JP7370293B2 - レーザ加工装置及びレーザ加工方法 - Google Patents
レーザ加工装置及びレーザ加工方法 Download PDFInfo
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- JP7370293B2 JP7370293B2 JP2020064222A JP2020064222A JP7370293B2 JP 7370293 B2 JP7370293 B2 JP 7370293B2 JP 2020064222 A JP2020064222 A JP 2020064222A JP 2020064222 A JP2020064222 A JP 2020064222A JP 7370293 B2 JP7370293 B2 JP 7370293B2
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- 238000003672 processing method Methods 0.000 title claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 4
- 239000007789 gas Substances 0.000 description 51
- 239000000835 fiber Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
- B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Description
Claims (4)
- 縦断面が上に凸のアーチ状であって円環状に延びるワークに上方からレーザを照射して複数の貫通孔を形成するレーザ加工装置であって、
前記ワークの下面側を支持し、前記支持したワークとの間に密閉空間を形成するワーク支持部と、
前記密閉空間の内部にて上下動が可能であって、前記ワークに前記貫通孔が形成される加工対象領域を分割した複数の領域にそれぞれ対応して、上昇したとき、前記ワークの前記領域を一周にわたって取り囲むように当接する上面を有する複数のパッドと、
前記複数のパッドをそれぞれ前記ワークと当接した状態と前記ワークと離間した状態との間を進退させるように駆動する駆動手段と、
前記密閉空間内にガスを供給するガス供給手段と、
前記ワーク支持部によって支持した前記ワークに対して、内周面又は外周面に1周にわたって上方から当接するクランプとを備えることを特徴とするレーザ加工装置。 - 前記パッドの前記当接面を含む部分は可撓性を有する封止部材からなることを特徴とする請求項1に記載のレーザ加工装置。
- 縦断面が上に凸のアーチ状であって円環状に延びるワークの下面側を支持して、前記支持したワークの下面との間に密閉空間を形成する工程と、
前記支持したワークに対して、内周面又は外周面に1周にわたってクランプを上方から当接させる工程と、
前記ワークに複数の貫通孔が形成される加工対象領域を分割した複数の領域のうち前記貫通孔が形成された領域を一周にわたって取り囲むように上面が当接するように、パッドを上昇させる工程と、
前記密閉空間内にガスを供給する工程と、
前記ワークに対して上方からレーザを照射して前記ワークに前記貫通孔を形成する工程とを含むことを特徴とするレーザ加工方法。 - 前記複数の領域のうち、前記貫通孔を所定の方向に向かって傾斜して斜め下方に延びるように形成する領域において前記貫通孔を形成するために前記レーザを照射する前に、当該領域の前記所定の方向に隣接している領域において、前記ワークに前記上面が当接するパッドを非当接位置に退避させる工程を含むことを特徴とする請求項3に記載のレーザ加工方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020064222A JP7370293B2 (ja) | 2020-03-31 | 2020-03-31 | レーザ加工装置及びレーザ加工方法 |
US17/218,187 US11717917B2 (en) | 2020-03-31 | 2021-03-31 | Laser processing apparatus and laser processing method |
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JP2020064222A JP7370293B2 (ja) | 2020-03-31 | 2020-03-31 | レーザ加工装置及びレーザ加工方法 |
Publications (2)
Publication Number | Publication Date |
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JP2021159948A JP2021159948A (ja) | 2021-10-11 |
JP7370293B2 true JP7370293B2 (ja) | 2023-10-27 |
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JP2020064222A Active JP7370293B2 (ja) | 2020-03-31 | 2020-03-31 | レーザ加工装置及びレーザ加工方法 |
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US (1) | US11717917B2 (ja) |
JP (1) | JP7370293B2 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009001497A1 (ja) | 2007-06-28 | 2008-12-31 | Panasonic Corporation | レーザ加工装置 |
WO2009091020A1 (ja) | 2008-01-17 | 2009-07-23 | Honda Motor Co., Ltd. | レーザ加工装置及びレーザ加工方法 |
JP2011206791A (ja) | 2010-03-29 | 2011-10-20 | Honda Motor Co Ltd | レーザ穿孔方法 |
JP2011235292A (ja) | 2010-05-06 | 2011-11-24 | Honda Motor Co Ltd | 穴あけ装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4277429B2 (ja) | 2000-07-27 | 2009-06-10 | 株式会社デンソー | 高密度エネルギビーム加工方法およびその装置 |
US9754791B2 (en) * | 2015-02-07 | 2017-09-05 | Applied Materials, Inc. | Selective deposition utilizing masks and directional plasma treatment |
KR102652337B1 (ko) * | 2015-10-09 | 2024-03-29 | 어플라이드 머티어리얼스, 인코포레이티드 | 에피 프로세스들을 위한 웨이퍼 가열을 위한 다이오드 레이저 |
-
2020
- 2020-03-31 JP JP2020064222A patent/JP7370293B2/ja active Active
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2021
- 2021-03-31 US US17/218,187 patent/US11717917B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009001497A1 (ja) | 2007-06-28 | 2008-12-31 | Panasonic Corporation | レーザ加工装置 |
WO2009091020A1 (ja) | 2008-01-17 | 2009-07-23 | Honda Motor Co., Ltd. | レーザ加工装置及びレーザ加工方法 |
JP2011206791A (ja) | 2010-03-29 | 2011-10-20 | Honda Motor Co Ltd | レーザ穿孔方法 |
JP2011235292A (ja) | 2010-05-06 | 2011-11-24 | Honda Motor Co Ltd | 穴あけ装置 |
Also Published As
Publication number | Publication date |
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US20210299793A1 (en) | 2021-09-30 |
US11717917B2 (en) | 2023-08-08 |
JP2021159948A (ja) | 2021-10-11 |
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