JP7353312B2 - LED light source and inspection method for LED light source - Google Patents
LED light source and inspection method for LED light source Download PDFInfo
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description
本発明は、ＬＥＤ素子とＬＥＤ素子を保護する保護素子とを備えたＬＥＤ光源の検査方法に関するものである。 The present invention relates to a method for inspecting an LED light source that includes an LED element and a protection element that protects the LED element.
ＬＥＤ光源は、ＬＥＤ素子に静電気等が印加されてＬＥＤ素子が破壊されてしまうのを防ぐために、保護素子としてツェナーダイオード等がＬＥＤ素子に対して並列に設けられる（特許文献１参照）。 In an LED light source, a Zener diode or the like is provided in parallel with the LED element as a protective element in order to prevent the LED element from being damaged by static electricity or the like being applied to the LED element (see Patent Document 1).
ところで、このようなＬＥＤ光源の保護素子を検査する場合、ＬＥＤ素子と保護素子がそれぞれ独立な回路として構成されている状態で検査を行う必要がある。このため、ＬＥＤ光源のプラス端子とマイナス端子を介して保護素子の検査が行われた後に、ＬＥＤ素子と保護素子とが並列に接続されるように例えばワイヤーボンディングによって配線が変更される。次に前述したプラス端子とマイナス端子を介してＬＥＤ素子の検査が行われ、その後、電力供給線とＬＥＤ光源のプラス端子とマイナス端子がボンディングされて最終的な製品の形態となる。 By the way, when inspecting the protection element of such an LED light source, it is necessary to perform the inspection in a state where the LED element and the protection element are each configured as an independent circuit. For this reason, after the protection element is inspected via the positive and negative terminals of the LED light source, the wiring is changed, for example, by wire bonding, so that the LED element and the protection element are connected in parallel. Next, the LED element is inspected via the above-mentioned positive terminal and negative terminal, and then the power supply line and the positive terminal and negative terminal of the LED light source are bonded to form the final product.
したがって、従来の検査方法では各検査が終了するごとにボンディングを２回に分けて行う必要があり、ＬＥＤ光源の検査には手間がかかっている。 Therefore, in the conventional inspection method, it is necessary to perform bonding twice after each inspection, and inspection of the LED light source is time-consuming.
ここで、特許文献２で提案されている半導体デバイスのように保護素子を含む保護回路と、保護対象となるＬＥＤ素子を含むＬＥＤ回路をそれぞれの端部にボンディングパッドを分割した状態で近接させて配置しておき、検査終了後に各ボンディングパッドが電気的に接続されるようにはんだ付けして保護素子がＬＥＤ素子に対して作用させることが考えられる。このようにすれば、ボンディングの回数は１回に抑えられる。 Here, as in the semiconductor device proposed in Patent Document 2, a protection circuit including a protection element and an LED circuit including an LED element to be protected are placed close to each other with bonding pads separated at their respective ends. It is conceivable to arrange the protection element and then solder the bonding pads so that they are electrically connected after the inspection is completed so that the protection element acts on the LED element. In this way, the number of bonding operations can be reduced to one.
しかしながら、保護素子の検査を終了してから、ボンディングのためにＬＥＤ光源を別の場所へ搬送する間は保護素子によってＬＥＤ素子は保護されていない状態となってしまう。この搬送中に静電気がＬＥＤ素子に印加されてしまうとＬＥＤ素子がダメージを受けて破壊されてしまうのを防ぐことができない。 However, after the inspection of the protection element is completed, the LED element is not protected by the protection element until the LED light source is transported to another location for bonding. If static electricity is applied to the LED element during this transportation, it is impossible to prevent the LED element from being damaged and destroyed.
本発明は上述したような問題に鑑みてなされたものであり、例えばボンディングの回数を減らして従来よりも検査工程を簡略しつつ、保護素子の検査終了後はＬＥＤ素子が保護されるようにできるＬＥＤ光源及びＬＥＤ光源の検査方法を提供することを目的とする。 The present invention has been made in view of the above-mentioned problems, and it is possible to simplify the inspection process by reducing the number of bonding operations, for example, and to protect the LED element after the inspection of the protection element is completed. An object of the present invention is to provide an LED light source and an inspection method for the LED light source.
すなわち、本発明に係るＬＥＤ光源は、第１端子と第２端子との間にＬＥＤ素子が設けられたＬＥＤ回路と、前記第１端子と第３端子との間に保護素子が設けられた保護回路と、前記ＬＥＤ回路と前記保護回路において互いに近接している部分であり、前記保護素子が前記ＬＥＤ素子と並列になるように仮接続される仮接続部と、前記ＬＥＤ回路と前記保護回路において互いに近接している部分であり、本接続される本接続部と、を備えたことを特徴とする。 That is, the LED light source according to the present invention includes an LED circuit in which an LED element is provided between a first terminal and a second terminal, and a protection element in which a protection element is provided between the first terminal and the third terminal. a temporary connection portion which is a portion of the LED circuit and the protection circuit that are close to each other and is temporarily connected so that the protection element is parallel to the LED element; It is characterized by comprising a main connection part which is a part that is close to each other and is permanently connected.
