JP7386344B2 - Anti-slip conductive resin composition and molded products containing the same - Google Patents
Anti-slip conductive resin composition and molded products containing the same Download PDFInfo
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- 239000011342 resin composition Substances 0.000 title claims description 29
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 35
- 239000004840 adhesive resin Substances 0.000 claims description 31
- 229920006223 adhesive resin Polymers 0.000 claims description 31
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- 229920006124 polyolefin elastomer Polymers 0.000 claims description 23
- 239000003963 antioxidant agent Substances 0.000 claims description 19
- 229910052799 carbon Inorganic materials 0.000 claims description 14
- 229920001577 copolymer Polymers 0.000 claims description 14
- 239000006229 carbon black Substances 0.000 claims description 13
- 239000002041 carbon nanotube Substances 0.000 claims description 13
- 239000000945 filler Substances 0.000 claims description 13
- 229920001400 block copolymer Polymers 0.000 claims description 12
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 150000001336 alkenes Chemical class 0.000 claims description 10
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 10
- 229920010346 Very Low Density Polyethylene (VLDPE) Polymers 0.000 claims description 9
- 239000006057 Non-nutritive feed additive Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 229910021389 graphene Inorganic materials 0.000 claims description 6
- 239000000155 melt Substances 0.000 claims description 6
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 3
- 239000004917 carbon fiber Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 230000005484 gravity Effects 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
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- 238000000034 method Methods 0.000 description 22
- 239000000047 product Substances 0.000 description 19
- 230000000694 effects Effects 0.000 description 12
- 230000008569 process Effects 0.000 description 8
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 7
- 239000002216 antistatic agent Substances 0.000 description 7
- -1 polyethylene terephthalate Polymers 0.000 description 7
- 239000004711 α-olefin Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
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- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 5
- 239000005977 Ethylene Substances 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 229920002943 EPDM rubber Polymers 0.000 description 4
- 244000043261 Hevea brasiliensis Species 0.000 description 4
- 229920000459 Nitrile rubber Polymers 0.000 description 4
- 239000005062 Polybutadiene Substances 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- QYMGIIIPAFAFRX-UHFFFAOYSA-N butyl prop-2-enoate;ethene Chemical compound C=C.CCCCOC(=O)C=C QYMGIIIPAFAFRX-UHFFFAOYSA-N 0.000 description 4
- 229920005549 butyl rubber Polymers 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 229920006245 ethylene-butyl acrylate Polymers 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 229920003049 isoprene rubber Polymers 0.000 description 4
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- 239000003973 paint Substances 0.000 description 4
- 229920001084 poly(chloroprene) Polymers 0.000 description 4
- 229920002857 polybutadiene Polymers 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 4
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 4
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- 239000000853 adhesive Substances 0.000 description 3
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- 239000004416 thermosoftening plastic Substances 0.000 description 3
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- 229920002614 Polyether block amide Polymers 0.000 description 2
- 239000004708 Very-low-density polyethylene Substances 0.000 description 2
- 229920000800 acrylic rubber Polymers 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
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- 230000001747 exhibiting effect Effects 0.000 description 2
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- 239000012467 final product Substances 0.000 description 2
- 150000002596 lactones Chemical class 0.000 description 2
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- 235000019271 petrolatum Nutrition 0.000 description 2
- VPRUMANMDWQMNF-UHFFFAOYSA-N phenylethane boronic acid Chemical compound OB(O)CCC1=CC=CC=C1 VPRUMANMDWQMNF-UHFFFAOYSA-N 0.000 description 2
- 239000002367 phosphate rock Substances 0.000 description 2
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
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- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 229920001866 very low density polyethylene Polymers 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- 229920010126 Linear Low Density Polyethylene (LLDPE) Polymers 0.000 description 1
- 239000004264 Petrolatum Substances 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 150000002191 fatty alcohols Chemical class 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000010102 injection blow moulding Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000012968 metallocene catalyst Substances 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 235000019809 paraffin wax Nutrition 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229940066842 petrolatum Drugs 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- DOIRQSBPFJWKBE-UHFFFAOYSA-N phthalic acid di-n-butyl ester Natural products CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- GRJISGHXMUQUMC-UHFFFAOYSA-N silyl prop-2-enoate Chemical compound [SiH3]OC(=O)C=C GRJISGHXMUQUMC-UHFFFAOYSA-N 0.000 description 1
- 239000012748 slip agent Substances 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 150000007970 thio esters Chemical class 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
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- Engineering & Computer Science (AREA)
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Description
本発明は、滑り防止機能を持つ伝導性樹脂組成物及びそれを含む成形品に関し、滑り防止のために粘着剤をコーティングしたり伝導性を付与するために帯電防止剤を添加する従来の方式と異なり、高い表面摩擦力を提供できる粘着性樹脂に炭素充填材を含むことで低い表面抵抗を提供して優れた電気伝導性を提供する技術に関する。 The present invention relates to a conductive resin composition having an anti-slip function and a molded article containing the same, and relates to a conductive resin composition having an anti-slip function and a molded article containing the same, which is different from the conventional method of coating with an adhesive to prevent slip or adding an antistatic agent to impart conductivity. Differently, the present invention relates to a technology that provides low surface resistance and excellent electrical conductivity by including a carbon filler in an adhesive resin that can provide high surface frictional force.
現代社会で携帯電話、テレビ、コンピュータなどの電子製品の使用は必須不可欠なもので、その発展の速度はもちろんのこと、その様相も急変している。このような電子製品を製造するために様々な電子部品が使用され、電子製品の迅速な大量生産のために大半が自動化工程で進められている。この時、自動化工程で使用される電子部品の移送のためのトレイ（ｔｒａｙ）は通常、伝導性ポリエチレンテレフタラート（ＰＥＴ）、ポリスチレン（ＰＳ）、アクリロニトリルブタジエンスチレン（ＡＢＳ）樹脂組成物を真空成形して使用されている。これらは比較的工程が簡単かつ生産単価が安価で経済的であるが、電子部品の移送中に低い表面摩擦力によって生じる部品の滑り現象で部品表面にスクラッチが生じ、これは伝導性の喪失につながり静電気問題が生じたりフィルム表面にスクラッチが生じて不良を誘発する問題点を引き起こす。また、トレイに積載される電子部品の位置を固定するためにトレイにキャビティを成形して使用するが、この場合、製品別に互いに異なる規格のトレイが必要となりトレイの生産、保管、管理コストが大きく増加するようになる。 In modern society, the use of electronic products such as mobile phones, televisions, and computers is indispensable, and not only the speed of their development but also their appearance is rapidly changing. Various electronic components are used to manufacture such electronic products, and most of them are automated in order to quickly mass produce electronic products. At this time, trays for transporting electronic components used in automated processes are usually vacuum-formed from conductive polyethylene terephthalate (PET), polystyrene (PS), and acrylonitrile butadiene styrene (ABS) resin compositions. is used. These are economical as the process is relatively simple and the production cost is low, but scratches occur on the component surface due to the sliding phenomenon of the component caused by the low surface friction force during the transportation of electronic components, which can lead to loss of conductivity. This causes problems such as static electricity and scratches on the film surface, leading to defects. In addition, cavities are molded into the tray to fix the position of electronic components loaded on the tray, but in this case, trays with different specifications are required for each product, which increases the cost of producing, storing, and managing the trays. It will start to increase.
このような問題を解決するために、自動化生産工程では滑りを防止するためにマット又はパッドなどを主に使用している。この場合、主にマットやパッド表面に粘着性塗料をコーティングして滑り防止機能を付与する場合が大半である。 To solve this problem, mats or pads are mainly used in automated production processes to prevent slipping. In most cases, the surface of the mat or pad is coated with an adhesive paint to provide an anti-slip function.
