JP7289267B2 - 半導体処理中のマイクロ波空洞における均一の熱分布のための方法および装置 - Google Patents
半導体処理中のマイクロ波空洞における均一の熱分布のための方法および装置 Download PDFInfo
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- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- H01L21/67248—Temperature monitoring
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- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/6402—Aspects relating to the microwave cavity
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- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/66—Circuits
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- H05B6/00—Heating by electric, magnetic or electromagnetic fields
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- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
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- H05B6/64—Heating using microwaves
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- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
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- H05B6/64—Heating using microwaves
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Description
Claims (5)
- 半導体処理のためのマイクロ波炉であって、
空洞および複数の入力ポートを有する熱ハウジングと、
前記複数の入力ポートを介して前記熱ハウジングの前記空洞へマイクロ波信号を提供するように構成された電源と、
複数のマイクロ波信号入力を有し、前記電源と前記入力ポートとの間に配置された移相器と、
前記電源を前記移相器に結合し、前記マイクロ波信号を少なくとも2つのマイクロ波信号に分割する第1の導波管であって、前記少なくとも2つのマイクロ波信号が、前記移相器に対する入力信号であり、前記移相器への前記第1の導波管の長さは、前記電源から前記移相器に入る少なくとも2つのマイクロ波信号が同相になるように、前記電源のマイクロ波信号入力の平均波長の整数倍となるように選択され、前記移相器は、それに提供された2つ以上の信号間の位相差を0度~180度まで変動させるように構成された、第1の導波管と、
前記移相器に通信結合され、前記2つ以上の信号間の前記位相差を制御するように構成されたコントローラと、
前記移相器を前記複数の入力ポートのうちの第1の入力ポートへ結合し、前記少なくとも2つのマイクロ波信号のうちの第1のマイクロ波信号を前記空洞内へ案内するように構成された第2の導波管と、
前記移相器を前記複数の入力ポートのうちの第2の入力ポートへ結合し、前記少なくとも2つのマイクロ波信号のうちの第2のマイクロ波信号を前記空洞内へ案内するように構成された第3の導波管と
を備え、
前記第1のマイクロ波信号と前記第2のマイクロ波信号との間に位相差が存在し、
前記第1の入力ポートおよび前記第2の入力ポートが、前記空洞の両端に配置され、
前記コントローラが、前記空洞内に位置する複数の対象物の均一な加熱を提供するために、
前記空洞の温度、
前記空洞内に配置された対象物の温度、
前記空洞の形状寸法、前記空洞内に配置された前記対象物上で検出される湿気レベル、
前記空洞の湿気レベル、
前記空洞内に配置された前記対象物の直接電磁界測定値、
前記空洞の直接電磁界測定値、またはそれらの組み合わせ
から選択される、1つもしくは複数の制御パラメータに基づいて、前記移相器によって導入された信号間の位相差を修正する、マイクロ波炉。 - 前記コントローラによって制御される可動の位置を有する機械ペデスタルをさらに備える、
請求項1に記載のマイクロ波炉。 - 前記熱ハウジングおよび前記コントローラに結合されたフィードバック機構をさらに備え、前記フィードバック機構が、制御パラメータを判定するように構成されており、前記コントローラが、制御パラメータに応じて、前記機械ペデスタルの位置決めを制御する、
請求項2に記載のマイクロ波炉。 - 前記熱ハウジングおよび前記コントローラに結合されたフィードバック機構をさらに備え、前記フィードバック機構が、制御パラメータを判定するように構成されており、前記コントローラが、前記制御パラメータに応じて、前記移相器によって導入される前記位相差を制御する、
請求項1から3までのいずれか1項に記載のマイクロ波炉。 - 前記電源が、可変周波数マイクロ波ドライブである、請求項1から4までのいずれか1項に記載のマイクロ波炉。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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US201762500609P | 2017-05-03 | 2017-05-03 | |
US62/500,609 | 2017-05-03 | ||
US15/966,211 | 2018-04-30 | ||
US15/966,211 US20180323091A1 (en) | 2017-05-03 | 2018-04-30 | Method and apparatus for uniform thermal distribution in a microwave cavity during semiconductor processing |
PCT/US2018/030787 WO2018204576A1 (en) | 2017-05-03 | 2018-05-03 | Method and apparatus for uniform thermal distribution in a microwave cavity during semiconductor processing |
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JP2020521275A JP2020521275A (ja) | 2020-07-16 |
JP2020521275A5 JP2020521275A5 (ja) | 2021-05-27 |
JP7289267B2 true JP7289267B2 (ja) | 2023-06-09 |
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US (1) | US20180323091A1 (ja) |
JP (1) | JP7289267B2 (ja) |
KR (1) | KR102540168B1 (ja) |
CN (1) | CN110663108B (ja) |
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WO (1) | WO2018204576A1 (ja) |
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CN112235003B (zh) * | 2020-10-13 | 2022-01-14 | 大连海事大学 | 一种用于改变场分布的双路宽带信号装置 |