また、本発明に係るＬＥＤ光源の検査方法は、第１端子と第２端子との間にＬＥＤ素子が設けられたＬＥＤ回路と、前記第１端子と第３端子との間に保護素子が設けられた保護回路と、を備えたＬＥＤ光源の検査方法であって、前記ＬＥＤ回路と前記保護回路とが独立している状態で前記第１端子と前記第３端子との間で前記保護素子の検査をすることと、前記保護素子の検査終了後に、前記保護素子が前記ＬＥＤ素子と並列になるように仮接続することと、仮接続した後に、本接続すること、を備えたことを特徴とする。 Further, the inspection method for an LED light source according to the present invention includes an LED circuit in which an LED element is provided between a first terminal and a second terminal, and a protection element is provided between the first terminal and the third terminal. A method for inspecting an LED light source, comprising: a protection circuit provided with the protection element between the first terminal and the third terminal in a state where the LED circuit and the protection circuit are independent; The present invention is characterized by comprising the steps of: performing an inspection; after the inspection of the protection element is completed, temporarily connecting the protection element so that it is parallel to the LED element; and after the temporary connection, making a final connection. do.
このようなものであれば、前記ＬＥＤ光源が前記仮接続部と前記本接続部を備えているので、前記保護素子の検査が終了した後は例えばボンディングを行うことなく、前記仮接続部で仮接続して前記保護素子を前記ＬＥＤ素子に対して作用させることができる。この仮接続がされた状態で前記ＬＥＤ光源を前記本接続部が接続される作業が行われる場所まで搬送できるので、従来のように搬送中に静電気がＬＥＤ素子に印加されて破壊されてしまうのを防ぐことができる。したがって、従来と比較してＬＥＤ光源の検査工程においてボンディング等の配線接続に関わる工程を減らしつつ、前記保護素子の検査終了後から本接続されるまでの間は前記保護素子により前記ＬＥＤ素子を保護できる。 In this case, since the LED light source includes the temporary connection part and the main connection part, after the inspection of the protection element is completed, the temporary connection part is used without performing bonding, for example. The protection element can be connected to act on the LED element. With this temporary connection made, the LED light source can be transported to the location where the final connection is to be made, which prevents static electricity from being applied to the LED element and destroying it during transport as in the past. can be prevented. Therefore, while reducing the number of processes related to wiring connections such as bonding in the inspection process of the LED light source compared to the conventional method, the protection element protects the LED element from the end of the inspection of the protection element until the actual connection. can.
また、例えば仮接続が信頼性の低い接続方法だったとしても、前記本接続部において例えばボンディング等によって本接続を行うことにより最終的な前記保護素子と前記ＬＥＤ素子との間の並列接続状態を信頼性の高いものにできる。 Furthermore, even if the temporary connection is a connection method with low reliability, for example, the final parallel connection state between the protection element and the LED element can be established by performing the actual connection by bonding or the like at the actual connection part. It can be made highly reliable.
前記仮接続部をボンディングのように専用の設備や機器が必要とならず、前記保護素子の検査直後でもその場で簡単に仮接続できるようにするには、前記仮接続部が、前記ＬＥＤ回路又は前記保護回路を形成する金属配線の形状変化により前記ＬＥＤ回路と前記保護回路との間を短絡させるように構成されたものであればよい。より具体的には、前記仮接続部が、前記ＬＥＤ回路又は前記保護回路を形成する金属配線を引っ掻いて剥がれた金属により前記ＬＥＤ回路と前記保護回路との間を短絡させるように構成されたものであってもよい。このようなものであれば、例えばピンセットで金属配線を引っ掻くだけで仮接続を実現でき、前記仮接続部においてボンディングを行う必要がない。また、前記仮接続部が、前記ＬＥＤ回路又は前記保護回路を形成する金属配線を押し潰すことにより前記ＬＥＤ回路と前記保護回路との間を短絡させるように構成されたものであってもよい。このようなものであれば、例えば平面を有する器具で前記金属配線を基板側へ押すだけで短絡させることができる。したがって、複雑な工程を追加することなく、従来よりも検査工程におけるボンディングの回数を減らすことができる。 In order to make the temporary connection part unnecessary for special equipment or equipment like bonding, and to be able to easily make the temporary connection on the spot even immediately after the inspection of the protection element, the temporary connection part is connected to the LED circuit. Alternatively, it may be configured to short-circuit between the LED circuit and the protection circuit by changing the shape of the metal wiring forming the protection circuit. More specifically, the temporary connection part is configured to cause a short circuit between the LED circuit and the protection circuit by metal peeled off by scratching the metal wiring forming the LED circuit or the protection circuit. It may be. With such a device, temporary connection can be achieved by simply scratching the metal wiring with tweezers, for example, and there is no need to perform bonding at the temporary connection portion. Further, the temporary connection portion may be configured to short-circuit between the LED circuit and the protection circuit by crushing metal wiring forming the LED circuit or the protection circuit. With such a device, the metal wiring can be short-circuited simply by pushing the metal wiring toward the board using, for example, a flat device. Therefore, the number of bonding operations in the inspection process can be reduced compared to the conventional method without adding any complicated process.