これと関連する技術として、特許文献１を見てみると、優れた摩擦抵抗低減性能を持つ塗料組成物に関する技術を開示している。バインダ樹脂としてエステル化合物と、シリルアクリレート系単量体をラジカル重合性不飽和単量体でさらに含んで分子量及び親水親油バランスを調節することによって長期間均一な摩耗率を示して防汚性及び優れた摩擦抵抗低減性能を持つものを開示している。ただし、上記特許のように塗料組成物をコーティングする場合は時間経過によって塗料の粘着性が弱くなったり塗料が剥がれる問題がある。 As a related technology, Patent Document 1 discloses a technology related to a coating composition having excellent frictional resistance reduction performance. By further containing an ester compound as a binder resin and a radically polymerizable unsaturated monomer such as a silyl acrylate monomer to adjust the molecular weight and hydrophilic/lipophilic balance, it exhibits a uniform wear rate over a long period of time and has excellent stain resistance and Discloses a product with excellent frictional resistance reduction performance. However, when coating with a paint composition as in the above patent, there is a problem that the adhesiveness of the paint becomes weak or the paint peels off over time.
一方、電子部品生産のための自動化工程で滑り防止とともに必要な静電気防止機能を提供するためには主に帯電防止剤を用いて静電気防止機能を付与している。これと関連する技術として、特許文献２では静電気防止機能に優れたシートを開示している。シート本体の上下部にハイブリッドコーティング液コーティング層を含み、上記ハイブリッドコーティング液は溶媒、ポリウレタン樹脂、アンチブロッキング剤、耐摩耗性向上剤、スリップ防止剤、消泡剤及び静電気防止剤からなることを技術的特徴とする。ただし、上記特許のように静電気防止剤又は帯電防止剤を使用した場合、表面抵抗が１０１０Ω／ｓｑ以上の高い抵抗を示すため、優れた静電気防止性能を提供するには多少限界がある。 On the other hand, in order to provide the necessary anti-static function as well as anti-slip in the automated process for producing electronic parts, anti-static agents are mainly used to provide the anti-static function. As a technology related to this, Patent Document 2 discloses a sheet with excellent antistatic function. The upper and lower parts of the sheet body contain a hybrid coating liquid coating layer, and the hybrid coating liquid consists of a solvent, a polyurethane resin, an anti-blocking agent, an abrasion resistance improver, an anti-slip agent, an antifoaming agent, and an antistatic agent. Characteristics. However, when an antistatic agent or antistatic agent is used as in the above patent, the surface resistance shows a high resistance of 10 10 Ω/sq or more, so there is a limit to providing excellent antistatic performance.
よって、本発明は、上記問題点を解決し、より簡単な工程を提供して加工性を向上させ、成形品の表面摩擦力に優れ、低い表面抵抗で優れた伝導性を持つ樹脂組成物を提供しようとする長い研究の果てに完成した。 Therefore, the present invention solves the above problems, provides a simpler process, improves processability, and provides a resin composition that has excellent surface friction force for molded products, low surface resistance, and excellent conductivity. It was completed at the end of a long period of research.
本発明は、上述の問題点をすべて解決することを目的とする。
本発明の目的は、樹脂成形品に高い表面摩擦力を提供できる樹脂組成物を提供することにある。
The present invention aims to solve all the above-mentioned problems.
An object of the present invention is to provide a resin composition that can provide high surface friction force to resin molded articles.
本発明の目的は、樹脂成形品に低い表面抵抗値を提供できる樹脂組成物を提供して、優れた電気伝導性を付与することにある。 An object of the present invention is to provide a resin composition that can provide a low surface resistance value to a resin molded article, thereby imparting excellent electrical conductivity.
本発明の目的は、成形品の加工性を単純化して生産性を向上させることにある。 An object of the present invention is to simplify the processability of molded products and improve productivity.
上述の本発明の目的を達成し、後述する本発明の特徴的な効果を実現するための、本発明の特徴的な構成は下記のとおりである。 The characteristic configuration of the present invention for achieving the above-mentioned object of the present invention and realizing the characteristic effects of the present invention described later is as follows.
本発明の一実施例によれば、樹脂成形品の摩擦力はＡＳＴＭ Ｄ１８９４準拠で１０Ｎ以上で、表面抵抗値はＡＳＴＭ Ｄ２５７準拠で１０３乃至１０９Ω／ｓｑで提供する滑り防止用伝導性樹脂組成物が提供される。 According to an embodiment of the present invention, the conductive resin for slip prevention provides a resin molded product with a friction force of 10 N or more according to ASTM D1894 and a surface resistance value of 10 3 to 10 9 Ω/sq according to ASTM D257. A composition is provided.
本発明の一実施例によれば、上記滑り防止用伝導性樹脂組成物は表面摩擦力に優れた粘着性樹脂に炭素充填材を含んで提供される。 According to one embodiment of the present invention, the conductive resin composition for preventing slipping is provided by including a carbon filler in an adhesive resin having excellent surface frictional force.
本発明の一実施例によれば、上記粘着性樹脂は超低密度ポリエチレン（ＶＬＤＰＥ）、ポリオレフィンエラストマー（ＰＯＥ）、オレフィンブロック共重合体（ＯＢＣ）、エチレン酢酸共重合体（ＥＶＡ）、エチレンブチルアクリレート（ＥＢＡ）、エチレンプロピレンジエンゴム（ＥＰＤＭ）、スチレンブタジエンゴム（ＳＢＲ）、スチレンブタジエンスチレン共重合体（ＳＢＳ）、スチレンエチレンブタジエンスチレン共重合体（ＳＥＢＳ）、エーテルブロックアミド共重合体（ＰＥＢＡ）、熱可塑性ウレタン（ＴＰＵ）、熱可塑性エステルエラストマー（ＴＰＥＥ）、シリコンゴム、天然ゴム（ＮＲ）、イソプレンゴム（ＩＲ）、ブチルゴム（ＩＩＲ）、ブタジエンゴム（ＢＲ）、アクリルゴム（ＡＣＭ）、ニトリルブタジエンゴム（ＮＢＲ）及びクロロプレンゴム（ＣＲ）から選択された少なくともいずれか１つ以上を含むことができる。 According to an embodiment of the present invention, the adhesive resin is very low density polyethylene (VLDPE), polyolefin elastomer (POE), olefin block copolymer (OBC), ethylene acetic acid copolymer (EVA), ethylene butyl acrylate. (EBA), ethylene propylene diene rubber (EPDM), styrene butadiene rubber (SBR), styrene butadiene styrene copolymer (SBS), styrene ethylene butadiene styrene copolymer (SEBS), ether block amide copolymer (PEBA), Thermoplastic urethane (TPU), thermoplastic ester elastomer (TPEE), silicone rubber, natural rubber (NR), isoprene rubber (IR), butyl rubber (IIR), butadiene rubber (BR), acrylic rubber (ACM), nitrile butadiene rubber (NBR) and chloroprene rubber (CR).
本発明の一実施例によれば、上記炭素充填材は炭素ナノチューブ（ＣＮＴ）、グラファイト（Ｇｒａｐｈｉｔｅ）、カーボンブラック（Ｃａｒｂｏｎ ｂｌａｃｋ）、カーボンファイバー（ｃａｒｂｏｎ ｆｉｂｅｒ）及びグラフェン（Ｇｒａｐｈｅｎｅ）から選択された少なくともいずれか１つ以上を含むことができる。 According to an embodiment of the present invention, the carbon filler is at least one selected from carbon nanotubes (CNT), graphite, carbon black, carbon fiber, and graphene. or one or more.
本発明の一実施例によれば、上記滑り防止用伝導性樹脂組成物を含む成形品が提供される。 According to one embodiment of the present invention, a molded article containing the above-mentioned anti-slip conductive resin composition is provided.
