JP7373503B2 - 親水性及びゼータ電位の調節可能な化学機械研磨パッド - Google Patents
親水性及びゼータ電位の調節可能な化学機械研磨パッド Download PDFInfo
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- JP7373503B2 JP7373503B2 JP2020562763A JP2020562763A JP7373503B2 JP 7373503 B2 JP7373503 B2 JP 7373503B2 JP 2020562763 A JP2020562763 A JP 2020562763A JP 2020562763 A JP2020562763 A JP 2020562763A JP 7373503 B2 JP7373503 B2 JP 7373503B2
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Images
Classifications
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
- B22F10/14—Formation of a green body by jetting of binder onto a bed of metal powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
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- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
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- B24B37/11—Lapping tools
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- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
- B22F10/12—Formation of a green body by photopolymerisation, e.g. stereolithography [SLA] or digital light processing [DLP]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
- B22F10/18—Formation of a green body by mixing binder with metal in filament form, e.g. fused filament fabrication [FFF]
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/25—Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS]
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/60—Treatment of workpieces or articles after build-up
- B22F10/68—Cleaning or washing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/50—Means for feeding of material, e.g. heads
- B22F12/55—Two or more means for feeding material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/50—Means for feeding of material, e.g. heads
- B22F12/58—Means for feeding of material, e.g. heads for changing the material composition, e.g. by mixing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
[式中、RはH又はCH3であり、R1、R2、及びR3は、同一であっても異なっていてもよく、それぞれ互いに独立して、直鎖状又は分岐状のC1からC8アルキル基であってもよい。]
を含む。複数の複合層を堆積させることは、多孔性形成組成物の一又は複数の液滴を支持体上に分注することをさらに含み、ここで、多孔性形成組成物の少なくとも一つの成分は除去可能であり、多孔性研磨パッドにポアが形成される。
[式中、RはH又はCH3であり、R1、R2、及びR3は、同一であっても異なっていてもよく、それぞれ互いに独立して、直鎖状又は分岐状のC1からC8アルキル基であってもよい。]
を有するカチオン系モノマーを含む。本方法は、硬化性樹脂前駆体組成物の一又は複数の液滴を電磁放射に曝露して、硬化性樹脂前駆体組成物を少なくとも部分的に硬化することをさらに含む。本方法は、分注及び曝露を繰り返して、支持体上に3Dレリーフを構築することをさらに含む。本方法は、複数の複合層を固化して多孔性パッド本体を形成することをさらに含む。
[式中、X-は、OH-、CH3COO-、CF3COO-、CH3SO3 -、又はCF3SO3 -の基から選択され得る。]
を含む。複数の複合層を堆積させることは、多孔性形成組成物の一又は複数の液滴を支持体上に分注することをさらに含み、ここで、多孔性形成組成物の少なくとも一つの成分は除去可能であり、多孔性研磨パッドにポアが形成される。