前記本接続部においてボンディングによって前記保護素子と前記ＬＥＤ素子との間を並列に接続し、その接続状態を信頼性の高いものにできるようにするには、前記本接続部が、前記ＬＥＤ回路に設けられた第１ボンディングパッドと、前記保護回路に設けられた第２ボンディングパッドと、を備えたものであればよい。 In order to connect the protection element and the LED element in parallel by bonding at the main connection part and to make the connection state highly reliable, the main connection part is connected to the LED circuit. Any device may be used as long as it includes a first bonding pad provided on the protection circuit and a second bonding pad provided on the protection circuit.
前記ＬＥＤ光源の具体的な構成例としては、前記ＬＥＤ回路が複数の前記ＬＥＤ素子が直列又は並列に接続されたＬＥＤ素子群を含み、前記保護素子、及び、複数の前記ＬＥＤ素子が実装基板上にＣＯＢ実装されたものが挙げられる。 As a specific configuration example of the LED light source, the LED circuit includes a group of LED elements in which a plurality of the LED elements are connected in series or in parallel, and the protection element and the plurality of LED elements are mounted on a mounting board. Examples include those that are COB-mounted.
仮接続した後に、前記第１端子と前記第２端子との間で前記ＬＥＤ素子を検査することをさらに備え、本接続が、前記ＬＥＤ素子の検査が終了した後に行われるようにすれば、前記保護素子の検査が終了した後、前記保護素子による前記ＬＥＤ素子の保護が仮接続によって作用している状態で前記ＬＥＤ素子の検査を行うことができる。このため、仮に前記ＬＥＤ素子の検査中に予期しない電圧が前記ＬＥＤ素子に印加されたとしても前記保護素子によって前記ＬＥＤ素子が破壊されてしまうのを防ぐことができる。 The method further comprises inspecting the LED element between the first terminal and the second terminal after the temporary connection, and the main connection is performed after the inspection of the LED element is completed. After the inspection of the protection element is completed, the LED element can be inspected while the protection of the LED element by the protection element is working through temporary connection. Therefore, even if an unexpected voltage is applied to the LED element during the inspection of the LED element, the protection element can prevent the LED element from being destroyed.
このように本発明に係るＬＥＤ光源及びＬＥＤ光源の検査方法によれば、前記保護素子と前記ＬＥＤ素子が独立した回路となっている状態で前記保護素子の検査を行い、その後前記仮接続部で例えばボンディング以外の方法で仮接続することができる。このため、前記保護素子の検査終了後に本接続をする場所まで前記ＬＥＤ光源を搬送する間は仮接続によって前記保護素子を前記ＬＥＤ素子に対して作用させることができる。したがって、搬送中に静電気等が前記ＬＥＤ素子に印加されたとしても当該ＬＥＤ素子が破壊されるのを防ぐことができる。また、本接続においてのみボンディングを行うことができるので、検査工程についても従来と比較して簡略化できる。 As described above, according to the LED light source and the inspection method for an LED light source according to the present invention, the protection element is inspected in a state where the protection element and the LED element are independent circuits, and then the temporary connection part is inspected. For example, temporary connection can be made by a method other than bonding. Therefore, while the LED light source is being transported to a place where the actual connection is to be made after the inspection of the protection element is completed, the protection element can be made to act on the LED element by temporary connection. Therefore, even if static electricity or the like is applied to the LED element during transportation, the LED element can be prevented from being destroyed. Further, since bonding can be performed only in the main connection, the inspection process can also be simplified compared to the conventional method.
本発明の第１実施形態に係るＬＥＤ光源１００について図１乃至図６を参照しながら説明する。 An LED light source 100 according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 6.