本発明による樹脂で製造される成形品の場合、高い表面摩擦力を提供して長時間使用しても優れた滑り防止機能を提供できる。 In the case of a molded article manufactured using the resin according to the present invention, it is possible to provide a high surface friction force and provide excellent anti-slip function even when used for a long time.
本発明による樹脂で製造される成形品の場合、低い表面抵抗を提供して、優れた静電気防止効果と電気伝導性を提供できる。 Molded articles made with the resin according to the present invention can provide low surface resistance and excellent antistatic effect and electrical conductivity.
本発明による樹脂を適用して成形する場合、従来の方式に比べて、加工方法が単純で加工性及び生産性の効率性を向上させることができる。 When molding is performed using the resin according to the present invention, the processing method is simpler and the efficiency of processing and productivity can be improved compared to conventional methods.
本発明による上記成形品を電子部品の製造工程に使用するトレイに適用した場合、部品の移動工程で滑り防止効果（ｎｏｎ－ｓｌｉｐ）及び低い表面抵抗を提供して電子部品及び素材を保護できる。 When the molded article according to the present invention is applied to a tray used in the manufacturing process of electronic parts, it can protect the electronic parts and materials by providing a non-slip effect and low surface resistance during the process of moving the parts.
以下、本発明の好ましい実施例によって本発明の構成及び作用をより詳細に説明する。ただし、これは本発明の好ましい例示として提示されたものであって、いかなる意味でもこれによって本発明が制限されることはない。
ここに記載していない内容は当該技術分野における熟練者であれば十分に技術的に類推できるものであるので、その説明を省略する。
Hereinafter, the structure and operation of the present invention will be explained in more detail with reference to preferred embodiments of the present invention. However, this is presented as a preferred example of the present invention, and the present invention is not limited thereto in any way.
Contents not described here can be sufficiently inferred technically by a person skilled in the art, so their explanation will be omitted.
［実施例］
＜実施例１：伝導性樹脂組成物の製造＞
粘着性樹脂１００重量部（ハンファソリューション社製ＥＶＡ １８３４ ８０重量部、ダウ社製Ｅｎｇａｇｅ ８１３７ ＰＯＥ ２０重量部）に炭素ナノチューブ（ＣＮＴ）２重量部、カーボンブラック（Ｃａｒｂｏｎ ｂｌａｃｋ）８重量部、酸化防止剤（ヒンダードフェノール系）０．１重量部及び加工助剤（脂肪酸アミド系）０．３重量部を含む滑り防止用伝導性樹脂組成物を製造した。
[Example]
<Example 1: Production of conductive resin composition>
100 parts by weight of adhesive resin (80 parts by weight of EVA 1834 manufactured by Hanwha Solutions, 20 parts by weight of Engage 8137 POE manufactured by Dow Corporation), 2 parts by weight of carbon nanotubes (CNT), 8 parts by weight of carbon black, and antioxidant. An anti-slip conductive resin composition containing 0.1 part by weight (hindered phenol) and 0.3 part by weight of a processing aid (fatty acid amide) was produced.
製造された滑り防止用伝導性樹脂組成物を金型のキャビティに充填した後、プレスで圧力を加えた後、冷却固化させて成形品（シート）を製造した。 The produced anti-slip conductive resin composition was filled into the cavity of a mold, pressure was applied with a press, and the composition was cooled and solidified to produce a molded article (sheet).
＜実施例２＞
粘着性樹脂１００重量部（ハンファソリューション社製ＥＶＡ １８３４ ２０重量部、ダウ社製Ｅｎｇａｇｅ ８１３７ ＰＯＥ ８０重量部）を使用したことを除いては実施例１と同様に進めた。
<Example 2>
The procedure was carried out in the same manner as in Example 1, except that 100 parts by weight of adhesive resin (20 parts by weight of EVA 1834 manufactured by Hanwha Solutions, 80 parts by weight of Engage 8137 POE manufactured by Dow Corporation) was used.
＜実施例３＞
粘着性樹脂１００重量部（ハンファソリューション社製ＥＶＡ １８３４ ２０重量部、ダウ社製ＦＬＥＸＯＭＥＲ ＤＦＤＢ－９０４２ ＮＴ ＶＬＤＰＥ ８０重量部）を使用したことを除いては実施例１と同様に進めた。
<Example 3>
The procedure was carried out in the same manner as in Example 1, except that 100 parts by weight of adhesive resin (20 parts by weight of EVA 1834 manufactured by Hanwha Solutions, 80 parts by weight of FLEXOMER DFDB-9042 NT VLDPE manufactured by Dow Corporation) was used.
＜実施例４＞
粘着性樹脂１００重量部（ハンファソリューション社製ＥＶＡ １８３４ ２０重量部、ダウ社製Ｉｎｆｕｓｅ ９８０７ ＯＢＣ ８０重量部）を使用したことを除いては実施例１と同様に進めた。
<Example 4>
The procedure was carried out in the same manner as in Example 1, except that 100 parts by weight of adhesive resin (20 parts by weight of EVA 1834 manufactured by Hanwha Solutions, 80 parts by weight of Infuse 9807 OBC manufactured by Dow Corporation) was used.
＜実施例５＞
粘着性樹脂１００重量部（ハンファソリューション社製ＥＶＡ １８３４）に対してカーボンブラック１４重量部を使用したことを除いては実施例１と同様に進めた。
<Example 5>
The procedure of Example 1 was repeated except that 14 parts by weight of carbon black was used for 100 parts by weight of adhesive resin (EVA 1834 manufactured by Hanwha Solutions).
＜実施例６＞
粘着性樹脂１００重量部（ダウ社製Ｅｎｇａｇｅ ８１３７ ＰＯＥ）に対してカーボンブラック１４重量部を使用したことを除いては実施例１と同様に進めた。
<Example 6>
The procedure was as in Example 1 except that 14 parts by weight of carbon black was used with respect to 100 parts by weight of adhesive resin (Engage 8137 POE manufactured by Dow).
＜実施例７＞
粘着性樹脂１００重量部（ダウ社製ＦＬＥＸＯＭＥＲ ＤＦＤＢ－９０４２ ＮＴ ＶＬＤＰＥ）に対してカーボンブラック１４重量部を使用したことを除いては実施例１と同様に進めた。
<Example 7>
The procedure was as in Example 1 except that 14 parts by weight of carbon black was used with respect to 100 parts by weight of adhesive resin (FLEXOMER DFDB-9042 NT VLDPE manufactured by Dow Corporation).
＜実施例８＞
粘着性樹脂１００重量部（ダウ社製Ｉｎｆｕｓｅ ９８０７ ＯＢＣ）に対してカーボンブラック１４重量部を使用したことを除いては実施例１と同様に進めた。
<Example 8>
The procedure was as in Example 1 except that 14 parts by weight of carbon black was used for 100 parts by weight of adhesive resin (Infuse 9807 OBC manufactured by Dow).
＜実施例９＞
粘着性樹脂１００重量部（ハンファソリューション社製ＥＶＡ １８３４）に対してカーボンブラック８重量部を使用したことを除いては実施例１と同様に進めた。
<Example 9>
The procedure was the same as in Example 1, except that 8 parts by weight of carbon black was used with respect to 100 parts by weight of adhesive resin (EVA 1834, manufactured by Hanwha Solutions Co., Ltd.).
＜実施例１０＞
粘着性樹脂１００重量部（ハンファソリューション社製ＥＶＡ １８３４）に対してカーボンブラック１１重量部を使用したことを除いては実施例１と同様に進めた。
<Example 10>
The procedure of Example 1 was repeated except that 11 parts by weight of carbon black was used for 100 parts by weight of adhesive resin (EVA 1834 manufactured by Hanwha Solutions).
