JP7353183B2 - 圧電スピーカー - Google Patents
圧電スピーカー Download PDFInfo
- Publication number
- JP7353183B2 JP7353183B2 JP2019555325A JP2019555325A JP7353183B2 JP 7353183 B2 JP7353183 B2 JP 7353183B2 JP 2019555325 A JP2019555325 A JP 2019555325A JP 2019555325 A JP2019555325 A JP 2019555325A JP 7353183 B2 JP7353183 B2 JP 7353183B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- piezoelectric film
- piezoelectric
- intervening layer
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
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- H04R17/005—Piezoelectric transducers; Electrostrictive transducers using a piezoelectric polymer
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
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Landscapes
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Description
第1電極、第2電極、及び、前記第1電極と前記第2電極とに挟持された圧電体を含む圧電フィルムと、
粘着性又は接着性の第1接合層と、
前記圧電フィルムと前記第1接合層の間に配置された介在層と、を備え、
前記圧電フィルムの両主面全体が、上下に振動する、圧電スピーカーを提供する。
図1及び図2を用いて、第1実施形態に係る圧電スピーカーを説明する。圧電スピーカー10は、圧電フィルム35と、第1接合層51と、介在層40と、第2接合層52と、を備えている。第1接合層51と、介在層40と、第2接合層52と、圧電フィルム35とは、この順に積層されている。
拘束度(N/m3)=弾性率(N/m2)×表面充填率÷厚さ(m)
第1電極61、第2電極62、及び、第1電極61と第2電極62とに挟持された圧電体30を含む圧電フィルム35と、
粘着性又は接着性の第1接合層51と、
圧電フィルム35と第1接合層51の間に配置された介在層40と、を備え、
圧電フィルム35における介在層40側の主面を被支持面16と定義したとき、
介在層40が、被支持面16全体に接合されている、圧電スピーカー10。
このような圧電スピーカー10は、圧電フィルム35が湾曲形状に維持されていなくても、実用的な音響特性を示し得る。
固定された支持部材に圧電スピーカー10の第1接合面17を貼り付けることによって、図3の支持体80として上記支持部材を用いた構造を作製した。具体的には、支持部材として、厚さ5mmのステンレス平板(SUS平板)を用いた。第1接合層51として、不織布の両面にアクリル系粘着剤を含侵させた、厚み0.16mmの粘着シート(両面テープ)を用いた。介在層40として、エチレンプロピレンゴムとブチルゴムとを含む混和物を約10倍の発泡倍率で発泡させた、厚さ3mmで独立気泡型の発泡体を用いた。第2接合層52として、基材が不織布でありその基材の両面に無溶剤型のアクリル樹脂を含む粘着剤が塗布された、厚さ0.15mmの粘着シート(両面テープ)を用いた。圧電フィルム35として、両面に銅電極(ニッケルを含む)が蒸着されたポリフッ化ビニリデンフィルム(総厚み33μm)を用いた。実施例1の第1接合層51、介在層40、第2接合層52及び圧電フィルム35は、平面視で縦37.5mm×横37.5mmの寸法を有しており、平面視で輪郭が重複した非分割かつ非枠状の板状形状を有している(後述の実施例及び参考例でも同様である)。支持部材80は、平面視で縦50mm×横50mmの寸法を有しており、第1接合層51を全体的に覆っている。このようにして、図3に示す構成を有する実施例1のサンプルを作製した。
介在層40として、エチレンプロピレンゴムを含む混和物を約10倍の発泡倍率で発泡させた、厚さ3mmで半独立半連続気泡型の発泡体を用いた。この発泡体は、硫黄を含むものである。それ以外は、実施例1と同様にして、実施例2のサンプルを作製した。
実施例3では、介在層40として、実施例2の介在層40と同一材料かつ同一構造の、厚さ5mmの発泡体を用いた。それ以外は、実施例2と同様にして、実施例3のサンプルを作製した。
実施例4では、介在層40として、実施例2の介在層40と同一材料かつ同一構造の、厚さ10mmの発泡体を用いた。それ以外は、実施例2と同様にして、実施例4のサンプルを作製した。
実施例5では、介在層40として、実施例2の介在層40と同一材料かつ同一構造の、厚さ20mmの発泡体を用いた。それ以外は、実施例2と同様にして、実施例5のサンプルを作製した。
介在層40として、エチレンプロピレンゴムを含む混和物を約10倍の発泡倍率で発泡させた、厚さ20mmで半独立半連続気泡型の発泡体を用いた。この発泡体は、硫黄を含まないものであり、実施例2~5の介在層40として用いた発泡体に比べて柔軟である。それ以外は、実施例1と同様にして、実施例6のサンプルを作製した。
介在層40として、エチレンプロピレンゴムを含む混和物を約20倍の発泡倍率で発泡させた、厚さ20mmで半独立半連続気泡型の発泡体を用いた。それ以外は、実施例1と同様にして、実施例7のサンプルを作製した。
介在層40として、金属多孔体を用いた。この金属多孔体は、材料がニッケルであり、孔径が0.9mmであり、厚みが2.0mmのものである。第2接合層52として、実施例1の第1接合層51と同じ粘着層を用いた。それ以外は、実施例1と同様にして、実施例8のサンプルを作製した。