図１に示すように第１実施形態のＬＥＤ光源１００は、基板Ｓ上にＣＯＢ実装された多数のＬＥＤ素子１１（ＬＥＤベアチップ）を含むＬＥＤ回路１と、ＬＥＤ素子１１を保護する保護素子２１を含む保護回路２と、を備えたものである。このＬＥＤ光源１００は、例えば製品の外観検査に用いられる。 As shown in FIG. 1, the LED light source 100 of the first embodiment includes an LED circuit 1 including a large number of LED elements 11 (LED bare chips) mounted on a substrate S by COB, and a protection element 21 for protecting the LED elements 11. A protection circuit 2 including a protection circuit 2 is provided. This LED light source 100 is used, for example, for visual inspection of products.
このＬＥＤ光源１００は、ＬＥＤ素子１１及び保護素子２１が実装される概略正方形状の基板Ｓと、基板Ｓの中央部に形成された円形状のダムＤとを備えている。ダムＤ内には複数のＬＥＤ素子１１及び保護素子２１がＣＯＢ（Chip on Board）実装されるとともに、透光性樹脂によってダムＤ内が封止されている。すなわち、第１実施形態のＬＥＤ光源１００はＣＯＢデバイスとして構成されている。 This LED light source 100 includes a substantially square substrate S on which the LED elements 11 and protection elements 21 are mounted, and a circular dam D formed in the center of the substrate S. Inside the dam D, a plurality of LED elements 11 and a protection element 21 are mounted on a COB (chip on board), and the inside of the dam D is sealed with a translucent resin. That is, the LED light source 100 of the first embodiment is configured as a COB device.
また、基板ＳにおいてダムＤの外側の表面にはＬＥＤ回路１及び保護回路２の一部を形成する金属配線が形成されている。より具体的には図１において基板Ｓの左下角及び右上角にはそれぞれプラス端子とマイナス端子となるボンディングパッドが形成されている。また、図１において基板Ｓの左上角には保護素子２１の検査後に仮接続される仮接続部３が金属配線により形成されている。 Further, on the outer surface of the dam D in the substrate S, metal wiring forming part of the LED circuit 1 and the protection circuit 2 is formed. More specifically, in FIG. 1, bonding pads serving as a positive terminal and a negative terminal are formed at the lower left corner and upper right corner of the substrate S, respectively. In addition, in FIG. 1, a temporary connection part 3 is formed by metal wiring at the upper left corner of the substrate S to be temporarily connected after the protection element 21 is inspected.
各部について詳述する。 Each part will be explained in detail.
基板Ｓ上に実装されている回路は、図２の模式図に示すようにＬＥＤ素子１１を含むＬＥＤ回路１と、保護素子２１を含む保護回路２である。検査実施前の状態ではＬＥＤ回路１と保護回路２はそれぞれ独立した状態となっている。すなわち、ＬＥＤ回路１はマイナス端子となる第１端子Ｔ１と、プラス端子となる第２端子Ｔ２とが配線の両端部にそれぞれ形成される。同様に保護回路２はＬＥＤ回路１と共用される第１端子Ｔ１と、第２端子Ｔ２とは別のプラス端子となる第３端子Ｔ３とが配線の両端部にそれぞれ形成される。 The circuits mounted on the substrate S are an LED circuit 1 including an LED element 11 and a protection circuit 2 including a protection element 21, as shown in the schematic diagram of FIG. In the state before inspection, the LED circuit 1 and the protection circuit 2 are in an independent state. That is, in the LED circuit 1, a first terminal T1 serving as a negative terminal and a second terminal T2 serving as a positive terminal are formed at both ends of the wiring, respectively. Similarly, in the protection circuit 2, a first terminal T1 that is shared with the LED circuit 1 and a third terminal T3 that is a positive terminal different from the second terminal T2 are formed at both ends of the wiring.
ＬＥＤ回路１は、複数のＬＥＤ素子１１を直列に接続したＬＥＤストリングスと、各ＬＥＤストリングスを並列に接続したＬＥＤ群を備えている。なお、図１ではＬＥＤ群を構成する配線については省略表記しており、図２では１つの記号でＬＥＤ群を代表させてある。 The LED circuit 1 includes LED strings in which a plurality of LED elements 11 are connected in series, and an LED group in which the LED strings are connected in parallel. Note that in FIG. 1, the wiring constituting the LED group is omitted, and in FIG. 2, one symbol represents the LED group.
保護回路２は、保護素子２１として例えばツェナーダイオードを含むものである。保護素子２１としてツェナーダイオード以外の例えばＴＶＳダイオードやバリスタ等の素子を含んでいても構わない。この保護回路２は保護素子２１の検査が終了した後に、最終的にＬＥＤ回路１に対して並列接続される。 The protection circuit 2 includes, for example, a Zener diode as the protection element 21. The protection element 21 may include an element other than the Zener diode, such as a TVS diode or a varistor. This protection circuit 2 is finally connected in parallel to the LED circuit 1 after the inspection of the protection element 21 is completed.