本明細書で開示される改善された研磨パッド設計は、多くの異なる種類の研磨装置で研磨プロセスを実施するのに使用することができる。一例では、本明細書で提供される開示の範囲を限定することを意図するものではないが、研磨パッドは、半導体基板を研磨するのに使用される研磨ステーションで使用されてもよい。図1は、本明細書に記載の実施態様に従って形成された多孔性研磨パッド106を有する研磨ステーション100の概略断面図である。研磨ステーション100は、複数の研磨ステーション100を含有する、より大きな化学機械研磨(CMP)システム内に置かれていてよい。研磨ステーション100は、プラテン102を含む。プラテン102は、中心軸104を中心にして回転し得る。研磨パッド106は、プラテン102上に置かれ得る。本明細書に記載の開示を限定する意図ではないが、多孔性研磨パッド106は通常、研磨ステーション100内で処理される基板110のサイズ(例えば基板直径)よりも少なくとも1倍~2倍大きいプラテン102の上表面103を覆っている。一実施例では、多孔性研磨パッド106とプラテン102は、直径で約6インチ(150mm)と40インチ(1,016mm)の間である。多孔性研磨パッド106は、一又は複数の基板110に接触して処理するよう構成された、研磨面112を含む。プラテン102は、研磨中に、多孔性研磨パッド106を支持し、多孔性研磨パッド106を回転させる。キャリアヘッド108は、多孔性研磨パッド106の研磨面112に接するように処理中の基板110を保持してよい。研磨面112と基板110との間に、研磨界面130が形成される。キャリアヘッド108は、通常、基板110を多孔性研磨パッド106に接触させるために使われる可撓性のダイヤフラム111と、研磨処理中に基板の表面全体にわたって見られる、本質的に不均一な圧力分布を補正するために使われるキャリアリング109とを含む。キャリアヘッド108は、中心軸114を中心にして回転し、かつ/又は、基板110と多孔性研磨パッド106との間に相対運動を発生させる、スイープ運動(sweeping motion)で動き得る。
研磨装置に使用することができる研磨パッドの様々な構造配置の実施例を図2A-Kと併せて説明する。図2A-Kに図示される研磨パッドは、例えば、図1に示される研磨ステーション100で使用することができる。別様に明記されていない限り、第1の研磨要素204及び第2の研磨要素206という語は、研磨パッド200の研磨体内の部分、領域、及び/又は特徴を広く表す。ある構成では、研磨パッド200は、スラリに曝露されるとパッドの表面にボイドを形成することになるポア又は材料を含有し得る。図2A~図2Kに示す研磨パッドの種々の構成の具体的な例は、本明細書の開示の範囲を限定することを意図してはいない。なぜならば、他の同様の構成も、本明細書に記載の一又は複数の付加製造プロセスを使用して形成されていてよいためである。
上記で検討したように、第1の研磨要素204及び第2の研磨要素206といったパッド本体202の部分を形成するのに用いられる材料は、それぞれ、高機能研磨パッドの目標の特性を実現するための、官能性ポリマー、官能性オリゴマー、モノマー、反応性希釈剤、流れ添加剤、硬化剤、光開始剤、ポア形成剤、カチオン系モノマー、及び硬化相乗剤の混合物であってよい、少なくとも一つのインクジェット印刷可能なプレポリマー組成物から形成されていてよい。一般的に、プレポリマーのインク又は組成物は、堆積された後に、硬化剤又は化学開始剤を使用するか又は使用しない、放射エネルギー又は熱エネルギーへの曝露又は接触といった、任意の数の手段を用いて処理されてよい。概して、堆積された材料は、紫外放射(UV)、ガンマ放射、X線放射、可視光放射、IR放射、及びマイクロ波放射を含んでいてよい電磁放射に曝露され得る。さらに、重合反応を開始するために、加速電子及びイオンビームもまた使用されてよい。本開示の目的のためには、貫通硬化剤若しくは酸素抑制剤などの、増感剤、開始剤、及び/又は硬化剤といった、硬化の方法又は重合を促進する添加剤の使用は限定されない。
本明細書に記載の実施態様は、下記の実施例によりさらに説明される。特定の材料及びその量は、これらの実施例で記載される他の条件及び詳細と同様に、本明細書に記載された実装態様を制限するために使用されるものではない。本開示の例は、文字「E」の後に試料番号が続くことによって識別され、本開示の例ではない比較例は、文字「X」の後に試料番号が続くことによって示される。
窒素雰囲気下、メチルトリフルオロメタンスルホネート(10g)を100ml丸底フラスコに添加した。クロロホルム(10ml)を添加して、混合物を形成した。混合物を氷水で5℃に冷却した。冷却後、2-(ジメチルアミノ)エチル アクリレート(8.72g)を混合物に滴下した。反応物を18時間撹拌し、減圧下で揮発物を除去して、表題化合物を得た。
窒素雰囲気下、2-(ジメチルアミノ)エチル アクリレート(15.74g)を100m丸底フラスコに添加した。混合物を氷水で5℃に冷却した。その後、エチルメタンスルホネート(13.65g)を滴下した。反応混合物を40℃にゆっくりと温め、40℃で2時間維持した。加熱を止め、得られた溶液を一晩撹拌して、表題化合物を得た。
光開始剤と共にモノマー及びオリゴマーを混合して、表2に示すように70℃で14.5cPの粘度を有するようにすることにより、高弾性調合物(X1)を調製した。
光開始剤と共にモノマー及びオリゴマーを混合して、70℃でおよそ14cPの粘度を有するようにすることにより、この低弾性調合物を調製した。オリゴマー及びモノマーの含有量をわずかに調整することにより、この調合物に実施例2の第2の調合物を10重量%(E4)及び15重量%(E5)で添加し、70℃でおよそ14cPの粘度を維持した。表4に示すように、硬化された生成物のZpはpH7で-40mV(Zpモノマーなし)から+56.6mVに増加した。これは、Zpモノマーの添加後にZpが正であることを示す。
図3Aは、本開示の一又は複数の実施態様による付加製造システムを用いて高機能研磨パッドを形成するのに使用され得る、付加製造システム350の概略断面図である。付加製造処理は、限定しないが、ポリジェット堆積処理、インクジェット印刷処理、熱溶解積層処理、バインダージェッティング処理、粉末床溶融結合処理、選択的レーザ焼結処理、ステレオリソグラフィ処理、液槽光重合デジタルライトプロセシング、シート積層処理、指向性エネルギー堆積処理、又は他の同様の3D堆積処理といった、処理を含み得る。
で計算されるパーセント値xによって規定される。
