JP7291795B2 - SUBSTRATE ARRANGEMENT SUPPORT JIG AND SUBSTRATE MANUFACTURING METHOD - Google Patents

SUBSTRATE ARRANGEMENT SUPPORT JIG AND SUBSTRATE MANUFACTURING METHOD Download PDF

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JP7291795B2
JP7291795B2 JP2021551426A JP2021551426A JP7291795B2 JP 7291795 B2 JP7291795 B2 JP 7291795B2 JP 2021551426 A JP2021551426 A JP 2021551426A JP 2021551426 A JP2021551426 A JP 2021551426A JP 7291795 B2 JP7291795 B2 JP 7291795B2
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substrate
carrier
holes
standby
jig
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JPWO2021066075A5 (en
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ヴッチポン シーテープ
ヴォラヴット クナリンチップ
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Hoya Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Description

本発明は、キャリアの基板保持孔に基板を保持して、基板の主表面を研磨するとき、キャリアの基板保持孔それぞれに複数の基板それぞれを配置するための基板配置支援治具、及びこの基板配置支援治具を用いて研磨を行う基板の製造方法に関する。 The present invention provides a substrate placement support jig for placing a plurality of substrates in respective substrate holding holes of a carrier when substrates are held in the substrate holding holes of the carrier and the main surfaces of the substrates are polished, and the substrates. The present invention relates to a substrate manufacturing method in which polishing is performed using an arrangement support jig.

今日、パーソナルコンピュータ、ＤＶＤ（Digital Versatile Disc）記録装置等には、データ記録のためにハードディスク装置(ＨＤＤ：Hard Disk Drive)が内蔵されている。
ハードディスク装置では、基板に磁性層が設けられた磁気ディスクが用いられ、磁気ディスクの面上を僅かに浮上させた磁気ヘッドで磁性層に磁気記録情報が記録され、あるいは読み取られる。ハードディスク装置では、記憶容量を増大させるために、磁気記録密度の増大が図られており、この磁気記録密度の増大を可能にするために、磁気ディスクの基板として用いる基板の主表面の表面凹凸は可能な限り小さくなっている。したがって、磁気ディスクに用いる基板の製造では、精度の高い研磨が行われる。2. Description of the Related Art Today, personal computers, DVD (Digital Versatile Disc) recording devices, and the like incorporate hard disk drives (HDDs) for data recording.
2. Description of the Related Art A hard disk drive uses a magnetic disk having a magnetic layer provided on a substrate, and magnetically recorded information is recorded on or read from the magnetic layer by a magnetic head slightly floated above the surface of the magnetic disk. In hard disk drives, efforts are being made to increase the magnetic recording density in order to increase the storage capacity. as small as possible. Therefore, in the manufacture of substrates used for magnetic disks, highly accurate polishing is performed.

研磨装置では、例えば、基板を、研磨パッドを備えた上定盤と下定盤とにより挟んで上定盤と下定盤を回転させながら研磨パッドで基板の主表面を研磨する。その際、研磨液が研磨パッドと基板の主表面の間に供給される。研磨液には、セリアやコロイダルシリカ等の粒径の細かい研磨砥粒を含む。研磨液は、基板の主表面上に供給される。上定盤と下定盤とにより挟まれた基板は、上定盤と下定盤との間で、自転しながら上定盤の回転中心軸の周りに公転運動するように移動することにより、基板の主表面が研磨される。 In a polishing apparatus, for example, a substrate is sandwiched between an upper surface plate and a lower surface plate provided with a polishing pad, and the main surface of the substrate is polished with the polishing pad while rotating the upper surface plate and the lower surface plate. At that time, a polishing liquid is supplied between the polishing pad and the main surface of the substrate. The polishing liquid contains abrasive grains having a fine grain size, such as ceria and colloidal silica. A polishing liquid is supplied onto the major surface of the substrate. The substrate sandwiched between the upper surface plate and the lower surface plate rotates between the upper surface plate and the lower surface plate so as to revolve around the central axis of rotation of the upper surface plate. A major surface is polished.

研磨装置では、複数、例えば６個の保持孔が設けられた平板状のキャリアの保持孔のそれぞれに基板を保持させて、研磨パッドが表面に設けられた上定盤及び下定盤でキャリアを挟み、上定盤及び下定盤との間に研磨液を供給しながら、キャリアと、上定盤及び下定盤とを相対的に移動させることにより基板の主表面を研磨する。すなわち、１つのキャリアに複数の基板を配置し、さらに、上定盤と下定盤の間に基板を保持した数枚のキャリアを挟んで同時に研磨を行うので、すべてのキャリアの基板保持孔１つ１つに基板を配置するための準備の時間は長い。 In the polishing apparatus, a substrate is held in each of the holding holes of a flat plate-shaped carrier provided with a plurality of, for example, six holding holes, and the carrier is sandwiched between an upper surface plate and a lower surface plate having polishing pads provided on their surfaces. , the main surface of the substrate is polished by relatively moving the carrier, the upper surface plate and the lower surface plate while supplying the polishing liquid between the upper surface plate and the lower surface plate. That is, a plurality of substrates are placed on one carrier, and polishing is performed simultaneously with several carriers holding the substrates between the upper surface plate and the lower surface plate. The preparation time for placing the substrates in one is long.

これに対して、両面研磨装置の上定盤と下定盤との間に配されたキャリアに保持される基板等の被研磨体を研磨する研磨工程において、複数の基板を効率良く装填作業するための被研磨体装填治具が提案されている（特許文献１）。
被研磨体装填治具は、上定盤と下定盤との間に配されたキャリアに保持される基板等の被研磨体を研磨する研磨工程で、キャリアに設けられた複数の保持孔の夫々に複数の被研磨体を同時に装填する装置である。被研磨体装填治具は、キャリアの複数の保持孔に対向するように配置された複数の挿入孔を有する第１の治具と、この第１の治具の上面に重ねられ、キャリアの複数の保持孔に装填される複数の被研磨体を待機させるための複数の待機孔を有する第２の治具と、を備える。第１の治具及び第２の治具は、夫々の接触面が互いに水平方向にスライド可能に支持されている。第１の治具と第２の治具の回転中心を互いに一致させ、待機孔と挿入孔とは円形状の回転中心に対する方位方向をずらして、第２の治具を第１の治具の上面に接するように重ねる。このとき、第２の治具の待機孔には、被研磨体を配置しておく。第２の治具を回転中心の周りにスライドさせることにより、待機孔が挿入孔と一致したとき、第２の治具に配置した複数の被研磨体のそれぞれが、挿入孔を通して第１の治具の下部にあるキャリアの保持孔に同時に落下してセットされる。 On the other hand, in the polishing step of polishing objects to be polished such as substrates held on a carrier arranged between the upper surface plate and the lower surface plate of the double-sided polishing apparatus, it is necessary to efficiently load a plurality of substrates. has been proposed (Patent Document 1).
In a polishing process for polishing an object to be polished such as a substrate held by a carrier disposed between an upper surface plate and a lower surface plate, the object loading jig is used to hold each of the plurality of holding holes provided in the carrier. This is a device for simultaneously loading a plurality of objects to be polished into the The object-to-be-polished loading jig comprises a first jig having a plurality of insertion holes arranged to face the plurality of holding holes of the carrier; a second jig having a plurality of waiting holes for waiting the plurality of objects to be polished loaded in the holding holes of the second jig. The contact surfaces of the first jig and the second jig are horizontally slidably supported. The rotation centers of the first jig and the second jig are aligned with each other, the azimuth directions of the waiting hole and the insertion hole are shifted with respect to the circular rotation center, and the second jig is moved from the first jig. Stack so that it touches the top surface. At this time, the object to be polished is placed in the standby hole of the second jig. By sliding the second jig around the center of rotation, when the standby hole is aligned with the insertion hole, each of the plurality of objects to be polished arranged in the second jig is moved through the insertion hole into the first jig. They are simultaneously dropped and set in the holding holes of the carrier at the bottom of the tool.