また、図１及び図２に示すようにＬＥＤ回路１と保護回路２との間には、保護素子２１の検査後に仮接続される仮接続部３と、保護素子２１及びＬＥＤ素子１１の検査終了後に本接続される本接続部４とが形成されている。 In addition, as shown in FIGS. 1 and 2, between the LED circuit 1 and the protection circuit 2, there is a temporary connection part 3 that is temporarily connected after the protection element 21 is inspected, and a temporary connection part 3 that is temporarily connected after the inspection of the protection element 21 and the LED element 11 is completed. A main connection portion 4 to be finally connected later is formed.
仮接続部３は、図１に示すように基板Ｓの左上部分においてＬＥＤ回路１の金属配線と保護回路２の金属配線において近接させた部分であり、金属配線の他の部分と比較してその太さを大きくしてある。ここで、仮接続は最終的なＬＥＤ光源１００として接続の信頼性を確保するための接続方法ではなく、検査工程において保護素子２１の検査終了後にＬＥＤ素子１１に対して保護素子２１が並列接続された状態を維持する接続方法である。図３の仮接続部３の断面図に示すように、仮接続部３はＬＥＤ回路１又は保護回路２を形成する金属配線を引っ掻いて剥がれた金属によりＬＥＤ回路１と保護回路２との間を短絡させるように構成されている。例えば仮接続部３を金属配線の幅方向に対してピンセットで引っ掻くことで図３（ｂ）に示すように金属配線の一部を剥離させて各金属配線同士が架橋された状態にして短絡させることができる。また、仮接続部３を短絡させた後には第１端子Ｔ１と第２端子Ｔ２とを用いてＬＥＤ素子１１の検査が行われる。加えて、仮接続部３が短絡して、ＬＥＤ素子１１が保護素子２１に対して作用している状態でＬＥＤ光源１００は次の本接続を行うための設備がある場所まで搬送される。 As shown in FIG. 1, the temporary connection part 3 is a part of the metal wiring of the LED circuit 1 and the metal wiring of the protection circuit 2 that are placed close to each other in the upper left part of the board S, and is The thickness has been increased. Here, the temporary connection is not a connection method for ensuring the reliability of the connection as the final LED light source 100, but the protection element 21 is connected in parallel to the LED element 11 after the inspection of the protection element 21 is completed in the inspection process. This is a connection method that maintains the same state. As shown in the cross-sectional view of the temporary connection part 3 in FIG. Configured to short circuit. For example, by scratching the temporary connection part 3 in the width direction of the metal wiring with tweezers, a part of the metal wiring is peeled off as shown in FIG. 3(b), and each metal wiring is bridged and short-circuited. be able to. Further, after short-circuiting the temporary connection portion 3, the LED element 11 is inspected using the first terminal T1 and the second terminal T2. In addition, with the temporary connection portion 3 short-circuited and the LED element 11 acting on the protection element 21, the LED light source 100 is transported to a location where there is equipment for making the next permanent connection.
本接続部４は、第１実施形態では前述した第２端子Ｔ２及び第３端子Ｔ３を兼ねるように構成されている。より具体的には図１における基板Ｓの左下部分、及び、図４の本接続部４の拡大図に示すように、本接続部４はＬＥＤ回路１に設けられた第１ボンディングパッド４１と、保護回路２に設けられ、第１ボンディングパッド４１とは分割して形成された第２ボンディングパッド４２とを備えている。図４（ｂ）に示すように第１ボンディングパッド４１と第２ボンディングパッド４２は、保護素子２１及びＬＥＤ素子１１の検査終了後にプラス側の電力供給線ＰＳとはんだ付けされる。また、第１ボンディングパッド４１及び第２ボンディングパッド４２は短絡するように双方にはんだＢが覆いかぶさった形ではんだ付けされる。 In the first embodiment, the main connecting portion 4 is configured to double as the second terminal T2 and the third terminal T3 described above. More specifically, as shown in the lower left part of the substrate S in FIG. 1 and the enlarged view of the main connection part 4 in FIG. A second bonding pad 42 is provided in the protection circuit 2 and is formed separately from the first bonding pad 41 . As shown in FIG. 4B, the first bonding pad 41 and the second bonding pad 42 are soldered to the positive power supply line PS after the inspection of the protection element 21 and the LED element 11 is completed. Further, the first bonding pad 41 and the second bonding pad 42 are soldered with solder B covering both of them so as to short-circuit them.
次にＬＥＤ光源１００の検査工程について図５のフローチャートを参照しながら説明する。 Next, the inspection process of the LED light source 100 will be explained with reference to the flowchart of FIG.
