JP7376322B2 - 樹脂シート固定装置 - Google Patents
樹脂シート固定装置 Download PDFInfo
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- JP7376322B2 JP7376322B2 JP2019201386A JP2019201386A JP7376322B2 JP 7376322 B2 JP7376322 B2 JP 7376322B2 JP 2019201386 A JP2019201386 A JP 2019201386A JP 2019201386 A JP2019201386 A JP 2019201386A JP 7376322 B2 JP7376322 B2 JP 7376322B2
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- wafer
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- 229920005989 resin Polymers 0.000 title claims description 115
- 239000011347 resin Substances 0.000 title claims description 115
- 238000001816 cooling Methods 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000007666 vacuum forming Methods 0.000 description 27
- 238000000034 method Methods 0.000 description 19
- 230000032258 transport Effects 0.000 description 18
- 238000003466 welding Methods 0.000 description 7
- 238000001514 detection method Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 5
- 238000009423 ventilation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
なお、真空形成チャンバー2の上面における支持柱11の貫通部分には、真空形成チャンバー2内の真空を維持するための真空シール2aが設けられている。
すなわち、切換手段27は、ペルチェ素子24に供給される直流電流の方向を、ペルチェ素子24の上面24aを加熱する第1方向と、ペルチェ素子24の上面24aを冷却する、第1方向とは逆方向の第2方向とを切り換えるように構成されている。なお、ペルチェ素子24の下面24bは、第1方向に直流電流が流れるときには冷却される一方、第2方向に直流電流が流れるときには加熱される。
この状態で、制御手段70は、真空ポンプ7を制御して、真空形成チャンバー2内を真空引きする。
このようにして、制御手段70は、上下移動手段30を制御して、ウェーハ保持手段10に保持されたウェーハW(第2面Wb)によって、シート保持面23に保持された樹脂シートSを押圧する。
そして、制御手段70は、ウェーハ搬送手段40によって、ウェーハWを、矢印Eによって示すように+X方向に移動させて、開口4を介して真空形成チャンバー2の外部に搬出する(ウェーハ搬出工程)。
なお、ウェーハ搬送手段40は、ウェーハWの第1面Waを保持してもよい。
すなわち、本実施形態では、1つのシート支持テーブル22のシート保持面23に樹脂シートSを載置したまま、樹脂シートSに対する熱溶着および冷却を実施して、樹脂シートSをウェーハWに固定している。
2:真空形成チャンバー、3:カバー、5:カバー開閉手段、7:真空ポンプ、
10:ウェーハ保持手段、12:ウェーハ保持テーブル、13:ウェーハ保持面、
14:エア供給源、15:通気路、16:吸引源、
20:シート保持手段、22:シート支持テーブル、23:シート保持面、
24:ペルチェ素子、24a:上面、24b:下面、
25:第1電力線、26:第2電力線、
27:切換手段、28:直流電源、
30:上下移動手段、60:荷重検知手段、
40:ウェーハ搬送手段、50:シート搬送手段、
70:制御手段、
S:樹脂シート、
W:ウェーハ、Wb:第2面
Claims (1)
- シート保持面によって樹脂シートを保持するシート保持手段と、ウェーハを保持するウェーハ保持手段と、該シート保持手段と該ウェーハ保持手段とを相対的にシート保持面に垂直な上下方向に移動させる上下移動手段と、を備え、該シート保持面に保持された該樹脂シートをウェーハの一方の面に固定する樹脂シート固定装置であって、
該樹脂シートは、加熱されることによって軟化されてウェーハに熱溶着された後、冷却されることによって硬化されてウェーハに固定されるものであり、
該シート保持手段は、
該シート保持手段の内部に配置され、該シート保持面に平行で該シート保持面に近い上面と該シート保持面から遠い下面とを有するペルチェ素子と、
該ペルチェ素子に直流電流を供給する直流電源と、
該ペルチェ素子に供給される該直流電流の方向を、該ペルチェ素子の該上面を加熱する第1方向と、該ペルチェ素子の該上面を冷却する該第1方向とは逆方向の第2方向とを切り換える切換手段と、を備え、
該上下移動手段を制御して、該ウェーハ保持手段に保持されたウェーハによって該シート保持面に保持された該樹脂シートを押圧しながら、該切換手段を制御して該直流電流を該第1方向に流すことにより該ペルチェ素子の該上面を加熱して、該樹脂シートを軟化してウェーハに熱溶着すること、および、
該切換手段を制御して該直流電流を該第2方向に流すことにより、該ペルチェ素子の該上面を冷却して、該シート保持面に保持された該樹脂シートを硬化してウェーハの一方の面に固定すること、を実施する制御手段をさらに備える、
樹脂シート固定装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019201386A JP7376322B2 (ja) | 2019-11-06 | 2019-11-06 | 樹脂シート固定装置 |
TW109136162A TWI844742B (zh) | 2019-11-06 | 2020-10-19 | 樹脂片材固定裝置 |
CN202011186776.9A CN112768396A (zh) | 2019-11-06 | 2020-10-30 | 树脂片固定装置 |
KR1020200145294A KR20210055005A (ko) | 2019-11-06 | 2020-11-03 | 수지 시트 고정 장치 |
US17/089,037 US11664248B2 (en) | 2019-11-06 | 2020-11-04 | Resin sheet fixing apparatus |