特開２０１２－７６１９１号公報JP 2012-76191 A

この被研磨体装填治具では、第２の治具を回転中心の周りにスライドさせるとき、第２の治具の待機孔に配置された被研磨体、例えば基板の主表面は、第１の治具の表面と接触しながら擦れるので、第１の治具を基板の表面に傷を与えにくい樹脂材を用いるとしても、研磨体の表面に傷が生じることを防止することはできないといった問題が生じる。特に、磁気ディスク用基板の主表面のように、基板の主表面の表面凹凸は可能な限り小さくなることが好ましいため、研磨前に、主表面に傷を発生させることは好ましくない。 In this object-to-be-polished loading jig, when the second jig is slid around the center of rotation, the main surface of the object to be polished, for example, the substrate, placed in the standby hole of the second jig is moved to the first position. Since the surface of the jig is rubbed while being in contact with the surface of the substrate, even if the first jig is made of a resin material that does not easily scratch the surface of the substrate, the surface of the polishing body cannot be prevented from being scratched. occur. In particular, as with the main surface of a magnetic disk substrate, it is preferable that the surface unevenness of the main surface of the substrate be as small as possible.

そこで、本発明は、上記被研磨体装填治具とは異なる構成により、基板の主表面に傷を生じさせることなく、基板の外周端部に傷を発生させることなく、効率よくキャリアの保持孔に基板を配置することができる基板配置支援治具、及びこの治具を用いて基板の研磨を行う研磨処理を含む基板の製造方法を提供することを目的とする。 Accordingly, the present invention has a structure different from that of the above-mentioned object loading jig, so as to efficiently remove a carrier holding hole without causing damage to the main surface of the substrate and without causing damage to the outer peripheral edge of the substrate. It is an object of the present invention to provide a substrate placement support jig capable of placing a substrate on a substrate, and a method of manufacturing a substrate including a polishing process for polishing a substrate using this jig.

本発明の一態様は、基板の主表面を研磨するために、キャリアに設けられた複数の基板保持孔それぞれに基板を配置するための基板配置支援治具である。当該基板配置支援治具は、 前記キャリアの複数の前記基板保持孔の位置に対応して、基板を配置可能な複数の待機孔が設けられた板状の治具本体と、
前記待機孔それぞれの縁の少なくとも１箇所には、前記縁から突出して、前記基板の外周端と接触して前記基板を保持する、前記治具本体に設けられた爪と、を備える。
前記爪部は前進して前記待機孔それぞれに前記基板を保持させ、前記治具本体を前記キャリアの上部に位置した状態で、前記爪部を後退させることにより、前記基板を前記待機孔それぞれから開放して落下させて下方にある前記キャリアの前記基板保持孔のそれぞれに配置するために、前記爪部が、前記待機孔の領域に出入り自在に前進あるいは後退する、ように前記爪部は構成されている。One aspect of the present invention is a substrate placement support jig for placing a substrate in each of a plurality of substrate holding holes provided in a carrier in order to polish the main surface of the substrate. The substrate placement support jig includes a plate-like jig body provided with a plurality of standby holes in which the substrates can be arranged corresponding to the positions of the plurality of substrate holding holes of the carrier;
At least one edge of each standby hole is provided with a claw provided on the jig body that protrudes from the edge and contacts the outer peripheral edge of the substrate to hold the substrate.
The claws advance to hold the substrate in each of the standby holes, and the jig body is positioned above the carrier, and the claws are retracted to remove the substrate from each of the standby holes. The claws are configured to move forward or backward freely in and out of the area of the waiting holes to be opened and dropped to be placed in each of the substrate holding holes of the carrier below. It is

前記待機孔それぞれの周上の２つ以上の場所に前記爪部が設けられ、
前記爪部は、前記基板の主表面と接触せず、前記基板の外周端に設けられた面取り面と接触するように設けられた傾斜面を有し、
前記傾斜面に前記面取り面が接触して前記爪部それぞれが前記基板を下方から支持することにより、前記基板は前記待機孔それぞれに保持される、ことが好ましい。The claw portions are provided at two or more locations on the circumference of each of the standby holes,
the claw portion has an inclined surface provided so as not to contact the main surface of the substrate but to contact a chamfered surface provided on the outer peripheral edge of the substrate;
Preferably, the substrate is held in each standby hole by the chamfered surface coming into contact with the inclined surface and each of the claw portions supporting the substrate from below.

前記爪部は、前記基板の外周端に設けられた前記基板の主表面と直交する側壁面に当接する、前記待機孔それぞれの縁から内側に向かって突出する突起部を有し、
前記突起部が前記側壁面に対して直交する方向から当接して前記基板を前記待機孔それぞれの壁に押圧することにより、前記基板は前記待機孔それぞれに保持される、ことが好ましい。the claw portion has a protruding portion protruding inward from the edge of each of the standby holes, the claw portion coming into contact with a side wall surface perpendicular to the main surface of the substrate provided at the outer peripheral end of the substrate;
It is preferable that the substrate is held in each of the stand-by holes by abutting the substrate against the wall of each of the stand-by holes with the protrusion coming into contact with the side wall surface in a direction perpendicular to the side wall.

