JP7341595B2 - flow sensor - Google Patents

flow sensor Download PDF

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JP7341595B2
JP7341595B2 JP2019220952A JP2019220952A JP7341595B2 JP 7341595 B2 JP7341595 B2 JP 7341595B2 JP 2019220952 A JP2019220952 A JP 2019220952A JP 2019220952 A JP2019220952 A JP 2019220952A JP 7341595 B2 JP7341595 B2 JP 7341595B2
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flow rate
resistance element
rate detection
heat conduction
insulating substrate
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JP2021089249A (en
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智一 池野
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Koa Corp
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Koa Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P5/00—Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft
    • G01P5/10—Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft by measuring thermal variables
    • G01P5/12—Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft by measuring thermal variables using variation of resistance of a heated conductor

Description

この発明は、例えば、風速を計測可能な流量センサに関する。 The present invention relates to, for example, a flow rate sensor that can measure wind speed.

加熱した流量検知用抵抗素子を流体に曝し、その際の放熱作用に基づいて流体の流量を検出する熱式の流量センサが知られている。例えば、特許文献１には、基板の表面に流量検知用抵抗素子と、流体の温度を検知するための温度補償用抵抗素子を配置した流量センサについて開示されている。 2. Description of the Related Art A thermal flow rate sensor is known that exposes a heated resistance element for flow rate detection to a fluid and detects the flow rate of the fluid based on the heat dissipation effect at that time. For example, Patent Document 1 discloses a flow sensor in which a resistance element for detecting flow rate and a resistance element for temperature compensation for detecting the temperature of fluid are arranged on the surface of a substrate.

特開平８－３５９７８号公報Japanese Patent Application Publication No. 8-35978

しかしながら、特許文献１の構成では、絶縁基板の表面上を流れる流体は、風向によって、流量検知用抵抗素子に到達する前に、温度補償用抵抗素子や各種電子部品が障壁となり、適切に流量検知を行うことができない問題があった。すなわち、特許文献１の構成では、絶縁基板の表面上を流れる全方向からの流量検知を高精度に行うことができない。 However, in the configuration of Patent Document 1, depending on the wind direction, the temperature compensation resistance element and various electronic components act as barriers before the fluid flowing on the surface of the insulating substrate reaches the flow rate detection resistance element, making it difficult to properly detect the flow rate. There was a problem where I couldn't do it. That is, with the configuration of Patent Document 1, it is not possible to detect the flow rate from all directions on the surface of the insulating substrate with high accuracy.

そこで本発明は、上記問題に鑑みてなされたもので、絶縁基板の表面上を流れる全方向からの流量検知を可能とする流量センサを提供することを目的とする。 The present invention has been made in view of the above problems, and an object of the present invention is to provide a flow rate sensor that can detect the flow rate from all directions flowing on the surface of an insulating substrate.

本発明における流量センサは、絶縁基板と、前記絶縁基板の厚み方向に貫く第１の熱伝導部と、前記第１の熱伝導部の流量検知面とは反対側に配置される流量検知用抵抗素子と、前記流量検知用抵抗素子と同じ面側に配置される温度補償用抵抗素子と、を有することを特徴とする。 The flow rate sensor according to the present invention includes an insulating substrate, a first heat conduction portion penetrating the insulating substrate in the thickness direction, and a flow rate detection resistor disposed on the opposite side of the flow rate detection surface of the first heat conduction portion. and a temperature compensation resistance element disposed on the same side as the flow rate detection resistance element.

本発明の流量センサにおいては、絶縁基板に、厚み方向に貫く第１の熱伝導部を設け、第１の熱伝導部の、流量検知面とは反対側に流量検知用抵抗素子を配置した。また、温度補償用抵抗素子を、流量検知用抵抗素子と同じ面側に配置した。これにより、流量検知面に沿って流れる流量の３６０°検知が可能になる。 In the flow rate sensor of the present invention, the insulating substrate is provided with the first thermally conductive portion penetrating in the thickness direction, and the flow rate sensing resistive element is disposed on the opposite side of the first thermally conductive portion from the flow rate sensing surface. Further, the temperature compensation resistance element was arranged on the same side as the flow rate detection resistance element. This enables 360° detection of the flow rate flowing along the flow rate detection surface.

本実施の形態における流量センサの斜視図である。FIG. 2 is a perspective view of a flow rate sensor in this embodiment. 本実施の形態における流量センサを裏側から見た斜視図（保護層は非表示）である。It is a perspective view (a protective layer is not shown) of a flow rate sensor in this embodiment seen from the back side. 図２から流量検知用抵抗素子及び温度補償用抵抗素子を除去した状態のプリント基板の裏面斜視図である。FIG. 3 is a rear perspective view of the printed circuit board with the flow rate detection resistance element and the temperature compensation resistance element removed from FIG. 2; 本実施の形態における流量センサの部分拡大断面図である。FIG. 3 is a partially enlarged cross-sectional view of the flow sensor according to the present embodiment. 本実施の形態における流量センサの部分拡大平面図である。FIG. 3 is a partially enlarged plan view of the flow rate sensor according to the present embodiment. 本実施の形態における流量検知用抵抗素子の設置付近を示す部分拡大断面図である。FIG. 3 is a partially enlarged cross-sectional view showing the vicinity of the installation of the flow rate detection resistance element in the present embodiment. 本実施の形態の流量センサの回路図である。FIG. 3 is a circuit diagram of a flow rate sensor according to the present embodiment.

