JP7291663B2 - 位置決め装置、位置決め方法、樹脂成形システムおよび樹脂成形品の製造方法 - Google Patents
位置決め装置、位置決め方法、樹脂成形システムおよび樹脂成形品の製造方法 Download PDFInfo
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- 239000011347 resin Substances 0.000 title claims description 55
- 229920005989 resin Polymers 0.000 title claims description 55
- 238000000465 moulding Methods 0.000 title claims description 41
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 238000000034 method Methods 0.000 title description 17
- 238000005259 measurement Methods 0.000 claims description 76
- 238000006073 displacement reaction Methods 0.000 claims description 39
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 230000003247 decreasing effect Effects 0.000 claims description 5
- 230000007423 decrease Effects 0.000 claims description 3
- 239000000284 extract Substances 0.000 claims description 2
- 238000000605 extraction Methods 0.000 claims 3
- 230000000052 comparative effect Effects 0.000 description 12
- 238000001514 detection method Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 238000000748 compression moulding Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14008—Inserting articles into the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/008—Handling preformed parts, e.g. inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
- B29C31/08—Feeding of the material to be moulded, e.g. into a mould cavity of preforms to be moulded, e.g. tablets, fibre reinforced preforms, extruded ribbons, tubes or profiles; Manipulating means specially adapted for feeding preforms, e.g. supports conveyors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
以下、本発明の実施の形態について、図面を参照しながら詳細に説明する。なお、図中同一又は相当部分には同一符号を付してその説明は繰り返さない。
以下、本実施形態の樹脂成形システム10の樹脂成形の基本構成を説明する。
以下、本実施形態の樹脂成形システム10の樹脂成形の基本動作を説明する。
図2は位置決め装置20を模式的に示す図であり、図2(a)は平面図であり、図2(b)は側面図である。図2に示されるように、位置決め装置20は、回転テーブル21と、測定器22とを備える。
以下、本実施形態の位置決め装置20の基本動作を説明する。
図5は、比較例のワークWの位置決め動作のフローチャートであり、図3に対応する。なお、位置決め装置の基本構成は、本発明と同様である。
上記実施の形態の思想は、以上で説明された実施の形態に限定されない。以下、上記実施の形態の思想を適用できる他の実施の形態の一例について説明する。
本実施形態の位置決め装置は、回転させたワークWを一定の回転角度毎にワークの周縁部の変位量を測定する測定器と、ワークWの切欠部の中心位置を検出するように測定器を制御する制御部とを備え、制御部は、測定結果の単調減少する第1領域および単調増加する第2領域の少なくとも一部の測定点の数に基づき、ワークWの切欠部の中心位置を検出するように制御する。この位置決め装置であれば、平面視で直線部分およびノッチを含むワークWの切欠部の中心位置を検出できる。
20・・・位置決め装置
30・・・樹脂成形装置
40・・・制御部
21・・・回転テーブル
22・・・測定器
Claims (4)
- ワークの回転中心位置を、前記ワークを回転させる回転テーブルの回転軸に一致させている状態で回転させた前記ワークを一定の回転角度毎に前記ワークの周縁部の変位量を測定する測定器と、
前記ワークの切欠部の中心位置を検出するように前記測定器を制御する制御部とを備え、
前記制御部は、
前記測定器が1つの前記ワークに関して測定した全ての変位量の平均値を算出し、
前記全ての変位量の中で、算出した平均値以下の測定点を抽出し、
抽出した測定点の中で、前記測定結果の単調減少する第1領域に属する測定点の数、および、抽出した測定点の中で、前記測定結果の単調増加する第2領域に属する測定点の数に基づき、ワークの切欠部の中心位置を検出するように制御する、位置決め装置。 - 請求項1に記載の位置決め装置で位置決めされた前記ワークが配置されて樹脂成形する樹脂成形部を備える、樹脂成形システム。
- 請求項2に記載の樹脂成形システムを用いて前記ワークを樹脂成形する、樹脂成形品の製造方法。
- ワークの回転中心位置を、前記ワークを回転させる回転テーブルの回転軸に一致させている状態で前記ワークを回転させ、一定の回転角度毎に前記ワークの周縁部の変位量を測定する測定工程と、
前記測定工程で1つの前記ワークに関して測定した全ての変位量の平均値を算出する算出工程と、
前記全ての変位量の中で、前記算出工程で算出した平均値以下の測定点を抽出する抽出工程と、
前記抽出工程で抽出した測定点の中で、前記測定工程で測定された測定結果の単調減少する第1領域に属する測定点の数、および、前記抽出工程で抽出した測定点の中で、前記測定結果の単調増加する第2領域に属する測定点の数に基づき、ワークの切欠部の中心位置を検出する検出工程とを含む、位置決め方法。
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JP2020077173A JP7291663B2 (ja) | 2020-04-24 | 2020-04-24 | 位置決め装置、位置決め方法、樹脂成形システムおよび樹脂成形品の製造方法 |
KR1020210025433A KR102397599B1 (ko) | 2020-04-24 | 2021-02-25 | 위치 결정 장치, 위치 결정 방법, 수지 성형 시스템, 및 수지 성형품의 제조 방법 |
CN202110332590.8A CN113547691B (zh) | 2020-04-24 | 2021-03-29 | 定位装置及方法、树脂成形***及树脂成形品的制造方法 |
TW110112588A TWI770930B (zh) | 2020-04-24 | 2021-04-07 | 定位裝置及方法、樹脂成形系統及樹脂成形品的製造方法 |
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JP2021173618A5 JP2021173618A5 (ja) | 2022-04-26 |
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TW (1) | TWI770930B (ja) |
Citations (2)
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JP4268746B2 (ja) | 2000-09-08 | 2009-05-27 | 株式会社リコー | 反発型磁気浮上軸受および光偏向走査装置 |
JP5864043B2 (ja) | 2011-04-12 | 2016-02-17 | シャープ株式会社 | 表示装置、操作入力方法、操作入力プログラム、及び記録媒体 |
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- 2021-03-29 CN CN202110332590.8A patent/CN113547691B/zh active Active
- 2021-04-07 TW TW110112588A patent/TWI770930B/zh active
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JP4268746B2 (ja) | 2000-09-08 | 2009-05-27 | 株式会社リコー | 反発型磁気浮上軸受および光偏向走査装置 |
JP5864043B2 (ja) | 2011-04-12 | 2016-02-17 | シャープ株式会社 | 表示装置、操作入力方法、操作入力プログラム、及び記録媒体 |
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CN113547691B (zh) | 2023-06-13 |
CN113547691A (zh) | 2021-10-26 |
KR20210131867A (ko) | 2021-11-03 |
JP2021173618A (ja) | 2021-11-01 |
TWI770930B (zh) | 2022-07-11 |
KR102397599B1 (ko) | 2022-05-16 |
TW202208140A (zh) | 2022-03-01 |
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