダイ１１２を含んでいる。すなわち、ＬＥＤ発光装置１１０は、中心線近傍でＬＥＤダイ１１２の実装密度が高くなり強く発光する。このため、ＬＥＤ発光装置１１０は、均一な発光を達成できないという課題を有する。
In order to uniformly emit light from the circular light emitting section, it is desirable to arrange the LED dies evenly in the light emitting section. In other words, it is preferable that the number of LED dies included in the array parallel to the center line decreases as the distance from the center line of the light emitting region (corresponding to line IV-IV in FIG. 3) increases. However, in the LED light emitting device 110, both the array of LED dies 112 along the center line and the array of two LED dies 112 adjacent thereto include 12 LED dies 112. That is, in the LED light emitting device 110, the mounting density of the LED dies 112 becomes high near the center line, and the LED dies 112 emit light strongly. Therefore, the LED light emitting device 110 has a problem in that it cannot achieve uniform light emission.
また、一般に、ＬＥＤ発光装置は、使用できる電源の電圧に合わせ、ＬＥＤ列に含まれるＬＥＤダイの直列段数を調整する。前述のように、ＬＥＤ発光装置１１０では、直列段数が１２段である。しかしながら、ＬＥＤ列の直列段数を維持したままＬＥＤ列の数を減らして発光部を小型化しようとした場合、ＬＥＤ発光装置１１０には、中心線近傍でＬＥＤダイ１１２が密集するか又は実装不能となる、という課題が生じる。 Further, in general, in an LED light emitting device, the number of series stages of LED dies included in an LED string is adjusted in accordance with the voltage of an available power supply. As described above, in the LED light emitting device 110, the number of series stages is 12. However, if an attempt is made to downsize the light emitting section by reducing the number of LED strings while maintaining the number of series stages of the LED strings, the LED dies 112 may become crowded near the center line of the LED light emitting device 110 or may become impossible to mount. The problem arises.
そこで、本発明は、上記課題に鑑みて為されたものであり、円形の発光部に多数のＬＥＤダイが実装されたＬＥＤ発光装置において、適正な直列段数を維持しながら均一な発光が得られるＬＥＤ発光装置を提供することを目的とする。 Therefore, the present invention has been made in view of the above-mentioned problems, and it is possible to obtain uniform light emission while maintaining an appropriate number of series stages in an LED light emitting device in which a large number of LED dies are mounted in a circular light emitting part. The purpose is to provide an LED light emitting device.
上記課題を解決するため、本発明のＬＥＤ発光装置は、実装基板と、前記実装基板の上面を占める円形の発光部と、前記発光部に実装された複数のＬＥＤダイとを備えたＬＥＤ発光装置において、前記ＬＥＤダイは、直列接続して第１ＬＥＤ列及び第２ＬＥＤ列を構成し、前記第１ＬＥＤ列は、Ｕ字状に配列し、前記第２ＬＥＤ列は、前記第１ＬＥＤ列からなるＵ字状の配列の内側の領域でＵ字状に配列していることを特徴とする。 In order to solve the above problems, an LED light emitting device of the present invention includes a mounting board, a circular light emitting section occupying the upper surface of the mounting board, and a plurality of LED dies mounted on the light emitting section. The LED dies are connected in series to form a first LED column and a second LED column, the first LED column is arranged in a U-shape, and the second LED column is arranged in a U-shape consisting of the first LED column. It is characterized by being arranged in a U-shape in the inner region of the arrangement.
Ｕ字状に配列する第１ＬＥＤ列には、発光部の中心線に近い配列と、中心線から遠い配列が含まれる。同様に、Ｕ字状に配列する第２ＬＥＤ列には、発光部の中心線に近い配列と、中心線から遠い配列が含まれる。円形の発光領域において、第１ＬＥＤ列と第２ＬＥＤ列の直列段数を等しくし、第１ＬＥＤ列を構成する配列の内側の領域に第２ＬＥＤ列を構成する配列を配するとき、第１ＬＥＤ列を構成する中心線に近い側の配列、第２ＬＥＤ列を構成する中心線に近い側の配列、第２ＬＥＤ列を構成する中心線から遠い側の配列、第１ＬＥＤ列を構成する中心線から遠い側の配列、のそれぞれに含まれるＬＥＤダイの数は、この順番で減少する。 The first LED array arranged in a U-shape includes an arrangement close to the center line of the light emitting part and an arrangement far from the center line. Similarly, the second LED row arranged in a U-shape includes an arrangement close to the center line of the light emitting part and an arrangement far from the center line. In a circular light-emitting region, when the number of serial stages of the first LED row and the second LED row is equal, and the array forming the second LED string is arranged in the inner area of the array forming the first LED string, the first LED string is formed. An array closer to the center line, an array closer to the center line constituting the second LED row, an array farther from the center line constituting the second LED row, an array farther from the center line constituting the first LED row, The number of LED dies included in each decreases in this order.