以下、本発明の一実施の形態（以下、「実施の形態」と略記する。）について、詳細に説明する。なお、本発明は、以下の実施の形態に限定されるものではなく、その要旨の範囲内で種々変形して実施することができる。 Hereinafter, one embodiment of the present invention (hereinafter abbreviated as "embodiment") will be described in detail. Note that the present invention is not limited to the following embodiments, and can be implemented with various modifications within the scope of the gist.

本実施の形態の流量センサ１は、熱式の流量センサ１であり、絶縁基板２と、絶縁基板２に配置された流量検知用抵抗素子３及び、温度補償用抵抗素子４と、を有して構成される。図１等に示すように、流量検知用抵抗素子３及び、温度補償用抵抗素子４は、絶縁基板２の表面には現れていない。 The flow rate sensor 1 according to the present embodiment is a thermal type flow rate sensor 1, and includes an insulating substrate 2, a flow rate detection resistance element 3 disposed on the insulating substrate 2, and a temperature compensation resistance element 4. It consists of As shown in FIG. 1 and the like, the flow rate detection resistance element 3 and the temperature compensation resistance element 4 do not appear on the surface of the insulating substrate 2.

絶縁基板２を特に限定するものではないが、フレキシブルプリント基板（ＦＰＣ）を使用することができる。或いは、ガラスクロスにエポキシ樹脂を含浸させたプリント基板であってもよく、例えば、ＦＲ４基板を提示することができる。ただし、フレキシブルプリント基板のほうが、ＦＲ４基板より薄く、表裏の熱伝導が良いため好ましい。 Although the insulating substrate 2 is not particularly limited, a flexible printed circuit board (FPC) can be used. Alternatively, it may be a printed circuit board made of glass cloth impregnated with epoxy resin; for example, an FR4 board can be presented. However, a flexible printed circuit board is preferable because it is thinner than the FR4 board and has better heat conduction between the front and back sides.

絶縁基板２は、流量検知面（外面）２ａと、流量検知面２ａとは反対側の裏面２ｂの、相対向する２つの主面を有する。図１では、流量検知面２ａを表側に向けて図示した。図２では、裏面２ｂを表側に向けて図示した。なお、図２では、図１等に図示された保護層２０を非表示とした。 The insulating substrate 2 has two main surfaces facing each other, a flow rate detection surface (outer surface) 2a and a back surface 2b on the opposite side from the flow rate detection surface 2a. In FIG. 1, the flow rate sensing surface 2a is shown facing toward the front side. In FIG. 2, the back surface 2b is shown facing the front side. In addition, in FIG. 2, the protective layer 20 illustrated in FIG. 1 etc. is not shown.

図１や図４、図５等に示すように、絶縁基板２の中央部には、絶縁基板２の流量検知面２ａから裏面２ｂに貫く第１の熱伝導部５が設けられている。第１の熱伝導部５は、平面視にて円形状で形成されることが好ましい。すなわち、第１の熱伝導部５は、流量検知面２ａ及び、裏面２ｂに円形状で現れることが好ましい。 As shown in FIG. 1, FIG. 4, FIG. 5, etc., a first heat conductive portion 5 is provided in the center of the insulating substrate 2, penetrating from the flow rate sensing surface 2a of the insulating substrate 2 to the back surface 2b. It is preferable that the first heat conductive part 5 is formed in a circular shape in a plan view. That is, it is preferable that the first heat conductive part 5 appears in a circular shape on the flow rate sensing surface 2a and the back surface 2b.

また、第１の熱伝導部５は、流量検知用抵抗素子３の対向面積よりも広いことが好ましい。すなわち、流量検知用抵抗素子３全体が、第１の熱伝導部５の内側に位置することが好ましい。 Moreover, it is preferable that the first heat conduction part 5 is wider than the opposing area of the flow rate detection resistive element 3. That is, it is preferable that the entire flow rate detection resistive element 3 is located inside the first heat conduction section 5.

図１や図４、図５等に示すように、第１の熱伝導部５の外側の絶縁基板２には、第１の熱伝導部５と略等間隔の位置に、第２の熱伝導部６が形成されている。第２の熱伝導部６は、円形リング形状であることが好ましい。すなわち、第２の熱伝導部６は、流量検知面２ａ及び、裏面２ｂに円形リング形状で現れることが好ましい。第２の熱伝導部６は全域が、一定幅で形成されることが好ましい。 As shown in FIG. 1, FIG. 4, FIG. 5, etc., the insulating substrate 2 outside the first heat conductive part 5 has a second heat conductive plate at a position approximately equidistant from the first heat conductive part 5. A portion 6 is formed. It is preferable that the second heat conductive part 6 has a circular ring shape. That is, it is preferable that the second heat conductive part 6 appears in a circular ring shape on the flow rate sensing surface 2a and the back surface 2b. It is preferable that the entire second heat conductive portion 6 is formed with a constant width.

