JP7219407B2 - Method for manufacturing light emitting device - Google Patents

Method for manufacturing light emitting device Download PDF

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JP7219407B2
JP7219407B2 JP2021034079A JP2021034079A JP7219407B2 JP 7219407 B2 JP7219407 B2 JP 7219407B2 JP 2021034079 A JP2021034079 A JP 2021034079A JP 2021034079 A JP2021034079 A JP 2021034079A JP 7219407 B2 JP7219407 B2 JP 7219407B2
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JP2021163967A (en
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翔吾 阿部
優貴 小椋
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Nichia Corp
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Nichia Corp
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Description

本開示は、発光装置の製造方法に関する。 The present disclosure relates to a method for manufacturing a light emitting device.

近年、車載用途等の光源としてＬＥＤ等の発光素子を用いて構成した高出力の発光装置が用いられており、種々の特性を備える発光装置の製造方法が提案されている。例えば、車載用の光源として用いられる高出力の発光装置において、光反射樹脂を、透光性部材の上面を被覆したり、保護素子を完全に被覆したり、光反射樹脂のボイドを防止する発光装置を製造する方法が提案されている（例えば、特許文献１）。 2. Description of the Related Art In recent years, high-output light-emitting devices configured using light-emitting elements such as LEDs have been used as light sources for vehicle-mounted applications, and methods for manufacturing light-emitting devices having various characteristics have been proposed. For example, in a high-output light-emitting device used as a light source for a vehicle, a light-reflecting resin is used to cover the upper surface of a light-transmitting member, to completely cover a protective element, or to prevent voids in the light-reflecting resin. A method of manufacturing a device has been proposed (eg, Patent Document 1).

特開２０１５－１８８０５３号公報JP 2015-188053 A

本願は、発光装置の所望の領域に、被覆部材を精度よく配置することができる発光装置の製造方法を提供することを目的とする。 An object of the present application is to provide a method for manufacturing a light-emitting device that allows a covering member to be precisely arranged in a desired region of the light-emitting device.

本願は、以下の発明を含む。
基板と、前記基板の上面に第１方向に配列された複数の発光素子と、前記第１方向に直交する第２方向において前記発光素子と離隔しかつ対向して前記基板の上面に配置された保護素子と、前記発光素子のそれぞれの上面に接合された透光性部材とを備えた第１中間体を準備する工程と、
前記複数の発光素子を挟んで配置され、前記第１方向に延伸する第１壁及び第２壁と、前記第１壁と前記第２壁との間に配置され、前記第２方向に延伸する第３壁及び第４壁とを含み、前記複数の発光素子及び前記保護素子を取り囲む樹脂壁を前記基板上に形成する工程であって、前記第１壁と前記発光素子との第１距離が、前記第３壁及び前記第４壁と前記発光素子との第２距離よりも大きい樹脂壁を形成する工程と、
前記第１壁と前記発光素子との間であって、前記保護素子が配置された第１領域に、前記第３壁から前記第４壁に向かって第１樹脂を塗布して、前記発光素子と前記第３壁との間、前記発光素子と前記第４壁との間、前記発光素子間及び前記発光素子と前記基板との間から第１樹脂を移動させて、前記第１領域と、前記第２壁と前記発光素子との間の第２領域とに、前記第１樹脂又は前記樹脂壁で構成された内側面を有する第１凹部及び第２凹部をそれぞれ形成する工程と、
前記第１凹部内及び前記第２凹部内に第２樹脂を塗布して、前記第１樹脂及び前記第２樹脂を硬化することにより前記透光性部材の側面を被覆する被覆部材を形成することを含む発光装置の製造方法。 The present application includes the following inventions.
a substrate; a plurality of light emitting elements arranged in a first direction on the upper surface of the substrate; preparing a first intermediate body comprising a protective element and a translucent member bonded to the top surface of each of the light emitting elements;
a first wall and a second wall arranged to sandwich the plurality of light emitting elements and extending in the first direction; and a first wall and a second wall arranged between the first wall and the second wall and extending in the second direction. forming a resin wall on the substrate, the resin wall including a third wall and a fourth wall and surrounding the plurality of light emitting elements and the protective element, wherein a first distance between the first wall and the light emitting element is forming a resin wall larger than a second distance between the third wall and the fourth wall and the light emitting element;
A first resin is applied from the third wall toward the fourth wall in a first region between the first wall and the light emitting element where the protective element is arranged, and the light emitting element and the third wall, between the light emitting element and the fourth wall, between the light emitting elements, and between the light emitting element and the substrate to move the first resin from the first region and forming a first recess and a second recess each having an inner surface made of the first resin or the resin wall in a second region between the second wall and the light emitting element;
Forming a coating member that coats the side surface of the translucent member by applying a second resin to the interior of the first recess and the interior of the second recess, and curing the first resin and the second resin. A method of manufacturing a light emitting device comprising:

本願の発光装置の製造方法によれば、発光装置の所望の領域に、被覆部材を精度よく配置することができる。 According to the manufacturing method of the light emitting device of the present application, the covering member can be precisely arranged on the desired region of the light emitting device.

