JP7371620B2 - 導電パターンの製造方法 - Google Patents
導電パターンの製造方法 Download PDFInfo
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- JP7371620B2 JP7371620B2 JP2020513351A JP2020513351A JP7371620B2 JP 7371620 B2 JP7371620 B2 JP 7371620B2 JP 2020513351 A JP2020513351 A JP 2020513351A JP 2020513351 A JP2020513351 A JP 2020513351A JP 7371620 B2 JP7371620 B2 JP 7371620B2
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- acid
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- aqueous solution
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- 238000000034 method Methods 0.000 title claims description 41
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000002253 acid Substances 0.000 claims description 76
- 239000007864 aqueous solution Substances 0.000 claims description 51
- 239000002245 particle Substances 0.000 claims description 48
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- 229920005989 resin Polymers 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 32
- 150000003839 salts Chemical class 0.000 claims description 28
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- 238000000576 coating method Methods 0.000 claims description 15
- 239000000178 monomer Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 9
- 239000003999 initiator Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 238000000206 photolithography Methods 0.000 claims description 8
- 238000010494 dissociation reaction Methods 0.000 claims description 7
- 230000005593 dissociations Effects 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- 238000011156 evaluation Methods 0.000 description 27
- 235000002639 sodium chloride Nutrition 0.000 description 26
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- 239000000243 solution Substances 0.000 description 12
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- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 6
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- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
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- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 3
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- 239000012535 impurity Substances 0.000 description 3
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- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 3
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- 238000003786 synthesis reaction Methods 0.000 description 3
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- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 2
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- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 2
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- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
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- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
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- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