前記待機孔それぞれに設けられた前記爪部は同時に後退するように構成されている、ことが好ましい。
前記キャリアに面する前記治具本体の面には、前記待機孔の位置が前記キャリアの前記基板保持孔の位置に対応するように、前記キャリアの面に設けられた孔または突起に係止される突起または孔が設けられている、ことが好ましい。It is preferable that the claws provided in each of the standby holes are configured to retreat at the same time.
A surface of the jig body facing the carrier is engaged with a hole or projection provided on the surface of the carrier so that the position of the standby hole corresponds to the position of the substrate holding hole of the carrier. is preferably provided with projections or holes that

本発明の他の一態様は、複数の基板保持孔が設けられたキャリアの前記基板保持孔のそれぞれに基板を保持した状態で、基板の主表面を研磨する研磨処理を含む基板の製造方法である。当該製造方法は、
前記基板配置支援治具の前記待機孔それぞれに、前記爪部を前記待機孔の縁から突出するように前進させて前記基板を保持した状態で、前記下定盤の上に配置した前記キャリアの上方の位置で、前記治具本体の前記爪部を後退させることにより、前記基板を前記待機孔から開放して落下させて、下方にある前記キャリアの前記基板保持孔のそれぞれに前記基板を配置させるステップと、
前記キャリアに配置した前記基板を、上定盤及び前記下定盤で挟んで相対移動させることにより、前記基板を研磨するステップと、
を備える。Another aspect of the present invention is a substrate manufacturing method including a polishing process of polishing a main surface of a substrate while holding the substrate in each of the substrate holding holes of a carrier provided with a plurality of substrate holding holes. be. The manufacturing method is
Above the carrier placed on the lower surface plate, the substrate is held in a state where the substrate is held by advancing the claw portion to each of the standby holes of the substrate placement support jig so as to protrude from the edge of the standby hole. position, the claw portion of the jig body is retracted to release the substrate from the standby hole and drop the substrate, thereby placing the substrate in each of the substrate holding holes of the carrier located below. a step;
polishing the substrate by sandwiching the substrate placed on the carrier between an upper surface plate and the lower surface plate and relatively moving the substrate;
Prepare.

上述の基板配置支援治具及びこの治具を用いて基板の研磨を行う基板の製造方法によれば、基板の主表面に傷を生じさせることなく、基板の外周端部に傷を発生させることなく、効率よくキャリアの基板保持孔に基板を配置することができる。 According to the above-described substrate placement support jig and substrate manufacturing method for polishing a substrate using this jig, the outer peripheral edge of the substrate can be scratched without causing scratches on the main surface of the substrate. Therefore, the substrate can be efficiently arranged in the substrate holding hole of the carrier.

一実施形態の基板配置支援治具の概略の構成を示す図である。It is a figure which shows the structure of the schematic of the board|substrate arrangement|positioning assistance jig|tool of one Embodiment. 一実施形態である、基板を待機孔に保持するための爪部を説明する図である。FIG. 10 is a diagram illustrating a claw portion for holding a substrate in a standby hole , which is one embodiment; 他の一実施形態である、基板を待機孔に保持するための爪部を説明する図である。FIG. 10 is a diagram illustrating a claw portion for holding a substrate in a standby hole , which is another embodiment; 一実施形態の基板配置支援治具において、基板が待機孔から離脱する状態を説明する図である。FIG. 10 is a diagram illustrating a state in which the substrate is separated from the waiting hole in the substrate placement assistance jig of one embodiment; 一実施形態の研磨処理に用いる研磨装置の構成を示す図である。It is a figure which shows the structure of the polishing apparatus used for the polishing process of one Embodiment. 一実施形態の研磨処理に用いる研磨装置の構成を示す図である。It is a figure which shows the structure of the polishing apparatus used for the polishing process of one Embodiment.

以下、一実施形態の基板配置支援治具及び基板の製造方法について、図面を参照しながら説明する。 A board placement assisting jig and a board manufacturing method according to one embodiment will be described below with reference to the drawings.

（基板配置支援治具）
図１は、一実施形態の基板配置支援治具の概略の構成を示す図である。
基板配置支援治具１０は、基板の主表面を研磨するために、キャリア１２に設けられた複数の基板保持孔それぞれに基板を配置するための配置支援治具である。本明細書でいう研磨は、研削後の基板の表面粗さを小さくするために表面を磨く“研磨”の他に、基板の寸法や形状を変更するために粗く削る加工、すなわち“研削（ラッピング）”も含む。“研削”後の基板の表面粗さを小さくするために表面を磨く加工を、研削と区別して“研磨”という場合には、基板配置支援治具１０は、基板の主表面を“研削”あるいは“研磨”をするために、キャリア１２に設けられた複数の基板保持孔それぞれに基板を配置するための配置支援治具である。換言すれば、基板配置支援治具１０は、上記のように、キャリア１２を用いて基板の主表面を加工する場合であれば、加工方法によらず用いることができる。
図１に示すように、基板配置支援治具１０は、板状の治具本体１６を備える。治具本体１６には、キャリア１２の複数の基板保持孔１４の位置に対応して、基板Ｓを配置可能な複数の待機孔１８が設けられている。キャリア１２には、６個の基板保持孔１４が設けられ、これに対応して、治具本体１６にも、待機孔１８が６個、同じ位置に設けられている。
図１に示す例では、キャリア１２には、６個の基板保持孔１４が設けられているが、基板保持孔１４の数は、６に制限されず、複数であればよい。基板保持孔１４の数は５以上であることが好ましく、１０以上であることがより好ましい。
なお、図１に示すキャリア１２の外周には、図示されないが、後述するように下定盤の内歯車（図５に示す歯車６２）と係合する歯部が設けられる。(Board placement support jig)
FIG. 1 is a diagram showing a schematic configuration of a substrate placement support jig according to one embodiment.
Substrate placement support jig 10 is a placement support jig for placing substrates in each of a plurality of substrate holding holes provided in carrier 12 in order to polish the main surface of the substrate. Polishing as used in this specification includes not only "polishing" to polish the surface of the substrate after grinding to reduce the surface roughness, but also rough grinding to change the size and shape of the substrate, that is, "grinding (lapping)". )” is also included. When the process of polishing the surface of the substrate after "grinding" to reduce the surface roughness is called "polishing" to distinguish it from grinding, the substrate placement assistance jig 10 "grinds" or "grinds" the main surface of the substrate. It is an arrangement support jig for arranging a substrate in each of a plurality of substrate holding holes provided in the carrier 12 for "polishing". In other words, the substrate placement support jig 10 can be used regardless of the processing method as long as the main surface of the substrate is processed using the carrier 12 as described above.
As shown in FIG. 1 , the board placement support jig 10 includes a plate-like jig body 16 . The jig main body 16 is provided with a plurality of standby holes 18 in which the substrates S can be arranged corresponding to the positions of the plurality of substrate holding holes 14 of the carrier 12 . The carrier 12 is provided with six substrate holding holes 14, and correspondingly, the jig body 16 is also provided with six standby holes 18 at the same positions.
In the example shown in FIG. 1, the carrier 12 is provided with six substrate holding holes 14, but the number of substrate holding holes 14 is not limited to six, and may be plural. The number of substrate holding holes 14 is preferably 5 or more, more preferably 10 or more.
Although not shown, the outer periphery of the carrier 12 shown in FIG. 1 is provided with a toothed portion that engages with an internal gear (gear 62 shown in FIG. 5) of the lower surface plate as will be described later.