本発明の一実施形態の発光装置の製造方法を示す概略平面図である。It is a schematic plan view which shows the manufacturing method of the light-emitting device of one Embodiment of this invention. 図１ＡのＩＢ－ＩＢ線断面図である。FIG. 1B is a sectional view along line IB-IB of FIG. 1A; 本発明の一実施形態の発光装置の製造方法を示す概略平面図である。It is a schematic plan view which shows the manufacturing method of the light-emitting device of one Embodiment of this invention. 図１Ｃの断面図である。1D is a cross-sectional view of FIG. 1C; FIG. 本発明の一実施形態の発光装置の製造方法を示す概略平面図である。It is a schematic plan view which shows the manufacturing method of the light-emitting device of one Embodiment of this invention. 図１Ｅの断面図である。Figure IE is a cross-sectional view of Figure IE; 本発明の一実施形態の発光装置の製造方法を示す概略平面図である。It is a schematic plan view which shows the manufacturing method of the light-emitting device of one Embodiment of this invention. 図１Ｇの断面図である。FIG. 1G is a cross-sectional view of FIG. 1G; 本発明の一実施形態の発光装置の製造方法を示す図１ＡのＩＩＡ－ＩＩＡ線に相当する概略断面図である。1B is a schematic cross-sectional view corresponding to line IIA-IIA in FIG. 1A, showing a method for manufacturing a light-emitting device according to an embodiment of the present invention; FIG. 本発明の一実施形態の発光装置の製造方法を示す概略断面図である。It is a schematic sectional drawing which shows the manufacturing method of the light-emitting device of one Embodiment of this invention. 本発明の一実施形態の発光装置の製造方法を示す概略断面図である。It is a schematic sectional drawing which shows the manufacturing method of the light-emitting device of one Embodiment of this invention. 本発明の一実施形態の発光装置の製造方法を示す概略断面図である。It is a schematic sectional drawing which shows the manufacturing method of the light-emitting device of one Embodiment of this invention. 本発明の一実施形態の発光装置の製造方法を示す概略断面図である。It is a schematic sectional drawing which shows the manufacturing method of the light-emitting device of one Embodiment of this invention. 本発明の一実施形態の発光装置の製造方法で製造された発光素子を示す概略斜視図である。1 is a schematic perspective view showing a light-emitting element manufactured by a method for manufacturing a light-emitting device according to one embodiment of the present invention; FIG. 本発明の一実施形態の発光装置の製造方法で用いられる基板を示す概略平面図である。1 is a schematic plan view showing a substrate used in a method for manufacturing a light emitting device according to one embodiment of the present invention; FIG.

以下、本発明の実施の形態について適宜図面を参照して説明する。ただし、以下に説明する実施形態は、本発明の技術思想を具体化するためのものであって、特定的な記載がない限り、本発明は以下のものに限定されない。各図面が示す部材の大きさ及び位置関係等は、説明を明確にするため、誇張していることがある。断面図は、切断面のみを示す端面図を用いる場合がある。また、各実施形態において他の実施形態と同一の名称を用いる部材は、同一又は対応する部材を表している。そのような部材は、特に説明がない限り、他の実施形態で挙げた材料及び大きさ等を採用することができる。本明細書において、「上」、「下」等は、説明のために参照する図面において構成要素間の相対的な位置を示すものであって、特に断らない限り絶対的な位置を示すことを意図したものではない。また、第１方向及び第２方向は、それぞれ、図面において双方向矢印で示されたいずれの方向であってもよい。本明細書において、「距離」とは、対象となる部材それぞれの表面のうち、最も近い位置にある表面間の距離を意味する。 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the embodiments described below are for embodying the technical idea of the present invention, and unless there is a specific description, the present invention is not limited to the following. The sizes and positional relationships of members shown in each drawing may be exaggerated for clarity of explanation. As a cross-sectional view, an end view showing only a cut surface may be used. Also, members using the same names as in other embodiments in each embodiment represent the same or corresponding members. Unless otherwise specified, such members can employ the materials, sizes, and the like mentioned in the other embodiments. In this specification, "top", "bottom", etc. indicate relative positions between constituent elements in the drawings referred to for explanation, and unless otherwise specified, they indicate absolute positions. not intended. Also, the first direction and the second direction may be any directions indicated by double-headed arrows in the drawings. As used herein, the term "distance" means the distance between the surfaces of the target members that are closest to each other.

〔発光装置の製造方法〕
本願における一実施形態の発光装置の製造方法は、
基板と、前記基板の上面に第１方向に配列された複数の発光素子と、前記第１方向に直交する第２方向において前記発光素子と離隔しかつ対向して前記基板の上面に配置された保護素子と、前記発光素子のそれぞれの上面に接合された透光性部材とを備えた第１中間体を準備する工程と、
前記複数の発光素子を挟んで配置され、前記第１方向に延伸する第１壁及び第２壁と、前記第１壁と前記第２壁との間に配置され、前記第２方向に延伸する第３壁及び第４壁とを含み、前記複数の発光素子及び前記保護素子を取り囲む樹脂壁を前記基板上に形成する工程であって、前記第１壁と前記発光素子との第１距離が、前記第３壁及び前記第４壁と前記発光素子との第２距離よりも大きい樹脂壁を形成する工程と、
前記第１壁と前記発光素子との間であって、前記保護素子が配置された第１領域に、前記第３壁から前記第４壁に向かって第１樹脂を塗布して、前記発光素子と前記第３壁との間、前記発光素子と前記第４壁との間、前記発光素子間及び前記発光素子と前記基板との間から第１樹脂を移動させて、前記第１領域と、前記第２壁と前記発光素子との間の第２領域とに、前記第１樹脂又は前記樹脂壁で構成された内側面を有する第１凹部及び第２凹部をそれぞれ形成する工程と、
前記第１凹部内及び前記第２凹部内に第２樹脂を塗布して、前記第１樹脂及び前記第２樹脂を硬化することにより前記透光性部材の側面を被覆する被覆部材を形成することを含む。
このような発光装置の製造方法によって、樹脂部材の発光装置の光取り出し面上への濡れ広がりを抑制し、また、樹脂部材の移動によるボイド等の発生を抑制することができる。つまり、本実施形態の発光装置の製造方法によれば、発光装置の所望の領域に、樹脂部材を精度よく配置することができる。 [Method for manufacturing light-emitting device]
A method for manufacturing a light-emitting device according to an embodiment of the present application includes:
a substrate; a plurality of light emitting elements arranged in a first direction on the upper surface of the substrate; preparing a first intermediate body comprising a protective element and a translucent member bonded to the top surface of each of the light emitting elements;
a first wall and a second wall arranged to sandwich the plurality of light emitting elements and extending in the first direction; and a first wall and a second wall arranged between the first wall and the second wall and extending in the second direction. forming a resin wall on the substrate, the resin wall including a third wall and a fourth wall and surrounding the plurality of light emitting elements and the protective element, wherein a first distance between the first wall and the light emitting element is forming a resin wall larger than a second distance between the third wall and the fourth wall and the light emitting element;
A first resin is applied from the third wall toward the fourth wall in a first region between the first wall and the light emitting element where the protective element is arranged, and the light emitting element and the third wall, between the light emitting element and the fourth wall, between the light emitting elements, and between the light emitting element and the substrate to move the first resin from the first region and forming a first recess and a second recess each having an inner surface made of the first resin or the resin wall in a second region between the second wall and the light emitting element;
Forming a coating member that coats the side surface of the translucent member by applying a second resin to the interior of the first recess and the interior of the second recess, and curing the first resin and the second resin. including.
With such a method for manufacturing a light-emitting device, it is possible to suppress the resin member from spreading over the light extraction surface of the light-emitting device, and to suppress the generation of voids or the like due to movement of the resin member. That is, according to the method for manufacturing the light emitting device of the present embodiment, the resin member can be precisely arranged in the desired region of the light emitting device.

