JP7395557B2 - 熱変換装置 - Google Patents
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- JP7395557B2 JP7395557B2 JP2021500218A JP2021500218A JP7395557B2 JP 7395557 B2 JP7395557 B2 JP 7395557B2 JP 2021500218 A JP2021500218 A JP 2021500218A JP 2021500218 A JP2021500218 A JP 2021500218A JP 7395557 B2 JP7395557 B2 JP 7395557B2
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- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
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Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
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- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
Claims (18)
- 第1方向および前記第1方向と交差する第2方向にそれぞれ複数個配列される複数の単位モジュール、
前記複数の単位モジュールを支持し、前記第1方向に沿って形成された第1冷却水流入管および第1冷却水排出管を含むフレーム、
前記第1冷却水流入管と連結され、前記複数の単位モジュールの一側で前記第2方向に沿って配置された複数の第2冷却水流入管、そして
前記第1冷却水排出管と連結され、前記複数の単位モジュールの他側で前記第2方向に沿って配置された複数の第2冷却水排出管を含み、
各単位モジュールは冷却水通過チャンバー、
前記冷却水通過チャンバーの第1面に配置された第1熱電モジュール、そして
前記冷却水通過チャンバーの第2面に配置された第2熱電モジュールを含み、
前記冷却水通過チャンバーの前記第1面と前記第2面の間の第3面には冷却水流入口が形成され、前記冷却水通過チャンバーの前記第1面と前記第2面の間の第4面には冷却水排出口が形成され、
前記冷却水流入口は前記第2冷却水流入管と連結され、前記冷却水排出口は前記第2冷却水排出管と連結され、
一対の第2冷却水流入管および第2冷却水排出管は前記第2方向に沿って配列された複数の単位モジュールと連結され、
前記フレームは前記第2方向に沿って配列された複数の単位モジュールの間に配置された支持壁をさらに含む、熱変換装置。 - 前記第1方向に沿って配列された複数の単位モジュールは所定の間隔で互いに離隔した、請求項1に記載の熱変換装置。
- 前記所定の間隔で互いに離隔した空間の間を気体が通過し、
前記気体の温度は前記冷却水通過チャンバーの冷却水の温度より高い、請求項2に記載の熱変換装置。 - 前記気体は前記第2冷却水排出管から前記第2冷却水流入管に向かう方向に通過し、
前記冷却水通過チャンバー内で冷却水は前記第2冷却水流入管から前記第2冷却水排出管に向かう方向に流れる、請求項3に記載の熱変換装置。 - 前記第1冷却水流入管の断面積は前記第2冷却水流入管の断面積より大きく、前記第1冷却水排出管の断面積は前記第2冷却水排出管の断面積より大きい、請求項1に記載の熱変換装置。
- 前記支持壁の両端にはそれぞれ第1溝および第2溝が形成され、
前記第1溝には前記第2冷却水流入管が固定され、
前記第2溝には前記第2冷却水排出管が固定される、請求項1に記載の熱変換装置。 - 前記第1冷却水流入管に流入した冷却水は前記第2冷却水流入管を経て前記冷却水通過チャンバーを通過した後、前記第2冷却水排出管を経て前記第1冷却水排出管に排出される、請求項1に記載の熱変換装置。
- 前記第1冷却水流入管の流入口から遠くなるほど前記第1冷却水流入管の断面積は小さくなる、請求項1に記載の熱変換装置。
- 前記第1熱電モジュール及び前記第2熱電モジュールの各々は、複数の熱電素子を含み、
前記複数の熱電素子は、電気的に互いに接続されている、
請求項1に記載の熱変換装置。 - 前記単位モジュールの各々は、更に、前記複数の熱電素子の間に配置された断熱層を含む、請求項9に記載の熱変換装置。
- 前記第1冷却水排出管は、前記第1冷却水流入管上に配置される、
請求項1に記載の熱変換装置。 - 前記第1方向に沿って前記第1冷却水流入管に流入した冷却水は、前記複数の第2冷却水流入管に分散して流入し、前記複数の第2冷却水排出管から排出された前記冷却水は、前記第1冷却水排出管によって集められ、前記第1方向に沿って外部に排出される、
請求項5に記載の熱変換装置。 - 更に、前記複数の第2冷却水排出管上に配置された固定部材を含み、
前記固定部材、前記複数の第2冷却水排出管、及び支持壁が、締結部材によって組み立てられる、
請求項6に記載の熱変換装置。 - 前記複数の熱電素子は、バスバーによって互いに電気的に接続される、
請求項9に記載の熱変換装置。 - 前記断熱層は、前記冷却水通過チャンバーの外部の表面のうち前記複数の熱電素子が配置される領域を除いて、前記冷却水通過チャンバーの外部の表面の少なくとも一部を囲むように配置される、
請求項10に記載の熱変換装置。 - 前記単位モジュールの各々は、更に、前記断熱層上に配置されるシールド層を含む、
請求項10に記載の熱変換装置。 - 前記第1冷却水流入管には前記複数の第2冷却水流入管の個数だけのホールが形成され、前記第2冷却水流入管の各々は、各ホールの位置に応じて配置される、
請求項12に記載の熱変換装置。 - 一対の前記第2冷却水流入管及び前記第2冷却水排出管は、前記単位モジュールの各々に配置される、
請求項1に記載の熱変換装置。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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KR10-2018-0079401 | 2018-07-09 | ||
KR1020180079401A KR102639098B1 (ko) | 2018-07-09 | 2018-07-09 | 열변환장치 |
KR10-2018-0081162 | 2018-07-12 | ||
KR1020180081162A KR102545690B1 (ko) | 2018-07-12 | 2018-07-12 | 열변환장치 |
PCT/KR2019/008239 WO2020013526A1 (ko) | 2018-07-09 | 2019-07-04 | 열변환장치 |
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JP2021530112A JP2021530112A (ja) | 2021-11-04 |
JP7395557B2 true JP7395557B2 (ja) | 2023-12-11 |
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US (2) | US11683984B2 (ja) |
EP (1) | EP3823052A4 (ja) |
JP (1) | JP7395557B2 (ja) |
CN (1) | CN112385054B (ja) |
WO (1) | WO2020013526A1 (ja) |
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- 2019-07-04 CN CN201980045572.2A patent/CN112385054B/zh active Active
- 2019-07-04 WO PCT/KR2019/008239 patent/WO2020013526A1/ko unknown
- 2019-07-04 JP JP2021500218A patent/JP7395557B2/ja active Active
- 2019-07-04 EP EP19833888.1A patent/EP3823052A4/en active Pending
- 2019-07-04 US US17/256,120 patent/US11683984B2/en active Active
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2023
- 2023-05-08 US US18/144,406 patent/US20230329113A1/en active Pending
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US11683984B2 (en) | 2023-06-20 |
US20230329113A1 (en) | 2023-10-12 |
WO2020013526A1 (ko) | 2020-01-16 |
EP3823052A1 (en) | 2021-05-19 |
CN112385054B (zh) | 2024-06-04 |
US20210226112A1 (en) | 2021-07-22 |
CN112385054A (zh) | 2021-02-19 |
EP3823052A4 (en) | 2022-04-06 |
JP2021530112A (ja) | 2021-11-04 |
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