JP7242429B2 - Wiring boards, electronic devices and electronic modules - Google Patents

Wiring boards, electronic devices and electronic modules Download PDF

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JP7242429B2
JP7242429B2 JP2019100406A JP2019100406A JP7242429B2 JP 7242429 B2 JP7242429 B2 JP 7242429B2 JP 2019100406 A JP2019100406 A JP 2019100406A JP 2019100406 A JP2019100406 A JP 2019100406A JP 7242429 B2 JP7242429 B2 JP 7242429B2
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wiring board
main surface
insulating substrate
corner
electronic component
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JP2020194914A (en
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英之 板東
純 橘
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Kyocera Corp
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Kyocera Corp
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本発明は、配線基板、電子装置および電子モジュールに関するものである。 The present invention relates to wiring boards, electronic devices and electronic modules.

従来、セラミックスからなる絶縁基板の主面に、ＬＤ（Ｌａｓｅｒ Ｄｉｏｄｅ）等の発光素子からなる電子部品を搭載する配線基板が知られている。 2. Description of the Related Art Conventionally, there has been known a wiring board in which an electronic component including a light-emitting element such as an LD (Laser Diode) is mounted on the main surface of an insulating substrate made of ceramics.

配線導体は、電子部品を収納するための凹部を有する絶縁基板と、絶縁基板の表面および内部に設けられた配線導体とを有している（例えば、特許文献１を参照。）。 The wiring conductor includes an insulating substrate having a recess for housing an electronic component, and wiring conductors provided on and inside the insulating substrate (see, for example, Patent Document 1).

特開2014－027179号公報Japanese Patent Application Laid-Open No. 2014-027179

近年、電子装置の小型化、高機能化が求められており、効率よく光を照射することができる電子装置が求められている。 2. Description of the Related Art In recent years, electronic devices have been required to be smaller and more functional, and electronic devices capable of efficiently irradiating light have been required.

本開示の配線基板は、第１主面および第１側面、および該第１側面と反対側に第２側面、および前記第１主面と反対側に第２主面を有し、電子部品の搭載部を含む凹部を前記第１主面に備える絶縁基板を有し、縦断面視において、前記搭載部を外側に延長した仮想線と前記第２側面とが成す第１角部、および前記第２主面と前記第２側面とが成す第２角部を有しており、該第２角部が前記第１角部より外側に位置している。 A wiring board of the present disclosure has a first main surface and a first side surface, a second side surface opposite to the first side surface, and a second main surface opposite to the first main surface; An insulating substrate having a concave portion including a mounting portion on the first main surface, and a first corner formed by an imaginary line extending outward from the mounting portion and the second side surface in a longitudinal cross-sectional view, and the second side surface. It has a second corner formed by two main surfaces and the second side, and the second corner is located outside the first corner.

本開示の電子装置は、上記構成の配線基板と、配線基板に搭載された電子部品とを有している。 An electronic device according to the present disclosure includes a wiring board configured as described above and an electronic component mounted on the wiring board.

本開示の電子モジュールは、接続パッドを有する外部部材と、光学部材と、接続パッドに接合材を介して接続され、光学部材に接した上記構成の電子装置とを有する。 An electronic module of the present disclosure includes an external member having a connection pad, an optical member, and the electronic device having the configuration described above, which is connected to the connection pad via a bonding material and is in contact with the optical member.

本開示の配線基板は、第１主面および第１側面、および第１側面と反対側に第２側面、および第１主面と反対側に第２主面を有し、電子部品の搭載部を含む凹部を第１主面に備える絶縁基板を有し、縦断面視において、搭載部を外側に延長した仮想線と第２側面とが成す第１角部、および第２主面と第２側面とが成す第２角部を有しており、第２角部が第１角部より外側に位置している。上記構成により、絶縁基板の第２側面の第１角部と第２角部とにより、第２側面側において絶縁基板を傾けることで、搭載部が第２側面側に向けて傾斜することとなり、搭載部に搭載された電子部品からの光が外部に効率よく照射することができる。 A wiring board of the present disclosure has a first main surface and a first side surface, a second side surface opposite to the first side surface, and a second main surface opposite to the first main surface; In a vertical cross-sectional view, a first corner formed by an imaginary line extending the mounting portion to the outside and the second side surface, and the second main surface and the second It has a second corner formed with the side surface, and the second corner is located outside the first corner. With the above configuration, by tilting the insulating substrate on the second side surface side by the first corner portion and the second corner portion of the second side surface of the insulating substrate, the mounting portion is inclined toward the second side surface side, Light from the electronic component mounted on the mounting portion can be efficiently irradiated to the outside.

本開示の電子装置は、上記構成の配線基板と、配線基板に搭載された電子部品とを有していることによって、小型で高機能な長期信頼性に優れた電子装置とすることができる。 Since the electronic device of the present disclosure includes the wiring board configured as described above and electronic components mounted on the wiring board, the electronic device can be a small, highly functional electronic device with excellent long-term reliability.

本開示の電子モジュールは、接続パッドを有する外部部材と、光学部材と、接続パッドに接合材を介して接続され、光学部材に接した上記構成の電子装置とを有する
ことによって、長期信頼性に優れたものとすることができる。 The electronic module of the present disclosure includes an external member having a connection pad, an optical member, and the electronic device having the configuration described above, which is connected to the connection pad via a bonding material and is in contact with the optical member. can be excellent.