第１の熱伝導部５及び、第２の熱伝導部６は、絶縁基板２に比べて熱伝導率が高い金属であり、材質を限定するものではないが、好ましくは、銅或いは銅合金で形成される。 The first heat conductive part 5 and the second heat conductive part 6 are made of a metal having higher thermal conductivity than the insulating substrate 2, and are preferably made of copper or a copper alloy, although the material is not limited. It is formed.

図４に示すように、第１の熱伝導部５の裏面側には、絶縁層７を介して、流量検知用抵抗素子３が配置されている。また、第２の熱伝導部６の裏面側には、絶縁層７を介して、温度補償用抵抗素子４が配置されている。これにより、流量検知用抵抗素子３と第１の熱伝導部５は、電気的に絶縁されており、温度補償用抵抗素子４と、第２の熱伝導部６は、電気的に絶縁されている。絶縁層７は、無機材料層であっても有機材料層であってもどちらでもよい。 As shown in FIG. 4, a flow rate detection resistive element 3 is arranged on the back side of the first heat conductive section 5 with an insulating layer 7 interposed therebetween. Furthermore, a temperature compensating resistance element 4 is arranged on the back side of the second thermally conductive section 6 with an insulating layer 7 interposed therebetween. As a result, the flow rate detection resistance element 3 and the first heat conduction part 5 are electrically insulated, and the temperature compensation resistance element 4 and the second heat conduction part 6 are electrically insulated. There is. The insulating layer 7 may be an inorganic material layer or an organic material layer.

また、流量検知用抵抗素子３は、第１の熱伝導部５の中心に配置されることが好ましい。また、温度補償用抵抗素子４は、第２の熱伝導部６と重なっていれば、流量検知用抵抗素子３からみて、どの方向に配置されていてもよいが、図２に示すように、配線パターン９ａ～９ｄの引き回しを考慮すると、温度補償用抵抗素子４を、流量検知用抵抗素子３よりも、配線パターン９ａ～９ｄを引き出す配線引出部８側に配置することが好ましい。 Further, it is preferable that the flow rate detection resistive element 3 is arranged at the center of the first heat conduction section 5. Further, the temperature compensation resistance element 4 may be placed in any direction from the flow rate detection resistance element 3 as long as it overlaps with the second heat conduction part 6, but as shown in FIG. Considering the routing of the wiring patterns 9a to 9d, it is preferable to arrange the temperature compensation resistance element 4 closer to the wiring extraction part 8 from which the wiring patterns 9a to 9d are drawn out than the flow rate detection resistance element 3.

図４に示す絶縁層７は、絶縁基板２の裏面２ｂの全域に形成されることが好ましく、絶縁層７の外面に、図３に示す配線パターン９ａ～９ｄが形成されている。なお、図３では、絶縁層７を省略した。 The insulating layer 7 shown in FIG. 4 is preferably formed over the entire back surface 2b of the insulating substrate 2, and wiring patterns 9a to 9d shown in FIG. 3 are formed on the outer surface of the insulating layer 7. Note that in FIG. 3, the insulating layer 7 is omitted.

図３に示すように、絶縁基板２には、４本の配線パターン９ａ～９ｄが形成されており、うち２本の配線パターン９ａ、９ｂは、第１の熱伝導部５と重なる位置まで引き出されている。各配線パターン９ａ、９ｂの先端は、配線パターン９ａ、９ｂよりも幅の広いランド１０ａ、１０ｂを構成している。また、ランド１０ａ、１０ｂの間には、金属部１１ａが形成されている。そして、金属部１１ａの両側から、ランド１０ａ、１０ｂの並び方向とは直交する方向に、金属延出部１２ａ、１２ｂが形成されている。金属延出部１２ａ、１２ｂには、第１の熱伝導部５に繋がる複数の導通部１３が形成されている。本実施の形態では、ランド１０ａ、１０ｂと、金属部１１ａは、電気的に接続されていない。 As shown in FIG. 3, four wiring patterns 9a to 9d are formed on the insulating substrate 2, of which two wiring patterns 9a and 9b are pulled out to a position overlapping with the first heat conductive part 5. It is. The ends of each wiring pattern 9a, 9b constitute lands 10a, 10b wider than the wiring patterns 9a, 9b. Furthermore, a metal portion 11a is formed between the lands 10a and 10b. Metal extending portions 12a and 12b are formed from both sides of the metal portion 11a in a direction perpendicular to the direction in which the lands 10a and 10b are arranged. A plurality of conductive parts 13 connected to the first heat conductive part 5 are formed in the metal extension parts 12a and 12b. In this embodiment, lands 10a, 10b and metal portion 11a are not electrically connected.