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- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
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- 239000010931 gold Substances 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 229910003480 inorganic solid Inorganic materials 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
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- 230000007774 longterm Effects 0.000 description 2
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- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
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- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
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- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
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- GJZFGDYLJLCGHT-UHFFFAOYSA-N 1,2-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(CC)C(CC)=CC=C3SC2=C1 GJZFGDYLJLCGHT-UHFFFAOYSA-N 0.000 description 1
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- GWXLEWHMIVKOGQ-UHFFFAOYSA-N 1-(2-hydroxyphenyl)-2-methylprop-2-en-1-one Chemical compound CC(=C)C(=O)C1=CC=CC=C1O GWXLEWHMIVKOGQ-UHFFFAOYSA-N 0.000 description 1
- KCKJMQMEWMHVCH-UHFFFAOYSA-N 1-butoxy-2-[2-(2-hydroxyethoxy)ethoxy]ethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.CCCCOC(O)COCCOCCO KCKJMQMEWMHVCH-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
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- 239000007795 chemical reaction product Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000004993 emission spectroscopy Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 238000001095 inductively coupled plasma mass spectrometry Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004255 ion exchange chromatography Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- GYCHYNMREWYSKH-UHFFFAOYSA-L iron(ii) bromide Chemical compound [Fe+2].[Br-].[Br-] GYCHYNMREWYSKH-UHFFFAOYSA-L 0.000 description 1
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- KIQBVKPQYARZTK-UHFFFAOYSA-N n-(2-hydroxyphenyl)prop-2-enamide Chemical compound OC1=CC=CC=C1NC(=O)C=C KIQBVKPQYARZTK-UHFFFAOYSA-N 0.000 description 1
- KCTMTGOHHMRJHZ-UHFFFAOYSA-N n-(2-methylpropoxymethyl)prop-2-enamide Chemical compound CC(C)COCNC(=O)C=C KCTMTGOHHMRJHZ-UHFFFAOYSA-N 0.000 description 1
- PMHOLXNNEPPFNZ-UHFFFAOYSA-N n-(3-hydroxyphenyl)prop-2-enamide Chemical compound OC1=CC=CC(NC(=O)C=C)=C1 PMHOLXNNEPPFNZ-UHFFFAOYSA-N 0.000 description 1
- POVITWJTUUJBNK-UHFFFAOYSA-N n-(4-hydroxyphenyl)prop-2-enamide Chemical compound OC1=CC=C(NC(=O)C=C)C=C1 POVITWJTUUJBNK-UHFFFAOYSA-N 0.000 description 1
- LSWADWIFYOAQRZ-UHFFFAOYSA-N n-(ethoxymethyl)prop-2-enamide Chemical compound CCOCNC(=O)C=C LSWADWIFYOAQRZ-UHFFFAOYSA-N 0.000 description 1
- ULYOZOPEFCQZHH-UHFFFAOYSA-N n-(methoxymethyl)prop-2-enamide Chemical compound COCNC(=O)C=C ULYOZOPEFCQZHH-UHFFFAOYSA-N 0.000 description 1