まず、ＬＥＤ回路１及び保護回路２が独立した状態のＬＥＤ光源１００において第１端子Ｔ１と第３端子Ｔ３間で保護素子２１の検査を行う（ステップＳ１）。 First, in the LED light source 100 in which the LED circuit 1 and the protection circuit 2 are independent, the protection element 21 is inspected between the first terminal T1 and the third terminal T3 (step S1).
保護素子２１の検査が終了すると、仮接続部３に対してピンセットにより金属配線の表面を引っ掻き、仮接続部３を短絡させる（ステップＳ２）。この結果、保護回路２はＬＥＤ回路１に対して並列接続された状態となり、保護素子２１によりＬＥＤ素子１１が保護された状態となる。 When the inspection of the protection element 21 is completed, the surface of the metal wiring of the temporary connection part 3 is scratched with tweezers to short-circuit the temporary connection part 3 (step S2). As a result, the protection circuit 2 is connected in parallel to the LED circuit 1, and the LED element 11 is protected by the protection element 21.
次に第１端子Ｔ１と第２端子Ｔ２間でＬＥＤ素子１１の検査を行う（ステップＳ３）。 Next, the LED element 11 is inspected between the first terminal T1 and the second terminal T2 (step S3).
ＬＥＤ素子１１の検査終了後は、ＬＥＤ光源１００をはんだ付けの設備がある場所まで搬送する（ステップＳ４）。 After the inspection of the LED element 11 is completed, the LED light source 100 is transported to a location where soldering equipment is located (step S4).
最後に図６に示すように各端子上に電力供給線ＰＳを配置して、はんだ付けを行う。この際、本接続部４でもある第２端子Ｔ２及び第３端子Ｔ３上に１つのはんだＢの粒が形成されて本接続部４が短絡するようにはんだ付けする（ステップＳ５）。 Finally, as shown in FIG. 6, a power supply line PS is placed on each terminal and soldered. At this time, soldering is performed so that one grain of solder B is formed on the second terminal T2 and the third terminal T3, which are also the main connection part 4, and the main connection part 4 is short-circuited (step S5).
このように第１実施形態のＬＥＤ光源１００によれば、保護素子２１の検査が終了し、仮接続部３が仮接続されてから本接続部４における本接続を行うまでの間は、仮接続によって保護素子２１によるＬＥＤ素子１１の保護が作用した状態にできる。このため、検査工程中でも保護素子２１でＬＥＤ素子１１を保護することができ、例えばはんだ付け前にＬＥＤ光源１００を搬送している間に静電気等が印加されてＬＥＤ素子１１が破壊されてしまうのを防ぐことができる。 As described above, according to the LED light source 100 of the first embodiment, the temporary connection is performed after the inspection of the protection element 21 is completed and the temporary connection part 3 is temporarily connected until the main connection is made in the main connection part 4. As a result, the LED element 11 can be protected by the protection element 21. Therefore, the protection element 21 can protect the LED element 11 even during the inspection process. For example, while the LED light source 100 is being transported before soldering, static electricity or the like may be applied and the LED element 11 may be destroyed. can be prevented.
また、仮接続部３における仮接続ははんだ付けではなく、ピンセットで基板Ｓ上の金属配線を引っ掻くだけなので、従来の検査工程と比較してほとんど工程は変化しない。 Furthermore, the temporary connection at the temporary connection section 3 is not performed by soldering, but by simply scratching the metal wiring on the substrate S with tweezers, so there is almost no change in the process compared to the conventional inspection process.
さらに本接続部４における本接続ははんだ付けによってＬＥＤ回路１と保護回路２とを短絡させるので、仮接続部３の一時的な接続だけでは実現しにくい製品としての信頼性も確保できる。 Furthermore, since the final connection at the final connection part 4 short-circuits the LED circuit 1 and the protection circuit 2 by soldering, it is possible to ensure reliability as a product, which is difficult to achieve only by a temporary connection at the temporary connection part 3.
次に本発明の第２実施形態に係るＬＥＤ光源１００について図７を参照しながら説明する。なお、第１実施形態において説明した部材に対応する部材には同じ符号を付すこととする。 Next, an LED light source 100 according to a second embodiment of the present invention will be described with reference to FIG. 7. Note that members corresponding to those described in the first embodiment are given the same reference numerals.
第２実施形態では仮接続部３における仮接続方法が第１実施形態とは異なっている。図７（ａ）に示すように仮接続部３を構成する各金属配線を平板状の絶縁体ＩＳ等で厚み方向に押し潰すことで、図７（ｂ）に示すように各金属配線を短絡させている。このような第２実施形態の仮接続方法であっても、例えばはんだ付け等の設備が必要となる接続方法を用いずに第１実施形態と同様に簡単に仮接続することができる。 In the second embodiment, the temporary connection method in the temporary connection section 3 is different from that in the first embodiment. As shown in FIG. 7(a), by crushing each metal wiring constituting the temporary connection part 3 in the thickness direction with a flat insulator IS, etc., each metal wiring is short-circuited as shown in FIG. 7(b). I'm letting you do it. Even with such a temporary connection method of the second embodiment, temporary connection can be easily performed as in the first embodiment without using a connection method that requires equipment such as soldering.