（第１中間体１０の準備）
第１中間体１０は、例えば、図１Ａ及び１Ｂに示すように、基板１１と、基板１１の上面に第１方向に配列された複数の発光素子１２と、第１方向に直交する第２方向において発光素子１２と離隔しかつ対向して基板１１の上面に配置された保護素子１３と、発光素子１２のそれぞれの上面に接合された透光性部材１４とを備える。 (Preparation of first intermediate 10)
For example, as shown in FIGS. 1A and 1B, the first intermediate 10 includes a substrate 11, a plurality of light emitting elements 12 arranged in a first direction on the upper surface of the substrate 11, and a second direction orthogonal to the first direction. , a protective element 13 arranged on the upper surface of the substrate 11 so as to be separated from and facing the light emitting elements 12, and a translucent member 14 bonded to the upper surface of each of the light emitting elements 12. As shown in FIG.

（基板１１）
基板１１は、発光素子１２等を支持する部材である。基板１１は、例えば、図４に示すように、少なくともその表面に発光素子１２の電極に電気的に接続される２以上の配線１１ａを有する。
基板１１の平面形状は、円形、楕円形、四角形及び六角形等の多角形、多角形の角が丸みをおびたもの等、種々の形状とすることができる。なかでも、長方形であるものが好ましい。基板１１の大きさは、その上に配置する発光素子１２の大きさ及び数等、求められる性能によって適宜調整することができる。
配線１１ａの平面形状は、そこに配置される発光素子の大きさ、数等によって適宜設定することができる。例えば、図４に示すように、基板１１上であって、基板１１の幅（つまり図４中の第２方向の長さ）の中央から基板１１の一辺１１ｂ側に偏って配置されていることが好ましい。言い換えると、平面視において、配線１１ａは、基板１１の第２方向の中心線に対して、基板１１の一辺１１ｂ側に偏って配置されていることが好ましい。
基板１１の主な材料としては、絶縁性材料であって、発光素子１２からの光及び外部からの光が透過しにくい材料が好ましい。このような材料としては、酸化アルミニウム、窒化アルミニウム等のセラミックス、フェノール樹脂、エポキシ樹脂、シリコーン樹脂、ポリイミド樹脂、ＢＴレジン、ポリフタルアミド等の樹脂が挙げられる。樹脂を用いる場合には、必要に応じて、ガラス繊維、酸化ケイ素、酸化チタン、酸化アルミニウム等の無機フィラーを樹脂に混合してもよい。これにより、機械的強度の向上や熱膨張率の低減、光反射率の向上を図ることができる。基板１１は、金属部材の表面に絶縁性材料を形成したものでもよい。
配線１１ａは、絶縁性材料の上に、所定のパターンで形成されている。配線の材料として、Ａｕ、Ａｇ、Ｃｕ、Ｆｅ、Ｔｉ、Ｐｄ、Ｎｉ、Ｃｒ、Ｐｔ、Ｗ、Ａｌ等の金属またはこれらを含む合金等が挙げられる。配線は、めっき、蒸着、スパッタ等によって形成することができる。例えば、後述する発光素子と基板との接合部材にＡｕを用いる場合、接合性の向上の観点から、配線１１ａの最表面にＡｕを用いることが好ましい。 (substrate 11)
The substrate 11 is a member that supports the light emitting element 12 and the like. For example, as shown in FIG. 4, the substrate 11 has two or more wirings 11a electrically connected to the electrodes of the light emitting elements 12 on at least its surface.
The planar shape of the substrate 11 may be circular, elliptical, polygonal such as quadrangular and hexagonal, and polygonal with rounded corners. Among them, a rectangular shape is preferable. The size of the substrate 11 can be appropriately adjusted depending on the required performance such as the size and number of the light emitting elements 12 arranged thereon.
The planar shape of the wiring 11a can be appropriately set according to the size, number, etc. of the light emitting elements arranged there. For example, as shown in FIG. 4, it is arranged on the substrate 11 so as to deviate from the center of the width of the substrate 11 (that is, the length in the second direction in FIG. 4) toward the side 11b of the substrate 11. is preferred. In other words, in a plan view, the wiring 11a is preferably arranged to be biased toward the side 11b of the substrate 11 with respect to the centerline of the substrate 11 in the second direction.
The main material of the substrate 11 is preferably an insulating material that hardly transmits the light from the light emitting element 12 and the light from the outside. Examples of such materials include ceramics such as aluminum oxide and aluminum nitride, and resins such as phenol resin, epoxy resin, silicone resin, polyimide resin, BT resin, and polyphthalamide. When a resin is used, inorganic fillers such as glass fiber, silicon oxide, titanium oxide, and aluminum oxide may be mixed with the resin, if necessary. As a result, it is possible to improve the mechanical strength, reduce the coefficient of thermal expansion, and improve the light reflectance. The substrate 11 may be formed by forming an insulating material on the surface of a metal member.
The wiring 11a is formed in a predetermined pattern on an insulating material. Examples of wiring materials include metals such as Au, Ag, Cu, Fe, Ti, Pd, Ni, Cr, Pt, W, and Al, and alloys containing these. The wiring can be formed by plating, vapor deposition, sputtering, or the like. For example, when Au is used as a bonding member between a light emitting element and a substrate, which will be described later, it is preferable to use Au for the outermost surface of the wiring 11a from the viewpoint of improving bondability.