図３に示すように、配線パターン９ｃ、９ｄは、第２の熱伝導部６と重なる位置まで引き出されている。各配線パターン９ｃ、９ｄの先端は、配線パターン９ｃ、９ｄよりも幅の広いランド１０ｃ、１０ｄを構成している。また、ランド１０ｃ、１０ｄの間には、金属部１１ｂが形成されている。そして、金属部１１ｂの両側から、ランド１０ｃ、１０ｄの並び方向とは直交する方向に、金属延出部１２ｃ、１２ｄが形成されている。金属延出部１２ｃ、１２ｄには、第２の熱伝導部６に繋がる複数の導通部１３が形成されている。本実施の形態では、ランド１０ｃ、１０ｃと、金属部１１ｂは、電気的に接続されていない。 As shown in FIG. 3, the wiring patterns 9c and 9d are drawn out to a position where they overlap with the second heat conductive section 6. As shown in FIG. The tips of each of the wiring patterns 9c and 9d constitute lands 10c and 10d that are wider than the wiring patterns 9c and 9d. Furthermore, a metal portion 11b is formed between the lands 10c and 10d. Metal extending portions 12c and 12d are formed from both sides of the metal portion 11b in a direction perpendicular to the direction in which the lands 10c and 10d are arranged. A plurality of conductive parts 13 connected to the second heat conductive part 6 are formed in the metal extension parts 12c and 12d. In this embodiment, lands 10c, 10c and metal portion 11b are not electrically connected.

図６は、流量検知用抵抗素子３の設置付近を示す部分拡大断面図である。図６に示すように、流量検知用抵抗素子３は、チップ型抵抗器である。図６に示すように、流量検知用抵抗素子３は、セラミック基板１６と、セラミック基板１６の表面に形成された抵抗層１７と、抵抗層１７と電気的に接続され、セラミック基板１６の表面に設けられた端子１８と、を有して構成される。図６に示すように、端子１８は、セラミック基板１６の両側の側面に形成され、抵抗層１７と電気的に接続する位置から側面を通って、第１の熱伝導部５と対向する裏面位置まで延出している。限定するものではないが、抵抗層１７は、例えば、白金を主成分として形成される。 FIG. 6 is a partially enlarged sectional view showing the vicinity of the installation of the flow rate detection resistive element 3. As shown in FIG. As shown in FIG. 6, the flow rate detection resistive element 3 is a chip resistor. As shown in FIG. 6, the flow rate detection resistance element 3 is electrically connected to a ceramic substrate 16, a resistance layer 17 formed on the surface of the ceramic substrate 16, and a resistance layer 17 formed on the surface of the ceramic substrate 16. and a terminal 18 provided therein. As shown in FIG. 6, the terminals 18 are formed on both side surfaces of the ceramic substrate 16, passing through the side surfaces from a position where they are electrically connected to the resistance layer 17, to a position on the back surface facing the first thermally conductive part 5. It has been extended to Although not limited to this, the resistance layer 17 is formed mainly of platinum, for example.

図６に示すように、流量検知用抵抗素子３は、端子１８の部分で、絶縁基板２の裏面２ｂに絶縁層７を介して形成されたランド１０ａ、１０ｂに、半田層１９を介して面実装されている。 As shown in FIG. 6, the flow rate detection resistive element 3 is connected to lands 10a and 10b formed on the back surface 2b of the insulating substrate 2 via the insulating layer 7 at the terminal 18 portion via the solder layer 19. Implemented.

図示しないが、温度補償用抵抗素子４も、図６に示す流量検知用抵抗素子３と同様の設置構造とされている。 Although not shown, the temperature compensation resistance element 4 also has the same installation structure as the flow rate detection resistance element 3 shown in FIG.

また、図６には、図示していないが、図１や図４に示すように、絶縁基板２の裏面２ｂには、電気絶縁性の保護層２０が設けられており、流量検知用抵抗素子３及び温度補償用抵抗素子４が、保護層２０内に埋設されている。したがって、流体は、流量検知用抵抗素子３及び温度補償用抵抗素子４に直接接触しない。 Although not shown in FIG. 6, as shown in FIGS. 1 and 4, an electrically insulating protective layer 20 is provided on the back surface 2b of the insulating substrate 2, and a resistive element for flow rate detection is provided on the back surface 2b of the insulating substrate 2. 3 and a temperature-compensating resistance element 4 are embedded in the protective layer 20. Therefore, the fluid does not directly contact the flow rate sensing resistive element 3 and the temperature compensating resistive element 4.

図７は、本実施の形態の流量センサの回路図である。図７に示すように、流量検知用抵抗素子３と、温度補償用抵抗素子４と、抵抗器２６、２７とでブリッジ回路２８を構成している。図７に示すように、流量検知用抵抗素子３と抵抗器２６とで第１の直列回路２９を構成し、温度補償用抵抗素子４と抵抗器２７とで第２の直列回路３０を構成している。そして、第１の直列回路２９と第２の直列回路３０とが、並列に接続されてブリッジ回路２８を構成している。 FIG. 7 is a circuit diagram of the flow rate sensor of this embodiment. As shown in FIG. 7, a bridge circuit 28 is composed of the flow rate detection resistance element 3, the temperature compensation resistance element 4, and the resistors 26 and 27. As shown in FIG. 7, the flow rate detection resistance element 3 and the resistor 26 constitute a first series circuit 29, and the temperature compensation resistance element 4 and the resistor 27 constitute a second series circuit 30. ing. The first series circuit 29 and the second series circuit 30 are connected in parallel to form a bridge circuit 28.