治具本体１６の待機孔１８それぞれの縁の少なくとも１箇所には、縁から突出して、基板Ｓの外周端と接触して基板Ｓを保持する爪部が設けられている。この爪部が前進して待機孔それぞれに基板Ｓを保持させ、治具本体１６を、下定盤の上に載せたキャリア１２の上部に移動した状態で、爪部を後退させることにより、基板Ｓを待機孔１８それぞれから開放して落下させて下方にあるキャリア１２の基板保持孔１４のそれぞれに配置するために、爪部が、待機孔１８の領域に出入り自在に前進あるいは後退する。爪部が基板Ｓを保持する場合に爪部が基板Ｓの外周端と接触するとは、爪部が外周端の少なくとも一部と接触することを意味する。外周端には、端面の他に、端面と主表面との境界部（面取り面が端面に形成されている場合は、面取り面と主表面との境界部）も含まれる。
爪部は、基板Ｓの外周端の少なくとも一部と接触することにより基板Ｓを保持するように突出する形状であればよく、必ずしも爪型の形状を有さなくてもよい。At least one edge of each of the standby holes 18 of the jig body 16 is provided with a claw portion that protrudes from the edge and contacts the outer peripheral edge of the substrate S to hold the substrate S. As shown in FIG. The claws move forward to hold the substrate S in each standby hole, and the jig body 16 is moved to the upper part of the carrier 12 placed on the lower surface plate. are released from the standby holes 18 and dropped to be placed in the respective substrate holding holes 14 of the carrier 12 below, the claws move forward or backward freely in and out of the area of the standby holes 18 . When the claw portion holds the substrate S, the claw portion contacts the outer peripheral edge of the substrate S means that the claw portion contacts at least a part of the outer peripheral edge. The outer peripheral edge includes not only the end face but also the boundary portion between the end face and the main surface (if the chamfered surface is formed on the end face, the boundary portion between the chamfered surface and the main surface).
The claw portion may have a shape that protrudes so as to hold the substrate S by coming into contact with at least a portion of the outer peripheral edge of the substrate S, and does not necessarily have a claw-shaped shape.

図２は、一実施形態である、基板Ｓを待機孔１８に保持するための爪部を説明する図である。図２に示す爪部２０は、基板Ｓの主表面と接触せず、基板Ｓの外周端に設けられた面取り面２２と接触するように設けられた傾斜面２４を有する。図２に示すように、傾斜面２４に面取り面２２（面取り面２２と主表面との境界部を含む）が接触して爪部２０それぞれが基板Ｓを下方から支持することにより、基板Ｓは待機孔１８それぞれに保持される。爪部２０は、図１に示される操作部２６を操作者が押圧するあるいは操作部２６の押圧を緩めることにより、待機孔１８の領域に出入り自在に前進あるいは後退する。
面取り面２２は、基板Ｓの主表面に略直交する（略直交する角度は、８９～９１度をいう）側壁面２５（図３参照）と主表面の間に介在する面である。面取り面２２は、主表面と滑らかに接続されて、側壁面２５に向かって延びている。FIG. 2 is a diagram illustrating a claw portion for holding the substrate S in the standby hole 18, which is one embodiment. The claw portion 20 shown in FIG. 2 has an inclined surface 24 provided so as not to contact the main surface of the substrate S but to contact the chamfered surface 22 provided on the outer peripheral edge of the substrate S. As shown in FIG. As shown in FIG. 2, the chamfered surface 22 (including the boundary portion between the chamfered surface 22 and the main surface) is in contact with the inclined surface 24, and the claw portions 20 support the substrate S from below. It is held in each standby hole 18 . The claw portion 20 advances or retreats freely in and out of the area of the waiting hole 18 when the operator presses the operation portion 26 shown in FIG.
The chamfered surface 22 is a surface interposed between the main surface and the side wall surface 25 (see FIG. 3) that is substantially perpendicular to the main surface of the substrate S (the angle substantially perpendicular is 89 to 91 degrees). Chamfered surface 22 is smoothly connected to the main surface and extends toward side wall surface 25 .

爪部２０の前進、後退の機構は、特に制限されない。例えば、爪部２０は、ばね部材で付勢されて待機孔１８に対して通常突出状態にあり、操作部２６を押圧することにより、ばね部材の付勢力に打ち勝って爪部２０を後退させるばね部材を利用した機構を用いることができる。また、待機孔１８それぞれの内周に沿って回転移動するギアを設け、このギアが回転移動することにより、爪部２０に接続したカム機構がギアの動きによって動作することにより、爪部２０が前進あるいは後退するカム機構を利用した機構を用いることができる。爪部２０は、待機孔１８それぞれの周上の２つ以上の場所に設けられる。これにより、基板Ｓを安定して待機孔１８に保持させることができる。
爪部２０の傾斜面２４は、面取り面２２を下方から支持するだけであり、基板Ｓと接する領域は少ないので、面取り面２２を傷つけることは少ない。
なお、爪部２０の数は特に限定されないが、爪部２０の数が４つ以上になると装置構成が複雑になるので、爪部２０の数は２つ又は３つであることが好ましい。爪部２０を２つ又は３つ設ける場合は、待機孔１８の周上においてそれぞれ約１８０度、約１２０度毎に爪部２０設けることが好ましい。A mechanism for advancing and retreating the claw portion 20 is not particularly limited. For example, the claw portion 20 is biased by a spring member so as to normally protrude from the standby hole 18, and by pressing the operation portion 26, the spring overcomes the biasing force of the spring member and retracts the claw portion 20. A mechanism using a member can be used. In addition, a gear that rotates along the inner circumference of each standby hole 18 is provided, and when this gear rotates, a cam mechanism connected to the pawl portion 20 is operated by the movement of the gear, whereby the pawl portion 20 is moved. A mechanism using a cam mechanism that advances or retreats can be used. The claws 20 are provided at two or more locations on the circumference of each standby hole 18 . Thereby, the substrate S can be stably held in the standby hole 18 .
Since the inclined surface 24 of the claw portion 20 only supports the chamfered surface 22 from below and has a small area in contact with the substrate S, the chamfered surface 22 is hardly damaged.
Although the number of claws 20 is not particularly limited, it is preferable that the number of claws 20 is two or three because the configuration of the device becomes complicated if the number of claws 20 is four or more. When two or three claw portions 20 are provided, it is preferable to provide the claw portions 20 at intervals of about 180 degrees and about 120 degrees on the circumference of the standby hole 18, respectively.