前記ＬＥＤダイ同士を接続するワイヤを備え、前記ＬＥＤダイと前記ワイヤは、一直線状に配列していても良い。 A wire may be provided to connect the LED dies, and the LED dies and the wires may be arranged in a straight line.
前記第１ＬＥＤ列は、配列中に中継配線が含まれていても良い。 The first LED row may include relay wiring in its arrangement.
前記発光部を囲むダムを備え、前記中継配線は、少なくとも一部分が前記ダムで覆われていても良い。 A dam surrounding the light emitting part may be provided, and at least a portion of the relay wiring may be covered with the dam.
前記発光部の一方の周辺部にアノード配線とカソード配線を備え、前記発光部の他方の周辺部に中継配線を備え、前記第１ＬＥＤ列及び前記第２ＬＥＤ列の一方の端部を構成する前記ＬＥＤダイのアノードは、それぞれ前記アノード配線と接続し、前記第１ＬＥＤ列及び前記第２ＬＥＤ列の他方の端部を構成する前記ＬＥＤダイのカソードは、それぞれ前記カソード配線と接続していても良い。 The LED includes an anode wiring and a cathode wiring in one peripheral part of the light emitting part, a relay wiring in the other peripheral part of the light emitting part, and constitutes one end part of the first LED row and the second LED row. The anodes of the dies may be respectively connected to the anode wiring, and the cathodes of the LED dies constituting the other ends of the first LED row and the second LED row may be respectively connected to the cathode wiring.
以上のように、本発明のＬＥＤ発光装置は、円形の発光部において、第１ＬＥＤ列から
なるＵ字状の配列の内側で第２ＬＥＤ列がＵ字状に配列しているため、適正な直列段数を維持しながら均一に発光することが可能となる。
As described above, in the LED light emitting device of the present invention, in the circular light emitting portion, the second LED row is arranged in a U shape inside the U shape arrangement consisting of the first LED row, so that an appropriate number of series stages can be achieved. It becomes possible to emit light uniformly while maintaining the
以下、図１及び図２を参照しながら本発明の好適な実施形態について詳細に説明する。なお、図面の説明において、同一または相当要素には同一の符号を付し、重複する説明は省略する。説明のため部材の縮尺は適宜変更している。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to FIGS. 1 and 2. In the description of the drawings, the same or equivalent elements are given the same reference numerals, and redundant description will be omitted. For the sake of explanation, the scale of the members has been changed as appropriate.
図１は、本発明の第１実施形態として示すＬＥＤ発光装置１０の斜視図である。図２０に示すように、ＬＥＤ発光装置１０は、実装基板１１と、実装基板１１の上面を占める円形の発光部１２と、発光部１２を囲むダム１５とを備えている。実装基板１１は、略正方形であり、対向する２つの角部に切り欠き１１ａが設けられ、他の対抗する２つの角部に電源電極１６ａ、１６ｂが形成されている。ダム１５で囲まれた発光部１２には、封止材１２ａが充填されている。 FIG. 1 is a perspective view of an LED light emitting device 10 shown as a first embodiment of the present invention. As shown in FIG. 20, the LED light emitting device 10 includes a mounting board 11, a circular light emitting section 12 occupying the upper surface of the mounting board 11, and a dam 15 surrounding the light emitting section 12. The mounting board 11 is approximately square, with cutouts 11a provided at two opposing corners, and power supply electrodes 16a, 16b formed at the other two opposing corners. The light emitting section 12 surrounded by the dam 15 is filled with a sealing material 12a.
