JP7259907B2 - 樹脂組成物、半導体用配線層積層体及び半導体装置 - Google Patents
樹脂組成物、半導体用配線層積層体及び半導体装置 Download PDFInfo
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- JP7259907B2 JP7259907B2 JP2021154409A JP2021154409A JP7259907B2 JP 7259907 B2 JP7259907 B2 JP 7259907B2 JP 2021154409 A JP2021154409 A JP 2021154409A JP 2021154409 A JP2021154409 A JP 2021154409A JP 7259907 B2 JP7259907 B2 JP 7259907B2
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Images
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- H05K1/00—Printed circuits
- H05K1/02—Details
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- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
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- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
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- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
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- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
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- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
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Description
式中、R1は、4価の有機基を表す。
式中、R2及びR3は、それぞれ独立にアルキレン基を表し、R4及びR5は、それぞれ独立にアルキル基を表す。
式中、Z1、Z2及びZ3は、それぞれ独立に上述した2価の炭化水素基を表し、R1は式(I)中のR1と同義であり、nは1~10の整数を表す。nが2以上である場合、複数のZ3は、互いに同一であっても異なっていてもよい。
ポンプ:L-6200型[株式会社日立ハイテクノロジーズ製]
検出器:L-3300型RI[株式会社日立ハイテクノロジーズ製]
カラムオーブン:L-655A-52[株式会社日立ハイテクノロジーズ製]
ガードカラム及びカラム:TSK Guardcolumn HHR-L+TSKgel G4000HHR+TSKgel G2000HHR[すべて東ソー株式会社製、商品名]
カラムサイズ:6.0×40mm(ガードカラム)、7.8×300mm(カラム)
溶離液:テトラヒドロフラン
試料濃度:30mg/5mL
注入量:20μL
測定温度:40℃
式中、Q4及びQ9は、それぞれ独立に、炭素数1~5のアルキレン基又は置換基を有してもよいフェニレン基を示し、Q5、Q6、Q7及びQ8は、それぞれ独立に、炭素数1~5のアルキル基、フェニル基又はフェノキシ基を示し、dは1~5の整数を示す。
式中、nは1以上の整数を示す。
で表される脂肪族ジアミン、下記式(12)で表される脂肪族エーテルジアミン等が挙げられる。
式中、eは0~80の整数を示す。
式中、aは2~20の整数を示す。
式中、R41及びR42は、それぞれ独立に、水素原子又はメチル基を示し、f及びgは、それぞれ独立に1以上の整数を示す。
ここでのイオンクロマトグラフィーの条件は以下のとおりである。