図３は、他の一実施形態である、基板Ｓを待機孔１８に保持するための爪部を説明する図である。
図３に示す爪部２０は、基板Ｓの外周端に設けられた基板Ｓの主表面と直交する側壁面２５に当接する、待機孔１８それぞれの縁から待機孔１８の内側に向かって突出する突起部２８を有する。この突起部２８が側壁面２５に対して直交する方向から当接して基板Ｓを待機孔１８それぞれの壁（突起部２８と反対側にある壁）に押圧することにより、基板Ｓは待機孔１８それぞれに摩擦力により保持される。爪部２０の突起部２８は、側壁面２５を側方から押さえるが、突起部２８が基板Ｓと接する領域は少ないので、側壁面２５を傷つけることは少ない。
図３における爪部２０の前進、後退の機構も、上述したように特に制限されず、ばね部材を利用した機構やカム機構を利用した機構を用いることができる。3A and 3B are diagrams illustrating a claw portion for holding the substrate S in the standby hole 18, which is another embodiment.
The claw portions 20 shown in FIG. 3 protrude inward of the standby holes 18 from the respective edges of the standby holes 18 that contact the side wall surfaces 25 perpendicular to the main surface of the substrate S provided at the outer peripheral edge of the substrate S. It has a protrusion 28 . The protrusions 28 abut against the side wall surface 25 in a direction orthogonal to the substrate S and press the substrate S against the respective walls of the standby holes 18 (walls on the side opposite to the protrusions 28 ). Each is held by frictional force. The protruding portion 28 of the claw portion 20 presses the side wall surface 25 from the side.
The mechanism for advancing and retracting the claw portion 20 in FIG. 3 is not particularly limited as described above, and a mechanism using a spring member or a mechanism using a cam mechanism can be used.

このような爪部２０は後退することにより、図４に示すように、待機孔１８に保持されていた基板Ｓは、待機孔１８から落下して、下方の下定盤に載せられたキャリア１２の基板保持孔１４に配置することができる。図４は、一実施形態の基板配置支援治具において、基板Ｓが待機孔１８から離脱する状態を説明する図である。
この場合、待機孔１８と基板保持孔１４は鉛直方向に正しく位置合わせしていなければ確実に基板Ｓを基板保持孔１４に配置することはできない。このため、一実施形態によれば、治具本体１６には位置合わせ部が設けられ、キャリア１２に設けられた位置合わせ部と係止することができる。これにより、治具本体１６は、キャリア１２に対して適切な位置に配することができる。治具本体１６の位置合わせ部は、例えば、治具本体１６からキャリア１２に向かって突出した突起あるいは孔であり、キャリア１２の位置合わせ部は、上記突起を係止することができる、例えば孔または治具本体１６に向かって突出した突起である。As shown in FIG. 4, the claw portion 20 retreats, thereby causing the substrate S held in the waiting hole 18 to drop from the waiting hole 18 and the carrier 12 placed on the lower surface plate below. It can be arranged in the substrate holding hole 14 . FIG. 4 is a diagram illustrating a state in which the substrate S is separated from the standby hole 18 in the substrate placement assistance jig of one embodiment.
In this case, the substrate S cannot be reliably placed in the substrate holding hole 14 unless the standby hole 18 and the substrate holding hole 14 are properly aligned in the vertical direction. For this reason, according to one embodiment, the fixture body 16 is provided with alignment features that can engage with alignment features provided on the carrier 12 . Thereby, the jig main body 16 can be arranged at an appropriate position with respect to the carrier 12 . The alignment portion of the jig body 16 is, for example, a projection or hole projecting from the jig body 16 toward the carrier 12, and the alignment portion of the carrier 12 can engage the projection, such as a hole. Alternatively, it is a protrusion protruding toward the jig body 16 .

このように、爪部２０は、基板Ｓを待機孔１８それぞれから開放して落下させて下方にあるキャリア１２の基板保持孔１４のそれぞれに配置するために、爪部２０が、待機孔１８の領域に出入り自在に前進あるいは後退する機構になっているので、基板Ｓの主表面に傷を生じさせることなく、基板Ｓの外周端部に傷を発生させることなく、効率よくキャリア１２の基板保持孔１４に基板Ｓを配置することができる。 In this manner, the claws 20 release the substrates S from the standby holes 18 and drop them to place them in the substrate holding holes 14 of the carrier 12 below. Since the mechanism is designed to advance or retreat freely in and out of the area, the carrier 12 can efficiently hold the substrates without damaging the main surface of the substrate S and without damaging the outer peripheral edge of the substrate S. A substrate S can be placed in the hole 14 .

待機孔１８それぞれに設けられた爪部２０は同時に後退するように構成されていることが、基板Ｓを同時にキャリア１２の基板保持孔１４に配置することができるので、好ましい。 It is preferable that the claw portions 20 provided in each of the standby holes 18 are configured to retract at the same time so that the substrates S can be placed in the substrate holding holes 14 of the carrier 12 at the same time.

このような基板配置支援治具１０は、基板Ｓをキャリア１２の基板保持孔１４に保持した状態で研磨処理を行う場合に好適に用いることができる。特に、研磨装置による研磨処理開始前、下定盤に対して上定盤が上方に移動してできる制限された空間を作業スペースとして基板Ｓを基板保持孔１４に配置するセット作業を行うので、制限された空間において効率よく基板Ｓのセット作業を行うために、基板配置支援治具１０を用いることが好ましい。したがって、一実施形態では、複数の基板保持孔１４が設けられたキャリア１２の基板保持孔１４のそれぞれに基板Ｓを保持した状態で基板Ｓの主表面を研磨する研磨処理を含む基板Ｓの製造方法に、基板配置支援治具１０が用いられる。 すなわち、基板の製造方法では、上述した基板配置支援治具１０の待機孔１８それぞれに、爪部２０を待機孔１８の縁から突出するように前進させて基板Ｓを保持した状態で、下定盤の上に配置したキャリア１２の上方の位置で、治具本体１６の爪部２０を後退させることにより、基板Ｓを待機孔１８から開放して落下させる。これにより、下方にあるキャリア１２の基板保持孔１４のそれぞれに基板Ｓは配置される。この後、キャリア１２に配置された基板Ｓを、上定盤及び下定盤で挟んで相対移動させることにより、基板Ｓを研磨する。
治具本体１６を、キャリア１２の上方の位置に配置する場合、例えば、キャリア１２の表面（主表面）と治具本体１６の表面（主表面）とが接するように治具本体１６をキャリア１２に重ねてもよいし、キャリア１２の表面（主表面）から治具本体１６の表面（主表面）が少し離れるように治具本体１６を配置してもよい。Such a substrate placement assisting jig 10 can be suitably used when polishing is performed while the substrate S is held in the substrate holding hole 14 of the carrier 12 . In particular, before the start of the polishing process by the polishing apparatus, the setting work of arranging the substrate S in the substrate holding hole 14 is performed using a limited space created by moving the upper surface plate upward with respect to the lower surface plate as a work space. In order to efficiently set the substrate S in the space provided, it is preferable to use the substrate placement support jig 10 . Therefore, in one embodiment, manufacturing of the substrate S includes a polishing process of polishing the main surface of the substrate S while holding the substrate S in each of the substrate holding holes 14 of the carrier 12 provided with the plurality of substrate holding holes 14. A substrate placement support jig 10 is used in the method. That is, in the substrate manufacturing method, the claw portions 20 are advanced to each standby hole 18 of the substrate placement support jig 10 described above so as to protrude from the edge of the standby hole 18, and the substrate S is held, and the lower surface plate is held. By retracting the claw portion 20 of the jig body 16 at a position above the carrier 12 arranged above, the substrate S is released from the waiting hole 18 and dropped. As a result, the substrates S are arranged in the respective substrate holding holes 14 of the carrier 12 located below. After that, the substrate S placed on the carrier 12 is polished by being sandwiched between the upper surface plate and the lower surface plate and relatively moved.
When the jig body 16 is arranged above the carrier 12, for example, the jig body 16 is placed on the carrier 12 so that the surface (main surface) of the carrier 12 and the surface (main surface) of the jig body 16 are in contact with each other. Alternatively, the jig body 16 may be arranged such that the surface (main surface) of the jig body 16 is slightly separated from the surface (main surface) of the carrier 12 .