ここで、AC=C及びAC=Oは、910cm-1でのC=Cピーク値及び1700cm-1でのC=Oピーク値であり、これらの値は、FT-IR分光法を用いて得られる。重合中、アクリレート中のC=C結合はC-C結合に変換されるが、一方でアクリレート中のC=Oには変換は生じない。したがって、C=CのC=Oに対する強度が、アクリレート変換率を表す。AC=C/AC=O比が、硬化された液滴中のC=C結合のC=O結合に対する相対的な比率を表しており、したがって、(AC=C/AC=O)0は、液滴中の当初のAC=CのAC=Oに対する比率を意味し、一方で、(AC=C/AC=O)xは、液滴が硬化された後の基板表面におけるAC=CのAC=Oに対する比率を意味する。ある実施態様では、ある層が最初に硬化された量は、分注された液滴のうちの約70%以上であってよい。ある構成では、分注された液滴を約70%から約80%のレベルの硬化エネルギーに最初に曝露している間に、分注された液滴中の材料が部分的に硬化され、それによって分注された液滴の目標とする接触角を達成し得ることが、望ましくあり得る。未硬化の又は部分的に硬化された頂面上のアクリレート材料は、後続の液滴と共に共重合される結果として、層間の結合が生み出されることが確信されている。
[式中、X-は、OH-、CH3COO-、CF3COO-、CH3SO3 -、又はCF3SO3 -の基から選択され得る。]
を含む。
を有する第1のカチオン系モノマーを含む。
を有する第2のカチオン系モノマーを含む。
Claims (20)
- 研磨パッドを形成する方法であって、
ターゲット厚に到達するよう、3Dプリンタを用いて複数の複合層を堆積させることであって:
アニオン(X-)及び式(I):
[式中、RはH又はCH3であり、R1、R2、及びR3は、同一であるか又は異なり、それぞれ互いに独立して、直鎖状又は分岐状のC1からC8アルキル基である。]のカチオン系モノマーを含む硬化性樹脂前駆体組成物の一又は複数の液滴を支持体上に分注すること
を含む、
複数の複合層を堆積させることを含み、
カチオン系モノマーが、7から11のpH範囲における0から100mVの平均ゼータ電位を有する研磨パッドを形成する量で加えられ、X-が、OH-、CH3COO-、CF3COO-、CH3SO3 -、又はCF3SO3 -から選択される、
方法。 - 多孔性形成組成物の一又は複数の液滴を支持体上に分注することをさらに含み、研磨パッドにポアを形成するよう、多孔性形成組成物の少なくとも一つの成分が除去可能である、請求項1に記載の方法。
- R 1、R2、及びR3がそれぞれ、C1からC2アルキル基から独立して選択される、請求項1に記載の方法。
- R 1及びR2がCH3であり、R3がCH2CH3である、請求項1に記載の方法。
- R 1、R2、及びR3がCH3である、請求項1に記載の方法。
- X-がCH3SO3 -である、請求項5に記載の方法。
- 多孔性形成組成物が、グリコール、グリコールエーテル、アミン、及びそれらの組み合わせから選択される多孔性形成剤を含む、請求項2に記載の方法。
- 多孔性形成組成物が、エチレングリコール、ブタンジオール、ダイマージオール、プロピレングリコール-(1,2)、プロピレングリコール-(1,3)、オクタン-1,8-ジオール、ネオペンチルグリコール、シクロヘキサン ジメタノール (1,4-ビス-ヒドロキシメチルシクロヘキサン)、2-メチル-1,3-プロパン ジオール、グリセリン、トリメチロールプロパン、ヘキサンジオール-(1,6)、ヘキサントリオール-(1,2,6) ブタン トリオール-(1,2,4)、トリメチロールエタン、ペンタエリスリトール、キニトール、マンニトール、ソルビトール、メチルグリコシド、ジエチレングリコール、トリエチレングリコール、テトラエチレングリコール、ポリエチレングリコール、ジブチレングリコール、ポリブチレングリコール、エチレングリコール、エチレングリコール モノブチルエーテル(EGMBE)、ジエチレングリコール モノエチルエーテル、エタノールアミン、ジエタノールアミン(DEA)、トリエタノールアミン(TEA)及びそれらの組み合わせから選択される多孔性形成剤を含む、請求項2に記載の方法。
- 硬化性樹脂前駆体組成物の分注された一又は複数の液滴及び多孔性形成組成物の分注された一又は複数の液滴をアニール処理、リンス処理の少なくとも一つ、又はその両方へ曝露する前に、硬化性樹脂前駆体組成物の分注された一又は複数の液滴及び多孔性形成組成物の分注された一又は複数の液滴を部分的に硬化することをさらに含む、請求項2に記載の方法。
- 研磨パッドを形成する方法であって、
ターゲット厚に到達するよう、3Dプリンタを用いて複数の複合層を堆積させることであって:
硬化性樹脂前駆体組成物の一又は複数の液滴を支持体上に分注することであって、硬化性樹脂前駆体組成物が:
多官能性アクリレートオリゴマーを含む第1の樹脂前駆体成分;
多官能性アクリレートモノマーを含む第2の樹脂前駆体成分;
OH-、CH3COO-、CF3COO-、CH3SO3 -、又はCF3SO3 -から選択されるアニオン(X-);及び
以下:
[式中、RはH又はCH3であり、R1、R2、及びR3は、同一であるか又は異なり、それぞれ互いに独立して、直鎖状又は分岐状のC1からC8アルキル基である。]
の構造を有するカチオン系モノマー
を含む、硬化性樹脂前駆体組成物の一又は複数の液滴を支持体上に分注すること;
硬化性樹脂前駆体組成物の一又は複数の液滴を電磁放射に曝露して、硬化性樹脂前駆体組成物を少なくとも部分的に硬化すること;及び
分注及び曝露を繰り返して、支持体上に3Dレリーフを構築すること;
を含む、複数の複合層を堆積させること;並びに
複数の複合層を固化してパッド本体を形成すること;
を含み、
カチオン系モノマーが、7から11のpH範囲における0から100mVの平均ゼータ電位を有する研磨パッドを形成する量で加えられる、方法。 - R 1、R2、及びR3がそれぞれ、C1からC2アルキル基から独立して選択される、請求項10に記載の方法。
- R 1及びR2がCH3であり、R3がCH2CH3である、請求項10に記載の方法。
- R 1、R2、及びR3がCH3である、請求項10に記載の方法。
- X-がCH3SO3 -である、請求項13に記載の方法。
- 硬化性樹脂前駆体組成物が、グリコール、グリコールエーテル、アミン、及びそれらの組み合わせから選択される多孔性形成剤をさらに含む、請求項10に記載の方法。
- 硬化性樹脂前駆体組成物が、光開始剤を含む硬化剤をさらに含む、請求項10に記載の方法。
- カチオン系モノマーが、硬化性樹脂前駆体組成物の全重量%の5重量%から約30重量%の間の範囲で存在する、請求項10に記載の方法。
- 複数の複合層を固化してパッド本体を形成することを更に含み、RがHであり、カチオン系モノマーの疎水性部分はパッド本体のパッドマトリックスに埋め込まれ、カチオン系モノマーの親水性部分はパッド本体のパッド表面に曝露される、請求項1に記載の方法。
