JP7327410B2 - ポリアミック酸エステル樹脂組成物 - Google Patents

ポリアミック酸エステル樹脂組成物 Download PDF

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Publication number
JP7327410B2
JP7327410B2 JP2020553099A JP2020553099A JP7327410B2 JP 7327410 B2 JP7327410 B2 JP 7327410B2 JP 2020553099 A JP2020553099 A JP 2020553099A JP 2020553099 A JP2020553099 A JP 2020553099A JP 7327410 B2 JP7327410 B2 JP 7327410B2
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Japan
Prior art keywords
group
acid ester
polyamic acid
ester resin
resin composition
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JP2020553099A
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English (en)
Japanese (ja)
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JPWO2020080206A1 (ja
JPWO2020080206A5 (zh
Inventor
友輝 臼井
拓矢 大橋
隼人 服部
和宏 澤田
雅久 遠藤
崇洋 坂口
一樹 平佐田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
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Nissan Chemical Corp
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Publication date
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Publication of JPWO2020080206A5 publication Critical patent/JPWO2020080206A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2020553099A 2018-10-15 2019-10-09 ポリアミック酸エステル樹脂組成物 Active JP7327410B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018194129 2018-10-15
JP2018194129 2018-10-15
PCT/JP2019/039733 WO2020080206A1 (ja) 2018-10-15 2019-10-09 ポリアミック酸エステル樹脂組成物

Publications (3)

Publication Number Publication Date
JPWO2020080206A1 JPWO2020080206A1 (ja) 2021-10-07
JPWO2020080206A5 JPWO2020080206A5 (zh) 2022-07-08
JP7327410B2 true JP7327410B2 (ja) 2023-08-16

Family

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Family Applications (1)

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JP2020553099A Active JP7327410B2 (ja) 2018-10-15 2019-10-09 ポリアミック酸エステル樹脂組成物

Country Status (3)

Country Link
JP (1) JP7327410B2 (zh)
TW (1) TW202028303A (zh)
WO (1) WO2020080206A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024033021A (ja) * 2021-01-14 2024-03-13 日産化学株式会社 感光性樹脂組成物中の金属不純物を除去する金属除去フィルターを用いた金属除去方法
TW202307085A (zh) 2021-03-30 2023-02-16 日商富士軟片股份有限公司 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體裝置、以及聚醯亞胺前驅物
JPWO2022210532A1 (zh) 2021-03-30 2022-10-06

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008107766A (ja) 2006-07-21 2008-05-08 Toray Ind Inc 位相差薄膜用樹脂組成物、液晶表示装置用カラーフィルター基板、および液晶表示装置、並びに位相差薄膜付き液晶表示装置用カラーフィルター基板の製造方法
WO2015159911A1 (ja) 2014-04-18 2015-10-22 ナガセケムテックス株式会社 レジスト樹脂及びその製造方法
JP2016021068A (ja) 2010-09-30 2016-02-04 大日本印刷株式会社 感光性樹脂組成物、パターン形成用材料及びパターン形成方法
US20160083509A1 (en) 2014-09-23 2016-03-24 Samsung Sdi Co., Ltd. Polyamide Ester Resin, Method for Preparing the Same, and Molded Article Including the Same
WO2017094898A1 (ja) 2015-12-03 2017-06-08 日産化学工業株式会社 液晶配向剤、液晶配向膜及びそれを用いた液晶表示素子

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0920865A (ja) * 1995-07-06 1997-01-21 Toray Ind Inc カラーペースト、樹脂ブラック・マトリクス用ペーストおよびカラーフィルタ
JPH09184912A (ja) * 1995-12-28 1997-07-15 Toray Ind Inc 樹脂ブラック・マトリクスおよび樹脂ブラック・マトリクス用ペースト

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008107766A (ja) 2006-07-21 2008-05-08 Toray Ind Inc 位相差薄膜用樹脂組成物、液晶表示装置用カラーフィルター基板、および液晶表示装置、並びに位相差薄膜付き液晶表示装置用カラーフィルター基板の製造方法
JP2016021068A (ja) 2010-09-30 2016-02-04 大日本印刷株式会社 感光性樹脂組成物、パターン形成用材料及びパターン形成方法
WO2015159911A1 (ja) 2014-04-18 2015-10-22 ナガセケムテックス株式会社 レジスト樹脂及びその製造方法
US20160083509A1 (en) 2014-09-23 2016-03-24 Samsung Sdi Co., Ltd. Polyamide Ester Resin, Method for Preparing the Same, and Molded Article Including the Same
WO2017094898A1 (ja) 2015-12-03 2017-06-08 日産化学工業株式会社 液晶配向剤、液晶配向膜及びそれを用いた液晶表示素子

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WO2020080206A1 (ja) 2020-04-23
TW202028303A (zh) 2020-08-01
JPWO2020080206A1 (ja) 2021-10-07

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