（研磨装置）
図５及び図６を参照して研磨装置の構成をさらに具体的に説明する。図５，６は、一実施形態の研磨処理に用いる研磨装置の構成を示す図である。
研磨装置において、下定盤６０の上面および上定盤４０の下面には、研磨パッド３０が貼り付けられている。図５では、研磨パッド３０はシート状に記されている。研磨パッド３０には、例えば、発泡ウレタン樹脂等を用いることができる。(polishing device)
The configuration of the polishing apparatus will be described more specifically with reference to FIGS. 5 and 6. FIG. 5 and 6 are diagrams showing the configuration of a polishing apparatus used for the polishing process of one embodiment.
In the polishing apparatus, a polishing pad 30 is attached to the upper surface of the lower surface plate 60 and the lower surface of the upper surface plate 40 . In FIG. 5, the polishing pad 30 is depicted as a sheet. For example, foamed urethane resin or the like can be used for the polishing pad 30 .

研磨装置による研磨対象の基板Ｓの素材や製造方法は、特に制限されない。基板Ｓの素材は、例えばガラスやアルミニウム合金である。また、これらの表面にＮｉＰ（ニッケルリン）合金の層を有していてもよい。基板Ｓが磁気ディスク用基板である場合、基板Ｓのサイズは、例えば、公称直径３．５インチや２．５インチの磁気ディスク用基板のサイズである。基板Ｓが公称直径３．５インチの磁気ディスク用基板の場合、例えば、外径は、９４ｍｍ～９８ｍｍであり、内径は約２５ｍｍである。基板Ｓが公称直径２．５インチの磁気ディスク用基板の場合、例えば、外径は、５６ｍｍ～６８ｍｍであり、内径は約２０ｍｍである。基板Ｓの板厚は、例えば０．２０ｍｍ～１．３ｍｍ、好ましくは０．３０ｍｍ～０．７ｍｍである。
基板Ｓは、ガラス板の場合、例えば、大きなシートガラスに対してスクライビング及びカッティングを行って円盤形状のガラス板を形成する。すなわち、スクライバを用いてガラス板に切り欠き線を形成し、加熱等によって切り欠き線に沿ってクラックを発生させて割断させる方法が用いられる。
また、基板Ｓがガラス板の場合、例えば、大きなガラス板からレーザー光を用いて、基板Ｓのサイズに比べてやや大きめの円板形状のガラス板を形成してもよい。また、フッ酸等のエッチング液を用いたウェットエッチングにより円板形状のガラス板を形成してもよい。
ガラスブランクを切り出す前の大きなシートガラスは、例えば、フローティング法あるいはダウンドロー法を用いて作製された一定の板厚のガラス板である。あるいは、ガラスの塊を、金型を用いてプレス成形した基板であってもよい。
さらに、円板状のガラスブランクに、同心円の円孔をあけるために、スクライバを用いて円孔をあける。スクライバを用いて円孔をあける代わりに、レーザー光の照射により、あるいはエッチングにより、円孔をあけてもよい。こうして得られた円盤形状の基板Ｓの端面（外周端部の端面及び内周端部の端面）に面取り面２２を形成するために、総型砥石による形状加工が行われる。総型砥石による形状加工の代わりにレーザー光Ｌによる形状加工を用いてもよい。The material and manufacturing method of the substrate S to be polished by the polishing apparatus are not particularly limited. The material of the substrate S is, for example, glass or aluminum alloy. Moreover, these surfaces may have a layer of NiP (nickel phosphorous) alloy. When the substrate S is a magnetic disk substrate, the size of the substrate S is, for example, the size of a magnetic disk substrate with a nominal diameter of 3.5 inches or 2.5 inches. If the substrate S is a magnetic disk substrate with a nominal diameter of 3.5 inches, for example, the outer diameter is 94 mm to 98 mm and the inner diameter is approximately 25 mm. If the substrate S is a magnetic disk substrate with a nominal diameter of 2.5 inches, for example, the outer diameter is 56 mm to 68 mm and the inner diameter is about 20 mm. The thickness of the substrate S is, for example, 0.20 mm to 1.3 mm, preferably 0.30 mm to 0.7 mm.
When the substrate S is a glass plate, for example, a large sheet glass is scribed and cut to form a disk-shaped glass plate. That is, a method is used in which notch lines are formed in a glass plate using a scriber, and cracks are generated along the notch lines by heating or the like to break the glass plate.
When the substrate S is a glass plate, for example, a disk-shaped glass plate slightly larger than the size of the substrate S may be formed by using a laser beam from a large glass plate. Alternatively, a disk-shaped glass plate may be formed by wet etching using an etchant such as hydrofluoric acid.
A large sheet glass before cutting into a glass blank is, for example, a glass plate with a constant thickness produced using a floating method or a down-draw method. Alternatively, the substrate may be obtained by press-molding a lump of glass using a mold.
Further, circular holes are made using a scriber in order to form concentric circular holes in the disk-shaped glass blank. Instead of using a scriber to form circular holes, laser light irradiation or etching may be used to form circular holes. In order to form the chamfered surfaces 22 on the end faces (the end face of the outer peripheral end and the end face of the inner peripheral end) of the disk-shaped substrate S obtained in this way, shape processing is performed using a formed grindstone. Shape processing using a laser beam L may be used instead of shape processing using a formed grindstone.