- RがHであり、カチオン系モノマーの疎水性部分はパッド本体のパッドマトリックスに埋め込まれ、カチオン系モノマーの親水性部分はパッド本体のパッド表面に曝露される、請求項10に記載の方法。
- カチオン系モノマーが、硬化性樹脂前駆体組成物の全重量%の25重量%から約30重量%の間の範囲で存在する、請求項10に記載の方法。
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US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
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US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
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US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
WO2018013668A1 (en) | 2016-07-12 | 2018-01-18 | Alexander Poltorak | System and method for maintaining efficiency of a heat sink |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
CN112654655A (zh) | 2018-09-04 | 2021-04-13 | 应用材料公司 | 先进抛光垫配方 |
WO2020123479A1 (en) * | 2018-12-10 | 2020-06-18 | Inkbit, LLC | Precision system for additive fabrication |
US11738517B2 (en) | 2020-06-18 | 2023-08-29 | Applied Materials, Inc. | Multi dispense head alignment using image processing |
CN116490337A (zh) * | 2020-08-31 | 2023-07-25 | 阿莱恩技术有限公司 | 相分离材料的3d打印复合物 |
US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
US20220362904A1 (en) * | 2021-05-17 | 2022-11-17 | Applied Materials, Inc. | Polishing pads having improved pore structure |
US11951590B2 (en) | 2021-06-14 | 2024-04-09 | Applied Materials, Inc. | Polishing pads with interconnected pores |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016151586A1 (en) | 2015-03-25 | 2016-09-29 | Stratasys Ltd. | Method and system for in situ sintering of conductive ink |
WO2017066077A1 (en) | 2015-10-16 | 2017-04-20 | Applied Materials, Inc. | Method and apparatus for forming advanced polishing pads using an additive manufacturing process |
JP2017078123A (ja) | 2015-10-21 | 2017-04-27 | Kjケミカルズ株式会社 | サポート材用活性エネルギー線硬化性樹脂組成物 |
WO2017074773A1 (en) | 2015-10-30 | 2017-05-04 | Applied Materials, Inc. | An apparatus and method of forming a polishing article that has a desired zeta potential |
US20170203406A1 (en) | 2016-01-19 | 2017-07-20 | Applied Materials, Inc. | Porous chemical mechanical polishing pads |
Family Cites Families (65)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5387380A (en) | 1989-12-08 | 1995-02-07 | Massachusetts Institute Of Technology | Three-dimensional printing techniques |
MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
US5906863A (en) | 1994-08-08 | 1999-05-25 | Lombardi; John | Methods for the preparation of reinforced three-dimensional bodies |
US5876268A (en) | 1997-01-03 | 1999-03-02 | Minnesota Mining And Manufacturing Company | Method and article for the production of optical quality surfaces on glass |
US5940674A (en) | 1997-04-09 | 1999-08-17 | Massachusetts Institute Of Technology | Three-dimensional product manufacture using masks |