［比較例］
＜比較例１＞
商業的に市販されている伝導性ＰＥＴシートを備えた。
[Comparative example]
<Comparative example 1>
A commercially available conductive PET sheet was provided.
＜比較例２＞
商業的に市販されているＰＥＴ樹脂層に帯電防止コーティングされたシートを備えた。
<Comparative example 2>
The sheet was provided with a commercially available PET resin layer coated with an antistatic coating.
［実験例１：表面摩擦力測定］
ＡＳＴＭ Ｄ１８９４準拠で表面摩擦力を測定した。実施例及び比較例による成形品（パッド）をスタンドに固定した後、ＰＥＴフィルムが付着された治具を引っ張りながらかかる力を測定する。これについて［図１］に示した。なお、これに対する結果を［表１］で示した。
[Experiment example 1: Surface friction force measurement]
Surface friction force was measured in accordance with ASTM D1894. After fixing the molded products (pads) according to Examples and Comparative Examples to a stand, the force applied while pulling the jig to which the PET film was attached was measured. This is shown in [Figure 1]. Note that the results are shown in [Table 1].
［実験例２：表面抵抗測定］
ＡＳＴＭ Ｄ２５７方法によって表面抵抗を測定した。これに対する結果は［表１］で示している。
Surface resistance was measured by ASTM D257 method. The results are shown in [Table 1].
表１の結果を見てみると、本発明による滑り防止用伝導性樹脂組成物を提供して成形した製品の場合、表面摩擦力は１０Ｎ乃至４０Ｎで提供でき、比較例が１Ｎ以下で提供されることに比べて顕著に高い表面摩擦力を提供できることを確認できた。 Looking at the results in Table 1, it can be seen that in the case of products molded using the conductive resin composition for anti-slip according to the present invention, the surface friction force can be provided at 10N to 40N, while the comparative example is provided with a surface friction force of 1N or less. We were able to confirm that it was possible to provide a significantly higher surface friction force compared to other materials.
また、表面抵抗値は１０３乃至１０９Ω／ｓｑの範囲で提供でき、比較例の表面抵抗値が１０６乃至１０９Ω／ｓｑの範囲で提供されることに比べて顕著に低いことを確認できる。したがって、低い表面抵抗を提供して優れた静電気防止機能と電気伝導性を提供できることを確認できた。 In addition, the surface resistance value can be provided in the range of 10 3 to 10 9 Ω/sq, which is significantly lower than that of the comparative example, which is provided in the range of 10 6 to 10 9 Ω/sq. You can check it. Therefore, it was confirmed that low surface resistance can be provided to provide excellent antistatic function and electrical conductivity.
したがって、本発明の場合、電子部品の製造工程に使用するトレイに適用した場合、部品の移動工程で滑り防止効果（ｎｏｎ－ｓｌｉｐ）及び低い表面抵抗を提供して電子部品及び素材を保護できることを確認できた。 Therefore, when the present invention is applied to a tray used in the manufacturing process of electronic parts, it is possible to protect the electronic parts and materials by providing a non-slip effect and low surface resistance during the process of moving the parts. It could be confirmed.
加えて、別途の工程を追加する必要なく粘着性樹脂自体で摩擦力を提供することにより、製造方法も容易な点から加工方法が単純で加工性及び生産性の効率性を向上させることができる。 In addition, since the adhesive resin itself provides frictional force without the need to add a separate process, the manufacturing method is easy, and the processing method is simple, improving processability and productivity efficiency. .
以上、本発明が具体的な構成要素などのような特定の事項と限定された実施例によって説明されたが、これは本発明のより全般的な理解を助けるために提供されたものに過ぎず、本発明が上記実施例らに限定されるわけではなく、本発明の属する分野における通常の知識を持つ者であれば、かかる記載から多様な修正及び変形を図ることができる。
よって、本発明の思想は上記説明された実施例に限られて定められてはならず、後述する特許請求の範囲のみならず、後述する特許請求の範囲と均等又は等価的に変形されたあらゆるものは本発明の思想の範疇に属すると言える。
後述する本発明に対する詳細な説明は、本発明が実施され得る特定の実施例を例示として参照する。これらの実施例は当業者が本発明を十分に実施できるように十分に詳細に説明される。本発明の多様な実施例は、互いに異なるが相互排他的である必要はない。例えば、ここに記載される特定の形状、構造及び特性は一実施例に関連して本発明の精神及び範囲から逸脱することなく他の実施例として具現され得る。また、各々の開示された実施例内の個別構成要素の位置又は配置は本発明の精神及び範囲から逸脱することなく変更され得る。したがって、後述する詳細な説明は限定的な意味として取ろうとするものでなく、本発明の範囲は、適切に説明された場合、その請求項らが主張するものと均等な全ての範囲とともに添付された請求項によってのみ限定される。
以下、本発明の属する技術分野における通常の知識を有する者が本発明を容易に実施できるようにするために、本発明の好ましい実施例を参照して詳細に説明する。
Although the present invention has been described above with reference to specific matters such as specific components and limited examples, these are merely provided to assist in a more general understanding of the present invention. However, the present invention is not limited to the above-mentioned embodiments, and a person having ordinary knowledge in the field to which the present invention pertains can make various modifications and variations based on the above description.
Therefore, the idea of the present invention should not be limited to the embodiments described above, and should not be limited to the scope of the claims described below, but also any modifications that are equivalent or equivalent to the scope of the claims described below. It can be said that these things belong to the scope of the idea of the present invention.
The detailed description of the invention that follows refers by way of illustration to specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. The various embodiments of the invention are different from each other but need not be mutually exclusive. For example, specific shapes, structures, and characteristics described herein may be related to one embodiment and may be embodied in other embodiments without departing from the spirit and scope of the invention. Additionally, the position or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. Therefore, the following detailed description is not intended to be taken in a limiting sense, and the scope of the invention, if properly described, is to be interpreted along with the full scope of equivalents to which the claims are claimed. limited only by the claims below.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to preferred embodiments so that those skilled in the art can easily carry out the present invention.
滑り防止性能とは、高い表面摩擦力を意味し、摩擦力とは製品の荷重を支持する面とその面の接触面積を最大化して、接触面に発生する運動を妨害する力を付与することを意味する。電子製品を生産するための自動化工程で電子部品移送用トレイ（ｔｒａｙ）の場合、移送中に部品が滑ることを防止するために、本発明は高い表面摩擦力を提供できる滑り防止用伝導性樹脂組成物を提供しようする。 Anti-slip performance means high surface friction force, and friction force means maximizing the contact area between the surface that supports the load of the product and that surface, and applying a force that obstructs the movement that occurs on the contact surface. means. In the case of a tray for transferring electronic components in an automated process for producing electronic products, in order to prevent the components from slipping during transfer, the present invention uses an anti-slip conductive resin that can provide high surface friction force. A composition is provided.
本発明の一実施例によれば、樹脂成形品の表面摩擦力はＡＳＴＭ Ｄ１８９４準拠で１０Ｎ以上で、表面抵抗値はＡＳＴＭ Ｄ２５７準拠で１０３乃至１０９Ω／ｓｑで提供できる滑り防止用伝導性樹脂組成物を提供しようとする。 According to an embodiment of the present invention, the surface friction force of the resin molded product is 10 N or more according to ASTM D1894, and the surface resistance value is 10 3 to 10 9 Ω/sq according to ASTM D257. The present invention aims to provide a resin composition.
本発明の一実施例によれば、上記滑り防止用伝導性樹脂組成物は表面摩擦力に優れた粘着性基本樹脂（ｂａｓｅ ｒｅｓｉｎ）に炭素充填材を含んで提供され、必要に応じて相溶化剤、酸化防止剤、加工助剤などをさらに含むことができる。 According to an embodiment of the present invention, the conductive resin composition for preventing slipping is provided by including a carbon filler in an adhesive base resin having excellent surface friction force, and compatibilizing as necessary. The composition may further include additives, antioxidants, processing aids, and the like.