DE102020213867.2A DE102020213867A1 (de) | 2019-11-06 | 2020-11-04 | Befestigungsvorrichtung für Kunststofffolie |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019201386A JP7376322B2 (ja) | 2019-11-06 | 2019-11-06 | 樹脂シート固定装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021074905A JP2021074905A (ja) | 2021-05-20 |
JP7376322B2 true JP7376322B2 (ja) | 2023-11-08 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2019201386A Active JP7376322B2 (ja) | 2019-11-06 | 2019-11-06 | 樹脂シート固定装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11664248B2 (ja) |
JP (1) | JP7376322B2 (ja) |
KR (1) | KR20210055005A (ja) |
CN (1) | CN112768396A (ja) |
DE (1) | DE102020213867A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003300255A (ja) | 2002-04-09 | 2003-10-21 | M B K Micro Tec:Kk | フィルム貼付け方法及びフィルム貼付け用治具並びにフィルム貼付け装置 |
JP2014120494A (ja) | 2012-12-13 | 2014-06-30 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2015082619A (ja) | 2013-10-23 | 2015-04-27 | リンテック株式会社 | シート貼付装置および貼付方法 |
JP2016215607A (ja) | 2015-05-26 | 2016-12-22 | トヨタ自動車株式会社 | 接着装置 |
JP2019186437A (ja) | 2018-04-12 | 2019-10-24 | 株式会社ディスコ | 拡張方法及び拡張装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002367931A (ja) * | 2001-06-07 | 2002-12-20 | Lintec Corp | ダイボンディングシート貼着装置およびダイボンディングシートの貼着方法 |
JP4074758B2 (ja) | 2001-06-18 | 2008-04-09 | 株式会社ディスコ | 半導体ウエーハの加工方法 |
KR20170092323A (ko) | 2016-02-03 | 2017-08-11 | 삼성전자주식회사 | 반도체 패키지의 몰딩 장치 |
JP6602702B2 (ja) | 2016-03-15 | 2019-11-06 | 株式会社ディスコ | 保護部材形成装置 |
DE102018202254A1 (de) | 2018-02-14 | 2019-08-14 | Disco Corporation | Verfahren zum Bearbeiten eines Wafers |
JP7024599B2 (ja) | 2018-05-23 | 2022-02-24 | セイコーエプソン株式会社 | 可塑化装置、射出成形機および造形装置 |
JP7099119B2 (ja) | 2018-07-20 | 2022-07-12 | セイコーエプソン株式会社 | 射出成形装置および射出成形方法 |
JP7233883B2 (ja) * | 2018-10-30 | 2023-03-07 | 株式会社ディスコ | 保護部材の形成方法 |
JP6839314B2 (ja) | 2019-03-19 | 2021-03-03 | 日本碍子株式会社 | ウエハ載置装置及びその製法 |
JP7335136B2 (ja) * | 2019-11-06 | 2023-08-29 | 株式会社ディスコ | 樹脂保護部材形成装置 |
-
2019
- 2019-11-06 JP JP2019201386A patent/JP7376322B2/ja active Active
-
2020
- 2020-10-30 CN CN202011186776.9A patent/CN112768396A/zh active Pending
- 2020-11-03 KR KR1020200145294A patent/KR20210055005A/ko active Search and Examination
- 2020-11-04 DE DE102020213867.2A patent/DE102020213867A1/de active Pending
- 2020-11-04 US US17/089,037 patent/US11664248B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003300255A (ja) | 2002-04-09 | 2003-10-21 | M B K Micro Tec:Kk | フィルム貼付け方法及びフィルム貼付け用治具並びにフィルム貼付け装置 |
JP2014120494A (ja) | 2012-12-13 | 2014-06-30 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2015082619A (ja) | 2013-10-23 | 2015-04-27 | リンテック株式会社 | シート貼付装置および貼付方法 |
JP2016215607A (ja) | 2015-05-26 | 2016-12-22 | トヨタ自動車株式会社 | 接着装置 |
JP2019186437A (ja) | 2018-04-12 | 2019-10-24 | 株式会社ディスコ | 拡張方法及び拡張装置 |
Also Published As
Publication number | Publication date |
---|---|
DE102020213867A1 (de) | 2021-05-06 |
US11664248B2 (en) | 2023-05-30 |
KR20210055005A (ko) | 2021-05-14 |
JP2021074905A (ja) | 2021-05-20 |
TW202119529A (zh) | 2021-05-16 |
US20210134623A1 (en) | 2021-05-06 |
CN112768396A (zh) | 2021-05-07 |
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