JP7316192B2 - ソケット - Google Patents
ソケット Download PDFInfo
- Publication number
- JP7316192B2 JP7316192B2 JP2019196587A JP2019196587A JP7316192B2 JP 7316192 B2 JP7316192 B2 JP 7316192B2 JP 2019196587 A JP2019196587 A JP 2019196587A JP 2019196587 A JP2019196587 A JP 2019196587A JP 7316192 B2 JP7316192 B2 JP 7316192B2
- Authority
- JP
- Japan
- Prior art keywords
- flat housing
- solder balls
- socket
- housing
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
- H01R13/11—Resilient sockets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
- H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connecting Device With Holders (AREA)
Description
平板状ハウジング、
平板状ハウジングに支持された多数のコンタクト、
平板状ハウジングに取り付けられてその平板状ハウジングに沿って延び、多数のコンタクトに接触する多数のパッドが下面に形成された電子部品を搭載する際の平板状ハウジングの面内方向の位置決めとなる枠体、および
平板状ハウジングの、搭載される回路基板側を向いた下面に配置され、多数のコンタクトの各々に電気的に接続されて回路基板と電気的に接続される多数の第1の半田ボール、および
平板状ハウジングの下面に、電気的な接続とは無関係に配置された複数の第2の半田ボールを備えたことを特徴とする。
20 平板状ハウジング
20A 第1面(上面)
20B 第2面(下面)
21 スルーホール
30 コンタクト
40 枠体
81 半田ボール(第1の半田ボール)
82 半田ボール(第2の半田ボール)
Claims (2)
- 平板状ハウジング、
前記平板状ハウジングに支持された多数のコンタクト、
前記平板状ハウジングに取り付けられて該平板状ハウジングに沿って延び、前記多数のコンタクトに接触する多数のパッドが下面に形成された電子部品を搭載する際の該平板状ハウジングの面内方向の位置決めとなる枠体、および
前記平板状ハウジングの、搭載される回路基板側を向いた下面に配置され、前記多数のコンタクトの各々に電気的に接続されて該回路基板と電気的に接続される多数の第1の半田ボール、および
前記平板状ハウジングの前記下面に、電気的な接続とは無関係に配置された複数の第2の半田ボールを備えたことを特徴とするソケット。 - 前記第2の半田ボールが、前記第1の半田ボールよりも前記平板状ハウジングの縁に寄った位置に配置されていることを特徴とする請求項1に記載のソケット。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019196587A JP7316192B2 (ja) | 2019-10-29 | 2019-10-29 | ソケット |
CN202011163513.6A CN112751226B (zh) | 2019-10-29 | 2020-10-27 | 插座 |
US17/084,120 US11916328B2 (en) | 2019-10-29 | 2020-10-29 | Socket having solder balls |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019196587A JP7316192B2 (ja) | 2019-10-29 | 2019-10-29 | ソケット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021072178A JP2021072178A (ja) | 2021-05-06 |
JP7316192B2 true JP7316192B2 (ja) | 2023-07-27 |
Family
ID=75586363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019196587A Active JP7316192B2 (ja) | 2019-10-29 | 2019-10-29 | ソケット |
Country Status (3)
Country | Link |
---|---|
US (1) | US11916328B2 (ja) |
JP (1) | JP7316192B2 (ja) |
CN (1) | CN112751226B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7316192B2 (ja) * | 2019-10-29 | 2023-07-27 | タイコエレクトロニクスジャパン合同会社 | ソケット |
Citations (3)
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JP2004104102A (ja) | 2002-08-21 | 2004-04-02 | Seiko Epson Corp | 半導体装置及びその製造方法、回路基板並びに電子機器 |
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JP2018174017A (ja) | 2017-03-31 | 2018-11-08 | タイコエレクトロニクスジャパン合同会社 | ソケット |
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2019
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2020
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- 2020-10-29 US US17/084,120 patent/US11916328B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004104102A (ja) | 2002-08-21 | 2004-04-02 | Seiko Epson Corp | 半導体装置及びその製造方法、回路基板並びに電子機器 |
US20050233628A1 (en) | 2004-04-16 | 2005-10-20 | Hon Hai Precision Ind. Co., Ltd. | Land grid array connector with reinforcement stiffener |
JP2018174017A (ja) | 2017-03-31 | 2018-11-08 | タイコエレクトロニクスジャパン合同会社 | ソケット |
Also Published As
Publication number | Publication date |
---|---|
US20210126394A1 (en) | 2021-04-29 |
JP2021072178A (ja) | 2021-05-06 |
CN112751226A (zh) | 2021-05-04 |
CN112751226B (zh) | 2024-05-31 |
US11916328B2 (en) | 2024-02-27 |
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