（ａ）は、第１の実施形態における配線基板を示す上面図であり、（ｂ）は（ａ）の下面図である。(a) is a top view showing the wiring board in the first embodiment, and (b) is a bottom view of (a). （ａ）は、図１（ａ）に示した配線基板のＡ方向における側面図であり、（ｂ）は、図１（ａ）に示した配線基板のＢ方向における側面図である。1(a) is a side view of the wiring board shown in FIG. 1(a) in the direction A, and FIG. 1(b) is a side view of the wiring board shown in FIG. 1(a) in the direction B; （ａ）は、図１（ａ）に示した配線基板のＡ－Ａ線における縦断面図であり、（ｂ）は、図１（ａ）に示した配線基板のＢ－Ｂ線における縦断面図である。1(a) is a vertical cross-sectional view of the wiring substrate taken along line AA of FIG. 1(a), and FIG. 1(b) is a vertical cross-sectional view of the wiring substrate taken along line BB of FIG. 1(a); It is a diagram. （ａ）は、図３（ａ）のＣ部における要部拡大縦断面図であり、（ｂ）は、図３（ａ）のＤ部における要部拡大縦断面図である。(a) is an enlarged vertical cross-sectional view of a main part in the C part of FIG. 3(a), and (b) is an enlarged vertical cross-sectional view of the main part in the D part of FIG. 3(a). （ａ）は、図１に示した配線基板を用いた電子装置を示す上面図であり、（ｂ）は、（ａ）のＡ－Ａ線における縦断面図である。(a) is a top view showing an electronic device using the wiring board shown in FIG. 1, and (b) is a longitudinal sectional view taken along line AA of (a). 図５に示した電子装置を用いた電子モジュールを示す縦断面図である。6 is a longitudinal sectional view showing an electronic module using the electronic device shown in FIG. 5; FIG. （ａ）は、第２の実施形態における配線基板を示す上面図であり、（ｂ）は（ａ）の下面図である。(a) is a top view showing a wiring board in a second embodiment, and (b) is a bottom view of (a). （ａ）は、図７（ａ）に示した配線基板のＡ方向における側面図であり、（ｂ）は、図１（ａ）に示した配線基板のＢ方向における側面図である。7A is a side view of the wiring board shown in FIG. 7A in the direction A, and FIG. 7B is a side view of the wiring board shown in FIG. 1A in the direction B. FIG. （ａ）は、図７（ａ）に示した配線基板のＡ－Ａ線における縦断面図であり、（ｂ）は、図１（ａ）に示した配線基板のＢ－Ｂ線における縦断面図である。7(a) is a vertical cross-sectional view taken along line AA of the wiring substrate shown in FIG. 7(a), and FIG. 7(b) is a vertical cross-sectional view taken along line BB of the wiring substrate shown in FIG. 1(a); It is a diagram. （ａ）は、図９（ａ）のＣ部における要部拡大縦断面図であり、（ｂ）は、図９（ａ）のＤ部における要部拡大縦断面図である。(a) is an enlarged vertical cross-sectional view of the main part in the C part of FIG. 9 (a), and (b) is an enlarged vertical cross-sectional view of the main part in the D part of FIG. 9 (a). （ａ）は、図７に示した配線基板を用いた電子装置を示す上面図であり、（ｂ）は、（ａ）のＡ－Ａ線における縦断面図である。8A is a top view showing an electronic device using the wiring substrate shown in FIG. 7, and FIG. 8B is a vertical cross-sectional view taken along line AA of FIG. （ａ）は、第３の実施形態における配線基板を示す上面図であり、（ｂ）は（ａ）の下面図である。(a) is a top view showing a wiring board in a third embodiment, and (b) is a bottom view of (a). （ａ）は、図１２（ａ）に示した配線基板のＡ方向における側面図であり、（ｂ）は、図１（ａ）に示した配線基板のＢ方向における側面図である。(a) is a side view of the wiring board shown in FIG. 12(a) in the A direction, and (b) is a side view of the wiring board shown in FIG. 1(a) in the B direction. （ａ）は、図１２（ａ）に示した配線基板のＡ－Ａ線における縦断面図であり、（ｂ）は、図１（ａ）に示した配線基板のＢ－Ｂ線における縦断面図である。12(a) is a vertical cross-sectional view taken along line AA of the wiring substrate shown in FIG. 12(a), and FIG. 1(b) is a vertical cross-sectional view taken along line BB of the wiring substrate shown in FIG. 1(a); It is a diagram. （ａ）は、図１２に示した配線基板を用いた電子装置を示す上面図であり、（ｂ）は、（ａ）のＡ－Ａ線における縦断面図である。13A is a top view showing an electronic device using the wiring substrate shown in FIG. 12, and FIG. 13B is a longitudinal sectional view taken along line AA of FIG.

本開示のいくつかの例示的な実施形態について、添付の図面を参照しつつ説明する。 Several exemplary embodiments of the disclosure will be described with reference to the accompanying drawings.

（第１の実施形態）
第１の実施形態における配線基板１は、図１～図４に示された例のように、第１主面11ａおよび第１側面11ｃ、および第１側面11ａと反対側に第２側面11ｄ、および第１主面11ａと反対側に第２主面11ｂを有し、電子部品２の搭載部12ａを含む凹部12を第１主面11ａに備える絶縁基板11を有している。縦断面視において、搭載部12ａを外側に延長した仮想線Ｎと第２側面11ｄとが成す第１角部111、および第２主面11ｂと第２側面11ｄとが成す
第２角部112を有しており、第２角部112が第１角部111より外側に位置している。 (First embodiment)
As in the example shown in FIGS. 1 to 4, the wiring board 1 in the first embodiment has a first main surface 11a and a first side surface 11c, a second side surface 11d opposite to the first side surface 11a, and a second side surface 11d. and a second main surface 11b on the side opposite to the first main surface 11a, and an insulating substrate 11 having a concave portion 12 including a mounting portion 12a for the electronic component 2 on the first main surface 11a. In a vertical cross-sectional view, a first corner 111 formed by an imaginary line N extending outward from the mounting portion 12a and the second side surface 11d and a second corner 112 formed by the second main surface 11b and the second side surface 11d are shown. The second corner 112 is positioned outside the first corner 111 .

電子装置は、配線基板１と、配線基板１に搭載された電子部品２とを含んでいる。電子装置は、例えば電子モジュールを構成する外部部材４上の接続パッド41に接合材５を用いて接続される。図１～図４において、上方向とは、仮想のｚ軸の正方向のことをいう。なお、以下の説明における上下の区別は便宜的なものであり、実際に配線基板１等が使用される際の上下を限定するものではない。 The electronic device includes a wiring board 1 and electronic components 2 mounted on the wiring board 1 . The electronic device is connected, for example, to connection pads 41 on the external member 4 forming an electronic module using a bonding material 5 . 1 to 4, the upward direction means the positive direction of the imaginary z-axis. Note that the distinction between upper and lower sides in the following description is for the sake of convenience, and does not limit the upper and lower sides when the wiring board 1 and the like are actually used.

絶縁基板11は、第１主面11ａ（図１～図４では上面）および第１主面11ａの反対側に相第２主面11ｂ（図１～図４では下面）と、側面とを有している。絶縁基板11は、複数の絶縁層からなり、平面視にて、第１主面に開口する凹部12を有している。絶縁基板11は、平面視すなわち主面に垂直な方向から見ると方形状を有している。絶縁基板11は、電子部品２を支持するための支持体として機能する。 The insulating substrate 11 has a first principal surface 11a (top surface in FIGS. 1 to 4), a second principal surface 11b opposite to the first principal surface 11a (bottom surface in FIGS. 1 to 4), and side surfaces. are doing. The insulating substrate 11 is composed of a plurality of insulating layers and has a recess 12 opening in the first main surface in plan view. The insulating substrate 11 has a square shape when viewed from above, that is, when viewed from a direction perpendicular to the main surface. The insulating substrate 11 functions as a support for supporting the electronic component 2 .