TWI820537B (zh) * | 2021-04-26 | 2023-11-01 | 財團法人工業技術研究院 | 微波加熱方法與微波加熱裝置 |
TWI786015B (zh) * | 2022-04-22 | 2022-12-01 | 宏碩系統股份有限公司 | 單源微波加熱裝置 |
DE102022127931A1 (de) * | 2022-10-21 | 2024-05-02 | TRUMPF Hüttinger GmbH + Co. KG | Werkstückbehandlungsvorrichtung zur Behandlung eines Werkstücks mit einer Mikrowelle und Verfahren zur Behandlung des Werkstücks mit der Mikrowelle |
Citations (5)
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JP2008060016A (ja) | 2006-09-04 | 2008-03-13 | Matsushita Electric Ind Co Ltd | マイクロ波利用装置 |
JP2010073383A (ja) | 2008-09-17 | 2010-04-02 | Panasonic Corp | マイクロ波加熱装置 |
WO2011114711A1 (ja) | 2010-03-19 | 2011-09-22 | パナソニック株式会社 | マイクロ波加熱装置 |
US20140042152A1 (en) | 2012-08-08 | 2014-02-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Variable frequency microwave device and method for rectifying wafer warpage |
US20150156827A1 (en) | 2012-07-02 | 2015-06-04 | Goji Limited | Rf energy application based on electromagnetic feedback |
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CA1053760A (en) * | 1976-12-30 | 1979-05-01 | Thomas E. Hester | Power controller for microwave magnetron |
JPS5830687B2 (ja) * | 1977-03-16 | 1983-06-30 | 松下電器産業株式会社 | 調理器 |
JP3957135B2 (ja) * | 2000-10-13 | 2007-08-15 | 東京エレクトロン株式会社 | プラズマ処理装置 |
JP3839395B2 (ja) * | 2002-11-22 | 2006-11-01 | 株式会社エーイーティー | マイクロ波プラズマ発生装置 |
JP5064924B2 (ja) * | 2006-08-08 | 2012-10-31 | パナソニック株式会社 | マイクロ波処理装置 |
JP5167678B2 (ja) * | 2007-04-16 | 2013-03-21 | パナソニック株式会社 | マイクロ波処理装置 |
KR101224520B1 (ko) * | 2012-06-27 | 2013-01-22 | (주)이노시티 | 프로세스 챔버 |
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JP2014032744A (ja) * | 2012-08-01 | 2014-02-20 | Panasonic Corp | マイクロ波加熱装置 |
US10588182B2 (en) * | 2014-05-28 | 2020-03-10 | Guangdong Midea Kitchen Appliances Manufacturing Co., Ltd. | Semiconductor microwave oven and semiconductor microwave source thereof |
CN105120549B (zh) * | 2015-09-02 | 2018-05-01 | 广东美的厨房电器制造有限公司 | 微波加热***及其半导体功率源和加热控制方法 |
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2018
- 2018-04-30 US US15/966,211 patent/US20180323091A1/en not_active Abandoned
- 2018-05-03 JP JP2019560260A patent/JP7289267B2/ja active Active
- 2018-05-03 KR KR1020197035666A patent/KR102540168B1/ko active IP Right Grant
- 2018-05-03 CN CN201880033408.5A patent/CN110663108B/zh active Active
- 2018-05-03 WO PCT/US2018/030787 patent/WO2018204576A1/en active Application Filing
- 2018-05-03 TW TW107114980A patent/TWI773753B/zh active
Patent Citations (5)
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JP2008060016A (ja) | 2006-09-04 | 2008-03-13 | Matsushita Electric Ind Co Ltd | マイクロ波利用装置 |
JP2010073383A (ja) | 2008-09-17 | 2010-04-02 | Panasonic Corp | マイクロ波加熱装置 |
WO2011114711A1 (ja) | 2010-03-19 | 2011-09-22 | パナソニック株式会社 | マイクロ波加熱装置 |
US20150156827A1 (en) | 2012-07-02 | 2015-06-04 | Goji Limited | Rf energy application based on electromagnetic feedback |
US20140042152A1 (en) | 2012-08-08 | 2014-02-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Variable frequency microwave device and method for rectifying wafer warpage |
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Publication number | Publication date |
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JP2020521275A (ja) | 2020-07-16 |
TW201907506A (zh) | 2019-02-16 |
TWI773753B (zh) | 2022-08-11 |
CN110663108A (zh) | 2020-01-07 |
CN110663108B (zh) | 2024-03-12 |
WO2018204576A1 (en) | 2018-11-08 |
KR102540168B1 (ko) | 2023-06-02 |
KR20190138317A (ko) | 2019-12-12 |
US20180323091A1 (en) | 2018-11-08 |
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