本発明の一実施例によれば、高い表面摩擦力を提供して滑り防止効果を提供するために粘着性を付与する基本樹脂（ｂａｓｅ ｒｅｓｉｎ）に超低密度ポリエチレン（ＶＬＤＰＥ）、ポリオレフィンエラストマー（ＰＯＥ）、オレフィンブロック共重合体（ＯＢＣ）、エチレン酢酸共重合体（ＥＶＡ）、エチレンブチルアクリレート（ＥＢＡ）、エチレンプロピレンジエンゴム（ＥＰＤＭ）、スチレンブタジエンゴム（ＳＢＲ）、スチレンブタジエンスチレン共重合体（ＳＢＳ）、スチレンエチレンブタジエンスチレン共重合体（ＳＥＢＳ）、エーテルブロックアミド共重合体（ＰＥＢＡ）、熱可塑性ウレタン（ＴＰＵ）、熱可塑性エステルエラストマー（ＴＰＥＥ）、シリコンゴム、天然ゴム（ＮＲ）、イソプレンゴム（ＩＲ）、ブチルゴム（ＩＩＲ）、ブタジエンゴム（ＢＲ）、アクリルゴム（ＡＣＭ）、ニトリルブタジエンゴム（ＮＢＲ）及びクロロプレンゴム（ＣＲ）から少なくとも１つ以上の樹脂を提供できる。好ましくはポリオレフィンエラストマー（ＰＯＥ）、エチレン酢酸共重合体（ＥＶＡ）、超低密度ポリエチレン（ＶＬＤＰＥ）及びオレフィンブロック共重合体（ＯＢＣ）から選択される少なくともいずれか１つ以上を提供できる。 According to an embodiment of the present invention, the base resin that imparts tackiness to provide high surface friction force and provide anti-slip effect includes very low density polyethylene (VLDPE) and polyolefin elastomer (POE). ), olefin block copolymer (OBC), ethylene acetic acid copolymer (EVA), ethylene butyl acrylate (EBA), ethylene propylene diene rubber (EPDM), styrene butadiene rubber (SBR), styrene butadiene styrene copolymer (SBS) ), styrene ethylene butadiene styrene copolymer (SEBS), ether block amide copolymer (PEBA), thermoplastic urethane (TPU), thermoplastic ester elastomer (TPEE), silicone rubber, natural rubber (NR), isoprene rubber ( IR), butyl rubber (IIR), butadiene rubber (BR), acrylic rubber (ACM), nitrile butadiene rubber (NBR) and chloroprene rubber (CR). Preferably, at least one selected from polyolefin elastomer (POE), ethylene acetic acid copolymer (EVA), very low density polyethylene (VLDPE), and olefin block copolymer (OBC) can be provided.
粘着性樹脂に提供され得るポリオレフィンエラストマー（ＰＯＥ）はエチレンとアルファオレフィンを共重合させて得られる重合体を意味し、アルファオレフィン共単量体の種類及び含量によって基本性質が変わる特性を持つ。アルファオレフィンの含量が増加するほど結晶化度が減少して密度が減少し光学性及び柔軟性は増加する。したがって、本発明のポリオレフィンエラストマー（ＰＯＥ）はアルファオレフィンでブテン及びオクテンを共重合したもので結晶化度３４％以下であることを特徴とする。好ましくは結晶化度１３乃至２４％に０．８５乃至０．８８ｇ／ｃｍ３範囲のポリオレフィンエラストマー（ＰＯＥ）でメルトインデックス（ＭＩ）はＡＳＴＭ Ｄ１２３８準拠で１９０℃の２．１６Ｋｇで０．５乃至６０ｇ／１０ｍｉｎで提供される。また、上記ポリオレフィンエラストマー（ＰＯＥ）の重量平均分子量は１０，０００乃至８００，０００ｇ／ｍｏｌで提供される。比重が低いほどスティッキー（Ｓｔｉｃｋｙ）な特性を示すので、上記範囲の比重を提供して、滑り防止特性を向上させることを助けることができる。 Polyolefin elastomer (POE), which can be provided to the adhesive resin, refers to a polymer obtained by copolymerizing ethylene and alpha olefin, and has characteristics whose basic properties change depending on the type and content of the alpha olefin comonomer. As the alpha olefin content increases, crystallinity decreases, density decreases, and optical properties and flexibility increase. Therefore, the polyolefin elastomer (POE) of the present invention is obtained by copolymerizing butene and octene with an alpha olefin, and is characterized by having a crystallinity of 34% or less. Preferably a polyolefin elastomer (POE) with a crystallinity of 13 to 24% and a range of 0.85 to 0.88 g/cm 3 and a melt index (MI) of 0.5 to 60 g at 2.16 kg at 190° C. according to ASTM D1238. /10min. Also, the weight average molecular weight of the polyolefin elastomer (POE) is 10,000 to 800,000 g/mol. Since the lower the specific gravity, the sticky properties are exhibited, so providing the specific gravity in the above range can help improve the anti-slip properties.
エチレン酢酸共重合体（ＥＶＡ）はエチレンと酢酸ビニル（ｖｉｎｙｌ ａｃｅｔａｔｅ）単量体を共重合させて得られる重合体を意味し、一般にエチレン単量体で作られたポリエチレン製品の基本性質に酢酸ビニルの性質が加えられた特性を持つ。エチレン単量体に比べて酢酸ビニル単量体はアセトキシ（ａｃｅｔｏｘｙ）基を含んでおり、この含量が高くなるほど極性（ｐｏｌａｒ）の性質を提供する。酢酸ビニルの含有量が増加することにより光学性（光沢度）が良くなり密度は増加するが、結晶化度は低下して柔軟性は増加するようになる。また、エチレン酢酸共重合体（ＥＶＡ）の場合、滑り性を示すが酢酸ビニル含量が増加すると摩擦係数が大きくなって滑りにくくなる。したがって、本発明のエチレン酢酸共重合体（ＥＶＡ）は酢酸ビニル（ＶＡ）の含有率が１０乃至５０重量％であることを特徴とする。含量が１０重量％未満の場合は加工が難しい問題点があり、５０重量％を超過する場合は結晶化度で不利な点がある。したがって、上記範囲１０乃至５０重量％を提供して、優れた滑り防止（ｎｏｎ－ｓｌｉｐ）効果を提供できる。その上、エチレン酢酸共重合体（ＥＶＡ）のメルトインデックス（ＭＩ）はＡＳＴＭ Ｄ１２３８準拠で１９０℃の２．１６Ｋｇで０．５乃至８０ｇ／１０ｍｉｎで提供される。また、エチレン酢酸共重合体（ＥＶＡ）の重量平均分子量は１０，０００乃至８００，０００ｇ／ｍｏｌで提供される。 Ethylene acetate copolymer (EVA) refers to a polymer obtained by copolymerizing ethylene and vinyl acetate monomers, and generally polyethylene products made from ethylene monomers have vinyl acetate as a basic property. It has the added property of . Compared to ethylene monomer, vinyl acetate monomer contains acetoxy groups, and the higher the content, the more polar properties it provides. As the vinyl acetate content increases, optical properties (gloss) improve and density increases, but crystallinity decreases and flexibility increases. Further, in the case of ethylene acetic acid copolymer (EVA), it exhibits slipping properties, but as the vinyl acetate content increases, the coefficient of friction increases and it becomes difficult to slip. Therefore, the ethylene acetic acid copolymer (EVA) of the present invention is characterized by having a vinyl acetate (VA) content of 10 to 50% by weight. If the content is less than 10% by weight, processing may be difficult, and if it exceeds 50% by weight, there may be disadvantages in terms of crystallinity. Therefore, by providing the above range of 10 to 50% by weight, an excellent non-slip effect can be provided. Moreover, the melt index (MI) of ethylene acetic acid copolymer (EVA) is provided in the range of 0.5 to 80 g/10 min at 2.16 Kg at 190° C. according to ASTM D1238. In addition, the weight average molecular weight of the ethylene acetic acid copolymer (EVA) is 10,000 to 800,000 g/mol.