- SOEDHYUFNWMILE-UHFFFAOYSA-N naphthalen-1-yl prop-2-enoate Chemical compound C1=CC=C2C(OC(=O)C=C)=CC=CC2=C1 SOEDHYUFNWMILE-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- IPLJNQFXJUCRNH-UHFFFAOYSA-L nickel(2+);dibromide Chemical compound [Ni+2].[Br-].[Br-] IPLJNQFXJUCRNH-UHFFFAOYSA-L 0.000 description 1
- BFSQJYRFLQUZKX-UHFFFAOYSA-L nickel(ii) iodide Chemical compound I[Ni]I BFSQJYRFLQUZKX-UHFFFAOYSA-L 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical class NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 238000001139 pH measurement Methods 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- OBFRFCIHSAOUGJ-UHFFFAOYSA-N phenylmethanethiol;prop-2-enoic acid Chemical compound OC(=O)C=C.SCC1=CC=CC=C1 OBFRFCIHSAOUGJ-UHFFFAOYSA-N 0.000 description 1
- 235000011007 phosphoric acid Nutrition 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005650 polypropylene glycol diacrylate Polymers 0.000 description 1
- CHKVPAROMQMJNQ-UHFFFAOYSA-M potassium bisulfate Chemical compound [K+].OS([O-])(=O)=O CHKVPAROMQMJNQ-UHFFFAOYSA-M 0.000 description 1
- 229910000343 potassium bisulfate Inorganic materials 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 239000004323 potassium nitrate Substances 0.000 description 1
- 235000010333 potassium nitrate Nutrition 0.000 description 1
- CUNPJFGIODEJLQ-UHFFFAOYSA-M potassium;2,2,2-trifluoroacetate Chemical compound [K+].[O-]C(=O)C(F)(F)F CUNPJFGIODEJLQ-UHFFFAOYSA-M 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229940077386 sodium benzenesulfonate Drugs 0.000 description 1
- WBHQBSYUUJJSRZ-UHFFFAOYSA-M sodium bisulfate Chemical compound [Na+].OS([O-])(=O)=O WBHQBSYUUJJSRZ-UHFFFAOYSA-M 0.000 description 1
- 229910000342 sodium bisulfate Inorganic materials 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 235000009518 sodium iodide Nutrition 0.000 description 1
- 239000004317 sodium nitrate Substances 0.000 description 1
- 235000010344 sodium nitrate Nutrition 0.000 description 1
- UYCAUPASBSROMS-AWQJXPNKSA-M sodium;2,2,2-trifluoroacetate Chemical compound [Na+].[O-][13C](=O)[13C](F)(F)F UYCAUPASBSROMS-AWQJXPNKSA-M 0.000 description 1
- MZSDGDXXBZSFTG-UHFFFAOYSA-M sodium;benzenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C1=CC=CC=C1 MZSDGDXXBZSFTG-UHFFFAOYSA-M 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- ADXGNEYLLLSOAR-UHFFFAOYSA-N tasosartan Chemical compound C12=NC(C)=NC(C)=C2CCC(=O)N1CC(C=C1)=CC=C1C1=CC=CC=C1C=1N=NNN=1 ADXGNEYLLLSOAR-UHFFFAOYSA-N 0.000 description 1
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- FEONEKOZSGPOFN-UHFFFAOYSA-K tribromoiron Chemical compound Br[Fe](Br)Br FEONEKOZSGPOFN-UHFFFAOYSA-K 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Conductive Materials (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
(1)基材上に、導電性粒子(a)、樹脂(b)を含むパターンを形成する工程と、
(2)形成されたパターンに、25℃におけるアニオンの共役酸の酸解離定数(pKa)が1.0以下である塩を少なくとも1種含み、25℃におけるpHが1.2~3.5である酸性水溶液を接触させる工程と
を有する導電パターンの製造方法である。
(1)基材上に、導電性粒子(a)、樹脂(b)を含むパターンを形成する工程(以下、工程(1)と記載する場合がある)と、
