JP7220732B2 - 金属ナノワイヤアレイの高伝導性接合方法 - Google Patents
金属ナノワイヤアレイの高伝導性接合方法 Download PDFInfo
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Description
本出願は、2015年2月26日出願の発明の名称「Vertically Aligned Metal Nanowire Arrays and Composites for Thermal Management Applications」の米国仮特許出願第62/121010号の優先権を主張し、その開示は参照によりここに取り込まれる。
本出願は、当出願と同一の譲渡人に譲渡された以下の出願の主題に関連する主題を含む。これにより、以下に記載する米国特許出願は、その全体で参照によりここに取り込まれる。
Barako、Starkovich、Silverman、Tice、Goodson、Coyan、Pengらによる発明の名称「THERMAL INTERFACE MATERIALS USING METAL NANOWIRE ARRAYS AND SACRIFICIAL TEMPLATES」、 日出願の米国特許出願第 号
Claims (8)
- 金属ナノワイヤ(MNW)アレイを隣接する表面に取り付けるための熱伝導的でかつ機械的に強固な接合方法であって、
前記MNWからテンプレート膜を除去する工程、
接合材を用いて前記MNWを浸透させる工程、
前記MNWアレイの一方の端面が隣接する前記隣接する表面に前記接合材を配置する工程、
前記接合材が接合可能となっている間に前記隣接する表面を前記MNWの上面に接触させる工程、
前記MNWと前記隣接する表面との間に前記接合材が固相接合を形成するのを可能にする工程、及び
前記配置工程の後でかつ前記接触工程の前に実行される追加の工程であって、前記隣接する表面への前記接合材を湿らせる工程
を備え、
前記浸透工程は、前記MNWアレイの間隙容積へ前記接合材を吸い込むことをさらに備える、方法。 - 前記浸透工程は、前記接合材が軟化及び溶融のうちの一方又は両方となるよう前記接合材を加熱する工程を備える、請求項1に記載の方法。
- 金属ナノワイヤ(MNW)アレイを隣接する表面に取り付けるための熱伝導的でかつ機械的に強固な接合方法であって、
前記MNWからテンプレート膜を除去する工程、
接合材を用いて前記MNWを浸透させる工程、
前記MNWアレイの一方の端面が隣接する前記隣接する表面に前記接合材を配置する工程、
前記接合材が接合可能となっている間に前記隣接する表面を前記MNWの上面に接触させる工程、及び
前記MNWと前記隣接する表面との間に前記接合材が固相接合を形成するのを可能にする工程を備え、
前記浸透工程は、前記MNWアレイの間隙容積へ前記接合材を吸い込むことをさらに備え、
前記浸透工程は、接合材を生成するのに複合材料を化学処理する工程を備える、方法。 - 前記接触工程は、前記接合材が軟化及び溶融のうちの一方又は両方となっている間に前記隣接する表面を前記上面に接触させる工程を備える、請求項1に記載の方法。
- 前記接合材は、可融金属及び合金のうちの一方又は両方から構成される、請求項1に記載の方法。
- 前記接合材は、スズ及び金のうちの一方又は両方から構成される、請求項1に記載の方法。
- 前記接触工程は、前記接合材及び前記MNWアレイのうちの一方又は両方を前記隣接する表面に対して圧縮する工程をさらに備える、請求項1に記載の方法。
- 前記吸い込み工程は、毛管力によりなされる、請求項1に記載の方法。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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US201562121010P | 2015-02-26 | 2015-02-26 | |
US62/121,010 | 2015-02-26 | ||
US15/006,658 US9468989B2 (en) | 2015-02-26 | 2016-01-26 | High-conductivity bonding of metal nanowire arrays |
US15/006,658 | 2016-01-26 |
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JP2017545222A Division JP2018512279A (ja) | 2015-02-26 | 2016-02-04 | 金属ナノワイヤアレイの高伝導性接合方法 |
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JP2021087996A JP2021087996A (ja) | 2021-06-10 |
JP7220732B2 true JP7220732B2 (ja) | 2023-02-10 |
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JP2021017397A Active JP7220732B2 (ja) | 2015-02-26 | 2021-02-05 | 金属ナノワイヤアレイの高伝導性接合方法 |
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US (3) | US9468989B2 (ja) |
JP (2) | JP2018512279A (ja) |
TW (1) | TWI700139B (ja) |
WO (1) | WO2016137711A1 (ja) |
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