図７に示すように、第１の直列回路２９の出力部３１と、第２の直列回路３０の出力部３２とが、夫々、差動増幅器（アンプ）３３に接続されている。ブリッジ回路２８には、差動増幅器３３を含めたフィードバック回路３４が接続されている。フィードバック回路３４には、トランジスタ（図示せず）等が含まれる。 As shown in FIG. 7, the output section 31 of the first series circuit 29 and the output section 32 of the second series circuit 30 are each connected to a differential amplifier (amplifier) 33. A feedback circuit 34 including a differential amplifier 33 is connected to the bridge circuit 28 . The feedback circuit 34 includes a transistor (not shown) and the like.

抵抗器２６、２７は、流量検知用抵抗素子３、及び温度補償用抵抗素子４よりも抵抗温度係数（ＴＣＲ）が小さい。流量検知用抵抗素子３は、例えば、所定の周囲温度よりも所定値だけ高くなるように制御された加熱状態で、所定の抵抗値Ｒｓ１を有し、また、温度補償用抵抗素子４は、例えば、前記の周囲温度にて、所定の抵抗値Ｒｓ２を有するように制御されている。なお、抵抗値Ｒｓ１は、抵抗値Ｒｓ２よりも小さい。限定するものではないが、例えば、抵抗値Ｒｓ２は、抵抗値Ｒｓ１の数倍～十数倍程度である。流量検知用抵抗素子３と第１の直列回路２９を構成する抵抗器２６は、例えば、流量検知用抵抗素子３の抵抗値Ｒｓ１と同様の抵抗値Ｒ１を有する固定抵抗器である。また、温度補償用抵抗素子４と第２の直列回路３０を構成する抵抗器２７は、例えば、温度補償用抵抗素子４の抵抗値Ｒｓ２と同様の抵抗値Ｒ２を有する固定抵抗器である。 The resistors 26 and 27 have a smaller temperature coefficient of resistance (TCR) than the flow rate detection resistance element 3 and the temperature compensation resistance element 4. The flow rate detection resistance element 3 has, for example, a predetermined resistance value Rs1 in a heated state controlled to be higher than a predetermined ambient temperature by a predetermined value, and the temperature compensation resistance element 4 has, for example, a predetermined resistance value Rs1. , is controlled to have a predetermined resistance value Rs2 at the above-mentioned ambient temperature. Note that the resistance value Rs1 is smaller than the resistance value Rs2. Although not limited to this, for example, the resistance value Rs2 is about several times to more than ten times the resistance value Rs1. The resistor 26 that constitutes the first series circuit 29 with the flow rate detection resistance element 3 is, for example, a fixed resistor having a resistance value R1 similar to the resistance value Rs1 of the flow rate detection resistance element 3. Further, the resistor 27 that constitutes the second series circuit 30 with the temperature compensation resistance element 4 is, for example, a fixed resistor having a resistance value R2 similar to the resistance value Rs2 of the temperature compensation resistance element 4.

本実施の形態の流量センサ１は、例えば、風速センサである。無風状態では、差動増幅器３３からの差動出力がほぼゼロとなるように制御されている。無風状態から風が作用すると、発熱抵抗である流量検知用抵抗素子３の温度は低下し、流量検知用抵抗素子３が接続された第１の直列回路２９の出力部３１の電位が変動する。これにより、差動増幅器３３により差動出力が得られる。そして、フィードバック回路３４では、差動出力に基づいて、流量検知用抵抗素子３に駆動電圧を印加する。流量センサ１は、流量検知用抵抗素子３の加熱に要する電圧の変化に基づいて風速を換算し出力することができる。風速が変化すると、それに伴い、流量検知用抵抗素子３の温度が変化するため、風速を検知することができる。 The flow rate sensor 1 of this embodiment is, for example, a wind speed sensor. In a windless state, the differential output from the differential amplifier 33 is controlled to be approximately zero. When wind acts from a calm state, the temperature of the flow rate detection resistance element 3, which is a heat generating resistor, decreases, and the potential of the output section 31 of the first series circuit 29 to which the flow rate detection resistance element 3 is connected changes. As a result, a differential output is obtained by the differential amplifier 33. Then, the feedback circuit 34 applies a drive voltage to the flow rate detection resistive element 3 based on the differential output. The flow rate sensor 1 can convert and output the wind speed based on a change in the voltage required to heat the flow rate detection resistive element 3. When the wind speed changes, the temperature of the flow rate detection resistive element 3 changes accordingly, so that the wind speed can be detected.

ここで、本実施の形態では、流量検知用抵抗素子３の熱は、絶縁基板２を貫く第１の熱伝導部５を介して流量検知面２ａに放熱される。そのため、風が、流量検知面２ａ上を流れると、第１の熱伝導部５を介して、流量検知用抵抗素子３の温度は低下し、上記した原理に基づいて風速検知が可能になる。 Here, in this embodiment, the heat of the flow rate detection resistive element 3 is radiated to the flow rate detection surface 2a via the first heat conduction section 5 that penetrates the insulating substrate 2. Therefore, when the wind flows on the flow rate detection surface 2a, the temperature of the flow rate detection resistance element 3 decreases via the first heat conduction part 5, and wind speed detection becomes possible based on the above-described principle.