実装基板１１は、ベース材がアルミナからなる白色のセラミクスであり、上面に、Ｃｕ上にＮｉ、Ａｕを積層し、パターニングされた電源電極１６ａ、１６ｂ等の金属膜を備えている。封止材１２ａは、ＹＡＧなどの蛍光体を含有したシリコーン樹脂である。ダム１５は、酸化チタンの微粒子を混練した白色のシリコーン樹脂からなり、太さが０．７～１．３ｍｍ、高さが０．５～０．８ｍｍである。 The mounting board 11 is made of white ceramics whose base material is alumina, and has metal films such as power supply electrodes 16a and 16b patterned on the upper surface by stacking Ni and Au on Cu. The sealing material 12a is a silicone resin containing a phosphor such as YAG. The dam 15 is made of white silicone resin kneaded with fine particles of titanium oxide, and has a thickness of 0.7 to 1.3 mm and a height of 0.5 to 0.8 mm.
図２は、ＬＥＤ発光装置１０の内部構造を示す平面図である。なお、図２では、内部構造を分かりやすくするため、図１に示した封止材１２ａ、ダム１５を取り除いて描いている（図中、ダム１５が占める領域を点線で示した。）。また、発光部１２の中心線（ＡＡ´線）を書き加えている。 FIG. 2 is a plan view showing the internal structure of the LED light emitting device 10. In addition, in FIG. 2, in order to make the internal structure easier to understand, the sealing material 12a and the dam 15 shown in FIG. 1 are removed (in the figure, the area occupied by the dam 15 is indicated by a dotted line). Additionally, the center line (line AA') of the light emitting section 12 is added.
図２に示すように、実装基板１１の上面には、パターニングされた金属膜として、電源電極１６ａ、１６ｂに加え、アノード配線１７ａ、カソード配線１７ｂ、中継配線１７ｃ、１７ｄ、１７ｅ、１７ｆが形成されている。アノード配線１７ａは、電源電極１６ａに接続するとともに、発光部の一方の周辺部（図の上側）に形成された部分がダム１５に覆われている。カソード配線１７ｂは、電源電極１６ｂに接続するとともに、アノード配線１７ａのダム１５に覆われている部分と並列配置されている部分と、ダム１５に沿って電極１６ｂの近傍まで延長された部分を有している。なお、カソード配線１７ｂのこれらの部分はダム１５に覆われている。また、カソード配線１７ｂのアノード配線１７ａと並列配置された部分は、４つに分断され、それぞれワイヤ１４で接続している。中継配線１７ｃ～１７ｆは、発光部１２の他方の周辺部（図の下側）に形成されている。なお、中継配線１７ｆは、ダム１５下の金属膜の分布を均一化するため一方の周辺部（図の上側）まで延長されている。 As shown in FIG. 2, in addition to power supply electrodes 16a and 16b, an anode wiring 17a, a cathode wiring 17b, and relay wirings 17c, 17d, 17e, and 17f are formed as a patterned metal film on the upper surface of the mounting board 11. ing. The anode wiring 17a is connected to the power supply electrode 16a, and a portion formed at one peripheral portion (upper side in the figure) of the light emitting portion is covered by the dam 15. The cathode wiring 17b is connected to the power supply electrode 16b, and has a portion that is arranged in parallel with the portion of the anode wiring 17a covered by the dam 15, and a portion that extends along the dam 15 to the vicinity of the electrode 16b. are doing. Note that these portions of the cathode wiring 17b are covered by the dam 15. Further, a portion of the cathode wiring 17b arranged in parallel with the anode wiring 17a is divided into four parts, each of which is connected by a wire 14. The relay wirings 17c to 17f are formed at the other peripheral portion of the light emitting section 12 (lower side in the figure). Note that the relay wiring 17f is extended to one peripheral portion (upper side in the figure) in order to equalize the distribution of the metal film under the dam 15.