（発光素子１２）
発光素子１２は、基板１１の上面に複数配置されている。この場合、発光素子１２は、第１方向に一列に配置されていてもよいし、マトリクス状に配置されていてもよい。なかでも、一列に配置されていることが好ましく、図１Ａに示すように、第１方向に一列に配置されていることがより好ましい。これにより、車両ヘッドライトに適した横長の配光パターンを有する発光装置２０とすることができる。例えば、上述したように基板１１の平面形状が長方形である場合、長辺が延長する方向を、第１方向として、複数の発光素子が第１方向に沿って、一列に配置されていることが好ましい。
複数の発光素子は等間隔で一列に配置されていることが好ましい。 (Light emitting element 12)
A plurality of light emitting elements 12 are arranged on the upper surface of the substrate 11 . In this case, the light emitting elements 12 may be arranged in a line in the first direction, or may be arranged in a matrix. Among them, it is preferable that they are arranged in a row, and as shown in FIG. 1A, it is more preferable that they are arranged in a row in the first direction. As a result, the light emitting device 20 having a horizontally long light distribution pattern suitable for vehicle headlights can be obtained. For example, when the planar shape of the substrate 11 is rectangular as described above, a plurality of light emitting elements may be arranged in a row along the first direction, with the direction in which the long sides extend as the first direction. preferable.
It is preferable that the plurality of light emitting elements be arranged in a line at regular intervals.

発光素子１２の平面形状は、円形、楕円形、四角形及び六角形等の多角形、多角形の角が丸みをおびたもの等、種々の形状とすることができる。なかでも、四角形であるものが好ましく、矩形であるものがより好ましい。これにより、複数の発光素子１２を第１方向に配列する際に、隣接する発光素子の側面間の距離を一定として、複数の発光素子を近接させて配列することができる。そして、全体として平面視で横長の矩形状の発光面を形成することができる。
発光素子の縦、横、及び高さの寸法は任意に設定することができる。なかでも、より高出力な発光装置を実現するために、大型の発光素子を用いることが好ましく、平面視において、発光素子の縦及び横の寸法は６００μｍ以上であることが好ましく、１０００μｍ以上であることがより好ましい。また、発光強度の均一性、実装のし易さ等の観点から、縦及び横の寸法は２０００μｍ以下であることが好ましい。
発光素子１２は、隣接する発光素子１２と離隔して配置されている。この場合の発光素子１２間の距離は、例えば、発光素子１２の第１方向に沿った一辺の０．１倍～０．５倍の範囲が挙げられる。具体的には、縦及び横の寸法が約１０００μｍの平面視略正方形状の発光素子１２を用いる場合、隣接する発光素子１２間の距離は、１００μｍから５００μｍの範囲が挙げられる。 The planar shape of the light emitting element 12 may be circular, elliptical, polygonal such as square and hexagonal, and polygonal with rounded corners. Among them, a square shape is preferable, and a rectangular shape is more preferable. As a result, when arranging the plurality of light emitting elements 12 in the first direction, the plurality of light emitting elements can be arranged close to each other while keeping the distance between the side surfaces of adjacent light emitting elements constant. As a whole, it is possible to form a horizontally long rectangular light emitting surface in a plan view.
The length, width, and height dimensions of the light emitting element can be set arbitrarily. In particular, in order to realize a light-emitting device with higher output, it is preferable to use a large-sized light-emitting element. is more preferable. Moreover, from the viewpoint of uniformity of emission intensity, ease of mounting, etc., the vertical and horizontal dimensions are preferably 2000 μm or less.
The light emitting elements 12 are arranged apart from adjacent light emitting elements 12 . In this case, the distance between the light emitting elements 12 is, for example, in the range of 0.1 to 0.5 times the length of one side of the light emitting elements 12 along the first direction. Specifically, when light emitting elements 12 having a substantially square shape in a plan view and having vertical and horizontal dimensions of about 1000 μm are used, the distance between adjacent light emitting elements 12 is in the range of 100 μm to 500 μm.