また、流量検知用抵抗素子３とともに、温度補償用抵抗素子４を、絶縁基板２の裏面２ｂ側に配置しており、流量検知用抵抗素子３及び、温度補償用抵抗素子４は、流量検知面２ａに現れていない。したがって、図５の平面図に示すように、第１の熱伝導部５が露出する絶縁基板２の流量検知面２ａに沿う風向Ａ～Ｄが変化しても、同様に、第１の熱伝導部５に作用する。図５では、風向Ａ～Ｄを９０°間隔で示したが、３６０°の全方位からの風が第１の熱伝導部５に同様に作用するため、絶縁基板２の流量検知面２ａに沿う全方向の風量検知を行うことが可能である。特に、本実施の形態のように、第１の熱伝導部５が平面視円形状で形成されることで、第１の熱伝導部５の外周と流量検知用抵抗素子３との間の距離を、どの方向からでも同じにできる。このため、風量が同じ風が、どの方向から作用しても、流量検知用抵抗素子３の温度低下を同じにでき、より効果的に高精度な流量検知、特に、応答性を改善することができる。 Further, together with the flow rate detection resistance element 3, a temperature compensation resistance element 4 is arranged on the back surface 2b side of the insulating substrate 2, and the flow rate detection resistance element 3 and the temperature compensation resistance element 4 are arranged on the flow rate detection surface. It does not appear in 2a. Therefore, as shown in the plan view in FIG. 5. In FIG. 5, wind directions A to D are shown at 90° intervals, but since wind from all directions of 360° acts on the first heat conduction part 5 in the same way, It is possible to detect air volume in all directions. In particular, as in the present embodiment, since the first heat conductive part 5 is formed in a circular shape in plan view, the distance between the outer periphery of the first heat conductive part 5 and the flow rate detection resistive element 3 is can be the same from any direction. Therefore, the temperature drop of the flow rate detection resistive element 3 can be made the same regardless of the direction in which the same amount of air is applied, making it possible to more effectively and accurately detect the flow rate, and in particular, improve responsiveness. can.

本実施の形態では、流量検知用抵抗素子３と第１の熱伝導部５との間に、金属部１１ａを配置している。また、金属部１１ａには、第１の熱伝導部５に繋がる金属延出部１２ａ、１２ｂが設けられており、より効果的に、流量検知用抵抗素子３と、第１の熱伝導部５の間の熱伝導性を高めることが可能になっている。 In this embodiment, a metal portion 11a is disposed between the flow rate sensing resistive element 3 and the first thermally conductive portion 5. Further, the metal portion 11a is provided with metal extension portions 12a and 12b connected to the first heat conduction portion 5, which more effectively connects the flow rate detection resistive element 3 and the first heat conduction portion 5. This makes it possible to increase the thermal conductivity between the two.

本実施の形態では、第１の熱伝導部５の外側に、絶縁基板２を貫く円形リング形状の第２の熱伝導部６を設け、温度補償用抵抗素子４を、第２の熱伝導部６の裏面側に配置している。これにより、流量検知用抵抗素子３と温度補償用抵抗素子４の間を、適切に熱分離することができ、応答性を向上させることができる。特に、本実施の形態では、円形状の第１の熱伝導部５と、円形リング形状の第２の熱伝導部６を配置することで、第１の熱伝導部５と、第２の熱伝導部６の間の間隔は、略一定となる。したがって、温度補償用抵抗素子４を、第２の熱伝導部６の裏面側のどの位置に配置しても、均一な熱分離が可能であり、高精度な応答性を実現できる。 In this embodiment, a circular ring-shaped second heat conduction part 6 penetrating through the insulating substrate 2 is provided outside the first heat conduction part 5, and the temperature compensation resistance element 4 is connected to the second heat conduction part 5. It is placed on the back side of 6. Thereby, it is possible to appropriately thermally isolate between the flow rate sensing resistive element 3 and the temperature compensating resistive element 4, and the responsiveness can be improved. In particular, in this embodiment, by arranging the circular first heat conductive part 5 and the circular ring-shaped second heat conductive part 6, the first heat conductive part 5 and the second heat conductive part 5 are arranged. The spacing between the conductive parts 6 is approximately constant. Therefore, no matter where the temperature compensating resistance element 4 is placed on the back surface side of the second thermally conductive section 6, uniform thermal isolation is possible and highly accurate responsiveness can be achieved.

また、図２、図３に示すように、温度補償用抵抗素子４と第２の熱伝導部６との間に、金属部１１ｂを配置しており、金属部１１ｂには、第２の熱伝導部６に繋がる金属延出部１２ｃ、１２ｄが設けられている。これにより、温度補償用抵抗素子４と、第２の熱伝導部６の間の熱伝導性を高めることが可能になっている。これにより温度補償用抵抗素子４にて、流体そのものの温度を精度良く検知でき、流体の温度変化の影響を効果的に補償することができる。このため、流量検知を精度よく行うことができる。 Further, as shown in FIGS. 2 and 3, a metal part 11b is arranged between the temperature compensation resistance element 4 and the second heat conduction part 6, and the metal part 11b has a second heat conduction part 11b. Metal extensions 12c and 12d connected to the conductive portion 6 are provided. This makes it possible to increase the thermal conductivity between the temperature compensating resistance element 4 and the second thermally conductive section 6. As a result, the temperature of the fluid itself can be detected with high precision by the temperature compensating resistance element 4, and the influence of temperature changes in the fluid can be effectively compensated for. Therefore, flow rate detection can be performed with high accuracy.