発光部１２には、４８個のＬＥＤダイ１３が実装されている。ＬＥＤダイ１３は、平面サイズが０．６ｍｍ×０．６ｍｍ、厚さが数１００μｍ、表面に発光層を備える青色発光ダイオードである。発光部１２において、ＬＥＤダイ１３は、発光部１２の中心線ＡＡ´と平行に８列で直線的に配列している。すなわち、中心線ＡＡ´から数えて１番目の配列２１、２番目の配列２２、３番目の配列２３、及び４番目の配列２４は、それぞれ８個、７個、５個、及び４個のＬＥＤダイ１３で構成されている。なお、発光部１２では、中心
線ＡＡ´に対し、ＬＥＤダイ１３の配置及びＬＥＤダイ１３同士の接続が対象であり、回路も等しいので、特に断らない限り、図２の左半分だけで説明を進める。また、各ＬＥＤダイ１３は、図の左右に２分する中心線（図示せず）上にアノードとカソードを備えており、各配列２１～２４においてＬＥＤダイ１３同士がワイヤ１４で直列接続されている。この結果、各配列２１～２４において、ＬＥＤダイ１３とワイヤ１４は、一直線状に配列している。
Forty-eight LED dies 13 are mounted on the light emitting section 12. The LED die 13 is a blue light emitting diode with a planar size of 0.6 mm x 0.6 mm, a thickness of several 100 μm, and a light emitting layer on the surface. In the light emitting section 12, the LED dies 13 are linearly arranged in eight rows parallel to the center line AA' of the light emitting section 12. That is, the first array 21, the second array 22, the third array 23, and the fourth array 24 counting from the center line AA' have 8, 7, 5, and 4 LEDs, respectively. It is composed of a die 13. In addition, in the light emitting part 12, the arrangement of the LED dies 13 and the connections between the LED dies 13 with respect to the center line AA' are targeted, and the circuits are also the same, so unless otherwise specified, the explanation will be based on only the left half of FIG. 2. Proceed. Each LED die 13 is provided with an anode and a cathode on a center line (not shown) that bisects the left and right sides of the figure, and the LED dies 13 in each array 21 to 24 are connected in series by wires 14. There is. As a result, in each array 21 to 24, the LED die 13 and the wire 14 are arranged in a straight line.
図２の左半分の領域において、配列２１と配列２４が１ＬＥＤ列３１を構成する。同様に、配列２２と配列２３が第２ＬＥＤ列３２を構成する。第１ＬＥＤ列３１及び第２ＬＥＤ列３２では、それぞれ１２個のＬＥＤダイ１３が直列接続している。第１ＬＥＤ列３１は、配列２１と配列２４を中継配線１７ｃで接続することによりＵ字状の配列を構成する。同様に、第２ＬＥＤ列３２は、配列２２と配列２３を中継配線１７ｄで接続することよりＵ字状の配列を構成する。第２ＬＥＤ列３２は、第１ＬＥＤ列３１からなるＵ字状の配列の内側の領域に配置されている。 In the left half region of FIG. 2, array 21 and array 24 constitute one LED row 31. Similarly, array 22 and array 23 constitute a second LED row 32. In each of the first LED row 31 and the second LED row 32, twelve LED dies 13 are connected in series. The first LED array 31 forms a U-shaped array by connecting the arrays 21 and 24 with relay wiring 17c. Similarly, the second LED row 32 forms a U-shaped array by connecting the arrays 22 and 23 with the relay wiring 17d. The second LED row 32 is arranged in a region inside the U-shaped arrangement made up of the first LED row 31.
第１ＬＥＤ列３１では、配列２１の上端部のＬＥＤダイ１３のカソード及び配列２４の上端部のＬＥＤダイ１３のアノードが、ワイヤ１４によりそれぞれカソード配線１７ｂ及びアノード配線１７ａと接続している。同様に、第２ＬＥＤ列３２では、配列２２の上端部のＬＥＤダイ１３のカソード及び配列２３の上端部のＬＥＤダイ１３のアノードが、ワイヤ１４によりそれぞれカソード配線１７ｂ及びアノード配線１７ａと接続している。すなわち、第１ＬＥＤ列３１と第２ＬＥＤ列３２は、並列接続している。なお、電源電極１６ａ及び電源電極１６ｂは、それぞれ＋側電極及び－側電極となる。 In the first LED row 31, the cathodes of the LED dies 13 at the upper end of the array 21 and the anodes of the LED dies 13 at the upper end of the array 24 are connected to the cathode wiring 17b and the anode wiring 17a by wires 14, respectively. Similarly, in the second LED row 32, the cathodes of the LED dies 13 at the upper end of the array 22 and the anodes of the LED dies 13 at the upper end of the array 23 are connected to the cathode wiring 17b and the anode wiring 17a, respectively, by wires 14. . That is, the first LED row 31 and the second LED row 32 are connected in parallel. Note that the power source electrode 16a and the power source electrode 16b serve as a + side electrode and a − side electrode, respectively.