絶縁基板11は、例えば、酸化アルミニウム質焼結体（アルミナセラミックス），窒化アルミニウム質焼結体，窒化珪素質焼結体、ムライト質焼結体またはガラスセラミックス焼結体等のセラミックスを用いることができる。絶縁基板11は、例えば酸化アルミニウム質焼結体である場合であれば、酸化アルミニウム（Ａｌ２Ｏ３），酸化珪素（ＳｉＯ２），酸化マグネシウム（ＭｇＯ），酸化カルシウム（ＣａＯ）等の原料粉末に適当な有機バインダーおよび溶剤等を添加混合して泥漿物を作製する。この泥漿物を、従来周知のドクターブレード法またはカレンダーロール法等を採用してシート状に成形することによってセラミックグリーンシートを作製する。次に、このセラミックグリーンシートに適当な打ち抜き加工を施すとともに、セラミックグリーンシートを複数枚積層して生成形体を形成し、この生成形体を高温（約1600℃）で焼成することによって絶縁基板11が製作される。 For the insulating substrate 11, ceramics such as aluminum oxide sintered body (alumina ceramics), aluminum nitride sintered body, silicon nitride sintered body, mullite sintered body, or glass ceramics sintered body can be used. can. If the insulating substrate 11 is, for example, an aluminum oxide sintered body, raw material powder such as aluminum oxide (Al 2 O 3 ), silicon oxide (SiO 2 ), magnesium oxide (MgO), calcium oxide (CaO), etc. A slurry is prepared by adding and mixing an appropriate organic binder and solvent. A ceramic green sheet is produced by forming this slurry into a sheet by employing a conventionally well-known doctor blade method, calender roll method, or the like. Next, this ceramic green sheet is subjected to a suitable punching process, and a plurality of ceramic green sheets are laminated to form a green body. produced.

凹部12は、図１および図２に示す例のように、絶縁基板11の第１主面に開口して設けられている。凹部12は、図５に示す例のように、電子部品２を搭載するための領域であり、凹部12の底面に電子部品２を搭載するための搭載部12ａが設けられている。このような凹部12は、絶縁基板11用のセラミックグリーンシートのいくつかに、レーザー加工または金型による打ち抜き加工等によって、凹部12となる貫通孔を形成しておくことにより形成される。 The concave portion 12 is provided so as to open in the first main surface of the insulating substrate 11 as in the example shown in FIGS. 1 and 2 . The recess 12 is a region for mounting the electronic component 2, as in the example shown in FIG. Such recesses 12 are formed by forming through holes, which will become the recesses 12, in some of the ceramic green sheets for the insulating substrate 11 by laser processing, punching with a mold, or the like.

絶縁基板11は、図１～図４に示す例のように、第１主面および第１主面に相対する第２主面に接する、４つの側面を有している。側面は、第１側面11ｃ（図１～図４では左側面）と第１側面11ｃと反対側に第２側面11ｄ（図１～図４では右側面）とを有している。第２側面11ｄは、縦電面視にて傾斜した側面として形成されている。第２側面11ｂは、側面全面にわたって傾斜しており、凹部12とつながる貫通孔12ｂが開口している。このような貫通孔12ｂは、絶縁基板11用のセラミックグリーンシートに凹部12となる貫通孔と貫通孔12ｂとがつながるように、形成しておくことにより形成される。搭載部12ａを外側に延長した仮想線Ｎ‐Ｎと第２側面11ｄとが成す第１角部111および第２主面11ｂと第２側面11
ｄとが成す第２角部112とを有しており、第２角部112が第１角部111より外側に位置して
いる。搭載部12ａを第２側面11ｄ側に延長した仮想線Ｎ‐Ｎと第２側面11ｄとの成す角θ１は鈍角である。第２主面11ｂと第２側面11ｄとが成す第２角部112の角θ２は鋭角であ
る。第２側面11ｄは、絶縁基板11となる大型絶縁基板の側面にスライシング法により、仮想線Ｎ‐Ｎと第１側面11ａとの成す角θ１が鈍角であり、かつ第２主面11ｂと第２側面11ｄとが成す第２角部112の角θ２が鋭角となるように切断することにより精度良く形成す
ることができる。もしくは、絶縁基板11となる大型絶縁基板の側面を研磨加工し、仮想線Ｎ‐Ｎと第１側面11ａとの成す角θ１が鈍角であり、かつ第２主面11ｂと第２側面11ｄとが成す第２角部112の角θ２が鋭角となるように切削することにより形成することができ
る。 The insulating substrate 11, as in the example shown in FIGS. 1-4, has four side surfaces contacting a first major surface and a second major surface opposite the first major surface. The side surface has a first side surface 11c (left side surface in FIGS. 1 to 4) and a second side surface 11d (right side surface in FIGS. 1 to 4) opposite to the first side surface 11c. The second side surface 11d is formed as a side surface that is inclined when viewed vertically. The second side surface 11b is inclined over the entire side surface, and a through hole 12b communicating with the concave portion 12 is open. Such a through hole 12b is formed by forming the ceramic green sheet for the insulating substrate 11 so that the through hole forming the concave portion 12 and the through hole 12b are connected to each other. A first corner 111, a second main surface 11b, and the second side surface 11 are defined by an imaginary line N--N extending outward from the mounting portion 12a and the second side surface 11d.
d, and the second corner 112 is located outside the first corner 111 . The angle .theta.1 between the second side surface 11d and the imaginary line N--N extending from the mounting portion 12a toward the second side surface 11d is an obtuse angle. The angle θ2 of the second corner portion 112 formed by the second main surface 11b and the second side surface 11d is an acute angle. The second side surface 11d is formed by slicing the side surface of a large insulating substrate that serves as the insulating substrate 11 so that the angle θ1 between the virtual line NN and the first side surface 11a is an obtuse angle, and the second main surface 11b and the second main surface 11b are formed by slicing. By cutting so that the angle θ2 of the second corner portion 112 formed with the side surface 11d is an acute angle, it can be formed with high accuracy. Alternatively, the side surface of a large insulating substrate to be the insulating substrate 11 is polished so that the angle θ1 formed between the imaginary line NN and the first side surface 11a is an obtuse angle, and the second main surface 11b and the second side surface 11d are separated from each other. It can be formed by cutting so that the angle θ2 of the second corner portion 112 formed is an acute angle.