発光素子１２は、発光ダイオードを用いるのが好ましい。発光素子は、任意の波長のものを選択することができる。例えば、青色、緑色の発光素子としては、窒化物半導体（ＩｎＸＡｌＹＧａ１－Ｘ－ＹＮ、０≦Ｘ、０≦Ｙ、Ｘ＋Ｙ≦１）、ＺｎＳｅ、ＧａＰを用いたものが挙げられる。また、赤色の発光素子としては、ＧａＡｌＡｓ、ＡｌＩｎＧａＰなどを用いることができる。さらに、これ以外の材料からなる半導体発光素子を用いることもできる。用いる発光素子の組成又は発光色、大きさ、個数などは目的に応じて適宜選択することができる。蛍光体を有する発光装置とする場合には、その蛍光体を効率的に励起できる短波長が発光可能な窒化物半導体からなる発光素子を用いることが好ましい。
発光素子１２は、例えば、成長用のサファイア基板など透光性の支持基板上に半導体層を積層させて形成され、支持基板側が発光素子１２の主な光出射面となる。支持基板は、例えば、研磨、レーザーリフトオフ等で除去してもよい。 A light-emitting diode is preferably used as the light-emitting element 12 . A light-emitting element with an arbitrary wavelength can be selected. For example, blue and green light-emitting elements include those using nitride semiconductors (In X Al Y Ga 1-XY N, 0≦X, 0≦Y, X+Y≦1), ZnSe, and GaP. . GaAlAs, AlInGaP, or the like can be used as a red light emitting element. Furthermore, semiconductor light-emitting elements made of other materials can also be used. The composition, emission color, size, number, and the like of the light-emitting element to be used can be appropriately selected according to the purpose. In the case of a light-emitting device having a phosphor, it is preferable to use a light-emitting element made of a nitride semiconductor capable of emitting short-wavelength light that can efficiently excite the phosphor.
The light emitting element 12 is formed by stacking semiconductor layers on a translucent support substrate such as a sapphire substrate for growth, for example, and the main light emitting surface of the light emitting element 12 is on the support substrate side. The support substrate may be removed, for example, by polishing, laser lift-off, or the like.

発光素子１２は、例えば、同一面側、つまり、光出射面とは反対側に第１電極及び第２電極を有するものが好ましい。第１電極及び第２電極は、発光素子１２において、例えば、中央部分に第１電極が配置され、第１電極を挟むように、第２電極がそれぞれ配置されているものが挙げられる。 The light emitting element 12 preferably has a first electrode and a second electrode on the same side, that is, on the side opposite to the light emitting surface, for example. As for the first electrode and the second electrode, in the light emitting element 12, for example, the first electrode is arranged in the central portion and the second electrodes are arranged so as to sandwich the first electrode.

発光素子１２は、電極が形成された面を下面として基板１１に対向させて、基板１１上に載置されている。具体的には、発光素子１２の第１電極又は第２電極が、接合部材を介して、基板１１上に設けられた配線１１ａに接続されている。
接合部材としては、例えば、Ａｕ、Ａｇ、Ｃｕ、又はこれらを含む合金等からなるバンプ、Ｓｎ－Ｂｉ系、Ｓｎ－Ｃｕ系、Ｓｎ－Ａｇ系、Ａｕ－Ｓｎ系などの半田、ＡｕとＳｎとを主成分とする合金、ＡｕとＳｉとを主成分とする合金、ＡｕとＧｅとを主成分とする合金等の共晶合金、あるいは、Ａｕ、Ａｇ、Ｐｄなどの導電性ペースト、ＡＣＰ、ＡＣＦ等の異方性導電材、低融点金属のろう材、これらを組み合わせた導電性接着剤、導電性複合接着剤等が挙げられる。なかでも位置精度の観点からバンプを用いることが好ましい。また接合強度、放熱性の観点から、第１電極及び第２電極がそれぞれ複数のバンプを介して基板１１上に接続されることが好ましい。
発光素子がバンプ等の接合部材によって配線に接合されている場合には、発光素子と基板との間に、接合部材の厚みに相当する隙間が生じる。この際、この隙間に、後述する光反射性を有する第１樹脂を配置することにより、発光素子から基板方向に向かう光を反射させて、外部に光を取り出しやすくすることができる。 The light emitting element 12 is mounted on the substrate 11 so that the surface on which the electrodes are formed faces the substrate 11 with the surface on which the electrodes are formed as the lower surface. Specifically, the first electrode or the second electrode of the light emitting element 12 is connected to the wiring 11a provided on the substrate 11 via the joining member.
Examples of the bonding member include bumps made of Au, Ag, Cu, or alloys containing these; Sn—Bi, Sn—Cu, Sn—Ag, and Au—Sn solder; eutectic alloys such as alloys mainly composed of Au and Si, alloys mainly composed of Au and Ge, or conductive pastes such as Au, Ag, and Pd, ACP, ACF Anisotropic conductive materials, such as low-melting-point metal brazing materials, conductive adhesives combining these, conductive composite adhesives, and the like. Among them, it is preferable to use bumps from the viewpoint of positional accuracy. Moreover, from the viewpoint of bonding strength and heat dissipation, it is preferable that the first electrode and the second electrode are connected to the substrate 11 via a plurality of bumps, respectively.
When the light emitting element is bonded to the wiring by a bonding member such as a bump, a gap corresponding to the thickness of the bonding member is generated between the light emitting element and the substrate. At this time, by disposing a first resin having light reflectivity, which will be described later, in this gap, it is possible to reflect the light directed toward the substrate from the light emitting element, thereby facilitating extraction of the light to the outside.