キャリア１２は、円盤状の基板Ｓを上定盤４０と下定盤６０で挟んで基板Ｓの主表面を研磨処理する際に、基板Ｓを保持するための基板保持孔１４を有する。キャリア１２は、外周部に設けられて太陽歯車６１及び内歯車６２に噛合する歯部３１と、基板Ｓを収容し保持するための複数の基板保持孔１４とを有する。太陽歯車６１、外縁に設けられた内歯車６２および円盤状のキャリア１２は全体として、中心軸ＣＴＲ（図６参照）を中心とする遊星歯車機構を構成する。円盤状のキャリア１２は、研磨装置内側で太陽歯車６１に噛合し、かつ研磨装置外側で内歯車６２に噛合するとともに、基板Ｓを複数収容し保持する。下定盤６０上では、キャリア１２が遊星歯車として自転しながら公転し、基板Ｓと下定盤６０とが相対的に移動させられる。例えば、太陽歯車６１が反時計回りの方向に回転すれば、キャリア１２は時計回りの方向に回転し、内歯車６２は反時計回りの方向に回転する。その結果、下定盤６０と基板Ｓの間に相対運動が生じる。同様にして、基板Ｓと上定盤４０とを相対的に移動させる。 The carrier 12 has a substrate holding hole 14 for holding the substrate S when the disk-shaped substrate S is sandwiched between the upper surface plate 40 and the lower surface plate 60 and the main surface of the substrate S is polished. The carrier 12 has a tooth portion 31 which is provided on the outer peripheral portion and meshes with the sun gear 61 and the internal gear 62, and a plurality of substrate holding holes 14 for accommodating and holding the substrate S. The sun gear 61, the internal gear 62 provided on the outer edge, and the disk-shaped carrier 12 as a whole constitute a planetary gear mechanism centered on the central axis CTR (see FIG. 6). The disk-shaped carrier 12 meshes with the sun gear 61 inside the polishing apparatus and meshes with the internal gear 62 outside the polishing apparatus, and accommodates and holds a plurality of substrates S. On the lower surface plate 60, the carrier 12 revolves while rotating as a planetary gear, and the substrate S and the lower surface plate 60 are relatively moved. For example, if the sun gear 61 rotates counterclockwise, the carrier 12 rotates clockwise and the internal gear 62 rotates counterclockwise. As a result, relative motion occurs between the lower surface plate 60 and the substrate S. Similarly, the substrate S and the upper surface plate 40 are moved relatively.

上記相対運動の動作中には、上定盤４０がキャリア１２に保持された基板Ｓに対して（つまり、鉛直方向に）所定の圧力で押圧し、これにより基板Ｓに対して研磨パッド３０が押圧される。また、図６に示すように、ポンプ（不図示）によって研磨スラリが、供給タンク７１から１または複数の配管７２を経由して基板Ｓと研磨パッド３０との間に供給される。
以上の研磨装置を用いて基板Ｓの主表面が研磨される。During the operation of the relative motion, the upper surface plate 40 presses the substrate S held by the carrier 12 (that is, in the vertical direction) with a predetermined pressure, whereby the polishing pad 30 is pressed against the substrate S. pressed. Further, as shown in FIG. 6 , polishing slurry is supplied between the substrate S and the polishing pad 30 from a supply tank 71 via one or more pipes 72 by a pump (not shown).
The main surface of the substrate S is polished using the polishing apparatus described above.

基板Ｓの研磨処理は、一実施形態によれば、第１研磨及び第２研磨を含む。
第１研磨では、基板Ｓの外側端面を、上述の両面研磨装置のキャリア１２に設けられた基板保持孔１４内に保持しながら基板Ｓの両側の主表面の研磨が行われる。第１研磨は、微小な表面凹凸（マイクロウェービネス、粗さ）の調整を目的とする。
第１研磨処理に用いる遊離砥粒として、例えば、酸化セリウム、あるいはジルコニア等の砥粒が用いられる。研磨砥粒の大きさは、平均粒径（Ｄ５０）で例えば、０．５～３μｍの範囲内である。The polishing process of the substrate S includes first polishing and second polishing, according to one embodiment.
In the first polishing, both main surfaces of the substrate S are polished while holding the outer end face of the substrate S in the substrate holding holes 14 provided in the carrier 12 of the above-described double-sided polishing apparatus. The purpose of the first polishing is to adjust minute surface unevenness (micro-waviness, roughness).
Abrasive grains such as cerium oxide or zirconia are used as loose abrasive grains used in the first polishing process. The average grain size (D50) of the abrasive grains is, for example, within the range of 0.5 to 3 μm.

基板Ｓがガラス板である場合、第１研磨後、化学強化してもよい。この場合、化学強化液として、例えば硝酸カリウムと硝酸ナトリウムの混合熔融液等を用い、ガラス板を化学強化液中に浸漬する。これにより、イオン交換によってガラス板の表面に圧縮応力層を形成することができる。 If the substrate S is a glass plate, it may be chemically strengthened after the first polishing. In this case, for example, a mixed molten liquid of potassium nitrate and sodium nitrate is used as the chemical strengthening liquid, and the glass plate is immersed in the chemical strengthening liquid. Thereby, a compressive stress layer can be formed on the surface of the glass plate by ion exchange.

次に、基板Ｓに第２研磨が施される。第２研磨処理は、上述の両面研磨装置のキャリア１２に設けられた基板保持孔１４内に保持しながら基板Ｓの両側の主表面の研磨が行われる。第２研磨処理では、第１研磨処理に対して、遊離砥粒の種類及び粒子サイズが異なり、樹脂ポリッシャの硬度が異なる。樹脂ポリッシャの硬度は第１研磨処理時よりも小さいことが好ましい。例えばコロイダルシリカを遊離砥粒として含む研磨液が両面研磨装置の研磨パッドとガラス板の主表面との間に供給され、ガラス板の主表面が研磨される。第２研磨に用いる研磨砥粒の大きさは、平均粒径（Ｄ５０）で、例えば５～５０ｎｍの範囲内であることが好ましい。
なお、円盤状の基板Ｓは、第１研磨を行う前に、“研削”処理を行ってもよい。“研削”処理において研磨装置と同様のキャリアを含む構成の装置を用いる場合、基板配置支援治具１０を用いることができる。また、上記の実施形態では２回の研磨処理を行ったが、研磨処理は1回としてもよい。
このようにして、基板Ｓに、第１研磨、第２研磨を行って目標とする表面凹凸の基板が製造される。Next, the substrate S is subjected to a second polishing. In the second polishing process, both main surfaces of the substrate S are polished while being held in the substrate holding holes 14 provided in the carrier 12 of the above-described double-sided polishing apparatus. In the second polishing treatment, the type and particle size of free abrasive grains are different from those in the first polishing treatment, and the hardness of the resin polisher is different. It is preferable that the hardness of the resin polisher is lower than that during the first polishing treatment. For example, a polishing liquid containing colloidal silica as free abrasive grains is supplied between the polishing pad of the double-sided polishing apparatus and the main surface of the glass plate, and the main surface of the glass plate is polished. The size of the abrasive grains used in the second polishing is preferably within the range of 5 to 50 nm in average particle size (D50), for example.
Note that the disk-shaped substrate S may be subjected to a "grinding" process before performing the first polishing. When using an apparatus having a configuration including a carrier similar to that of the polishing apparatus in the "grinding" process, the substrate placement support jig 10 can be used. Further, although the polishing process is performed twice in the above embodiment, the polishing process may be performed once.
In this manner, the substrate S is subjected to the first polishing and the second polishing to manufacture the substrate having the target surface unevenness.

上述の説明では、基板配置支援治具１０に適用する基板Ｓとして、内孔の開いていない円板状の基板を用いて説明したが、基板Ｓは、円形状の基板の他に、同心円状の内孔が開いた円盤形状の基板でもよく、さらには、四角形などの多角形基板、シリコンウエハーなどの半導体基板であってもよい。 In the above description, as the substrate S applied to the substrate placement support jig 10, a disc-shaped substrate with no inner hole was used. It may be a disc-shaped substrate with an inner hole, a polygonal substrate such as a square, or a semiconductor substrate such as a silicon wafer.