配線導体13は、絶縁基板11の第１主面および内部に位置している。配線導体13は、絶縁基板11の絶縁層の表面に位置する配線層と、絶縁基板11の内部の厚み方向に位置する貫通導体とを有する。外部電極14は、絶縁基板11の第２主面に位置している。絶縁基板11の第１主面に位置する配線導体13と外部電極14とは電気的に接続している。配線導体13および外部電極14は、配線基板１の搭載部12ａに搭載された電子部品２と外部部材４とを電気的に接続するためのものである。 The wiring conductor 13 is located on the first main surface and inside of the insulating substrate 11 . The wiring conductor 13 has a wiring layer located on the surface of the insulating layer of the insulating substrate 11 and a through conductor located inside the insulating substrate 11 in the thickness direction. The external electrodes 14 are located on the second main surface of the insulating substrate 11 . The wiring conductor 13 located on the first main surface of the insulating substrate 11 and the external electrode 14 are electrically connected. The wiring conductors 13 and the external electrodes 14 are for electrically connecting the electronic component 2 mounted on the mounting portion 12 a of the wiring board 1 and the external member 4 .

配線導体13および外部電極14は、タングステン（Ｗ），モリブデン（Ｍｏ），マンガン（Ｍｎ），銀（Ａｇ），銅（Ｃｕ）等の金属粉末メタライズから成る。配線導体13が配線層である場合、例えば絶縁基板11用のセラミックグリーンシートに配線導体13用のメタライズペーストをスクリーン印刷法等の印刷手段によって印刷塗布し、絶縁基板11用のセラミックグリーンシートとともに焼成することによって形成される。また、配線導体13が貫通導体である場合、例えば絶縁基板11用のセラミックグリーンシートに金型またはパンチングによる打ち抜き加工またはレーザー加工等の加工方法によって貫通導体用の貫通孔を形成し、この貫通孔に配線導体13用のメタライズペーストを上記印刷手段によって充填しておき、絶縁基板11用のセラミックグリーンシートとともに焼成することによって形成される。また、外部電極14は、上述の配線導体13が配線層である場合と同様な方法により形成される。メタライズペーストは、上述の金属粉末に適当な溶剤およびバインダーを加えて混練することによって、適度な粘度に調整して作製される。なお、配線導体13および外部電極14と絶縁基板11との接合強度を高めるために、ガラス粉末、セラミック粉末を含んでいても構わない。 The wiring conductors 13 and external electrodes 14 are made of metal powder metallization such as tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag) and copper (Cu). When the wiring conductor 13 is a wiring layer, for example, the metallized paste for the wiring conductor 13 is printed on the ceramic green sheet for the insulating substrate 11 by printing means such as screen printing, and then fired together with the ceramic green sheet for the insulating substrate 11. formed by Further, when the wiring conductor 13 is a through conductor, for example, a through hole for the through conductor is formed in the ceramic green sheet for the insulating substrate 11 by a processing method such as punching by a metal mold or punching, or laser processing. The metallized paste for the wiring conductors 13 is filled in by the above-described printing means, and the ceramic green sheets for the insulating substrate 11 are fired together. Also, the external electrodes 14 are formed by the same method as in the case where the above wiring conductors 13 are wiring layers. The metallized paste is prepared by adding an appropriate solvent and binder to the metal powder described above and kneading them to adjust the viscosity to an appropriate level. In order to increase the bonding strength between the wiring conductors 13 and the external electrodes 14 and the insulating substrate 11, glass powder or ceramic powder may be included.

配線導体13および外部電極14の絶縁基板11から露出する表面には、電気めっき法または無電解めっき法によって金属めっき層が被着される。金属めっき層は、ニッケル，銅，金または銀等の耐食性および接続部材３または接合材５との接続性に優れる金属から成るものであり、例えば厚さ0.5～５μｍ程度のニッケルめっき層と0.1～３μｍ程度の金めっき層とが順次被着される。これによって、配線導体13および外部電極14が腐食することを効果的に抑制できるとともに、配線導体13とボンディングワイヤ等の接続部材３との接合、ならびに外部電極14と外部部材４に形成された接続用の接続パッド41との接合を強固にできる。 A metal plating layer is applied to the surfaces of the wiring conductors 13 and the external electrodes 14 exposed from the insulating substrate 11 by an electroplating method or an electroless plating method. The metal plating layer is made of a metal such as nickel, copper, gold or silver which is excellent in corrosion resistance and connectivity with the connection member 3 or the bonding material 5. A gold plating layer of about 3 μm is deposited in sequence. As a result, the corrosion of the wiring conductor 13 and the external electrode 14 can be effectively suppressed, and the connection between the wiring conductor 13 and the connection member 3 such as a bonding wire and the connection formed between the external electrode 14 and the external member 4 can be prevented. The connection with the connection pad 41 for the terminal can be strengthened.

また、金属めっき層は、ニッケルめっき層／金めっき層に限られるものではなく、ニッケルめっき層／パラジウムめっき層／金めっき層等を含むその他の金属めっき層であっても構わない。 Also, the metal plating layer is not limited to the nickel plating layer/gold plating layer, and may be other metal plating layers including nickel plating layer/palladium plating layer/gold plating layer and the like.

配線基板１の凹部12の底面に位置する搭載部12ａに電子部品２を搭載し、電子装置を作製できる。配線基板１に搭載される電子部品２は、ＬＤ（Ｌａｓｅｒ Ｄｉｏｄｅ）、ＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）等の発光素子である。例えば、電子部品２が、電子部品２がワイヤボンディング型の電子部品２である場合には、電子部品２は、低融点ろう材または導電性樹脂等の接合部材によって、配線基板１の搭載部12ａ上に固定された後、ボンディングワイヤ等の接続部材３を介して電子部品２の電極と配線導体13とが電気的に接続されることによって配線基板１に搭載される。これにより、電子部品２は配線導体13に電気的に接続される。また、配線基板１の搭載部12ａ上には、複数の電子部品２を搭載してもよいし、必要に応じて、抵抗素子または容量素子等の小型の電子部品を搭載してもよい。また、電子部品２は必要に応じて、樹脂またはガラス等からなる封止材を用いて、あるいは、樹脂、ガラス、セラミックスまたは金属等からなる蓋体等により封止される。 An electronic device can be manufactured by mounting the electronic component 2 on the mounting portion 12a positioned on the bottom surface of the recess 12 of the wiring board 1. FIG. The electronic component 2 mounted on the wiring board 1 is a light-emitting element such as an LD (Laser Diode) or an LED (Light Emitting Diode). For example, when the electronic component 2 is a wire-bonding type electronic component 2, the electronic component 2 is bonded to the mounting portion 12a of the wiring board 1 by a bonding member such as a low melting point brazing material or a conductive resin. After being fixed on the top, the electronic component 2 is mounted on the wiring substrate 1 by electrically connecting the electrodes of the electronic component 2 and the wiring conductors 13 via the connecting members 3 such as bonding wires. Thereby, the electronic component 2 is electrically connected to the wiring conductor 13 . A plurality of electronic components 2 may be mounted on the mounting portion 12a of the wiring board 1, and small electronic components such as resistance elements or capacitive elements may be mounted as necessary. In addition, the electronic component 2 is sealed with a sealing material made of resin, glass, or the like, or with a cover made of resin, glass, ceramics, metal, or the like, if necessary.