発光素子１２は、基板１１の配線１１ａ上において、後述する保護素子１３が配置される領域を考慮して、例えば、配線１１ａの第２方向における幅の中央（）から、保護素子１３が配置される領域と反対側にシフトした位置に配置されることが好ましい。特に、上述したように、配線１１ａが、図４に示すように、基板１１の一辺１１ｂ側に偏って配置されている場合には、発光素子１２は、配線１１ａ上において、基板１１の一辺１１ｂ側とは反対側の他辺１１ｃ側に偏って配置されていることが好ましい。このような配置によって、図１Ａに示すように、基板１１の一辺１１ｂ側に保護素子１３を載置する領域を確保しながら、発光素子１２を、基板１１上において、第１方向に沿って、その第２方向の中央に配置することができる。このような配線１１ａ上への発光素子１２の配置は、発光素子１２を挟んで対向する基板１１の一辺１１ｂ側と他辺１１ｃ側とにおいて、配線１１ａの面積が異なることを示す。具体的には、一列に配列した発光素子１２に対して、基板１１の一辺１１ｂ側であって保護素子１３が載置される側に配置された配線１１ａの面積が、他辺１１ｃ側に配置された配線１１ａの面積よりも大きいことを示す。 Considering the area where the protection element 13 described later is arranged on the wiring 11a of the substrate 11, the light emitting element 12 is arranged, for example, from the center ( ) of the width of the wiring 11a in the second direction. It is preferably arranged in a position shifted to the opposite side of the area where the In particular, as described above, when the wiring 11a is arranged to be biased toward the side 11b of the substrate 11 as shown in FIG. It is preferable that it be arranged biased toward the other side 11c side opposite to the side. With this arrangement, as shown in FIG. 1A, the light emitting element 12 is arranged on the substrate 11 along the first direction while securing a region for mounting the protective element 13 on the one side 11b side of the substrate 11. It can be arranged centrally in the second direction. The placement of the light emitting element 12 on the wiring 11a in this manner indicates that the area of the wiring 11a is different between the one side 11b side and the other side 11c side of the substrate 11 facing each other with the light emitting element 12 interposed therebetween. Specifically, with respect to the light emitting elements 12 arranged in a line, the area of the wiring 11a arranged on the one side 11b side of the substrate 11 and the side on which the protective element 13 is mounted is arranged on the other side 11c side. This indicates that the area of the wiring 11a is larger than the area of the wiring 11a.

（保護素子１３）
保護素子１３は、図１Ａに示すように、第１方向に直交する第２方向において発光素子１２と離隔し、かつ発光素子１２と対向して、基板の上面に載置されている。発光素子１２と保護素子１３との距離は、例えば、発光素子１２の第２方向に沿った一辺の０．１倍～０．５倍の範囲が挙げられる。
さらに、保護素子１３は、第１方向において、第１方向に配列された複数の発光素子の列の略中心に配置されていることが好ましい。これにより、後述する第１樹脂が、保護素子を伝って発光素子の列の両端部に向かって均等に広がりやすくなる。
保護素子１３としては、例えば、コンデンサ、バリスタ、ツェナーダイオード、ブリッジダイオード等が挙げられる。
保護素子１３は、図１Ａ、図２Ａ等に示すように、保護素子１３の側面と発光素子１２の側面とが対向するように配置されていることが好ましい。これにより、対向する保護素子１３の側面と発光素子１２の側面との距離を一定として、近接して配置することができる。さらに後述する第１樹脂が、保護素子１３と発光素子１２との対向する側面間を伝って発光素子側に移動しやすくなる。
保護素子１３の平面視形状は、例えば略矩形状である。保護素子の縦、横、及び高さの寸法は任意に設定することができる。なかでも、発光装置の小型化の観点から、平面視において、保護素子の縦及び横の寸法は、発光素子の縦及び横の寸法より小さいことが好ましい。また、保護素子の高さは、発光素子と透光性部材とを合わせた高さよりも低くすることが好ましい。 (protective element 13)
As shown in FIG. 1A, the protective element 13 is placed on the upper surface of the substrate so as to be separated from the light emitting element 12 in a second direction orthogonal to the first direction and to face the light emitting element 12 . The distance between the light emitting element 12 and the protective element 13 is, for example, in the range of 0.1 to 0.5 times the length of one side of the light emitting element 12 along the second direction.
Furthermore, it is preferable that the protective element 13 is arranged in the first direction substantially at the center of the row of the plurality of light emitting elements arranged in the first direction. This makes it easier for the first resin, which will be described later, to spread evenly toward both ends of the row of light emitting elements along the protective element.
Examples of the protective element 13 include capacitors, varistors, Zener diodes, bridge diodes, and the like.
As shown in FIG. 1A, FIG. 2A, etc., the protective element 13 is preferably arranged such that the side surface of the protective element 13 and the side surface of the light emitting element 12 face each other. As a result, the distance between the side surface of the protection element 13 and the side surface of the light emitting element 12 facing each other can be kept constant, and they can be arranged close to each other. Further, the first resin, which will be described later, can easily move to the light emitting element side along the opposing side surfaces of the protection element 13 and the light emitting element 12 .
The planar view shape of the protective element 13 is, for example, a substantially rectangular shape. The length, width, and height dimensions of the protective element can be set arbitrarily. In particular, from the viewpoint of miniaturization of the light-emitting device, it is preferable that the protective element has vertical and horizontal dimensions smaller than those of the light-emitting element in plan view. Moreover, the height of the protective element is preferably lower than the combined height of the light emitting element and the translucent member.