以上のように、第１ＬＥＤ列３１と第２ＬＥＤ列３２は、円形の発光部１２において、それぞれの直列段数が等しく、中心線ＡＡ´から離れるにしたがって、配列２１～２４に含まるＬＥＤダイ１３の個数が減少する。この結果、発光部１２において、ＬＥＤダイ１３が均等に配置され、発光が均一化する。すなわち、ＬＥＤ発光装置１０は、円形の発光部１２に多数のＬＥＤダイ１３を実装しながら、適正な直列段数を維持しながら均一な発光を得ることが可能となる。 As described above, the first LED row 31 and the second LED row 32 have the same number of series stages in the circular light emitting section 12, and as they move away from the center line AA', the number of LED dies 13 included in the arrays 21 to 24 increases. The number decreases. As a result, the LED dies 13 are evenly arranged in the light emitting section 12, and the light emission becomes uniform. That is, the LED light emitting device 10 can obtain uniform light emission while maintaining an appropriate number of series stages while mounting a large number of LED dies 13 in the circular light emitting section 12.
なお、ＬＥＤ発光装置１０では、各配列２１～２４においてＬＥＤダイ１３とワイヤ１４が一直線状に配列していた。本発明のＬＥＤ発光装置では、必ずしもＬＥＤダイ又はワイヤを一直線状に配列する必要はない。つまり、多少斜行する部分があっても良い。しかしながら、ＬＥＤ発光装置１０のように、ＬＥＤダイ１３とワイヤ１４とを一直線状に配列することで、ダイボンディングやワイヤボンディングの条件が簡単化し製造しやすくなるのに加え、ワイヤ１４の断線が減り信頼性が向上する。 Note that in the LED light emitting device 10, the LED die 13 and the wire 14 were arranged in a straight line in each of the arrays 21 to 24. In the LED light emitting device of the present invention, the LED dies or wires do not necessarily need to be arranged in a straight line. In other words, there may be some oblique portions. However, by arranging the LED die 13 and the wire 14 in a straight line as in the LED light emitting device 10, the conditions for die bonding and wire bonding are simplified, making manufacturing easier, and the possibility of disconnection of the wire 14 is reduced. Improved reliability.
また、ＬＥＤ発光装置１０では、第１ＬＥＤ列３１及び第２ＬＥＤ列３２に中継配線１７ｃ、１７ｄが含まれていた。本発明のＬＥＤ発光装置では、必ずしも中継配線を使用しなくても良い。例えば、第１ＬＥＤ列及び第２ＬＥＤ列は、部分的な配列同士（例えば、図２の配列２２と配列２３同士）を中継配線の代わりにワイヤで接続しても良い。しかしながら、ＬＥＤ発光装置１０のように中継配線１７ｃ～１７ｆを使用すると、ワイヤ１４を短くでき、製造しやすくなる上、信頼性が向上する。また、中継配線１７ｃ～１７ｆをダム１５の下に配することは、発光部１２に暗部を作らないようにでき、発光の均一性及び効率向上に寄与する。 Further, in the LED light emitting device 10, the first LED row 31 and the second LED row 32 included relay wirings 17c and 17d. In the LED light emitting device of the present invention, it is not necessary to use relay wiring. For example, partial arrays of the first LED column and the second LED column (for example, the arrays 22 and 23 in FIG. 2) may be connected with wires instead of relay wiring. However, if relay wirings 17c to 17f are used as in the LED light emitting device 10, the wires 14 can be shortened, making manufacturing easier and improving reliability. Further, by arranging the relay wirings 17c to 17f under the dam 15, it is possible to prevent dark areas from being formed in the light emitting section 12, contributing to uniformity and improvement in efficiency of light emission.