本実施形態の配線基板によれば、第１主面11ａおよび第１側面11ｃ、および第１側面11ｃと反対側に第２側面11ｄ、および第１主面11ａと反対側に第２主面11ｂを有し、電子部品２の搭載部12ａを含む凹部12を第１主面11ａに備える絶縁基板11を有し、縦断面視において、搭載部12ａを外側に延長した仮想線Ｎ－Ｎと第２側面11ｄとが成す第１角部111、
および第２主面12ｂと第２側面11ｄとが成す第２角部112を有しており、第２角部112が第１角部111より外側に位置している。上記構成により、絶縁基板11の第２側面11ｄの第１
角部111と第２角部112とにより、第２側面11ｄ側において絶縁基板11を傾けることで、搭載部12ａが第2側面11ｄに向けて傾斜することとなり、搭載部12ａに搭載された電子部品
２からの光を外部に効率よく照射することができる。また、例えば電子部品２がＬＤの場
合、ＬＤから発せられた光が光学部材６で反射した場合にＬＤへ戻ることが抑制され、ノイズが抑制された良好な光を光学部材６に放出することができる。 According to the wiring board of the present embodiment, the first main surface 11a and the first side surface 11c, the second side surface 11d opposite to the first side surface 11c, and the second main surface 11b opposite to the first main surface 11a are formed. and an insulating substrate 11 having a recess 12 including a mounting portion 12a for the electronic component 2 on the first main surface 11a. A first corner 111 formed by two side surfaces 11d,
and a second corner portion 112 formed by the second main surface 12b and the second side surface 11d. With the above configuration, the first side surface 11d of the insulating substrate 11
By tilting the insulating substrate 11 on the side of the second side surface 11d with the corner portion 111 and the second corner portion 112, the mounting portion 12a is tilted toward the second side surface 11d. The light from the component 2 can be efficiently irradiated to the outside. In addition, for example, when the electronic component 2 is an LD, the light emitted from the LD is suppressed from returning to the LD when reflected by the optical member 6, and good light with suppressed noise is emitted to the optical member 6. can be done.

なお、図１～図４に示す例のように、第２側面11ｄの第２角部112を有する辺が第２側
面11ｄの第１角部111を有する辺よりも外側に位置している。 1 to 4, the side of the second side face 11d having the second corner 112 is located outside the side of the second side face 11d having the first corner 111. FIG.

縦断面視において、第１角部111の成す角θ１が鈍角であると、絶縁基板11の第２側面11ｄの第１角部111と第２角部112とにより、第２側面11ｄ側において絶縁基板11を傾ける
ことで、搭載部12ａが第２側面11ｄに向けて傾斜することとなり、搭載部12ａに搭載された電子部品２からの光を外部に効率よく照射することができる。 When the angle θ1 formed by the first corner portion 111 is an obtuse angle in a vertical cross-sectional view, the second side surface 11d of the insulating substrate 11 is insulated by the first corner portion 111 and the second corner portion 112 of the second side surface 11d. By tilting the substrate 11, the mounting portion 12a tilts toward the second side surface 11d, and the light from the electronic component 2 mounted on the mounting portion 12a can be efficiently irradiated to the outside.

縦断面視において、第２角部112の成す角θ２が鋭角であると、絶縁基板11の第２側面11ｄの第１角部111と第２角部112とにより、第２側面11ｄ側において絶縁基板11を傾ける
ことで、搭載部12ａが第2側面11ｄに向けて傾斜することとなり、搭載部12ａに搭載され
た電子部品２からの光を外部に効率よく照射することができる。 When the angle θ2 formed by the second corner portion 112 is an acute angle in a vertical cross-sectional view, the second side surface 11d of the insulating substrate 11 is insulated by the first corner portion 111 and the second corner portion 112 of the second side surface 11d. By tilting the substrate 11, the mounting portion 12a tilts toward the second side surface 11d, and the light from the electronic component 2 mounted on the mounting portion 12a can be efficiently irradiated to the outside.

なお、第１角部111の成す角θ１は、95°≦θ１≦120°程度であり、第２角部112の成
す角θ２は、60°≦θ２≦85°程度であると、光学部材６に良好に光を照射することができる。 The angle θ1 formed by the first corner portion 111 is approximately 95°≦θ1≦120°, and the angle θ2 formed by the second corner portion 112 is approximately 60°≦θ2≦85°. can be well irradiated with light.

また、第２側面11ｄが第１主面11ａ側に向いた傾斜面を有していると、第２側面12ｂが光学部材６に接触して、傾斜した状態で光を光学部材６に照射することができ、搭載部12ａに搭載された電子部品２からの光を外部に効率よく照射することができ、光学部品として効率を高めることができる。なお、第１角部111の成す角θ１と第２角部112の成す角θ２とは、175°≦θ１＋θ２≦185°であることが好ましい。 Further, if the second side surface 11d has an inclined surface facing the first main surface 11a, the second side surface 12b comes into contact with the optical member 6 and irradiates the optical member 6 with light in an inclined state. Therefore, the light from the electronic component 2 mounted on the mounting portion 12a can be efficiently irradiated to the outside, and the efficiency as an optical component can be improved. The angle θ1 formed by the first corner portion 111 and the angle θ2 formed by the second corner portion 112 are preferably 175°≦θ1+θ2≦185°.

また、図１～図４に示す例のように、第２側面11ｄと凹部12とを貫通する貫通孔12ｂを有していると、搭載部12ａに搭載した電子部品２からの光を貫通孔12ｂを介して搭載部12ａが第２側面11ｄに向けて照射することができ、傾斜した状態で光を光学部材６に照射することができ、光学部品として効率を高めることができ、搭載部12ａに搭載された電子部品２からの光を外部に効率よく照射することができる。 1 to 4, if the through hole 12b passing through the second side surface 11d and the concave portion 12 is provided, the light from the electronic component 2 mounted on the mounting portion 12a is transmitted through the through hole. The mounting portion 12a can irradiate the second side surface 11d via the mounting portion 12b, the light can be irradiated to the optical member 6 in an inclined state, and the efficiency as an optical component can be improved. The light from the electronic component 2 mounted on the can be efficiently irradiated to the outside.