・装置:ダイオネクス製ISC-2000
・検出器:電気伝導度検出器
・カラム:AS20(4mmφ×200mm)
・カラム温度:30℃
・流速:1.0ml/min
・注入量:25μl
・グラジェント設定:KOH濃度を、0分に5mM、5分で5mM、15分で30mM、20分で55mMに設定した。
取り扱い容易性の観点から、フィルム状の樹脂組成物を用いて、第1の配線層間絶縁層17を形成することが好ましい。また、第1の配線層間絶縁層17の膜厚均一性及び大判化に対応できる観点から、ラミネートによって第1の配線層間絶縁層17を形成することが好ましい。第1の配線層間絶縁層17をラミネートによって形成する場合、第2,第3ステップと同様に、フィルム状の樹脂組成物を第1の有機絶縁層21に貼り付ける。この場合、残留応力を低減する観点から150℃以下に設定されることが好ましく、ボイド抑制の観点から60℃以上に設定されることが好ましい。
図14(a),(b)に示される測定評価用試料を以下のようにして作製した。まず、厚さ150mmのシリコンウェハ51に厚さ3μmの感光性絶縁樹脂フィルム52を貼り付けた。この感光性絶縁樹脂フィルム52は、以下のようにして形成した。まず、クレゾールノボラック樹脂(旭有機材工業株式会社製、商品名:TR-4020G、100質量部)と、1,3,4,6-テトラキス(メトキシメチル)グリコールウリル(30質量部)と、トリメチロールプロパントリグリシジルエーテル(40質量部)と、トリアリールスルホニウム塩(サンアプロ株式会社製、商品名:CPI-310B、8質量部)と、メチルエチルケトン(100質量部)とを配合し、感光性絶縁樹脂を得た。次に、得られた感光性絶縁樹脂をポリエチレンテレフタレートフィルム(帝人デュポンフィルム株式会社製、商品名:A-53)に塗布し、90℃のオーブンで10分間乾燥することによって、厚さ3μmの感光性絶縁樹脂フィルム52を得た。
まず、シロキサン鎖を有する熱可塑性樹脂の合成をするため、「BMI-3000」(Designer Molecules Inc.社製、商品名)を25gと、2,2-ビス(4-(4-マレイミドフェノキシ)フェニル)プロパン(大和化成工業株式会社製、商品名:BMI-4000)を25gと、トルエン150gとをフラスコに入れ、20分間撹拌した。次いで、シリコーンジアミン(信越化学工業株式会社製、商品名:KF-8010)を16.4g上記フラスコに入れ、オイルバスを用いて130℃に加熱した。還流が始まった時間から3時間撹拌して反応させ、空冷によって室温まで冷却し、固形状のシリコーン鎖を有する熱可塑性樹脂を形成した。次に、トルエンに溶解した熱硬化性エラストマ(旭化成株式会社製、商品名:タフテックM1911)を固形分で50gと、上記シリコーン鎖を有する熱可塑性樹脂を固形分で50gと、硬化剤(日油株式会社製、商品名:パーヘキシン25B)2gとを配合した。この配合物を均一に分散するように30分間撹拌することによって、不揮発分20%に調整された配線層間絶縁層形成用の樹脂組成物のワニスを形成した。得られた樹脂組成物のワニスを、卓上コータを用いて離型処理されたPETフィルム(厚さ38μm、商品名:NR-1)上に塗工した。塗膜の厚みは、アプリケータを使用して、乾燥後に10μmとなるように調整した。次に、樹脂組成物の塗膜を130℃、10分間の加熱により乾燥して、硬化性フィルム(材料A)をPETフィルム上に形成させた。そして、PETフィルムを除去して、硬化性フィルム(材料A)を配線層間絶縁層57を形成するために用いた。実施例1の配線層間絶縁層57(材料Aの硬化物)は、吸湿率が1.0質量%以下、塩化物イオン濃度が3ppm以下、破断伸びが150%、40℃における貯蔵弾性率が60MPaであった。
ライン幅L及びスペース幅Sを3μmに設定したこと以外は実施例1と同様にして測定評価用試料50を形成し、上述した高加速度寿命試験を行った。実施例2の高加速度寿命試験の結果を、下記表1に示す。
ライン幅L及びスペース幅Sを2μmに設定したこと以外は実施例1と同様にして測定評価用試料50を形成し、上述した高加速度寿命試験を行った。実施例3の高加速度寿命試験の結果を、下記表1に示す。
配線層間絶縁層57を形成するための硬化性フィルムとして下記材料Bを用いたこと以外は、実施例2と同様にして測定評価用試料50を形成した。この測定評価用試料50に対して上述した高加速度寿命試験を行った。実施例4の高加速度寿命試験の結果を、下記表1に示す。