１０…ＬＥＤ発光装置、
１１…実装基板、
１１ａ…切り欠き、
１２…発光部、
１２ａ…封止材、
１３…ＬＥＤダイ、
１４…ワイヤ、
１５…ダム、
１６ａ、１６ｂ…電源電極、
１７ａ…アノード配線、
１７ｂ…カソード配線、
１７ｃ…中継配線、
１７ｅ～１７ｆ…中継配線、
２１～２４…配列、
３１…第１ＬＥＤ列、
３２…第２ＬＥＤ列。
10...LED light emitting device,
11... Mounting board,
11a...notch,
12... Light emitting part,
12a... Sealing material,
13...LED die,
14...Wire,
15...dam,
16a, 16b...power electrode,
17a...Anode wiring,
17b...Cathode wiring,
17c...Relay wiring,
17e to 17f...Relay wiring,
21-24...Array,
31...first LED row,
32...Second LED row.
Claims (5)
前記複数のＬＥＤダイは、直列接続して第１ＬＥＤ列及び第２ＬＥＤ列を構成し、
前記第１ＬＥＤ列はＵ字状に配列され、配列途中に第１中継配線を含み、
前記第２ＬＥＤ列は、前記第１ＬＥＤ列からなるＵ字状の配列の内側の領域でＵ字状に配列され、配列途中に第２中継配線を含み、
前記第１中継配線と前記第２中継配線は前記円形の発光部の周辺部に形成され、且つ前記ダムの下に配置されていることを特徴とするＬＥＤ発光装置。 An LED light emitting device including a mounting board, a circular light emitting part occupying an upper surface of the mounting board, a plurality of LED dies mounted on the light emitting part , and a dam surrounding the circular light emitting part,
The plurality of LED dies are connected in series to form a first LED column and a second LED column,
The first LED row is arranged in a U-shape and includes a first relay wiring in the middle of the arrangement,
The second LED row is arranged in a U-shape in an area inside the U-shaped arrangement made of the first LED row , and includes a second relay wiring in the middle of the arrangement,
The LED light emitting device , wherein the first relay wiring and the second relay wiring are formed around the circular light emitting section and are arranged under the dam .
前記複数のＬＥＤダイと前記第１のワイヤは、一直線状に配列していることを特徴とする請求項１に記載のＬＥＤ発光装置。 a first wire connecting the plurality of LED dies to each other ;
The LED light emitting device according to claim 1 , wherein the plurality of LED dies and the first wire are arranged in a straight line.
前記発光部の他方の周辺部に前記第１中継配線と前記第２中継配線を備え、
前記第１ＬＥＤ列及び前記第２ＬＥＤ列の一方の端部を構成する前記複数のＬＥＤダイのアノードは、それぞれ前記アノード配線と接続し、
前記第１ＬＥＤ列及び前記第２ＬＥＤ列の他方の端部を構成する前記複数のＬＥＤダイのカソードは、それぞれ前記カソード配線と接続していることを特徴とする請求項１又は２に記載のＬＥＤ発光装置。 An anode wiring and a cathode wiring are provided in one peripheral part of the light emitting part,
The first relay wiring and the second relay wiring are provided in the other peripheral part of the light emitting part,
Anodes of the plurality of LED dies constituting one end of the first LED column and the second LED column are respectively connected to the anode wiring,
3. The LED light emitting device according to claim 1, wherein cathodes of the plurality of LED dies constituting the other end of the first LED column and the second LED column are respectively connected to the cathode wiring. Device.
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| JP2014123465A (en) | 2012-12-20 | 2014-07-03 | Panasonic Corp | Led lighting device and led light-emitting module |
| JP2018041843A (en) | 2016-09-07 | 2018-03-15 | パナソニックＩｐマネジメント株式会社 | Light-emitting device and illuminating device |
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| WO2012165007A1 (en) | 2011-05-27 | 2012-12-06 | シャープ株式会社 | Light emitting device, lighting device, and method for manufacturing light emitting device |
| JP2014123465A (en) | 2012-12-20 | 2014-07-03 | Panasonic Corp | Led lighting device and led light-emitting module |
| JP2018041843A (en) | 2016-09-07 | 2018-03-15 | パナソニックＩｐマネジメント株式会社 | Light-emitting device and illuminating device |
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