以上のように、本実施の形態及び変形例を説明したが、他の実施の形態として、上記実施の形態及び変形例を全体的又は部分的に組み合わせたものでもよい。 As described above, the present embodiment and the modified examples have been described, but the above embodiments and the modified examples may be combined in whole or in part as other embodiments.

また、本実施の形態は上記の実施の形態及び変形例に限定されるものではなく、技術的思想の趣旨を逸脱しない範囲において様々に変更、置換、変形されてもよい。さらに、技術の進歩又は派生する別技術によって、技術的思想を別の仕方で実現することができれば、その方法を用いて実施されてもよい。したがって、特許請求の範囲は、技術的思想の範囲内に含まれ得る全ての実施態様をカバーしている。 Further, the present embodiment is not limited to the above-described embodiments and modified examples, and may be variously changed, replaced, and modified without departing from the spirit of the technical idea. Further, if the technical idea can be realized in a different manner due to advances in technology or other derived technologies, the invention may be implemented using that method. Accordingly, the claims cover all embodiments that may fall within the scope of the technical spirit.

例えば、上記の実施の形態では、第１の熱伝導部５の形状を平面視円形状としたが、平面視円形状でなくてもよく、平面視多角形状等を例示できる。第１の熱伝導部５を平面視多角形としたとき、第２の熱伝導部６の形状は、多角形リング形状として、第１の熱伝導部５と第２の熱伝導部６の間の間隔を、略一定となるようにすることが好ましい。ただし、第１の熱伝導部５を平面視円形状で形成し、第２の熱伝導部６を円形リング形状で形成することが、流量の３６０°検知を精度良く行なうことができ好適である。 For example, in the above-described embodiment, the first heat conductive portion 5 has a circular shape in plan view, but it does not have to be circular in plan view, and may be polygonal in plan view. When the first heat conduction part 5 is a polygon in plan view, the shape of the second heat conduction part 6 is a polygonal ring shape between the first heat conduction part 5 and the second heat conduction part 6. It is preferable that the intervals between the two be substantially constant. However, it is preferable to form the first heat conductive part 5 in a circular shape in plan view and to form the second heat conductive part 6 in a circular ring shape, since this allows accurate 360° detection of the flow rate. .

また、上記では、本実施の形態の流量センサ１を、風速センサとして説明したが、風速センサに限定されるものではない。本実施の形態では、風以外の流体、例えば、ガス流や、水等の液体を対象とした流量センサであってもよい。
下記に、上記実施の形態における特徴点を整理する。 Moreover, although the flow rate sensor 1 of this embodiment was described above as a wind speed sensor, it is not limited to a wind speed sensor. In this embodiment, the flow rate sensor may be used for a fluid other than wind, for example, a gas flow or a liquid such as water.
The characteristic points of the above embodiment are summarized below.

上記実施の形態に記載の流量センサは、絶縁基板と、前記絶縁基板の厚み方向に貫く第１の熱伝導部と、前記第１の熱伝導部の流量検知面とは反対側に配置される流量検知用抵抗素子と、前記流量検知用抵抗素子と同じ面側に配置される温度補償用抵抗素子と、を有することを特徴とする。 The flow rate sensor described in the above embodiment includes an insulating substrate, a first heat conductive portion penetrating the insulating substrate in the thickness direction, and an opposite side of the flow rate sensing surface of the first heat conductive portion. It is characterized by having a flow rate detection resistance element and a temperature compensation resistance element disposed on the same side as the flow rate detection resistance element.

上記実施の形態に記載の流量センサは、前記第１の熱伝導部は、平面視円形状であることが好ましい。 In the flow rate sensor described in the above embodiment, it is preferable that the first heat conductive part has a circular shape in plan view.

上記実施の形態に記載の流量センサは、更に、前記第１の熱伝導部の外側に、前記第１の熱伝導部から略等距離、離れた位置に、前記絶縁基板を厚み方向に貫くリング状の第２の熱伝導部を有し、前記第２の熱伝導部の前記流量検知面とは反対側に、前記温度補償用抵抗素子が配置されることが好ましい。 The flow rate sensor according to the above embodiment further includes a ring that penetrates the insulating substrate in the thickness direction, and is located on the outside of the first thermally conductive portion at a position approximately equal distance away from the first thermally conductive portion. It is preferable that the temperature compensating resistance element is disposed on the opposite side of the flow rate detection surface of the second heat conduction part.

上記実施の形態に記載の流量センサは、前記流量検知用抵抗素子は、セラミック基板と、前記セラミック基板の表面に設けられた抵抗層と、前記抵抗層と電気的に接続し、前記セラミック基板の表面に設けられた端子と、を有して構成されており、前記端子は、前記第１の熱伝導部の前記流量検知面とは反対側に形成されたランドに電気的に接続されていることが好ましい。 In the flow rate sensor described in the above embodiment, the flow rate detection resistance element is electrically connected to a ceramic substrate, a resistance layer provided on a surface of the ceramic substrate, and the resistance layer, and a terminal provided on the surface, and the terminal is electrically connected to a land formed on the opposite side of the flow rate detection surface of the first heat conduction section. It is preferable.