US7300619B2 (en) | 2000-03-13 | 2007-11-27 | Objet Geometries Ltd. | Compositions and methods for use in three dimensional model printing |
EP1268165B1 (en) | 2000-03-24 | 2004-10-06 | GENERIS GmbH | Method and apparatus for manufacturing a structural part by a multi-layer deposition technique, and mold or core as manufactured by the method |
US6736869B1 (en) | 2000-08-28 | 2004-05-18 | Micron Technology, Inc. | Method for forming a planarizing pad for planarization of microelectronic substrates |
US6641471B1 (en) | 2000-09-19 | 2003-11-04 | Rodel Holdings, Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
US7192340B2 (en) | 2000-12-01 | 2007-03-20 | Toyo Tire & Rubber Co., Ltd. | Polishing pad, method of producing the same, and cushion layer for polishing pad |
GB0103754D0 (en) | 2001-02-15 | 2001-04-04 | Vantico Ltd | Three-dimensional structured printing |
US6776810B1 (en) * | 2002-02-11 | 2004-08-17 | Cabot Microelectronics Corporation | Anionic abrasive particles treated with positively charged polyelectrolytes for CMP |
DE10224981B4 (de) | 2002-06-05 | 2004-08-19 | Generis Gmbh | Verfahren zum schichtweisen Aufbau von Modellen |
CN100445091C (zh) | 2002-06-07 | 2008-12-24 | 普莱克斯S.T.技术有限公司 | 控制渗透子垫 |
US7311862B2 (en) | 2002-10-28 | 2007-12-25 | Cabot Microelectronics Corporation | Method for manufacturing microporous CMP materials having controlled pore size |
US7377840B2 (en) | 2004-07-21 | 2008-05-27 | Neopad Technologies Corporation | Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs |
GB0323462D0 (en) | 2003-10-07 | 2003-11-05 | Fujifilm Electronic Imaging | Providing a surface layer or structure on a substrate |
US7582127B2 (en) * | 2004-06-16 | 2009-09-01 | Cabot Microelectronics Corporation | Polishing composition for a tungsten-containing substrate |
US7846008B2 (en) | 2004-11-29 | 2010-12-07 | Semiquest Inc. | Method and apparatus for improved chemical mechanical planarization and CMP pad |
WO2006057713A2 (en) | 2004-11-29 | 2006-06-01 | Rajeev Bajaj | Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance |
WO2006057720A1 (en) | 2004-11-29 | 2006-06-01 | Rajeev Bajaj | Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor |
US7815778B2 (en) | 2005-11-23 | 2010-10-19 | Semiquest Inc. | Electro-chemical mechanical planarization pad with uniform polish performance |
TWI385050B (zh) | 2005-02-18 | 2013-02-11 | Nexplanar Corp | 用於cmp之特製拋光墊及其製造方法及其用途 |
US7829000B2 (en) | 2005-02-25 | 2010-11-09 | Hewlett-Packard Development Company, L.P. | Core-shell solid freeform fabrication |
US7435364B2 (en) | 2005-04-11 | 2008-10-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for forming a porous polishing pad |
KR101134432B1 (ko) | 2005-05-17 | 2012-04-10 | 도요 고무 고교 가부시키가이샤 | 연마 패드 |
US20070117393A1 (en) | 2005-11-21 | 2007-05-24 | Alexander Tregub | Hardened porous polymer chemical mechanical polishing (CMP) pad |