(2)形成されたパターンに、25℃におけるアニオンの共役酸の酸解離定数(pKa)が1.0以下である塩を少なくとも1種含み、25℃におけるpHが1.2~3.5である酸性水溶液を接触させる工程(以下、工程(2)と記載する場合がある)と
を有する。本発明の製造方法により得られる導電パターンは、樹脂(b)の有機成分と導電性粒子(a)の無機成分の複合物となっており、導電性粒子(a)同士が、原子拡散現象によってお互いに接触することにより導電性が発現するものである。樹脂(b)はバインダーとして、パターンと基材との密着性を向上させる作用を有する。25℃におけるアニオンの共役酸の酸解離定数(pKa)が1.0以下である塩を少なくとも1種含み、25℃におけるpHが1.2~3.5である酸性水溶液にパターンを接触させることにより、導電性粒子表面からの原子の拡散を促進し、100℃以下の低温であっても、導電性を向上させることができる。
リコール、グリセリン等が挙げられる。レベリング剤の具体例としては特殊ビニル系重合
物、特殊アクリル系重合物などが挙げられる。
ン、フェニルトリエトキシシラン、ヘキサメチルジシラザン、3-メタクリロキシプロピ
ルトリメトキシシラン、3-グリシドキシプロピルトリメトキシシラン、ビニルトリメト
キシシラン、3-グリシドキシプロピルメチルジエトキシシランなどが挙げられる。
体積平均粒子径0.3μmの銀粒子
[不飽和二重結合を有する反応性モノマー(c)]
ライトアクリレートBP-4EA(アクリル系モノマー;共栄社化学株式会社製)。
EA/メタクリル酸2-エチルヘキシル(以下、「2-EHMA」と記すことがある。)/スチレン/アクリル酸のアクリル系共重合体(共重合比率(質量部):20/40/20/15)に、グリシジルメタクリレート(以下、「GMA」と記すことがある。)を5質量部付加反応させたもの
窒素雰囲気の反応容器中に、150gの後述するDMEAを仕込み、オイルバスを用いて80℃まで昇温した。これに、20gのEA、40gの2-EHMA、20gのSt、15gのAA、0.8gの2,2’-アゾビスイソブチロニトリル及び10gのDMEAからなる混合物を、1時間かけて滴下した。滴下終了後、さらに6時間重合反応を行った。その後、1gのハイドロキノンモノメチルエーテルを添加して、重合反応を停止した。引き続き、5gのGMA、1gのトリエチルベンジルアンモニウムクロライド及び10gのDMEAからなる混合物を、0.5時間かけて滴下した。滴下終了後、さらに2時間付加反応を行った。得られた反応溶液をメタノールで精製することで未反応不純物を除去し、さらに24時間真空乾燥することで、アクリル系共重合体(B-1)を得た。得られたアクリル系共重合体(B-1)の酸価は103mgKOH/gであった。
エチレンオキサイド変性ビスフェノールAジアクリレート(FA-324A;日立化成工業株式会社製)/EA/AAのアクリル系共重合体(共重合比率(質量部):50/10/15)にGMAを5質量部付加反応させたもの
窒素雰囲気の反応容器中に、150gのDMEAを仕込み、オイルバスを用いて80℃まで昇温した。これに、50gのエチレンオキサイド変性ビスフェノールAジアクリレートFA-324A、20gのEA、15gのAA、0.8gの2,2’-アゾビスイソブチロニトリル及び10gのDMEAからなる混合物を、1時間かけて滴下した。滴下終了後、さらに6時間重合反応を行った。その後、1gのハイドロキノンモノメチルエーテルを添加して、重合反応を停止した。引き続き、5gのGMA、1gのトリエチルベンジルアンモニウムクロライド及び10gのDMEAからなる混合物を、0.5時間かけて滴下した。滴下終了後、さらに2時間付加反応を行った。得られた反応溶液をメタノールで精製することで未反応不純物を除去し、さらに24時間真空乾燥することで、アクリル系共重合体(B-2)を得た。得られたアクリル系共重合体(B-2)の酸価は96mgKOH/gであった。
EA/2-EHMA/BA/N-メチロールアクリルアミド/AAのアクリル系共重合体(共重合比率(質量部):20/40/20/5/15)
窒素雰囲気の反応容器中に、150gのDMEAを仕込み、オイルバスを用いて80℃まで昇温した。これに、20gのEA、40gの2-EHMA、20gのBA、5gのN-メチロールアクリルアミド、15gのAA、0.8gの2,2’-アゾビスイソブチロニトリル及び10gのDMEAからなる混合物を、1時間かけて滴下した。滴下終了後、さらに6時間重合反応を行った。その後、1gのハイドロキノンモノメチルエーテルを添加して、重合反応を停止した。得られた反応溶液をメタノールで精製することで未反応不純物を除去し、さらに24時間真空乾燥することで、アクリル系共重合体(B-3)を得た。得られたアクリル系共重合体(B-3)の酸価は103mgKOH/gであった。
“IRGACURE(登録商標)”OXE01(商品名、BASFジャパン(株)製、オキシム系化合物)(以下、OXE01と称す)。
DMEA(東京化成工業株式会社製)
各実施例および比較例における評価方法を以下に示す。
酸のpKaは表1に記載の酸を0.01mol/Lに調整した酸性水溶液を25℃の液温に保ち、pKa分析装置(Sirius-T3;Pion社製)を用いて測定した。
<URL:http://evans.rc.fas.harvard.edu/pdf/evans_pKa_table.pdf>」を参照した。
酸性水溶液のpHは表1に記載の酸性水溶液を25℃の液温に保ち、pHメーター(F-71;株式会社堀場製作所製)を用いて測定した。
各実施例及び比較例にて得られたパターニング性の評価用サンプルを光学顕微鏡で観察し、パターン間に残渣がなく、かつパターン剥がれのないラインアンドスペース(以下、「L/S」と記すことがある。)の値が最小の導電パターンを確認し、そのL/Sの値が7/7の場合をA、10/10の場合をB、15/15の場合をC、15/15で導電パターンが形成できない場合をD、とそれぞれ判定した。A>B>C>Dの順にパターニング性が優れており、微細なパターニングが可能なことを示す。
各実施例及び比較例にて得られた導電性の評価用サンプルのそれぞれの端部を抵抗計(RM3544;HIOKI製)でつないで抵抗値を測定し、以下の数式(2)に基づいて比抵抗率を算出した。なお膜厚は、“サーフコム(登録商標)”1400((株)東京精密製)のような触針式段差計を用いて測定した。より具体的には、無作為に選択した10の位置の膜厚を触針式段差計(測長:1mm、走査速度:0.3mm/sec)でそれぞれ測定し、それらの平均値を求めることで算出した。また線幅は、無作為に選択した10の位置の線幅を光学顕微鏡でそれぞれ観察し、画像データを解析して、それらの平均値を求めることで算出した。
比抵抗 = 抵抗値×膜厚×線幅/ライン長 ・・・ (2)
比抵抗が小さいほど導電性に優れていることを示す。