本発明における流量センサは、絶縁基板の表面に沿う全方向からの流量検知を可能とする。このため、本発明の流量センサを、例えば、風速を検知できる風速センサに適用したとき、流量検出方向の指向性を無くすことができ、風向が特に定まっていない様々なアプリケーションに適用可能である。 The flow rate sensor according to the present invention enables flow rate detection from all directions along the surface of the insulating substrate. Therefore, when the flow rate sensor of the present invention is applied to, for example, a wind speed sensor capable of detecting wind speed, the directivity of the flow rate detection direction can be eliminated, and it can be applied to various applications where the wind direction is not particularly determined.

１ ：流量センサ
２ ：絶縁基板
２ａ ：流量検知面
２ｂ ：裏面
３ ：流量検知用抵抗素子
４ ：温度補償用抵抗素子
５ ：第１の熱伝導部
６ ：第２の熱伝導部
７ ：絶縁層
８ ：配線引出部
９ａ～９ｄ ：配線パターン
１０ａ～１０ｄ ：ランド
１１ａ、１１ｂ ：金属部
１２ａ～１２ｄ ：金属延出部
１３ ：導通部
１６ ：セラミック基板
１７ ：抵抗層
１８ ：端子
１９ ：半田層
２０ ：保護層
２６、２７ ：抵抗器
２８ ：ブリッジ回路
２９ ：第１の直列回路
３０ ：第２の直列回路
３１、３２ ：出力部
３３ ：差動増幅器
３４ ：フィードバック回路
Ａ～Ｄ ：風向

1: Flow rate sensor 2: Insulating substrate 2a: Flow rate detection surface 2b: Back surface 3: Resistance element for flow rate detection 4: Resistance element for temperature compensation 5: First heat conduction section 6: Second heat conduction section 7: Insulation layer 8: Wiring lead-out portions 9a to 9d: Wiring patterns 10a to 10d: Lands 11a, 11b: Metal portions 12a to 12d: Metal extension portions 13: Conductive portions 16: Ceramic substrate 17: Resistance layer 18: Terminals 19: Solder layer 20 : Protective layer 26, 27 : Resistor 28 : Bridge circuit 29 : First series circuit 30 : Second series circuit 31, 32 : Output section 33 : Differential amplifier 34 : Feedback circuit A to D : Wind direction

Claims (4)

絶縁基板と、
前記絶縁基板の厚み方向に貫く第１の熱伝導部と、
前記第１の熱伝導部の流量検知面とは反対側に配置される流量検知用抵抗素子と、
前記流量検知用抵抗素子と同じ面側に配置される温度補償用抵抗素子と、
を有することを特徴とする流量センサ。 an insulating substrate;
a first thermally conductive portion penetrating the insulating substrate in the thickness direction;
a flow rate detection resistive element disposed on the opposite side of the flow rate detection surface of the first heat conduction section;
a temperature compensation resistance element disposed on the same side as the flow rate detection resistance element;
A flow rate sensor characterized by having: 前記第１の熱伝導部は、平面視円形状であること特徴とする請求項１に記載の流量センサ。 The flow rate sensor according to claim 1, wherein the first heat conduction section has a circular shape in plan view. 更に、前記第１の熱伝導部の外側に、前記第１の熱伝導部から略等距離、離れた位置に、前記絶縁基板を厚み方向に貫くリング状の第２の熱伝導部を有し、前記第２の熱伝導部の前記流量検知面とは反対側に、前記温度補償用抵抗素子が配置されることを特とする請求項１又は請求項２に記載の流量センサ。 Furthermore, a ring-shaped second heat conduction part that penetrates the insulating substrate in the thickness direction is provided on the outside of the first heat conduction part and at a position approximately equal distance away from the first heat conduction part. 3. The flow rate sensor according to claim 1, wherein the temperature compensating resistance element is disposed on a side of the second heat conduction section opposite to the flow rate sensing surface. 前記流量検知用抵抗素子は、セラミック基板と、前記セラミック基板の表面に設けられた抵抗層と、前記抵抗層と電気的に接続し、前記セラミック基板の表面に設けられた端子と、を有して構成されており、前記端子は、前記第１の熱伝導部の前記流量検知面とは反対側に形成されたランドに電気的に接続されていることを特徴とする請求項１から請求項３のいずれかに記載の流量センサ。

The flow rate detection resistance element includes a ceramic substrate, a resistance layer provided on the surface of the ceramic substrate, and a terminal electrically connected to the resistance layer and provided on the surface of the ceramic substrate. Claims 1 to 3 are characterized in that the terminal is electrically connected to a land formed on a side opposite to the flow rate detection surface of the first heat conduction part. 3. The flow rate sensor according to any one of 3.
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WO2018105753A2 (en) 2017-05-08 2018-06-14 株式会社村田製作所 Sensor substrate, air velocity measurement device, and air volume measurement device

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