まず、シロキサン鎖を有する熱可塑性樹脂の合成をするため、撹拌機、温度計及び窒素置換装置(窒素流入管)を備えた500mlフラスコ内に、ジアミンである1,4-ブタンジオール ビス(3-アミノプロピル)エーテル(東京化成工業株式会社製、商品名:B-12)を8.17g、ポリオキシプロピレンジアミン(BASFジャパン株式会社製、商品名:D-400)を21.65g、及びシリコーンジアミン(信越化学工業株式会社製、商品名:KF-8010)を8.6gと、溶媒であるNMP(N-メチル-2-ピロリドン)250gとを添加し、撹拌してジアミンを溶媒に溶解させた。次に、当該フラスコに水分受容器付の還流冷却器を取り付け、窒素ガスを吹き込みながら180℃に昇温させた後、180℃を5時間保持し、水を除去しながら反応させた。こうして得られた溶液を室温まで冷却した。次に、NMPに溶解したポリブタジエン樹脂(CRAY VALLEY製、商品名:Ricon130MA8)を固形分で50gと、上記のシロキサン鎖を有する熱可塑性樹脂を固形分で50gと、硬化剤(日油株式会社製、商品名:パーヘキシン25B)を2gと、G8009L(第一工業製薬株式会社製、商品名)を1gとを配合し、均一に分散するように30分間撹拌し、配線層間絶縁層形成用の樹脂組成物のワニスを形成した。得られた樹脂組成物のワニスを、卓上コータを用いて離型処理されたPETフィルム(厚さ38μm、商品名:NR-1)上に塗工した。樹脂組成物の塗膜の膜厚は、アプリケータを使用して、乾燥後に10μmとなるように調整した。次に、樹脂組成物の塗膜を120℃、20分間の加熱により乾燥して、硬化性フィルム(材料B)をPETフィルム上に形成させた。そして、PETフィルムを除去し、硬化性フィルム(材料B)を配線層間絶縁層57を形成するために用いた。実施例4の配線層間絶縁層57(材料Bの硬化物)は、吸湿率が1.0質量%以下、塩化物イオン濃度が3ppm以下、破断伸びが70%、40℃における貯蔵弾性率が180MPaであった。
ライン幅L及びスペース幅Sを2μmに設定したこと以外は実施例4と同様にして測定評価用試料50を形成し、上述した高加速度寿命試験を行った。実施例5の高加速度寿命試験の結果を、下記表1に示す。
配線層間絶縁層57を形成するための硬化性フィルムとして下記材料Cを用いたこと以外は、実施例2と同様にして測定評価用試料50を形成した。この測定評価用試料50に対して上述した高加速度寿命試験を行った。実施例6の高加速度寿命試験の結果を、下記表1に示す。
まず、熱可塑性樹脂の合成をするため、攪拌機、温度計、及び窒素置換装置を備えたフラスコ内に、2,2-ビス(4-(4-アミノフェノキシ)フェニル)プロパンを10.3g、1,4-ブタンジオール ビス(3-アミノプロピル)エーテル(東京化成工業株式会社製、商品名:B-12)を4.1g、及び、NMPを101gを添加した。次いで、1,2-(エチレン)ビス(トリメリテート無水物)を20.5gを当該フラスコ内に添加し、室温で1時間攪拌した。次に、当該フラスコに水分受容器付の還流冷却器を取り付け、窒素ガスを吹き込みながら180℃に昇温させた後、180℃を5時間保持し、水を除去しながら反応させた。こうして得られた溶液を室温まで冷却した。次に、NMPに溶解したポリブタジエン樹脂(CRAY VALLEY製、商品名:Ricon130MA8)を固形分で50g、上記の熱可塑性樹脂を固形分で50g、硬化剤(日油株式会社製、商品名:パーヘキシン25B)を2gと、NMPに溶解したエポキシ樹脂(日本化薬株式会社製、商品名:NC3000H)を固形分で10gと、G8009L(第一工業製薬株式会社製、商品名)を1gと、シリカスラリー[アドマテックス製;商品名:SC2050-KNK]を固形分で70gとを配合し、均一に分散するように30分間撹拌し、配線層間絶縁層形成用の樹脂組成物のワニスを形成した。得られた樹脂組成物のワニスを、卓上コータを用いて離型処理されたPETフィルム(厚さ38μm、商品名:NR-1)上に塗工した。樹脂組成物の塗膜の膜厚は、アプリケータを使用して、乾燥後に10μmとなるように調整した。次に、樹脂組成物の塗膜を120℃、20分間の加熱により乾燥して、硬化性フィルム(材料C)をPETフィルム上に形成させた。そして、PETフィルムを除去し、硬化性フィルム(材料C)を、配線層間絶縁層57を形成するために用いた。実施例6の配線層間絶縁層57(材料Cの硬化物)は、吸湿率が1.0質量%以下、塩化物イオン濃度が5ppm以下、破断伸びが3%、40℃における貯蔵弾性率が11GPaであった。
