JP7376601B2 - 表示装置 - Google Patents
表示装置 Download PDFInfo
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- JP7376601B2 JP7376601B2 JP2021543266A JP2021543266A JP7376601B2 JP 7376601 B2 JP7376601 B2 JP 7376601B2 JP 2021543266 A JP2021543266 A JP 2021543266A JP 2021543266 A JP2021543266 A JP 2021543266A JP 7376601 B2 JP7376601 B2 JP 7376601B2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8794—Arrangements for heating and cooling
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Geometry (AREA)
- Electroluminescent Light Sources (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
- Control Of El Displays (AREA)
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Description
Claims (21)
- サブ画素と前記サブ画素の少なくとも一つに電気的に接続される放熱パッドとを含む表示パネルと、
前記放熱パッド上に配置される放熱シートと、
前記放熱シートと前記放熱パッドとの間に配置されて、前記放熱シートと前記放熱パッドとを接着する絶縁放熱接着層を備え、
前記表示パネルは、前記サブ画素の少なくとも一つと、前記放熱パッドとを電気的に接続する導電ラインをさらに含み、
前記表示パネルは、前記サブ画素が配置される表示領域を囲む密封材をさらに含み、
前記導電ラインは前記密封材と交差する、表示装置。 - 前記表示パネルは、第2電源電圧が印加される第2電源電圧ラインをさらに含み、
前記導電ラインは前記第2電源電圧ラインと交差する、請求項1に記載の表示装置。 - 前記密封材は前記第2電源電圧ラインの外側に配置され、前記放熱パッドは前記密封材の外側に配置される、請求項2に記載の表示装置。
- 前記サブ画素のそれぞれは、
発光素子と、
前記第2電源電圧より高い第1電源電圧が印加される第1電源ラインと、
ゲート電極に印加されたデータ電圧に応じて、前記第1電源ラインから、前記発光素子に流れる電流を制御するための駆動トランジスタを含む、請求項2に記載の表示装置。 - 前記導電ラインには前記第1電源電圧が印加され、前記導電ラインは前記第2電源電圧ラインの上方に配置される、請求項4に記載の表示装置。
- 前記サブ画素のそれぞれは、
前記駆動トランジスタのゲート電極を初期化電圧に初期化するための初期化トランジスタをさらに含む、請求項5に記載の表示装置。 - 前記導電ラインには前記初期化電圧が印加され、前記導電ラインは前記第2電源電圧ラインの上方に配置される、請求項6に記載の表示装置。
- 前記サブ画素のそれぞれは、
スキャン信号に応じて、前記データ電圧を前記駆動トランジスタのゲート電極に供給するためのスキャントランジスタをさらに含む、請求項4に記載の表示装置。 - 前記導電ラインには前記データ電圧が印加され、前記導電ラインは前記第2電源電圧ラインの上方に配置される、請求項8に記載の表示装置。
- 前記導電ラインには前記スキャン信号が印加され、前記導電ラインは前記第2電源電圧ラインと同じ層に配置される、請求項8に記載の表示装置。
- 前記導電ラインは、前記第2電源電圧ライン上に配置されるスキャン連結電極を含む、請求項10に記載の表示装置。
- 前記サブ画素のそれぞれは、
発光制御信号に応じて、前記駆動トランジスタを介して前記第1電源ラインから前記発光素子に流れる電流を遮断する発光制御トランジスタをさらに含む、請求項4に記載の表示装置。 - 前記導電ラインには前記発光制御信号が印加され、前記導電ラインは前記第2電源電圧ラインと同じ層に配置される、請求項12に記載の表示装置。
- 前記サブ画素のそれぞれは、
前記駆動トランジスタのアクティブ層の下に配置される光遮断層をさらに含み、
前記導電ラインは前記光遮断層である、請求項4に記載の表示装置。 - 前記導電ラインは、前記第2電源電圧ラインの下方に配置される、請求項13に記載の表示装置。
- 前記表示パネルは、第2電源電圧が印加される第2電源電圧ラインをさらに含み、
前記導電ラインは、前記第2電源電圧ラインである、請求項1に記載の表示装置。 - 前記表示パネルは、
第1基板と、
前記第1基板上に配置される第2基板を含み、
前記放熱パッドは、前記第2基板によって覆われていない、前記第1基板の一方の側に配置される、請求項1に記載の表示装置。 - 前記放熱シートは、前記第1基板の上面の一部、一側面、および下面の一部の上に配置される、請求項17に記載の表示装置。
- 前記表示パネルは、前記第2基板によって覆われていない、前記第1基板の他方の側に配置される表示パッドをさらに含む、請求項17に記載の表示装置。
- 前記表示パネルの表示パッド上に取り付けられるフレキシブル回路ボードをさらに備える、請求項19に記載の表示装置。
- 前記絶縁放熱接着層は熱伝導性シリコーン接着剤である、請求項1に記載の表示装置。
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KR1020190011011A KR20200094243A (ko) | 2019-01-29 | 2019-01-29 | 표시 장치 |
PCT/KR2019/015753 WO2020159045A1 (ko) | 2019-01-29 | 2019-11-18 | 표시 장치 |
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EP (1) | EP3920252A4 (ja) |
JP (1) | JP7376601B2 (ja) |
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WO2022011582A1 (zh) * | 2020-07-15 | 2022-01-20 | 京东方科技集团股份有限公司 | 显示基板、显示面板和显示装置 |
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KR20200094243A (ko) | 2020-08-07 |
EP3920252A4 (en) | 2022-10-12 |
US20220077419A1 (en) | 2022-03-10 |
CN113348567A (zh) | 2021-09-03 |
JP2022518790A (ja) | 2022-03-16 |
WO2020159045A1 (ko) | 2020-08-06 |
EP3920252A1 (en) | 2021-12-08 |
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