（透光性部材１４）
透光性部材１４は、発光素子１２から出射される光を透過して外部に放出する部材であり、発光素子１２の上面に接合されている。透光性部材１４は、発光素子１２からの光（例えば、波長３２０ｎｍ～８５０ｎｍの範囲の光）の６０％以上を透過するものが挙げられ、７０％以上の光を透過するものが好ましい。また、板状の部材であるものが好ましい。
具体的には、透光性部材１４は、例えば、第１面と、第１面の反対側の第２面と、第１面及び第２面の間の側面とを有する。第１面は、発光装置２０の光取り出し面に相当する。第２面が、発光素子１２の上面と接合されている。第１面及び第２面は平坦であることが好ましく、互いに平行であることがより好ましい。側面は、第１面及び／又は第２面に垂直な垂直面であってもよいし、第１面及び／又は第２面に対して傾斜した傾斜面を有していてもよい。また、透光性部材１４は、第１面と第２面との間に段差を有していてもよい。
透光性部材１４の第２面は、発光素子１２の上面面積の０．８～１．５倍程度の面積を有することが好ましい。透光性部材の第２面の外縁は、発光素子の上面外縁と一致するか、上面外縁より内側又は外側のどちらかのみに位置していることが好ましい。つまり、平面視において、発光素子の上面と透光性部材の第２面のどちらか一方がもう一方に内包されることが好ましい。
透光性部材１４の厚みは、例えば、５０μｍ～３００μｍの範囲とすることができる。
透光性部材１４と発光素子１２とは、当該分野で通常用いられているような、透光性の接着剤等を用いて接合することができる。また、透光性部材１４と発光素子１２とは圧着、表面活性化接合、原子拡散接合、水酸基接合による直接接合法を用いて接合してもよい。 (translucent member 14)
The translucent member 14 is a member that transmits the light emitted from the light emitting element 12 and emits it to the outside, and is bonded to the upper surface of the light emitting element 12 . The translucent member 14 may transmit 60% or more of the light (for example, light in the wavelength range of 320 nm to 850 nm) from the light emitting element 12, and preferably transmit 70% or more of the light. Also, a plate-shaped member is preferable.
Specifically, the translucent member 14 has, for example, a first surface, a second surface opposite to the first surface, and side surfaces between the first surface and the second surface. The first surface corresponds to the light extraction surface of the light emitting device 20 . The second surface is joined to the top surface of the light emitting element 12 . The first and second surfaces are preferably flat and more preferably parallel to each other. The side surface may be a vertical surface perpendicular to the first surface and/or the second surface, or may have an inclined surface that is inclined with respect to the first surface and/or the second surface. Moreover, the translucent member 14 may have a step between the first surface and the second surface.
The second surface of the translucent member 14 preferably has an area about 0.8 to 1.5 times the area of the upper surface of the light emitting element 12 . It is preferable that the outer edge of the second surface of the translucent member coincides with the outer edge of the top surface of the light-emitting element, or is positioned either inside or outside the outer edge of the upper surface. In other words, it is preferable that one of the upper surface of the light-emitting element and the second surface of the translucent member is included in the other in plan view.
The thickness of the translucent member 14 can be, for example, in the range of 50 μm to 300 μm.
The light-transmitting member 14 and the light-emitting element 12 can be bonded using a light-transmitting adhesive or the like that is commonly used in the relevant field. Alternatively, the translucent member 14 and the light-emitting element 12 may be bonded by direct bonding such as pressure bonding, surface activation bonding, atomic diffusion bonding, or hydroxyl group bonding.

透光性部材１４は、例えば、ガラス、セラミックス、サファイア等の無機材料、シリコーン樹脂、変性シリコーン樹脂、エポキシ樹脂、変性エポキシ樹脂、アクリル樹脂、フェノール樹脂、フッ素樹脂の１種以上を含む樹脂又はハイブリッド樹脂等の有機材料のいずれによって形成されていてもよい。
透光性部材１４は、光拡散材、入射された光の少なくとも一部を波長変換可能な蛍光体を含有させてもよい。蛍光体を含有する透光性部材は、例えば、蛍光体の焼結体、樹脂、ガラス、セラミックス又は他の無機物に蛍光体を含有させたもの等が挙げられる。また、樹脂、ガラス、セラミックス等の成形体の表面に蛍光体を含有する樹脂層を形成したものでもよい。
蛍光体としては、発光素子１２からの発光で励起可能なものが使用される。例えば、青色発光素子又は紫外線発光素子で励起可能な蛍光体としては、セリウムで賦活されたイットリウム・アルミニウム・ガーネット系蛍光体（ＹＡＧ：Ｃｅ）、セリウムで賦活されたルテチウム・アルミニウム・ガーネット系蛍光体（ＬＡＧ：Ｃｅ）、ユウロピウムおよび／又はクロムで賦活された窒素含有アルミノ珪酸カルシウム系蛍光体（ＣａＯ－Ａｌ２Ｏ３－ＳｉＯ２：Ｅｕ）、ユウロピウムで賦活されたシリケート系蛍光体（（Ｓｒ，Ｂａ）２ＳｉＯ４：Ｅｕ）、βサイアロン蛍光体、ＣａＡｌＳｉＮ３：Ｅｕで表されるＣＡＳＮ系蛍光体、（Ｓｒ，Ｃａ）ＡｌＳｉＮ３：Ｅｕで表されるＳＣＡＳＮ系蛍光体等の窒化物系蛍光体、Ｋ２ＳｉＦ６：Ｍｎで表されるＫＳＦ系蛍光体、硫化物系蛍光体、量子ドット蛍光体などが挙げられる。これらの蛍光体と、青色発光素子又は紫外線発光素子と組み合わせることにより、所望の発光色の発光装置（例えば白色系の発光装置）を製造することができる。
光拡散材としては、酸化チタン、チタン酸バリウム、酸化アルミニウム、酸化ケイ素、酸化ジルコニウム、アエロジル、ガラス、ガラスファイバー又はワラストナイトなどのフィラー、窒化アルミニウム等、当該分野で通常用いられているもののいずれを用いてもよい。 The translucent member 14 is made of, for example, glass, ceramics, inorganic materials such as sapphire, silicone resins, modified silicone resins, epoxy resins, modified epoxy resins, acrylic resins, phenolic resins, and fluorine resins. It may be formed of any organic material such as resin.
The translucent member 14 may contain a light diffusing material and a phosphor capable of wavelength-converting at least part of the incident light. Examples of translucent members containing phosphors include sintered bodies of phosphors, resins, glass, ceramics, and other inorganic substances containing phosphors. Alternatively, a resin layer containing a phosphor may be formed on the surface of a molding made of resin, glass, ceramics, or the like.
A phosphor that can be excited by light emitted from the light emitting element 12 is used as the phosphor. For example, phosphors that can be excited by a blue light emitting device or an ultraviolet light emitting device include a cerium-activated yttrium aluminum garnet phosphor (YAG:Ce), a cerium activated lutetium aluminum garnet phosphor. (LAG:Ce), nitrogen-containing calcium aluminosilicate phosphor activated with europium and/or chromium (CaO—Al 2 O 3 —SiO 2 :Eu), silicate phosphor activated with europium ((Sr, Ba) 2 SiO 4 :Eu), β-SiAlON phosphor, CASN phosphor represented by CaAlSiN 3 :Eu, Nitride phosphor such as SCASN phosphor represented by (Sr, Ca)AlSiN 3 :Eu a KSF-based phosphor represented by K 2 SiF 6 :Mn, a sulfide-based phosphor, a quantum dot phosphor, and the like. By combining these phosphors with a blue light-emitting element or an ultraviolet light-emitting element, a light-emitting device with a desired emission color (for example, a white light-emitting device) can be manufactured.
As the light diffusing material, titanium oxide, barium titanate, aluminum oxide, silicon oxide, zirconium oxide, aerosil, filler such as glass, glass fiber or wollastonite, aluminum nitride, etc., which are commonly used in the field. may be used.