配線層間絶縁層57を下記材料Dを用いて形成したこと以外は、実施例1と同様にして測定評価用試料50を形成した。ただし、貼り付けられた材料Dに対して、高精度平行露光機(株式会社オーク製作所製、商品名:EXM-1172-B-∞)で露光量:500mJ/cm2の露光処理を施した後、熱硬化処理を実施した。この測定評価用試料50に対して上述した高加速度寿命試験を行った。比較例1の高加速度寿命試験の結果を、下記表1に示す。
材料Dは、感光性絶縁樹脂フィルム52等と同一の感光性絶縁樹脂から形成された、厚さ10μmのフィルムである。材料Dの硬化物は、吸湿率が2.0質量%、塩化物イオン濃度が8.6ppmであった。
ライン幅L及びスペース幅Sを2μmに設定したこと以外は比較例1と同様にして測定評価用試料50を形成し、上述した高加速度寿命試験を行った。比較例2の高加速度寿命試験の結果を、下記表1に示す。
配線層間絶縁層57を下記材料Eを用いて形成し、ライン幅L及びスペース幅Sを3μmに設定したこと以外は比較例1と同様にして測定評価用試料50を形成した。この測定評価用試料50に対して上述した高加速度寿命試験を行った。比較例3の高加速度寿命試験の結果を、下記表1に示す。
材料Eとして、FZ-2700GA(日立化成株式会社製、商品名)を用いた。材料Eの硬化物は、吸湿率が1.3質量%、塩化物イオン濃度が6.3ppmであった。
配線層間絶縁層57を形成するための硬化性フィルムとして下記材料Fを用い、ライン幅L及びスペース幅Sを3μmに設定したこと以外は、比較例1と同様にして測定評価用試料50を形成した。この測定評価用試料50に対して上述した高加速度寿命試験を行った。比較例4の高加速度寿命試験の結果を、下記表1に示す。
まず、熱可塑性樹脂の合成をするため、攪拌機、温度計及び窒素置換装置を備えたフラスコ内に、5,5’-メチレン-ビス(アントラニリックアシッド)を2.16gと、脂肪族エーテルジアミン(BASFジャパン株式会社製、商品名:D-400)を15.13gと、1,1,3,3-テトラメチル-1,3-ビス(4-アミノフェニル)ジシロキサン(信越化学工業株式会社製、商品名:LP-7100)を1.63gと、NMPを115gとを配合した。次いで、オキシジフタル酸無水物(ODPA)16.51gを当該フラスコ内に添加した後、室温で1時間攪拌した。そして、当該フラスコ内に窒素ガスを吹き込みながら180℃に昇温させた後、180℃を5時間保持し、水を除去しながら反応させた。こうして得られた溶液を室温まで冷却した。NMPに溶解したエポキシ樹脂(日本化薬株式会社製、商品名:NC3000H)を固形分で30gと、上記の熱可塑性樹脂を固形分で50gと、硬化剤として2P4MHZ(四国化成工業株式会社製、商品名)を1gとを配合し、均一に分散するように30分間撹拌し、樹脂組成物のワニスを形成した。得られた樹脂組成物のワニスを、卓上コータを用いて離型処理されたPETフィルム(厚さ38μm、商品名:NR-1)上に塗工した。樹脂組成物の塗膜は、アプリケータを使用して、乾燥後に10μmとなるように調整した。次に、樹脂組成物の塗膜を120℃、20分間の加熱により乾燥して、硬化性フィルム(材料F)をPETフィルム上に形成させた。そして、PETフィルムを除去し、配線層間絶縁層を形成するために硬化性フィルム(材料F)を用いた。比較例4の配線層間絶縁層(材料Fの硬化物)は、吸湿率が1.2質量%、塩化物イオン濃度が5ppm以下であった。
以下の各成分を表1に示す組成となるように、25℃で30分間以上攪拌した後、#200のナイロンメッシュ(目開き:75μm)でろ過して、樹脂組成物(ワニス)を得た。
(C)成分:光ラジカル重合開始剤(BASF社製、商品名:Irgacure907)
(D-1)成分:エポキシ基を有するシランカップリング剤(信越化学工業株式会社社製、商品名:X-12-984S)
(D-2)成分:エポキシ基を有するシランカップリング剤(信越化学工業株式会社社製、商品名:KBM-403)