介在層40として、アクリル系粘着剤によって構成された、厚さ3mmの基材レス粘着シートを用いた。それ以外は、実施例8と同様にして、実施例9のサンプルを作製した。
介在層40として、厚さ5mmのウレタンフォームを用いた。それ以外は、実施例8と同様にして、実施例10のサンプルを作製した。
介在層40として、厚さ10mmのウレタンフォームを用いた。このウレタンフォームは、実施例10の介在層40として用いたウレタンフォームに比べて孔径が小さいものである。それ以外は、実施例8と同様にして、実施例11のサンプルを作製した。
介在層40として、厚さ5mmで独立気泡型のアクリルニトリルブタジエンゴムの発泡体を用いた。それ以外は、実施例8と同様にして、実施例12のサンプルを作製した。
介在層40として、厚さ5mmで独立気泡型のエチレンプロピレンゴムの発泡体を用いた。それ以外は、実施例8と同様にして、実施例13のサンプルを作製した。
介在層40として、天然ゴムとスチレンブタジエンゴムとがブレンドされた厚さ5mmで独立気泡型の発泡体を用いた。それ以外は、実施例8と同様にして、実施例14のサンプルを作製した。
介在層40として、厚さ5mmで独立気泡型のシリコーンの発泡体を用いた。それ以外は、実施例8と同様にして、実施例15のサンプルを作製した。
介在層40として、実施例1の介在層40と同一材料かつ同一構造の、厚さ10mmの発泡体を用いた。第2接合層52として、実施例1と同じ粘着シートを用いた。圧電フィルム35の圧電体30として、厚さ35μmのトウモロコシ由来のポリ乳酸を主原料とした樹脂シートを用いた。圧電フィルム35の第1電極61及び第2電極62は、それぞれ、厚さ0.1μmのアルミニウム膜であり、蒸着によって形成した。こうして、総厚みが35.2μmの圧電フィルム35を得た。それ以外は、実施例1と同様にして、実施例16のサンプルを作製した。
実施例1の圧電フィルム35を、参考例1のサンプルとした。参考例1では、地面に平行な台上に、接着せずにサンプルを置いた。
介在層の厚さは、厚みゲージを用いて測定した。
介在層から、小片を切り出した。切り出した小片に対して、引張試験機(TA Instruments社製「RSA-G2」)を用いて、常温で圧縮試験を行った。これにより、応力-ひずみ曲線を得た。応力-ひずみ曲線の初期傾きから、弾性率を算出した。
顕微鏡により、介在層の拡大画像を得た。この拡大画像を画像解析することにより、介在層の孔径の平均値を求めた。求めた平均値を、介在層の孔径とした。
介在層から直方体の小片を切り出した。切り出した小片の体積及び質量から見かけの密度を求めた。見かけの密度を、介在層を形成する母材(中実体)の密度で除した。これにより、充填率を算出した。さらに1から充填率を差し引いた。これにより、空孔率を得た。
実施例2~15については、上述の充填率を表面充填率とした。実施例1及び16では、介在層は表面スキン層を有しているため、表面充填率は100%とした。
実施例1~16のサンプルを測定するための構成を、図5に示す。圧電フィルム35の両面の角部に、厚さ70μmであり縦5mm×横70mmである導電性銅箔テープ70(3M社製のCU-35C)を取り付けた。また、これらの導電性銅箔テープ70のそれぞれに、みのむしクリップ75を取り付けた。導電性銅箔テープ70及びみのむしクリップ75は、圧電フィルム35に交流電圧を印加するための電気経路の一部を構成する。
・周波数範囲:100Hz~100kHz
・スイープ時間:20秒
・実効電圧:10V
・出力波形:サイン波
・測定時間:22秒
・ピークホールド
・測定範囲:4Hz~102.4kHz
・ライン数:6400
暗騒音よりも3dB以上音圧レベルが大きい周波数域(音圧レベルが暗騒音+3dB以上に保たれる周波数範囲がピーク周波数(音圧レベルがピークとなる周波数)の±10%に満たないような急峻なピーク部を除く)の下端を、音が出始める周波数と判断した。
さらに、図6を参照して説明した出力系を用い、10Vで2000Hzの電圧を実施例1のサンプル404に印加することによって、サンプル404を振動させた。振動中のサンプル404における圧電フィルム35の厚さ方向の変位を、ポリテックジャパン株式会社製のレーザドップラー振動計(PSV-400)を用いて、非接触でレーザーにより測定した。測定結果は、圧電フィルム35の両主面全体が上下に振動していることを示していた。
図3に戻って本発明による圧電スピーカーの支持構造の一例を参照する。圧電スピーカー10では、圧電フィルム35の全面が粘着層51、52及び介在層40を介して支持体80に固定されている。
Claims (6)
- 第1電極、第2電極、及び、前記第1電極と前記第2電極とに挟持された圧電体を含む圧電フィルムと、
粘着性又は接着性の第1接合層と、
前記圧電フィルムと前記第1接合層の間に配置された介在層と、を備えた圧電スピーカーであって、
前記圧電フィルムを平面視で観察したときに、前記圧電フィルムの面積の90%以上の領域において前記第1接合層が配置され、
厚さ5mmのステンレス平板に前記第1接合層の第1接合面を、前記第1接合層を全体的に覆うように張り付けた場合に、前記圧電スピーカーから可聴音域の音が出るように、前記圧電フィルムの両主面全体が、上下に振動する、圧電スピーカー。 - 前記第1接合層及び前記介在層は、それぞれ、均一な厚さを有する、請求項1に記載の圧電スピーカー。
- 前記第1接合層は、第1接合面を含み、
前記第1接合面は、
(i)露出面である、又は、
(ii)前記第1接合面から剥離可能な剥離層に覆われている、請求項1又は2に記載の圧電スピーカー。 - 前記介在層は、樹脂層及び/又は多孔体層である、請求項1~3のいずれか一項に記載の圧電スピーカー。
- 前記介在層は、接着層及び粘着層以外の、樹脂層及び/又は多孔体層である、請求項4に記載の圧電スピーカー。
- 前記圧電フィルムを平面視で観察したときに、前記圧電フィルムの面積の90%以上の領域において前記介在層が配置されている、請求項1~5のいずれか一項に記載の圧電スピーカー。
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