また、図１～図４に示す例のように、第１側面11ａと反対側に第２側面11ｂを有し、第２側面11ｂと凹部12とを貫通する貫通孔12ｂを有しており、第２側面12ｂが光学部材６に接触していると、傾斜した状態で光を光学部材６に照射することができ、光学部品として効率を高めることができる。 1 to 4, it has a second side surface 11b opposite to the first side surface 11a, and has a through hole 12b passing through the second side surface 11b and the recess 12, When the second side surface 12b is in contact with the optical member 6, the optical member 6 can be irradiated with light in an inclined state, and the efficiency of the optical component can be improved.

また、縦断面視において、図４に示す例のように、第１主面11ａと第２側面11ｄとの成す内角θ３が鈍角であると、第１側面11ｃ側を傾斜させて配線基板１にて外部部材４に搭載することができるので、第１側面11ｃと第２側面11ｄとにより傾斜した状態の配線基板１を保持することができ、搭載部12ａに搭載された電子部品２からの光を外部に効率よく照射することができる。 4, when the internal angle .theta.3 between the first main surface 11a and the second side surface 11d is obtuse as in the example shown in FIG. Since the wiring board 1 can be held in an inclined state by the first side surface 11c and the second side surface 11d, the light from the electronic component 2 mounted on the mounting portion 12a can be held. can be efficiently irradiated to the outside.

また、縦断面視において、第１側面11ｃと第２側面11ｄとが平行であると、第１側面11ｃと第２側面11ｄとにより傾斜した状態の配線基板１を外部部材４で良好に保持することができるので、搭載部12ａに搭載された電子部品２からの光を外部に効率よく照射することができる。なお、搭載部12ａを外側に延長した仮想線Ｎと第１側面11ｃとが成す内角をθ４、第２主面11ｂと第１側面11ｃとが成す内角をθ５として、θ１＋θ２とθ４＋θ５との角度の差は５°以内であることが好ましい（｜（θ１＋θ２）－（θ４＋θ５）｜≦５°）。 Further, when the first side surface 11c and the second side surface 11d are parallel to each other in a vertical cross-sectional view, the wiring substrate 1 in a state of being inclined by the first side surface 11c and the second side surface 11d is favorably held by the external member 4. Therefore, the light from the electronic component 2 mounted on the mounting portion 12a can be efficiently emitted to the outside. Assuming that the interior angle between the first side surface 11c and the imaginary line N extending outward from the mounting portion 12a is θ4, and the interior angle between the second main surface 11b and the first side surface 11c is θ5, the angle between θ1+θ2 and θ4+θ5 is calculated. The difference is preferably within 5° (|(θ1+θ2)−(θ4+θ5)|≦5°).

また、第２主面11ｂの第１側面11ｃ側に外部電極14が位置した部分を有していると、搭載部12ａから絶縁基板１を介して伝熱された熱を外部電極14により外部部材４側に良好に伝熱することができ、長期間にわたって良好に光を光学部材６に照射することができ、光学部品として効率を高めることができる。なお、例えば、光学部材６は、電子部品２がＬＤの場合、ＬＤから発せられるレーザー（光）の伝送路である。 In addition, if the second main surface 11b has a portion where the external electrode 14 is located on the first side surface 11c side, the heat transferred from the mounting portion 12a through the insulating substrate 1 is transferred by the external electrode 14 to the external member. 4 side, the optical member 6 can be satisfactorily irradiated with light for a long period of time, and the efficiency as an optical component can be improved. For example, when the electronic component 2 is an LD, the optical member 6 is a transmission path for laser (light) emitted from the LD.

外部電極14の長手方向が第１側面11ｃ側および第２側面11ｄ側であると、外部電極14は、第１側面11ａの側面に直交する方向に配置され、外部電極14と接続パッド41とを接続した際に、生じた応力が凹部の側壁の際に沿って発生することを抑制し、長期間にわたって良好に光を直接光学部材６に照射することができ、光学部品として効率を高めることができる。 When the longitudinal direction of the external electrode 14 is on the side of the first side surface 11c and the side of the second side surface 11d, the external electrode 14 is arranged in a direction orthogonal to the side surface of the first side surface 11a, and the external electrode 14 and the connection pad 41 are separated from each other. When connected, the stress generated along the side wall of the recess can be suppressed, and the optical member 6 can be satisfactorily irradiated directly with light for a long period of time, and the efficiency as an optical component can be improved. can.

また、凹部12の底面に形成された搭載部12ａは、平面視において、第２側面11ｄよりも第１側面11ｃ側に位置すると、第１側面11ｃ側、また外部電極14を介して外部部材４側に良好に伝熱しやすいものとなり、第２側面11ｄ側への伝熱を小さくして第２側面11ｄ側および光学部材６の熱膨張を抑制し、第２側面11ｄが光学部材６に良好に接するものとなり、良好に光を光学部材６に照射することができ、光学部品として効率を高めることができる。 When the mounting portion 12a formed on the bottom surface of the concave portion 12 is positioned closer to the first side surface 11c than the second side surface 11d in a plan view, the mounting portion 12a is located closer to the first side surface 11c side and the external member 4 via the external electrode . Since the heat transfer to the second side surface 11d side is reduced, the thermal expansion of the second side surface 11d side and the optical member 6 is suppressed, and the second side surface 11d is well connected to the optical member 6. Since they are in contact with each other, the optical member 6 can be favorably irradiated with light, and the efficiency as an optical component can be improved.

また、図１～図４に示す例のように、第１側面11ａと反対側に第２側面11ｂを有し、第２側面11ｂと凹部12とを貫通する貫通孔12ｂを有しており、第２側面12ｂが光学部材６に接触していると、傾斜した状態で光を光学部材６に照射することができ、光学部品として効率を高めることができる。 1 to 4, it has a second side surface 11b opposite to the first side surface 11a, and has a through hole 12b passing through the second side surface 11b and the recess 12, When the second side surface 12b is in contact with the optical member 6, the optical member 6 can be irradiated with light in an inclined state, and the efficiency of the optical component can be improved.