誘電特性の評価は、ワニスを卓上コータで乾燥後の厚みが50μmとなるように銅箔上に塗工・乾燥させ樹脂フィルム(半硬化)を得た。次に、得られた樹脂フィルム(半硬化)に2000mJ/cm2のUVを照射した。作製した樹脂フィルム上に同様に樹脂膜を形成・積層していき、樹脂フィルムの膜厚を300μmとした。さらに、支持体である銅箔を物理的剥離もしくはエッチングによって除去して評価用の樹脂フィルムを得た。
そして、樹脂フィルムを長さ60mm、幅2mm、厚み0.3mmに切断したものを試験片として空洞共振器摂動法により誘電特性を測定した。測定器には、アジレントテクノロジー社製ベクトル型ネットワークアナライザE8364B、空洞共振器には株式会社関東電子応用開発製CP531(10GHz帯共振器)、測定プログラムにはCPMA-V2をそれぞれ使用した。条件は、周波数10GHz、測定温度25℃とした。
ウェハ(6インチ径、厚さ400μm)にスピンコータを用いてワニスを塗布し、90℃/5分乾燥させて樹脂層を形成した。2000mJ/cm2で露光して硬化させた後、180℃/1時間加熱することによって、試料を作製した。この試料を、相対湿度85%、130℃に設定された恒温恒湿槽(エスペック株式会社製、商品名:EHS-221MD)内にて、200時間静置した。そして、恒温恒湿槽内を50℃まで下げた後、試料を取り出し、シリコンウェハ上から樹脂の一部を削り取った。削り取られた樹脂の一部を示差熱熱重量同時測定装置(株式会社日立ハイテクサイエンス製、商品名:TG/DTA6300)を用いて、昇温速度:10℃/分、窒素フロー:400mL/分、温度範囲:25℃~150℃の条件下で測定した。150℃における上記の重量減少率を吸湿率として算出した。
上記と同様の手法にて作製した樹脂フィルムを、長さ30mm、幅5mmに切断して得られたサンプルを、小型卓上試験機(株式会社島津製作所製、商品名:EZ-S)にて送り速度5mm/分にて測定したときの破断伸びを測定した。
シリコンウェハ(6インチ径、厚さ400μm)上に、スピンコートにてワニスを塗布し、90℃/5分加熱乾燥して、シリコンウェハ上に樹脂膜を形成した。その際、乾燥後の樹脂の膜厚は5μmとなるようにスピンコート条件を調整した。次に、Line/Space(L/S(μm/μm))が200/200、100/100、80/80、60/60、50/50、40/40、30/30、20/20、10/10、7/7、5/5、4/4、3/3で、ビア径が50、40、30、20、10、7、5、4、3μmとなるネガ型用パターンマスクを載せ、高精度平行露光機(オーク製作所製、商品名:EXM-1172-B-∞)を用いて1000mJ/cm2で露光した。さらに、100℃/1分の条件で追加加熱を行い、サンプルを得た。得られたサンプルをシクロペンタノンに常温で60秒、揺動しながら浸漬、次いでシクロペンタノンでリンスしてからイソプロピルアルコールに常温で5秒間浸漬した。その後、圧空を吹きかけるなどしてイソプロピルアルコールを揮発させた。
微細配線形成性は、樹脂膜のウェハ上から剥離、樹脂膜のひび割れ、パターン端部の荒れの有無、及び、樹脂を現像したパターン底部の残渣の有無を金属顕微鏡で確認した。これらの不具合が確認できなかった最小のL/S及びビア径を表2に示す。
上記の高加速度寿命試験と同様にして、パターンを形成した。次いで、無電解・電解銅メッキなどによりめっきアップし、CMPにより表面を平たん化した。なお、L/S(μm/μm)は3/3、5/5となるようにマスクサイズを調整した。
次に、得られた配線上に、スピンコートでワニスを積層し、90℃で5分間乾燥させた。スピンコートする際、配線の55cと55d部分にはポリイミドテープを貼って樹脂がコーティングされるのを防ぎ、UV硬化したのちポリイミドテープをはく離した。樹脂膜の膜厚は、5μmとなるようにスピンコート条件を調整した。UVを1000mJ/cm2照射した後、180℃/1時間加熱して樹脂膜を硬化させた。なお、基材となるウェハ(6インチ径、厚さ400μm)と配線層の間には、パターンを形成する以外は全く同様の方法で作製した樹脂層がある。
得られた配線に、湿度85%、130℃の条件下において第1の接続配線55cと第2の接続配線55dとに3.3Vの電圧を印加し、所定の時間にわたって静置した。これにより、時間経過に伴う第1の配線55aと、第2の配線55bとの絶縁性の変化を測定した。この試験では、第1の配線55aと第2の配線55bとの間の抵抗値が、300時間以上、1×106Ω以上だったものを「A」(b-HAST耐性あり)とし、そうでなかったものを「B」(b-HAST耐性なし)として評価した。