US20070128991A1 (en) | 2005-12-07 | 2007-06-07 | Yoon Il-Young | Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same |
US7732393B2 (en) | 2006-03-20 | 2010-06-08 | Cabot Microelectronics Corporation | Oxidation-stabilized CMP compositions and methods |
US20070235904A1 (en) | 2006-04-06 | 2007-10-11 | Saikin Alan H | Method of forming a chemical mechanical polishing pad utilizing laser sintering |
WO2008077850A2 (en) | 2006-12-21 | 2008-07-03 | Agfa Graphics Nv | 3d-inkjet printing methods |
US7862320B2 (en) | 2007-07-17 | 2011-01-04 | Seiko Epson Corporation | Three-dimensional object forming apparatus and method for forming three dimensional object |
CN101808780A (zh) | 2007-09-03 | 2010-08-18 | 塞米奎斯特股份有限公司 | 抛光垫 |
WO2009037903A1 (ja) * | 2007-09-21 | 2009-03-26 | Hitachi Chemical Co., Ltd. | シリコン膜研磨用cmpスラリー及び研磨方法 |
CN102083586B (zh) | 2008-04-29 | 2015-08-12 | 塞米奎斯特股份有限公司 | 抛光垫片组合物与制造和使用方法 |
WO2009145069A1 (ja) | 2008-05-26 | 2009-12-03 | ソニー株式会社 | 造形装置および造形方法 |
US8821214B2 (en) | 2008-06-26 | 2014-09-02 | 3M Innovative Properties Company | Polishing pad with porous elements and method of making and using the same |
US8282866B2 (en) | 2008-06-30 | 2012-10-09 | Seiko Epson Corporation | Method and device for forming three-dimensional model, sheet material processing method, and sheet material processing device |
TW201038690A (en) | 2008-09-26 | 2010-11-01 | Rhodia Operations | Abrasive compositions for chemical mechanical polishing and methods for using same |
US8292692B2 (en) | 2008-11-26 | 2012-10-23 | Semiquest, Inc. | Polishing pad with endpoint window and systems and method using the same |
KR101855073B1 (ko) | 2009-12-22 | 2018-05-09 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 연마 패드 및 그의 제조 방법 |
WO2011082155A2 (en) | 2009-12-30 | 2011-07-07 | 3M Innovative Properties Company | Polishing pads including phase-separated polymer blend and method of making and using the same |
US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
JP5620141B2 (ja) | 2010-04-15 | 2014-11-05 | 東洋ゴム工業株式会社 | 研磨パッド |
KR20130084932A (ko) * | 2012-01-18 | 2013-07-26 | 삼성전자주식회사 | 반도체 소자의 제조 방법 |
US9067299B2 (en) | 2012-04-25 | 2015-06-30 | Applied Materials, Inc. | Printed chemical mechanical polishing pad |
EP2906194B1 (en) | 2012-10-11 | 2018-06-06 | Dow Corning Corporation | Aqueous silicone polyether microemulsions |
US10357435B2 (en) | 2012-12-18 | 2019-07-23 | Dentca, Inc. | Photo-curable resin compositions and method of using the same in three-dimensional printing for manufacturing artificial teeth and denture base |
CA2936015C (en) | 2013-01-17 | 2021-05-25 | Ehsan Toyserkani | Systems and methods for additive manufacturing of heterogeneous porous structures and structures made therefrom |
