JP7397927B2 - 複数の電子基板上への複数の供給ポンプを用いた同時供給を可能にする供給ポンプのアレイの回転 - Google Patents
複数の電子基板上への複数の供給ポンプを用いた同時供給を可能にする供給ポンプのアレイの回転 Download PDFInfo
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- JP7397927B2 JP7397927B2 JP2022128034A JP2022128034A JP7397927B2 JP 7397927 B2 JP7397927 B2 JP 7397927B2 JP 2022128034 A JP2022128034 A JP 2022128034A JP 2022128034 A JP2022128034 A JP 2022128034A JP 7397927 B2 JP7397927 B2 JP 7397927B2
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- electronic board
- supply
- feed
- supply pump
- pump
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- 238000003491 array Methods 0.000 claims description 27
- 239000011345 viscous material Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 description 31
- 239000000463 material Substances 0.000 description 29
- 239000000758 substrate Substances 0.000 description 27
- 230000007246 mechanism Effects 0.000 description 24
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 7
- 239000007788 liquid Substances 0.000 description 5
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
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- 230000008901 benefit Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000012840 feeding operation Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
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- 238000010438 heat treatment Methods 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
- B05C5/0229—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet the valve being a gate valve or a sliding valve
- B05C5/0233—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet the valve being a gate valve or a sliding valve rotating valve, e.g. rotating perforated cylinder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B11/00—Single-unit hand-held apparatus in which flow of contents is produced by the muscular force of the operator at the moment of use
- B05B11/01—Single-unit hand-held apparatus in which flow of contents is produced by the muscular force of the operator at the moment of use characterised by the means producing the flow
- B05B11/10—Pump arrangements for transferring the contents from the container to a pump chamber by a sucking effect and forcing the contents out through the dispensing nozzle
- B05B11/1042—Components or details
- B05B11/1043—Sealing or attachment arrangements between pump and container
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D3/00—Control of position or direction
- G05D3/12—Control of position or direction using feedback
- G05D3/20—Control of position or direction using feedback using a digital comparing device
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Die Bonding (AREA)
- Length Measuring Devices By Optical Means (AREA)
Description
12 電子基板
14 供給ユニット
16 供給ユニット
18 コントローラー
20 フレーム
22 支持体
24 ガントリー
26 計量器
28 ディスプレイユニット
30 視覚システム
32 視覚システムガントリー
40 供給ポンプアレイ
40A 供給ポンプアレイ
40B 供給ポンプアレイ
42 第1の供給ポンプ
44 第2の供給ポンプ
46 電子基板
46A 第1の電子基板
46B 第2の電子基板
Claims (3)
- 粘性材料を電子基板上に供給するための供給システムにおいて、
フレームと、
前記フレームに結合され、少なくとも2つの同一パターンと、少なくとも2つの基準マークとを有した第1の電子基板および少なくとも2つの同一パターンと、少なくとも2つの基準マークとを有した第2の電子基板を受け取るように構成された支持体と、
X軸方向に所定の距離だけ互いに離隔させて配置され、粘性材料を供給する2つの供給ポンプアレイと、
前記2つの供給ポンプアレイを前記X軸方向および該X軸方向に垂直なY軸方向に移動させ、かつ、前記2つの供給ポンプアレイをX-Y平面内で互いに異なる角度に回転させる、前記フレームに結合されたガントリーと、
前記フレームと前記ガントリーの一方に結合され、前記第1の電子基板上に設けられた前記少なくとも2つの基準マークの少なくとも一方の画像、および、前記第2の電子基板上に設けられた前記少なくとも2つの基準マークの少なくとも一方の画像を撮像する視覚システムと、
前記第1の電子基板および第2の電子基板への供給動作を実行するように、前記2つの供給ポンプアレイ、前記ガントリーおよび前記視覚システムを制御するコントローラーであって、該コントローラーは、前記少なくとも一方の画像を解析して、前記第1の電子基板および第2の電子基板の位置を、X軸方向、Y軸方向および前記X-Y平面内の回転方向であるθ方向に求め、前記第1の電子基板および第2の電子基板の前記X-Y平面内における回転角度を演算し、前記2つの供給ポンプアレイの一方の供給ポンプアレイを前記X-Y平面内で回転させて前記第1の電子基板の角度に適合させ、前記2つの供給ポンプアレイの他方の供給ポンプアレイを前記X-Y平面内で回転させて前記第2の電子基板の角度に適合させるコントローラーとを具備する供給システム。 - 前記コントローラーは、前記2つの供給ポンプアレイによって、前記第1の電子基板の前記少なくとも2つの同一パターン上および前記第2の電子基板の前記少なくとも2つの同一パターン上へ同時に供給動作を実行するように更に構成される請求項1に記載の供給システム。
- 前記2つの供給ポンプアレイの各々は、第1と第2の供給ポンプを備えており、該第2の供給ポンプは該第1の供給ポンプから所定の距離だけ離隔している請求項2に記載の供給システム。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/710,498 US10434537B2 (en) | 2017-09-20 | 2017-09-20 | Rotation of an array of dispensing pumps to enable simultaneous dispensing with multiple dispensing pumps on multiple electronic substrates |