その他の実施形態について説明する。 Other embodiments will be described.
第１実施形態のＬＥＤ光源は、ＣＯＢ実装タイプのＬＥＤを用いたものであったが、本発明に係るＬＥＤ光源は砲弾型のＬＥＤや表面実装型のＬＥＤを用いたものであってもよい。すなわち、ＬＥＤ回路及び保護回路を備えているとともに、各回路間に仮接続部と本接続部を備えているように適宜回路を構成すればよい。 Although the LED light source of the first embodiment uses a COB mounting type LED, the LED light source according to the present invention may use a bullet-shaped LED or a surface-mounted LED. That is, the circuit may be configured as appropriate so as to include an LED circuit and a protection circuit, and a temporary connection portion and a permanent connection portion between each circuit.
第１実施形態では、仮接続部と本接続部はそれぞれ異なる場所に設けられていたが、同じ場所に設けてもよい。例えば第１実施形態における第１ボンディングパッドと第２ボンディングパッドを仮接続時にはピンセットで引っ掻いておき、本接続時にははんだ付けするようにして仮接続部と本接続部としての機能を兼ねるようにしてもよい。 In the first embodiment, the temporary connection portion and the permanent connection portion are provided at different locations, but they may be provided at the same location. For example, the first bonding pad and the second bonding pad in the first embodiment may be scratched with tweezers during the temporary connection, and soldered during the actual connection, so that they function as both the temporary connection part and the final connection part. good.
また、本接続部は第２端子及び第３端子を兼ねなくても良く、それぞれが別々の場所に設けられていても良い。 Further, the main connecting portion does not have to serve as the second terminal and the third terminal, and each terminal may be provided at a separate location.
仮接続部を仮接続する方法は、ピンセットにより金属配線を引っ掻く方法や、金属配線を押し潰す方法に限られない。例えば導電性のペーストやテープを仮接続部に付着させて短絡させたり、仮接続部を加熱して金属配線を溶かすことで１つにして短絡させたりしてもよい。加熱方法としては仮接続部にレーザ光を照射することなどが挙げられる。 The method of temporarily connecting the temporary connection portion is not limited to the method of scratching the metal wiring with tweezers or the method of crushing the metal wiring. For example, a conductive paste or tape may be attached to the temporary connection portion to cause a short circuit, or the temporary connection portion may be heated to melt the metal wiring to combine them into a short circuit. Examples of the heating method include irradiating the temporarily connected portion with laser light.
その他、本発明の趣旨に反しない限りにおいて様々な実施形態の変形や、各実施形態の一部同士の組み合わせを行っても構わない。 In addition, various modifications of the embodiments and combinations of parts of each embodiment may be made as long as they do not go against the spirit of the present invention.
１００・・・ＬＥＤ光源
１ ・・・ＬＥＤ回路
１１ ・・・ＬＥＤ素子
２ ・・・保護回路
２１ ・・・保護素子
３ ・・・仮接続部
４ ・・・本接続部
４１ ・・・第１ボンディングパッド
４２ ・・・第２ボンディングパッド
Ｔ１ ・・・第１端子
Ｔ２ ・・・第２端子
Ｔ３ ・・・第３端子
100...LED light source 1...LED circuit 11...LED element 2...protective circuit 21...protective element 3...temporary connection part 4...main connection part 41...first Bonding pad 42...Second bonding pad T1...First terminal T2...Second terminal T3...Third terminal
Claims (8)
前記第１端子と第３端子との間に保護素子が設けられた保護回路と、
前記ＬＥＤ回路と前記保護回路において互いに近接している部分であり、前記保護素子が前記ＬＥＤ素子と並列になるように仮接続される仮接続部と、
前記ＬＥＤ回路と前記保護回路において互いに近接している部分であり、本接続される本接続部と、を備えたことを特徴とするＬＥＤ光源。 an LED circuit in which an LED element is provided between a first terminal and a second terminal;
a protection circuit including a protection element between the first terminal and the third terminal;
a temporary connection portion that is a portion of the LED circuit and the protection circuit that are close to each other and is temporarily connected so that the protection element is parallel to the LED element;
An LED light source comprising: a main connection part which is a part of the LED circuit and the protection circuit that are close to each other and is permanently connected.
前記ＬＥＤ回路に設けられた第１ボンディングパッドと、
前記保護回路に設けられた第２ボンディングパッドと、を備えた請求項１乃至４いずれかに記載のＬＥＤ光源。 The main connection part is
a first bonding pad provided on the LED circuit;
5. The LED light source according to claim 1, further comprising a second bonding pad provided on the protection circuit.