以上、本発明の基板配置支援治具及び基板の製造方法について詳細に説明したが、本発明は上記実施形態に限定されず、本発明の主旨を逸脱しない範囲において、種々の改良や変更をしてもよいのはもちろんである。 Although the board placement support jig and the board manufacturing method of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various improvements and modifications can be made without departing from the scope of the present invention. Of course you can.

１０ 基板配置支援治具
１２ キャリア
１４ 基板保持孔
１６ 治具本体
１８ 待機孔
２０ 爪部
２２ 面取り面
２４ 傾斜面
２５ 側壁面
２６ 操作部
２８ 突起部
３０ 研磨パッド
３１ 歯部
４０ 上定盤
６０ 下定盤
６１ 太陽歯車
６２ 内歯車
７１ タンク
７２ 配管10 substrate placement support jig 12 carrier 14 substrate holding hole 16 jig main body 18 waiting hole 20 claw portion 22 chamfered surface 24 inclined surface 25 side wall surface 26 operating portion 28 protrusion 30 polishing pad 31 tooth portion 40 upper surface plate 60 lower surface plate 61 sun gear 62 internal gear 71 tank 72 piping

Claims (6)

基板の主表面を研磨するために、キャリアに設けられた複数の基板保持孔それぞれに基板を配置するための基板配置支援治具であって、
前記キャリアの複数の前記基板保持孔の位置に対応して、基板を配置可能な複数の待機孔が設けられた板状の治具本体と、
前記待機孔それぞれの縁の少なくとも１箇所には、前記縁から突出して、前記基板の外周端と接触して前記基板を保持する、前記治具本体に設けられた爪部と、を備え、
前記爪部を前進させて前記待機孔それぞれに前記基板を保持させ、前記治具本体を前記キャリアの上部に位置した状態で、前記爪部を後退させることにより、前記基板を前記待機孔それぞれから開放して落下させて下方にある前記キャリアの前記基板保持孔のそれぞれに配置するために、前記爪部が、前記待機孔の領域に出入り自在に前進あるいは後退するように前記爪部は構成されている、ことを特徴とする基板配置支援治具。 A substrate placement support jig for placing a substrate in each of a plurality of substrate holding holes provided in a carrier in order to polish a main surface of the substrate, comprising:
a plate-shaped jig body provided with a plurality of standby holes in which substrates can be arranged corresponding to the positions of the plurality of substrate holding holes of the carrier;
a claw part provided on the jig body that protrudes from the edge and contacts the outer peripheral edge of the substrate to hold the substrate at least one location on the edge of each of the standby holes;
The claws are advanced to hold the substrate in each of the standby holes, and with the jig body positioned above the carrier, the claws are retracted to remove the substrate from each of the standby holes. The claws are configured to move forward or backward freely in and out of the area of the waiting holes so as to open and drop and place the substrates in the respective substrate holding holes of the carrier below. A board placement support jig characterized by: 前記待機孔それぞれの周上の２つ以上の場所に前記爪部が設けられ、
前記爪部は、前記基板の主表面と接触せず、前記基板の外周端に設けられた面取り面と接触するように設けられた傾斜面を有し、
前記傾斜面に前記面取り面が接触して前記爪部それぞれが前記基板を下方から支持することにより、前記基板は前記待機孔それぞれに保持される、請求項１に記載の基板配置支援治具。 The claw portions are provided at two or more locations on the circumference of each of the standby holes,
the claw portion has an inclined surface provided so as not to contact the main surface of the substrate but to contact a chamfered surface provided on the outer peripheral edge of the substrate;
2. The jig according to claim 1, wherein the chamfered surface is in contact with the inclined surface and the claw portions support the substrate from below, whereby the substrate is held in each of the waiting holes. 前記爪部は、前記基板の外周端に設けられた前記基板の主表面と直交する側壁面に当接する、前記待機孔それぞれの縁から内側に向かって突出する突起部を有し、
前記突起部が前記側壁面に対して直交する方向から当接して前記基板を前記待機孔それぞれの壁に押圧することにより、前記基板は前記待機孔それぞれに保持される、請求項１に記載の基板配置支援治具。 the claw portion has a protruding portion protruding inward from the edge of each of the standby holes, the claw portion coming into contact with a side wall surface perpendicular to the main surface of the substrate provided at the outer peripheral end of the substrate;
2. The substrate according to claim 1, wherein the substrate is held in each of the standby holes by abutting the projections from a direction orthogonal to the side wall surface and pressing the substrate against the walls of the respective standby holes. Board placement support jig. 前記待機孔それぞれに設けられた前記爪部は同時に後退するように構成されている、請求項１～３のいずれか１項に記載の基板配置支援治具。 4. The jig according to any one of claims 1 to 3, wherein said claws provided in said standby holes are configured to retract simultaneously. 前記キャリアに面する前記治具本体の面には、前記待機孔の位置が前記キャリアの前記基板保持孔の位置に対応するように、前記キャリアの面に設けられた孔または突起に係止される突起または孔が設けられている、請求項１～４のいずれか1項に記載の基板配置支援治具。 A surface of the jig body facing the carrier is engaged with a hole or projection provided on the surface of the carrier so that the position of the standby hole corresponds to the position of the substrate holding hole of the carrier. 5. The substrate placement support jig according to any one of claims 1 to 4, wherein a protrusion or a hole is provided. 複数の基板保持孔が設けられたキャリアの前記基板保持孔のそれぞれに基板を保持した状態で、基板の主表面を研磨する研磨処理を含む基板の製造方法であって、
請求項１～５のいずれか１項に記載の基板配置支援治具の前記待機孔それぞれにおいて、前記爪部を前記待機孔の縁から突出するように前進させて前記基板を保持した状態で、下定盤の上に配置した前記キャリアの上方の位置で、前記治具本体の前記爪部を後退させることにより、前記基板を前記待機孔から開放して落下させて、下方にある前記キャリアの前記基板保持孔のそれぞれに前記基板を配置させるステップと、
前記キャリアに配置した前記基板を、上定盤及び前記下定盤で挟んで相対移動させることにより研磨するステップと、
を備えることを特徴とする基板の製造方法。 A substrate manufacturing method including a polishing process for polishing a main surface of a substrate while the substrate is held in each of the substrate holding holes of a carrier provided with a plurality of substrate holding holes,
6. A state in which the board is held by advancing the claw portion so as to protrude from the edge of the standby hole in each of the standby holes of the substrate arrangement support jig according to claim 1 Then, at a position above the carrier arranged on the lower surface plate , the claw portion of the jig body is retracted to release the substrate from the waiting hole and drop it to the carrier below. placing the substrate in each of the substrate holding holes of
polishing by sandwiching the substrate placed on the carrier between an upper surface plate and the lower surface plate and relatively moving the substrate ;
A method of manufacturing a substrate, comprising:
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