電子装置は、上記構成の配線基板１と、配線基板１に搭載された電子部品２とを有していることによって、小型で高機能な長期信頼性に優れた電子装置とすることができる。 Since the electronic device has the wiring board 1 configured as described above and the electronic component 2 mounted on the wiring board 1, the electronic device can be a small, highly functional electronic device with excellent long-term reliability.

電子モジュールは、接続パッド41を有する外部部材４と、光学部材６と、接続パッド41に接合材５を介して接続され、前記光学部材６に接した上記記載の電子装置とを有することによって、長期信頼性に優れたものとすることができる。 The electronic module includes an external member 4 having a connection pad 41, an optical member 6, and the above-described electronic device connected to the connection pad 41 via a bonding material 5 and in contact with the optical member 6, Excellent long-term reliability can be achieved.

（第２の実施形態）
次に、第２の実施形態による配線基板１について、図７～図11を参照しつつ説明する。 (Second embodiment)
Next, a wiring board 1 according to a second embodiment will be described with reference to FIGS. 7 to 11. FIG.

第２の実施形態における配線基板１において、上記した実施形態の配線基板１と異なる点は、貫通孔12ｂが、第１主面11ａ側にも開口している点、言い換えると貫通孔12ｂが第２側面11ｂから第１主面11ａにかけて位置している点である。 The wiring board 1 of the second embodiment differs from the wiring board 1 of the above-described embodiment in that the through hole 12b is also open to the first main surface 11a side, in other words, the through hole 12b is located on the first main surface 11a side. It is located from the second side surface 11b to the first main surface 11a.

第２の実施形態の配線基板１によれば、上述の実施形態の配線基板１と同様に、第１角部11と第２角部112とにより、第２側面11ｄを傾斜させて外部部材４側に向けるので、搭
載部12ａが第２側面11ｄに向けて傾斜することとなり、搭載部12ａに搭載された電子部品２からの光を外部に効率よく照射することができる。 According to the wiring board 1 of the second embodiment, as in the wiring board 1 of the above-described embodiment, the second side surface 11d is tilted by the first corner 11 and the second corner 112 so that the external member 4 Since the mounting portion 12a is directed toward the side, the mounting portion 12a is inclined toward the second side surface 11d, and the light from the electronic component 2 mounted on the mounting portion 12a can be efficiently irradiated to the outside.

また、貫通孔12ｂが、第１主面側11ａ側もに開口しているので、配線基板１の製作時、あるいは配線基板１の第１主面11ａに蓋体等を接合した際に、貫通孔12ｂの第１主面11ａ側の絶縁層の歪みがなく、貫通孔12ｂが良好に形成されるので、貫通孔12ｂを介して光学部材６に良好に光を放出することができる小型の配線基板１とすることができる。 In addition, since the through hole 12b is also open on the first main surface side 11a side, when the wiring board 1 is manufactured or when a lid or the like is joined to the first main surface 11a of the wiring board 1, the through hole 12b can be easily penetrated. Since there is no distortion of the insulating layer on the side of the first main surface 11a of the hole 12b and the through hole 12b is well formed, a small wiring that can favorably emit light to the optical member 6 through the through hole 12b. It can be a substrate 1 .

このような貫通孔12ｂは、上述に示すように、絶縁基板11用のセラミックグリーンシー
トに凹部12となる貫通孔と貫通孔12ｂとがつながるように、形成しておくことにより形成される。 Such a through-hole 12b is formed by forming the through-hole forming the concave portion 12 in the ceramic green sheet for the insulating substrate 11 so that the through-hole 12b is connected to the through-hole 12b, as described above.

第２の実施形態の配線基板１は、その他は上述の実施形態の配線基板１と同様の製造方法を用いて製作することができる。 The wiring board 1 of the second embodiment can be manufactured using the same manufacturing method as that of the wiring board 1 of the above-described embodiment.

（第３の実施形態）
次に、第３の実施形態による配線基板１について、図12～図15を参照しつつ説明する。 (Third Embodiment)
Next, a wiring board 1 according to a third embodiment will be described with reference to FIGS. 12 to 15. FIG.

第３の実施形態における配線基板１において、上記した第２の実施形態の配線基板１と異なる点は、平面視において、貫通孔12ｂの幅が、凹部12の幅よりも小さくなっている点である。 The wiring board 1 of the third embodiment differs from the wiring board 1 of the second embodiment in that the width of the through hole 12b is smaller than the width of the recess 12 in plan view. be.

第３の実施形態の配線基板１によれば、上述の実施形態の配線基板１と同様に、第１角部11と第２角部112とにより、第２側面11ｄを傾斜させて外部部材４側に向けるので、搭
載部12ａが第２側面11ｄに向けて傾斜することとなり、搭載部12ａに搭載された電子部品２からの光を外部に効率よく照射することができる。 According to the wiring board 1 of the third embodiment, as in the wiring board 1 of the above-described embodiments, the second side surface 11d is inclined by the first corner 11 and the second corner 112 so that the external member 4 Since the mounting portion 12a is directed toward the side, the mounting portion 12a is inclined toward the second side surface 11d, and the light from the electronic component 2 mounted on the mounting portion 12a can be efficiently irradiated to the outside.

また、平面視において、貫通孔12ｂの幅が凹部12の幅よりも小さいことから、第２側面11ｄの領域を大きくすることができ、第２側面11ｄと光学部材６と広領域にわたって良好に接触させることができ、傾斜した状態で光を光学部材６に照射することができ、光学部品として効率を高めることができる。 In addition, since the width of the through hole 12b is smaller than the width of the concave portion 12 in plan view, the area of the second side surface 11d can be increased, and the second side surface 11d and the optical member 6 can be in good contact over a wide area. The optical member 6 can be irradiated with light in an inclined state, and the efficiency as an optical component can be improved.

また、凹部12の底面側に搭載される配線導体13は、図12～図15に示される例のように、第２側面11ｄ側の凹部12の側面にまで達していないと、電子部品２の熱が、配線導体13を介して第１側面11ａ側に伝熱することを抑制し、第１側面11ａと凹部12の搭載部とにより生じた応力が凹部12側壁の際に集中することを抑制し、凹部12の側壁にクラックが生じることを抑制することができる。 Also, if the wiring conductor 13 mounted on the bottom side of the recess 12 does not reach the side surface of the recess 12 on the second side surface 11d side as in the examples shown in FIGS. It suppresses the heat transfer to the first side surface 11a side through the wiring conductor 13, and suppresses the stress generated by the first side surface 11a and the mounting portion of the recess 12 from concentrating on the side wall of the recess 12. Thus, cracks in the side walls of the recess 12 can be suppressed.