前記保護素子、及び、複数の前記ＬＥＤ素子が実装基板上にＣＯＢ実装されたものである請求項１乃至５いずれかに記載のＬＥＤ光源。 The LED circuit includes a group of LED elements in which a plurality of the LED elements are connected in series or in parallel,
6. The LED light source according to claim 1, wherein the protection element and the plurality of LED elements are COB mounted on a mounting board.
前記ＬＥＤ回路と前記保護回路とが独立している状態で前記第１端子と前記第３端子との間で前記保護素子の検査をすることと、
前記保護素子の検査終了後に、前記保護素子が前記ＬＥＤ素子と並列になるように仮接続することと、
仮接続した後に、本接続すること、を備えたことを特徴とするＬＥＤ光源の検査方法。 Inspection of an LED light source that includes an LED circuit that includes an LED element between a first terminal and a second terminal, and a protection circuit that includes a protection element between the first and third terminals. A method,
Inspecting the protection element between the first terminal and the third terminal in a state where the LED circuit and the protection circuit are independent;
After the inspection of the protection element is completed, temporarily connecting the protection element so that it is parallel to the LED element;
A method for inspecting an LED light source, comprising the steps of making a temporary connection and then making a permanent connection.
本接続が、前記ＬＥＤ素子の検査が終了した後に行われる請求項７記載のＬＥＤ光源の検査方法。 further comprising inspecting the LED element between the first terminal and the second terminal after the temporary connection;
8. The method for inspecting an LED light source according to claim 7, wherein the main connection is performed after the inspection of the LED element is completed.
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001308329A (en) | 2000-04-25 | 2001-11-02 | Hitachi Ltd | Semiconductor device, its manufacturing method and characteristic estimation method thereof |
| JP2006513585A (en) | 2002-12-20 | 2006-04-20 | アドバンスト・アナロジック・テクノロジーズ・インコーポレイテッド | Inspectable electrostatic discharge protection circuit |
| JP2006156588A (en) | 2004-11-26 | 2006-06-15 | Seiwa Electric Mfg Co Ltd | Light emitting diode |
| JP2008022006A (en) | 2006-07-14 | 2008-01-31 | Lg Innotek Co Ltd | Light emitting diode package |
| JP2012151436A (en) | 2010-11-05 | 2012-08-09 | Rohm Co Ltd | Semiconductor light emitting device |
| CN203165944U (en) | 2012-11-23 | 2013-08-28 | 芜湖德豪润达光电科技有限公司 | LED package structure |
| US20130328070A1 (en) | 2012-06-06 | 2013-12-12 | Cree, Inc. | Light emitting devices and substrates with improved plating |
| JP2015502669A (en) | 2011-12-20 | 2015-01-22 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ | Optoelectronic semiconductor device manufacturing method, conductor frame assembly, and optoelectronic semiconductor device |
| JP2023018836A (en) | 2021-07-28 | 2023-02-09 | 聯嘉光電股▲ふん▼有限公司 | Light-emitting diode package with multiple test terminals and parallel connection component |
-
2021
- 2021-01-07 JP JP2021001384A patent/JP7353312B2/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001308329A (en) | 2000-04-25 | 2001-11-02 | Hitachi Ltd | Semiconductor device, its manufacturing method and characteristic estimation method thereof |
| JP2006513585A (en) | 2002-12-20 | 2006-04-20 | アドバンスト・アナロジック・テクノロジーズ・インコーポレイテッド | Inspectable electrostatic discharge protection circuit |
| JP2006156588A (en) | 2004-11-26 | 2006-06-15 | Seiwa Electric Mfg Co Ltd | Light emitting diode |
| JP2008022006A (en) | 2006-07-14 | 2008-01-31 | Lg Innotek Co Ltd | Light emitting diode package |
| JP2012151436A (en) | 2010-11-05 | 2012-08-09 | Rohm Co Ltd | Semiconductor light emitting device |
| JP2015502669A (en) | 2011-12-20 | 2015-01-22 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ | Optoelectronic semiconductor device manufacturing method, conductor frame assembly, and optoelectronic semiconductor device |
| US20130328070A1 (en) | 2012-06-06 | 2013-12-12 | Cree, Inc. | Light emitting devices and substrates with improved plating |
| CN203165944U (en) | 2012-11-23 | 2013-08-28 | 芜湖德豪润达光电科技有限公司 | LED package structure |
| JP2023018836A (en) | 2021-07-28 | 2023-02-09 | 聯嘉光電股▲ふん▼有限公司 | Light-emitting diode package with multiple test terminals and parallel connection component |
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|---|---|
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