US15/710,498 | 2017-09-20 | ||
PCT/US2018/045993 WO2019060057A1 (en) | 2017-09-20 | 2018-08-09 | ROTATION OF A DISTRIBUTION PUMPS NETWORK TO ALLOW SIMULTANEOUS DISTRIBUTION WITH MULTIPLE DISTRIBUTION PUMPS ON MULTIPLE ELECTRONIC SUBSTRATES |
JP2020516445A JP2020534148A (ja) | 2017-09-20 | 2018-08-09 | 複数の電子基板上への複数の供給ポンプを用いた同時供給を可能にする供給ポンプのアレイの回転 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020516445A Division JP2020534148A (ja) | 2017-09-20 | 2018-08-09 | 複数の電子基板上への複数の供給ポンプを用いた同時供給を可能にする供給ポンプのアレイの回転 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022176185A JP2022176185A (ja) | 2022-11-25 |
JP7397927B2 true JP7397927B2 (ja) | 2023-12-13 |
Family
ID=63405389
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020516445A Pending JP2020534148A (ja) | 2017-09-20 | 2018-08-09 | 複数の電子基板上への複数の供給ポンプを用いた同時供給を可能にする供給ポンプのアレイの回転 |
JP2022128034A Active JP7397927B2 (ja) | 2017-09-20 | 2022-08-10 | 複数の電子基板上への複数の供給ポンプを用いた同時供給を可能にする供給ポンプのアレイの回転 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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JP2020516445A Pending JP2020534148A (ja) | 2017-09-20 | 2018-08-09 | 複数の電子基板上への複数の供給ポンプを用いた同時供給を可能にする供給ポンプのアレイの回転 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10434537B2 (ja) |
EP (1) | EP3685646A1 (ja) |
JP (2) | JP2020534148A (ja) |
KR (1) | KR102525823B1 (ja) |
CN (1) | CN111108822B (ja) |
TW (1) | TWI803519B (ja) |
WO (1) | WO2019060057A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10434537B2 (en) * | 2017-09-20 | 2019-10-08 | Illinois Tool Works Inc. | Rotation of an array of dispensing pumps to enable simultaneous dispensing with multiple dispensing pumps on multiple electronic substrates |
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JP2008155175A (ja) | 2006-12-26 | 2008-07-10 | Dainippon Printing Co Ltd | パターン形成装置、パターン形成方法、ヘッドユニット、表示装置構成部材の製造方法 |
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JP2010137145A (ja) | 2008-12-10 | 2010-06-24 | Konica Minolta Holdings Inc | 液滴吐出ヘッドによる直線の描画方法 |
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JP2020534148A (ja) | 2017-09-20 | 2020-11-26 | イリノイ トゥール ワークス インコーポレイティド | 複数の電子基板上への複数の供給ポンプを用いた同時供給を可能にする供給ポンプのアレイの回転 |
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-
2017
- 2017-09-20 US US15/710,498 patent/US10434537B2/en active Active
-
2018
- 2018-08-09 WO PCT/US2018/045993 patent/WO2019060057A1/en unknown
- 2018-08-09 JP JP2020516445A patent/JP2020534148A/ja active Pending
- 2018-08-09 CN CN201880060860.0A patent/CN111108822B/zh active Active
- 2018-08-09 KR KR1020207010552A patent/KR102525823B1/ko active IP Right Grant
- 2018-08-09 EP EP18760127.3A patent/EP3685646A1/en active Pending
- 2018-09-12 TW TW107132031A patent/TWI803519B/zh active
-
2022
- 2022-08-10 JP JP2022128034A patent/JP7397927B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2006205005A (ja) | 2005-01-26 | 2006-08-10 | Dainippon Printing Co Ltd | パターン形成装置、ヘッドユニット装置、ヘッドユニット制御方法 |
JP2008155175A (ja) | 2006-12-26 | 2008-07-10 | Dainippon Printing Co Ltd | パターン形成装置、パターン形成方法、ヘッドユニット、表示装置構成部材の製造方法 |
JP2010125369A (ja) | 2008-11-26 | 2010-06-10 | Konica Minolta Holdings Inc | 描画装置及び描画装置におけるヘッドユニットへのヘッドの取り付け方法 |
JP2010137145A (ja) | 2008-12-10 | 2010-06-24 | Konica Minolta Holdings Inc | 液滴吐出ヘッドによる直線の描画方法 |
JP2010205626A (ja) | 2009-03-05 | 2010-09-16 | Musashi Eng Co Ltd | 液体材料の塗布方法および塗布装置 |
JP2020534148A (ja) | 2017-09-20 | 2020-11-26 | イリノイ トゥール ワークス インコーポレイティド | 複数の電子基板上への複数の供給ポンプを用いた同時供給を可能にする供給ポンプのアレイの回転 |
Also Published As
Publication number | Publication date |
---|---|
WO2019060057A8 (en) | 2020-04-02 |
TWI803519B (zh) | 2023-06-01 |
TW201927417A (zh) | 2019-07-16 |
CN111108822A (zh) | 2020-05-05 |
CN111108822B (zh) | 2023-06-13 |
WO2019060057A1 (en) | 2019-03-28 |
US10434537B2 (en) | 2019-10-08 |
EP3685646A1 (en) | 2020-07-29 |
JP2022176185A (ja) | 2022-11-25 |
KR20200056404A (ko) | 2020-05-22 |
US20190083998A1 (en) | 2019-03-21 |
JP2020534148A (ja) | 2020-11-26 |
KR102525823B1 (ko) | 2023-04-25 |
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