超低密度ポリエチレン（ＶＬＤＰＥ）は０．８９０乃至０．９１４ｇ／ｃｍ３範囲の密度を持つポリエチレンの類型で直鎖状低密度ポリエチレン（ＬＬＤＰＥ）のようにメタロセン触媒を使用する低圧重合技術で生産され、他の類型のポリエチレンに比べてアルファオレフィン含量が高いことが特徴である。アルファオレフィンのアルキル分枝はパッキング密度と結晶性を下げる効果があり、高い靭性と弾性を示し引張強さと融点は非常に低い。その上、超低密度ポリエチレン（ＶＬＤＰＥ）のメルトインデックス（ＭＩ）はＡＳＴＭ Ｄ１２３８準拠で１９０℃の２．１６Ｋｇで０．５乃至８０ｇ／１０ｍｉｎで提供される。また、超低密度ポリエチレン（ＶＬＤＰＥ）の重量平均分子量は１０，０００乃至８００，０００ｇ／ｍｏｌで提供される。 Very low density polyethylene (VLDPE) is a type of polyethylene with a density ranging from 0.890 to 0.914 g/ cm3 , and like linear low density polyethylene (LLDPE), it is produced by low pressure polymerization technology using metallocene catalysts. It is characterized by a higher alpha olefin content than other types of polyethylene. The alkyl branches of alpha olefins have the effect of reducing packing density and crystallinity, exhibiting high toughness and elasticity, and very low tensile strength and melting point. Moreover, the melt index (MI) of very low density polyethylene (VLDPE) is provided from 0.5 to 80 g/10 min at 2.16 Kg at 190° C. according to ASTM D1238. Further, the weight average molecular weight of the very low density polyethylene (VLDPE) is 10,000 to 800,000 g/mol.
オレフィンブロック共重合体（ＯＢＣ）はエチレン系又はプロピレン系繰り返し単位と、α－オレフィン系繰り返し単位を含む複数のブロック又はセグメントを含むオレフィンブロック共重合体であって、０．８６０乃至０．８９０ｇ／ｃｍ３範囲の密度を持つ。ブロック共重合体はソフトセグメントと称される軟質の弾性ブロックと、ハードセグメントと称される硬質の結晶性ブロックを共に含むことができ、これにより、優れた弾性と耐熱性などの物性を共に示すことができる。より具体的には、このようなブロック共重合体はソフトセグメントのガラス転移温度以上では上記ブロック共重合体が軟質特性を示すことができ、溶融温度より高い温度に至って熱可塑性挙動を示すため、比較的優れた加工性を示すことができる。その上、オレフィンブロック共重合体（ＯＢＣ）のメルトインデックス（ＭＩ）はＡＳＴＭ Ｄ１２３８準拠で１９０℃の２．１６Ｋｇで０．５乃至２０ｇ／１０ｍｉｎで提供される。また、オレフィンブロック共重合体（ＯＢＣ）の重量平均分子量は１０，０００乃至８００，０００ｇ／ｍｏｌで提供される。 An olefin block copolymer (OBC) is an olefin block copolymer containing an ethylene-based or propylene-based repeating unit and a plurality of blocks or segments containing an α-olefin-based repeating unit, and has an amount of 0.860 to 0.890 g/ It has a density in the cm3 range. A block copolymer can contain both a soft elastic block called a soft segment and a hard crystalline block called a hard segment, thereby exhibiting physical properties such as excellent elasticity and heat resistance. be able to. More specifically, such a block copolymer can exhibit soft properties above the glass transition temperature of the soft segment, and exhibits thermoplastic behavior at temperatures higher than the melting temperature. It can exhibit relatively excellent workability. Moreover, the melt index (MI) of the olefin block copolymer (OBC) is provided in the range of 0.5 to 20 g/10 min at 2.16 Kg at 190° C. according to ASTM D1238. Further, the weight average molecular weight of the olefin block copolymer (OBC) is provided in a range of 10,000 to 800,000 g/mol.
本発明の一実施例によれば、上記粘着性樹脂はポリオレフィンエラストマー（ＰＯＥ）、エチレン酢酸共重合体（ＥＶＡ）、超低密度ポリエチレン（ＶＬＤＰＥ）及びオレフィンブロック共重合体（ＯＢＣ）から選択される少なくともいずれか１つ以上が溶融混練されることができ、上記溶融混練とは８０℃乃至１９０℃の条件で押出機、ニーダー、ロールミールなどを用いて進めることができ、通常の技術者が実施できる適切な加工範囲内で進めることができる。 According to one embodiment of the present invention, the adhesive resin is selected from polyolefin elastomer (POE), ethylene acetic acid copolymer (EVA), very low density polyethylene (VLDPE) and olefin block copolymer (OBC). At least one or more of them can be melt-kneaded, and the above-mentioned melt-kneading can be carried out using an extruder, kneader, roll mill, etc. at a temperature of 80°C to 190°C, and can be carried out by ordinary engineers. You can proceed within the appropriate processing range.
本発明の一実施例によれば、上記粘着性樹脂１００重量部に対して、炭素充填材０．１乃至４０重量部を含んで提供される。 According to an embodiment of the present invention, 0.1 to 40 parts by weight of carbon filler is provided based on 100 parts by weight of the adhesive resin.
本発明の一実施例によれば、上記炭素充填材は炭素ナノチューブ（ＣＮＴ）、グラファイト（Ｇｒａｐｈｉｔｅ）、カーボンブラック（Ｃａｒｂｏｎ Ｂｌａｃｋ）、カーボンファイバー（ｃａｒｂｏｎ ｆｉｂｅｒ）及びグラフェン（Ｇｒａｐｈｅｎｅ）から選択される少なくともいずれか１つ以上を含んで提供される。従来の帯電防止剤の投入によって静電気防止効果を提供する場合は表面抵抗値が相対的に高いが、それに対して伝導性炭素充填材によって静電気防止効果を提供する場合はより低い表面抵抗値を提供でき、よって、優れた静電気防止効果と電気伝導性を提供できる。また、最終製品の引張伸び率、光沢などの物性を向上させ、向上した衝撃補強効果を共に提供できる。 According to an embodiment of the present invention, the carbon filler is at least one selected from carbon nanotubes (CNT), graphite, carbon black, carbon fiber, and graphene. or one or more of the following. The surface resistance value is relatively high when the antistatic effect is provided by adding a conventional antistatic agent, whereas the surface resistance value is lower when the antistatic effect is provided by the conductive carbon filler. Therefore, it can provide excellent antistatic effect and electrical conductivity. In addition, physical properties such as tensile elongation and gloss of the final product can be improved, and an improved impact reinforcement effect can also be provided.