US20150056895A1 (en) | 2013-08-22 | 2015-02-26 | Cabot Microelectronics Corporation | Ultra high void volume polishing pad with closed pore structure |
KR102252673B1 (ko) | 2013-09-25 | 2021-05-18 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 다층화된 폴리싱 패드 |
WO2015046163A1 (ja) * | 2013-09-30 | 2015-04-02 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびその製造方法 |
US9993907B2 (en) | 2013-12-20 | 2018-06-12 | Applied Materials, Inc. | Printed chemical mechanical polishing pad having printed window |
CN106414039B (zh) | 2014-01-23 | 2022-01-18 | 株式会社理光 | 三维物体及其形成方法 |
US20160354896A1 (en) | 2014-02-10 | 2016-12-08 | President And Fellows Of Harvard College | 3d-printed polishing pad for chemical-mechanical planarization (cmp) |
JP2016023209A (ja) * | 2014-07-17 | 2016-02-08 | 日立化成株式会社 | 研磨剤、研磨剤セット及び基体の研磨方法 |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
TWI689406B (zh) * | 2014-10-17 | 2020-04-01 | 美商應用材料股份有限公司 | 研磨墊及製造其之方法 |
US10399201B2 (en) * | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
WO2016121587A1 (ja) * | 2015-01-26 | 2016-08-04 | Kjケミカルズ株式会社 | 三次元造型サポート材用活性エネルギー線硬化性樹脂組成物 |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
US10773509B2 (en) | 2016-03-09 | 2020-09-15 | Applied Materials, Inc. | Pad structure and fabrication methods |
KR102363829B1 (ko) | 2016-03-24 | 2022-02-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 화학적 기계적 연마를 위한 조직화된 소형 패드 |
WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
-
2019
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- 2019-04-04 WO PCT/US2019/025879 patent/WO2019217012A1/en unknown
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016151586A1 (en) | 2015-03-25 | 2016-09-29 | Stratasys Ltd. | Method and system for in situ sintering of conductive ink |
WO2017066077A1 (en) | 2015-10-16 | 2017-04-20 | Applied Materials, Inc. | Method and apparatus for forming advanced polishing pads using an additive manufacturing process |
JP2017078123A (ja) | 2015-10-21 | 2017-04-27 | Kjケミカルズ株式会社 | サポート材用活性エネルギー線硬化性樹脂組成物 |
WO2017074773A1 (en) | 2015-10-30 | 2017-05-04 | Applied Materials, Inc. | An apparatus and method of forming a polishing article that has a desired zeta potential |
US20170203406A1 (en) | 2016-01-19 | 2017-07-20 | Applied Materials, Inc. | Porous chemical mechanical polishing pads |
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CN112088069A (zh) | 2020-12-15 |
US20190337117A1 (en) | 2019-11-07 |
TW201946940A (zh) | 2019-12-16 |
SG11202010448TA (en) | 2020-11-27 |
CN112088069B (zh) | 2024-03-19 |
KR20200140931A (ko) | 2020-12-16 |
EP3790706A4 (en) | 2022-02-16 |
US11826876B2 (en) | 2023-11-28 |
JP2021523025A (ja) | 2021-09-02 |
TWI833745B (zh) | 2024-03-01 |
WO2019217012A1 (en) | 2019-11-14 |
EP3790706A1 (en) | 2021-03-17 |
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