Claims (16)
- 硬化性樹脂と、硬化剤とを含有し、
銅配線と接する配線層間絶縁層を形成するために用いられる、樹脂組成物であって、
前記樹脂組成物の硬化物の破断伸びが5~200%であり、前記樹脂組成物の硬化物における塩化物イオンの濃度が5ppm以下である、樹脂組成物。 - 前記硬化性樹脂が、少なくとも2つのマレイミド基と、2価の炭化水素基とを有する、請求項1に記載の樹脂組成物。
- 前記炭化水素基が、炭素数4以上の主鎖を有する鎖状のアルキレン基を含む、請求項2に記載の樹脂組成物。
- 前記炭化水素基の炭素数が8以上である、請求項2又は3に記載の樹脂組成物。
- 前記硬化性樹脂が、少なくとも2つのイミド結合を有する2価の有機基を有する、請求項2~4のいずれか一項に記載の樹脂組成物。
- 前記硬化剤が光ラジカル重合開始剤を含む、請求項2~7のいずれか一項に記載の樹脂組成物。
- (メタ)アクリロイル基を有する化合物を更に含有する、請求項2~8のいずれか一項に記載の樹脂組成物。
- カップリング剤を更に含有する、請求項2~9のいずれか一項に記載の樹脂組成物。
- 熱可塑性樹脂を更に含有する、請求項1に記載の樹脂組成物。
- 前記樹脂組成物の硬化物の40℃における貯蔵弾性率が10MPa~5GPaである、請求項11に記載の樹脂組成物。
- 前記樹脂組成物の硬化物のガラス転移温度が120~240℃である、請求項11又は12に記載の樹脂組成物。
- 前記樹脂組成物の硬化物の10GHzでの誘電率が3.0以下である、請求項11~13のいずれか一項に記載の樹脂組成物。
- 前記樹脂組成物の硬化物の10GHzでの誘電正接が0.005以下である、請求項11~14のいずれか一項に記載の樹脂組成物。
- 前記樹脂組成物の硬化物の5%重量減少温度が300℃以上である、請求項11~15のいずれか一項に記載の樹脂組成物。
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CN109791916A (zh) | 2019-05-21 |
KR20220131356A (ko) | 2022-09-27 |
JP2023026454A (ja) | 2023-02-24 |
JP2022023056A (ja) | 2022-02-07 |
JP7276575B2 (ja) | 2023-05-18 |
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JP7306543B2 (ja) | 2023-07-11 |
KR20210019591A (ko) | 2021-02-22 |
JP2022159327A (ja) | 2022-10-17 |
KR20240033138A (ko) | 2024-03-12 |
TW201819534A (zh) | 2018-06-01 |
JPWO2018056466A1 (ja) | 2019-06-24 |
JP6950699B2 (ja) | 2021-10-13 |
JP2022159328A (ja) | 2022-10-17 |
TW202229456A (zh) | 2022-08-01 |
JP2023026453A (ja) | 2023-02-24 |
TWI761375B (zh) | 2022-04-21 |
JP2022163084A (ja) | 2022-10-25 |
US20190281697A1 (en) | 2019-09-12 |
KR102217489B1 (ko) | 2021-02-19 |
JP7306542B2 (ja) | 2023-07-11 |
US10575402B2 (en) | 2020-02-25 |
KR20190055182A (ko) | 2019-05-22 |
JP7435712B2 (ja) | 2024-02-21 |
KR102643949B1 (ko) | 2024-03-05 |
JP2023026452A (ja) | 2023-02-24 |
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