本発明の一実施例によれば、上記粘着性樹脂１００重量部に対して、炭素ナノチューブ（ＣＮＴ）０．１乃至１０重量部、カーボンブラック（Ｃａｒｂｏｎ ｂｌａｃｋ）１乃至１５重量部及びグラフェン（Ｇｒａｐｈｅｎｅ）０．１乃至１０重量部から選択された少なくともいずれか１つを含むことを特徴とする。すなわち、上記範囲のような組成物を提供することによって高い表面摩擦力を提供できる基本樹脂に伝導性を提供できる炭素充填材を溶融混練して優れた静電気防止性能を同時に提供できる。特に、本発明の場合、摩擦力の高い樹脂に伝導性の炭素充填材を含むことによって加工工程を単純化できる長所がある。この場合、上記粘着性樹脂はエチレン酢酸共重合体（ＥＶＡ）２０乃至８０重量部に対して、ポリオレフィンエラストマー（ＰＯＥ）、超低密度ポリエチレン（ＶＬＤＰＥ）又はオレフィンブロック共重合体（ＯＢＣ）を２０乃至８０重量部含むことができる。 According to an embodiment of the present invention, 0.1 to 10 parts by weight of carbon nanotubes (CNT), 1 to 15 parts by weight of carbon black, and graphene are added to 100 parts by weight of the adhesive resin. It is characterized by containing at least one selected from 0.1 to 10 parts by weight. That is, by providing a composition within the above range, it is possible to melt and knead a base resin that can provide high surface friction with a carbon filler that can provide conductivity, thereby providing excellent antistatic performance at the same time. In particular, the present invention has the advantage that the processing steps can be simplified by including a conductive carbon filler in the resin having high frictional force. In this case, the adhesive resin contains 20 to 80 parts by weight of ethylene acetic acid copolymer (EVA) and 20 to 80 parts by weight of polyolefin elastomer (POE), very low density polyethylene (VLDPE), or olefin block copolymer (OBC). It can contain 80 parts by weight.
特に、粘着性樹脂１００重量部に対して、炭素ナノチューブ（ＣＮＴ）が０．１乃至１０重量部で提供され、低い炭素含有量に比べて優れた電気伝導度を提供しながらも樹脂の粘着特性を維持して高い表面摩擦力を提供でき、カーボンブラック（Ｃａｒｂｏｎ ｂｌａｃｋ）１乃至１５重量部を含むことで、加工時に樹脂流れによる内部構造の変化にも所定水準以上の電気伝導度も維持できる効果を提供できる。また、グラフェン０．１乃至１０重量部を含むことで電気伝導度の向上は勿論のこと、モジュラスの向上による引張強度及び屈曲強度を向上させる効果を提供できる。 In particular, carbon nanotubes (CNTs) are provided in an amount of 0.1 to 10 parts by weight per 100 parts by weight of adhesive resin, which provides adhesive properties of the resin while providing superior electrical conductivity compared to low carbon content. By containing 1 to 15 parts by weight of carbon black, it is possible to maintain electrical conductivity above a specified level even when the internal structure changes due to resin flow during processing. can be provided. Further, by including 0.1 to 10 parts by weight of graphene, it is possible to provide the effect of improving not only electrical conductivity but also tensile strength and bending strength due to improved modulus.
本発明の一実施例によれば、上記樹脂組成物は酸化防止剤及び加工助剤から選択される少なくともいずれか１つ以上をさらに含むことができる。この場合、上記粘着性樹脂１００重量部に対して、酸化防止剤及び加工助剤から選択された少なくともいずれか１つを０．０１乃至１０重量部含んで提供される。 According to an embodiment of the present invention, the resin composition may further include at least one selected from an antioxidant and a processing aid. In this case, 0.01 to 10 parts by weight of at least one selected from antioxidants and processing aids is provided based on 100 parts by weight of the adhesive resin.
酸化防止剤の場合、樹脂組成物に含まれて成形される最終製品の酸化を防止し、酸化防止剤の種類には一次酸化防止剤（ｐｒｉｍａｒｙ ａｎｔｉｏｘｉｄａｎｔ）、二次酸化防止剤（ｓｅｃｏｎｄａｒｙ ａｎｔｉｏｘｉｄａｎｔ）がある。一次酸化防止剤にはヒンダードフェノール（ｈｉｎｄｅｒｅｄ ｐｈｅｎｏｌ）系、ラクトン（ｌａｃｔｏｎｅ）系が使用され、二次酸化防止剤にはリン（ｐｈｏｓｐｈｉｔｅ）系、チオエステル（ｔｈｉｏｅｓｔｅｒ）系が使用される。一次酸化防止剤の役割はラジカルスカベンジャー（ｒａｄｉｃａｌ ｓｃａｖｅｎｇｅｒ）でヒンダードフェノール（ｈｉｎｄｅｒｅｄ ｐｈｅｎｏｌ）系は酸素中心ラジカル（ｏｘｙｇｅｎ ｃｅｎｔｅｒｅｄ ｒａｄｉｃａｌ）を処理する。二次酸化防止剤はヒドロペルオキシド分解者（ｈｙｄｒｏｐｅｒｏｘｉｄｅ（ＲＯＯＨ） ｄｅｃｏｍｐｏｓｅｒ）として作用する。酸化防止剤は大半の樹脂において一次と二次酸化防止剤を共に使用することで上昇効果をさらに増加させるので、ヒンダードフェノール（ｈｉｎｄｅｒｅｄ ｐｈｅｎｏｌ）系、ラクトン（ｌａｃｔｏｎｅ）系及びリン（ｐｈｏｓｐｈｉｔｅ）系が適切な割合で混合されて使用されている。フェノール系は２，６－ｄｉ－ｔ－Ｂｕｔｙｌ－４－ｍｅｔｈｙｌｐｈｅｎｏｌ、２，２－Ｍｅｔｈｙｌｅｎｅｂｉｓ（４－ｍｅｔｈｙｌ－６－ｔ－ｂｕｔｙｌｐｈｅｎｏｌ）などが提供されることができ、リン系の場合はＢｉｓ（２，４－ｄｉ－ｔ－ｂｕｔｙｌ）、Ｔｒｉｓ（２，４－ｄｉ－ｔ－ｂｕｔｙｌｐｈｅｎｙｌ）－ｐｈｏｓｐｈｉｔｅなどが提供され得る。酸化防止剤の場合、粘着性樹脂１００重量部に対して０．０１乃至５重量部を含むことができる。 In the case of antioxidants, they are included in resin compositions to prevent oxidation of the final product to be molded. Types of antioxidants include primary antioxidants and secondary antioxidants. be. Hindered phenol type and lactone type antioxidants are used as primary antioxidants, and phosphorite type and thioester type antioxidants are used as secondary antioxidants. The role of the primary antioxidant is a radical scavenger, and the hindered phenol type treats oxygen-centered radicals. Secondary antioxidants act as hydroperoxide (ROOH) decomposers. In most resins, the use of both primary and secondary antioxidants further increases the effectiveness of antioxidants, so hindered phenol, lactone, and phosphorite antioxidants are recommended. They are mixed and used in appropriate proportions. The phenol type can be provided with 2,6-di-t-Butyl-4-methylphenol, 2,2-Methylenebis (4-methyl-6-t-butylphenol), etc., and in the case of the phosphorus type, Bis(2-butylphenol) can be provided. , 4-di-t-butyl), Tris(2,4-di-t-butylphenyl)-phosphorite, and the like. In the case of an antioxidant, it may be included in an amount of 0.01 to 5 parts by weight based on 100 parts by weight of the adhesive resin.
加工助剤の場合、押出物の表面を滑らかにして成形品の品質を高めることができる。金型面や押出機表面と樹脂との粘着性を防止しスリップ性を向上するための添加剤で樹脂と混練されて融解粘度を低下させて成形加工性を向上し樹脂加工時にペレット間のケーキング現象を防止する。このような加工助剤はアクリルポリマー、スチレン共重合物、ミネラルオイル、ペトロラタム、パラフィンワックス、石油レジン、脂肪酸、脂肪酸エステル、脂肪アルコール、金属石鹸、脂肪酸アミド、フェノール樹脂、ポリエチレン、ポリブテン、有機シリコンなどが提供されることができ、これに限定されない。また、加工助剤の場合、粘着性樹脂１００重量部に対して０．０１乃至５重量部を含むことができる。 In the case of processing aids, they can smooth the surface of the extrudate and improve the quality of the molded product. Additives are used to prevent the adhesion of the resin to the mold surface or extruder surface and improve slip properties.They are kneaded with the resin to lower the melt viscosity and improve moldability, resulting in caking between pellets during resin processing. Prevent the phenomenon. Such processing aids include acrylic polymers, styrene copolymers, mineral oil, petrolatum, paraffin wax, petroleum resins, fatty acids, fatty acid esters, fatty alcohols, metallic soaps, fatty acid amides, phenolic resins, polyethylene, polybutenes, organic silicones, etc. may be provided, but is not limited to this. Further, in the case of processing aids, 0.01 to 5 parts by weight may be included per 100 parts by weight of the adhesive resin.