第３の実施形態の配線基板１は、その他は上述の実施形態の配線基板１と同様の製造方法を用いて製作することができる。 The wiring board 1 of the third embodiment can be manufactured using the same manufacturing method as that of the wiring board 1 of the above-described embodiments.

本発明は、上述の実施の形態の例に限定されるものではなく、種々の変更は可能である。例えば、絶縁基板11は、平面視において側面または角部に、切欠きまたは面取りを有している矩形状であっても構わない。 The invention is not limited to the examples of embodiments described above, and various modifications are possible. For example, the insulating substrate 11 may have a rectangular shape with notches or chamfers on the side surfaces or corners in plan view.

また、配線基板１は、多数個取り基板の形態で製作されていてもよい。 Also, the wiring board 1 may be manufactured in the form of a multi-piece board.

１・・・・配線基板
11・・・・絶縁基板
11ａ・・・第１主面
11ｂ・・・第２主面
11ｃ・・・第１側面
11ｄ・・・第２側面
111 ・・・第１角部
112 ・・・第２角部
12・・・・凹部
12ａ・・・搭載部
12ｂ・・・貫通孔
13・・・・配線導体
14・・・・外部電極
２・・・・電子部品
３・・・・接続部材
４・・・・外部部材
41・・・・接続パッド
５・・・・接合材
６・・・・光学部材 1... Wiring board
11・・・Insulating substrate
11a First main surface
11b... second main surface
11c... first side
11d... second side
111 ... first corner
112 ・・・Second corner
12・・・Recessed part
12a... Mounting part
12b... through hole
13・・・Wiring conductor
14 External electrode 2 Electronic component 3 Connecting member 4 External member
41・・・connection pad 5・・・bonding material 6・・・optical member

Claims (5)

光源である電子部品および前記電子部品からの光を受光する光学部材の取り付けが可能な配線基板であって、
平面視において方形状を有する絶縁基板と、
前記絶縁基板に配置され、前記電子部品と電気的に接続される配線導体と、を有し、
前記絶縁基板は、第１主面、前記第１主面と対向する第２主面、前記第１主面および前記第２主面に接する側面、ならびに前記第１主面に開口する凹部を有し、
前記側面は、第１側面と、前記第１側面に対向し、前記光学部材が取り付けられる第２側面を含み、
前記凹部の底面には、前記電子部品が搭載される領域である搭載部が位置しており、
前記配線導体の少なくとも一部は、前記搭載部に位置しており、
前記第１主面に平行かつ前記第１主面と前記第２側面との境界線に直交する方向を第１方向、前記第１主面に直交する方向を第２方向とした場合、
前記第１方向および前記第２方向を含む断面において、前記搭載部から前記絶縁基板の前記第１方向の外側に延びる直線である仮想線と前記第２側面とが交差する第１角部と、前記第２主面と前記第２側面とが交差する第２角部とを有しており、
前記第２角部は前記第１角部より前記絶縁基板の前記第１方向の外側に位置しており、
前記第２側面は、前記第２主面と前記第２側面とがなす角が鋭角となる傾斜面であり、かつ、前記第１方向に沿った方向に延在する貫通孔を有している、配線基板。 A wiring board on which an electronic component that is a light source and an optical member that receives light from the electronic component can be attached,
an insulating substrate having a square shape in plan view;
a wiring conductor disposed on the insulating substrate and electrically connected to the electronic component;
The insulating substrate has a first main surface, a second main surface facing the first main surface, side surfaces in contact with the first main surface and the second main surface, and a recess opening in the first main surface. death,
the side surface includes a first side surface and a second side surface facing the first side surface and to which the optical member is attached;
A mounting portion, which is a region where the electronic component is mounted, is located on the bottom surface of the recess,
at least part of the wiring conductor is positioned on the mounting portion,
When a direction parallel to the first principal surface and orthogonal to the boundary line between the first principal surface and the second side surface is defined as a first direction, and a direction orthogonal to the first principal surface is defined as a second direction,
a first corner where an imaginary line, which is a straight line extending from the mounting portion to the outside of the insulating substrate in the first direction, intersects the second side surface in a cross section including the first direction and the second direction; It has a second corner where the second main surface and the second side surface intersect,
The second corner is located outside the first corner of the insulating substrate in the first direction ,
The second side surface is an inclined surface forming an acute angle between the second main surface and the second side surface, and has a through hole extending in a direction along the first direction. , wiring board. 前記第２主面の前記第１側面側に外部電極が位置した部分を有していることを特徴とする請求項１に記載の配線基板。 2. The wiring board according to claim 1, wherein said second main surface has a portion where an external electrode is positioned on said first side surface. 前記外部電極の長手方向は、前記第１方向であることを特徴とする請求項２に記載の配線基板。 3. The wiring board according to claim 2, wherein the longitudinal direction of the external electrodes is the first direction. 請求項１乃至請求項３のいずれかに記載の配線基板と、
該配線基板に搭載された電子部品とを有することを特徴とする電子装置。 A wiring board according to any one of claims 1 to 3;
and an electronic component mounted on the wiring board. 接続パッドを有する外部部材と、
光学部材と、
前記接続パッドに接合材を介して接続され、前記光学部材に接した請求項４に記載の電子装置とを有することを特徴とする電子モジュール。 an external member having connection pads;
an optical member;
5. An electronic module, comprising: the electronic device according to claim 4, which is connected to said connection pad via a bonding material and is in contact with said optical member.
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JP2003124373A (en) 2001-10-10 2003-04-25 Mitsui Chemicals Inc Manufacturing method for resin substrate
JP2016167492A (en) 2015-03-09 2016-09-15 スタンレー電気株式会社 Light emission device
JP2017055056A (en) 2015-09-11 2017-03-16 京セラ株式会社 Package for mounting optical element and electronic device

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JPH03108391A (en) * 1989-09-21 1991-05-08 Sony Corp Optical integrated circuit device and package for integrated circuit
JPH07235621A (en) * 1994-02-22 1995-09-05 Ibiden Co Ltd Leadless chip carrier and manufacture thereof
JP3498937B2 (en) * 1997-05-08 2004-02-23 三井化学株式会社 Resin substrate and manufacturing method thereof

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Publication number Priority date Publication date Assignee Title
JP2003124373A (en) 2001-10-10 2003-04-25 Mitsui Chemicals Inc Manufacturing method for resin substrate
JP2016167492A (en) 2015-03-09 2016-09-15 スタンレー電気株式会社 Light emission device
JP2017055056A (en) 2015-09-11 2017-03-16 京セラ株式会社 Package for mounting optical element and electronic device

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