100mLクリーンボトルに、10.0gのアクリル系共重合体(B-1)、2.0gのライトアクリレートBP-4EA、0.60gのOXE01及び9.0gのDMEAを入れ、“あわとり錬太郎”(ARE-310;株式会社シンキー製)で混合して、21.6gの樹脂溶液(全固形分58.3質量%)を得た。
一定のL/Sで配列された直線群すなわち透光パターンを1つのユニットとし、L/Sの値が異なる3種類のユニットをそれぞれ有するフォトマスクを介して、乾燥後の塗布膜を露光及び現像して、L/Sの値が異なる3種類のパターンをそれぞれ得た。その後、得られた3種類のパターンを表1に記載の酸性水溶液に所定時間浸漬させ、超純水によるリンス処理により酸を洗い流し、エアーカットで水を切り、80℃の乾燥オーブンで3分間乾燥させ、L/Sの値が異なる3種類の導電パターンをそれぞれ得、これをパターニング性の評価用サンプルとした。なお、フォトマスクが有する各ユニットのL/Sの値は、15/15、10/10、7/7とした(それぞれライン幅(μm)/間隔(μm)を表す)。露光は露光装置(PEM-6M;ユニオン光学株式会社製)を用いて露光量300mJ/cm2(波長365nm換算)で全線露光を行い、現像は0.20質量%のNa2CO3溶液に基板を30秒間浸漬させた後、超純水によるリンス処理を施して行った。パターニング性についての評価結果を表1に示す。
図1に示す透光パターン100を100個有するフォトマスクを介して、乾燥後の塗布膜を露光及び現像して、パターンを得た。その後、得られたパターンを表1に記載の酸性水溶液に表1に記載の時間浸漬させ、超純水によるリンス処理により酸を洗い流し、エアーカットで水を切り、80℃の乾燥オーブンで3分間乾燥させ、導電性の評価用サンプルを得た。得られた導電パターンの線幅は0.10mmであり、ライン長は80mmであった。なお、露光及び現像の条件は、上記パターニング性の評価用サンプルの作製記載の条件と同様とした。導電性についての評価結果を表1に示す。
表1に示す組成の導電ペーストにより所定のパターンを形成し、表1に示す酸性水溶液を用いて実施例1と同様の方法で導電パターンを製造し、実施例1と同様の評価をした。パターニング性および導電性についての評価結果を表1に示す。
100mLクリーンボトルに、12.0gのアクリル系共重合体(B-2)、0.60gのOXE01及び9.0gのDMEAを入れ、“あわとり錬太郎”(ARE-310;株式会社シンキー製)で混合して、21.6gの樹脂溶液(全固形分58.3質量%)を得た。
表1に示す組成の導電ペーストにより所定のパターンを形成し、得られたパターンを表1に示す酸性水溶液に表1に記載の時間浸漬させた後、洗浄を施すことなく、100℃の乾燥オーブンで10分間キュアした。その後、超純水によるリンス処理により酸を洗い流し、エアーカットで水を切り、80℃の乾燥オーブンで3分間乾燥させて導電パターンを製造し、実施例1と同様の評価をした。パターニング性および導電性についての評価結果を表1に示す。
100mLクリーンボトルに、10.0gのアクリル系共重合体(B-1)及び8.0gのDMEAを入れ、“あわとり錬太郎”(ARE-310;株式会社シンキー製)で混合して、18.0gの樹脂溶液(全固形分55.6質量%)を得た。
表2に示す組成の導電ペーストにより所定のパターンを形成し、表2に示す酸性水溶液を用いて実施例1と同様の方法で導電パターンを製造し、実施例1と同様の評価をした。パターニング性および導電性についての評価結果を表2に示す。
表2に示す組成の導電ペーストにより所定のパターンを形成し、得られたパターンを25℃の0.2mol/Lの塩酸水溶液に1分間浸漬した後、70℃に加温された0.2mol/Lのクエン酸水溶液に5分間浸漬させ、超純水によるリンス処理により酸を洗い流し、エアーカットで水を切り、80℃の乾燥オーブンで3分間乾燥させて導電パターンを製造し、実施例1と同様の評価をした。パターニング性および導電性についての評価結果を表2に示す。
表2に示す組成の導電ペーストにより所定のパターンを形成し、得られたパターンを25℃の0.2mol/Lの塩酸水溶液に1分間浸漬した後、70℃に加温された0.2mol/Lのクエン酸水溶液に10分間浸漬させ、超純水によるリンス処理により酸を洗い流し、エアーカットで水を切り、80℃の乾燥オーブンで3分間乾燥させて導電パターンを製造し、実施例1と同様の評価をした。パターニング性および導電性についての評価結果を表2に示す。
表2に示す組成の導電ペーストにより所定のパターンを形成し、得られたパターンを25℃の1mol/Lの塩酸水溶液に1分間浸漬した後、70℃に加温された1mol/Lのクエン酸水溶液に10分間浸漬させ、超純水によるリンス処理により酸を洗い流し、エアーカットで水を切り、80℃の乾燥オーブンで3分間乾燥させて導電パターンを製造し、実施例1と同様の評価をした。パターニング性および導電性についての評価結果を表2に示す。
表2に示す組成の導電ペーストにより所定のパターンを形成し、酸性水溶液に浸漬することなく、得られたパターンを100℃で1時間、乾燥オーブンでキュアして導電パターンを製造し、実施例1と同様の評価をした。パターニング性および導電性についての評価結果を表2に示す。
Claims (7)
- (1)基材上に、導電性粒子(a)、樹脂(b)を含むパターンを形成する工程と、
(2)形成されたパターンに、25℃におけるアニオンの共役酸の酸解離定数(pKa)が1.0以下である塩を少なくとも1種含み、25℃におけるpHが1.2~3.5である酸性水溶液を接触させる工程とを有し、
前記(1)のパターンを形成する工程が、基材上に、導電性粒子(a)、カルボキシル基を含有する樹脂(B)、不飽和二重結合を有する反応性モノマー(c)および光重合開始剤(d)を含有する感光性ペーストを塗布することにより塗布膜を形成し、該塗布膜を露光及び現像することによりパターンを形成するフォトリソグラフィ工程である導電パターンの製造方法。 - 前記酸性水溶液に含まれる塩の濃度が0.05mol/L以上である請求項1に記載の導電パターンの製造方法。
- 前記酸性水溶液に、前記塩以外の酸を含有し、当該酸のpKaが2~5である請求項1又は2に記載の導電パターンの製造方法。
- 前記酸性水溶液の液温が40℃~90℃である請求項1~3いずれか1項に記載の導電パターンの製造方法。
- 前記パターンと前記酸性水溶液とが接触した状態で加熱する請求項1~4いずれか1項に記載の導電パターンの製造方法。
- 前記導電性粒子(a)が銀粒子を含有する請求項1~5いずれか1項に記載の導電パターンの製造方法。
- 前記導電パターンの厚みが3μm以下である請求項1~6いずれか1項に記載の導電パターンの製造方法。
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