本発明の一実施例によれば、上記樹脂組成物を含んで成形された最終成形品の表面摩擦力はＡＳＴＭ Ｄ１８９４準拠で１０Ｎ以上で提供でき、好ましくは１０Ｎ乃至４０Ｎで提供され得る。図１を参照すると、本発明による樹脂を含む成形品（シート）の表面摩擦力の測定方法を示した図であって、図２を参照すると、表面の高い摩擦力を提供して置かれた物体が横衝撃によって動かないように支持できるように助けられることが確認できる。 According to one embodiment of the present invention, the surface friction force of the final molded article molded containing the resin composition may be 10N or more in accordance with ASTM D1894, preferably 10N to 40N. Referring to FIG. 1, there is shown a method for measuring the surface friction force of a molded article (sheet) containing a resin according to the present invention, and FIG. It can be confirmed that the object is supported so that it does not move due to the lateral impact.
また、最終成形品の表面抵抗値は１０３乃至１０９Ω／ｓｑで、比較的低い表面抵抗値を提供して優れた静電気防止機能を提供でき、該当機能によって電子部品及び素材を保護できる。特に従来の滑り防止マット又はパッドの場合、静電気防止機能を付与するために帯電防止剤を含んで製造される場合は表面抵抗値が１０１０Ω／ｓｑを超過して提供されるが、それに対して、本発明の場合は炭素充填材を含むことで表面抵抗値を１０３乃至１０９Ω／ｓｑに減少させることができる。 In addition, the final molded product has a surface resistance value of 10 3 to 10 9 Ω/sq, which provides a relatively low surface resistance value and provides excellent anti-static function, which can protect electronic components and materials. Particularly in the case of conventional anti-slip mats or pads, which are manufactured with anti-static agents to provide anti-static properties, they provide surface resistance values exceeding 10 10 Ω/sq; In the case of the present invention, the surface resistance value can be reduced to 10 3 to 10 9 Ω/sq by including the carbon filler.
本発明の一実施例によれば、上記滑り防止用伝導性樹脂組成物を含む成形品が提供される。成形品の製造には射出成形（Ｉｎｊｅｃｔｉｏｎ Ｍｏｌｄｉｎｇ）、射出ブロー成形（Ｉｎｊｅｃｔｉｏｎ Ｂｌｏｗ Ｍｏｌｄｉｎｇ）、真空成形（Ｖａｃｕｕｍ Ｍｏｌｄｉｎｇ）又はＴダイを用いた押出シート成形方法が提供されることができ、上記方法は成形材料を加熱溶融させて予め閉じられた金型のキャビティに射出充填した後、冷却固化させて成形品を得るか、または成形材料を金型に上げた後、加熱してから真空をかけて金型に密着成形する方法で進めることができる。また、通常の技術者が実施できる範囲内で適切な範囲内で変形して進められることは無論である。 According to one embodiment of the present invention, a molded article containing the above-mentioned anti-slip conductive resin composition is provided. Injection molding, injection blow molding, vacuum molding, or an extrusion sheet molding method using a T-die can be provided for manufacturing the molded product, and the above method includes molding Either the material is heated and melted and injected into a pre-closed mold cavity, then cooled and solidified to obtain a molded product, or the molding material is raised into a mold, heated and then vacuumed to form a mold. This can be done by molding in close contact with the mold. Moreover, it goes without saying that the invention may be modified within an appropriate range within the scope of practice by ordinary engineers.
本発明の一実施例によれば、上記成形品はシート、パッド、フィルム、包装紙、パイプ、ポーチ、内装材、容器、電子部品製造用トレイから選択される少なくともいずれか１つである成形品で提供されることができ、好ましくは電子部品製造用トレイに適用されることができ、これに限定されない。
According to an embodiment of the present invention, the molded product is at least one selected from a sheet, a pad, a film, a wrapping paper, a pipe, a pouch, an interior material, a container, and a tray for manufacturing electronic parts. The present invention is not limited thereto, and can be preferably applied to a tray for manufacturing electronic components.
Claims (9)
前記樹脂組成物は粘着性樹脂に炭素充填材を含み、
前記粘着性樹脂は、ポリオレフィンエラストマー（ＰＯＥ）、エチレン酢酸共重合体（ＥＶＡ）、 超低密度ポリエチレン（ＶＬＤＰＥ）及びオレフィンブロック共重合体（ＯＢＣ）から選択された少なくともいずれか1つ以上を含み、
前記粘着性樹脂の重量平均分子量は１０，０００乃至８００，０００である
ことを特徴とする滑り防止用伝導性樹脂組成物。 The friction force of the resin molded product is 10N or more in accordance with ASTM D1894 (load 200g, speed 150mm/min) , and the surface resistance value is 10 3 to 10 9 Ω/sq in accordance with ASTM D257.A conductive resin composition for slip prevention. is a thing,
The resin composition includes a carbon filler in an adhesive resin,
The adhesive resin includes at least one selected from polyolefin elastomer (POE), ethylene acetic acid copolymer (EVA), very low density polyethylene (VLDPE), and olefin block copolymer (OBC),
The weight average molecular weight of the adhesive resin is 10,000 to 800,000.
A conductive resin composition for preventing slipping.
請求項１に記載の滑り防止用伝導性樹脂組成物。 Contains 0.1 to 40 parts by weight of carbon filler per 100 parts by weight of the adhesive resin.
The anti-slip conductive resin composition according to claim 1 .
請求項１に記載の滑り防止用伝導性樹脂組成物。 The carbon filler includes at least one selected from carbon nanotubes (CNT), graphite, carbon black, carbon fiber, and graphene.
The anti-slip conductive resin composition according to claim 1 .
請求項１に記載の滑り防止用伝導性樹脂組成物。 Based on 100 parts by weight of the adhesive resin, selected from 0.1 to 10 parts by weight of carbon nanotubes (CNT), 1 to 15 parts by weight of carbon black, and 0.1 to 10 parts by weight of graphene. Contains at least one of
The anti-slip conductive resin composition according to claim 1 .
請求項１に記載の滑り防止用伝導性樹脂組成物。 Contains 0.01 to 10 parts by weight of at least one selected from antioxidants and processing aids based on 100 parts by weight of the adhesive resin.
The anti-slip conductive resin composition according to claim 1 .
請求項１に記載の滑り防止用伝導性樹脂組成物。 The melt index (MI) of the adhesive resin is 0.5 to 60 g/10 min at 2.16 kg at 190° C. according to ASTM D1238.
The anti-slip conductive resin composition according to claim 1 .
請求項１に記載の滑り防止用伝導性樹脂組成物。 The specific gravity of the adhesive resin is 0.85 to 0.96 g/cc.
The anti-slip conductive resin composition according to claim 1 .
ことを特徴とする成形品。 A molded article comprising the anti-slip conductive resin composition according to any one of claims 1 to 7 .
請求項８に記載の成形品。
The molded product is at least one selected from sheets, pads, films, wrapping paper, pipes, pouches, interior materials, containers, and trays for manufacturing electronic components.
The molded article according to claim 8 .
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