（樹脂壁の形成）
図１Ｃ及び１Ｄに示すように、上面に透光性部材１４が接合された複数の発光素子１２及び保護素子１３を取り囲む樹脂壁１５０を基板１１上に形成する。例えば、平面視長方形の基板１１上に、複数の発光素子１２が第１方向に一列に配置されている場合、樹脂壁は複数の発光素子１２を取り囲む略矩形の枠状とすることが好ましい。
樹脂壁は、図１Ｃに示すように、透光性部材１４が接合された複数の発光素子１２を挟んで配置され、第１方向に延伸する第１壁１５１及び第２壁１５２と、第１壁１５１と第２壁１５２との間に配置され、第２方向に延伸する第３壁１５３及び第４壁１５４とを含む。第３壁１５３と第４壁１５４は複数の発光素子１２を挟んで対向して配置される。つまり、第１壁１５１、第２壁１５２、第３壁１５３及び第４壁１５４は、透光性部材１４が接合された複数の発光素子１２及び保護素子１３を取り囲むように、これら透光性部材１４、発光素子１２及び保護素子１３と離隔して基板１１上に配置される。ここで、第１壁１５１、第２壁１５２、第３壁１５３及び第４壁１５４は互いに連なって形成されており、透光性部材１４が接合された複数の発光素子１２及び保護素子１３を取り囲む、１つの枠状の樹脂壁として基板１１上に配置されている。この場合、樹脂壁は、図１Ｃに示すように、第１壁１５１、第４壁１５４、第２壁１５２、第３壁１５３がこの順に連結する、平面視略矩形の環状構造を示す。なお、この場合の矩形状は角丸矩形状であってもよく、つまり、第１壁１５１、第４壁１５４、第２壁１５２、第３壁１５３間の連結部はいわゆるアール形状としてもよい。 (Formation of resin wall)
As shown in FIGS. 1C and 1D, a resin wall 150 is formed on the substrate 11 so as to surround the plurality of light emitting elements 12 and the protective elements 13 with the translucent member 14 bonded to their upper surfaces. For example, when a plurality of light emitting elements 12 are arranged in a row in the first direction on a substrate 11 that is rectangular in plan view, the resin wall preferably has a substantially rectangular frame shape surrounding the plurality of light emitting elements 12.
As shown in FIG. 1C, the resin walls are arranged to sandwich the plurality of light-emitting elements 12 to which the translucent members 14 are joined, and extend in the first direction. It includes a third wall 153 and a fourth wall 154 disposed between the wall 151 and the second wall 152 and extending in the second direction. The third wall 153 and the fourth wall 154 are arranged to face each other with the plurality of light emitting elements 12 interposed therebetween. In other words, the first wall 151, the second wall 152, the third wall 153, and the fourth wall 154 surround the plurality of light-emitting elements 12 and the protective elements 13 to which the translucent member 14 is joined. It is arranged on the substrate 11 apart from the member 14 , the light emitting element 12 and the protection element 13 . Here, the first wall 151, the second wall 152, the third wall 153, and the fourth wall 154 are formed to be connected to each other, and the plurality of light emitting elements 12 and the protective elements 13 to which the translucent member 14 is joined are provided. It is arranged on the substrate 11 as one frame-shaped resin wall surrounding it. In this case, as shown in FIG. 1C, the resin wall has a substantially rectangular annular structure in which the first wall 151, the fourth wall 154, the second wall 152, and the third wall 153 are connected in this order. Note that the rectangular shape in this case may be a rectangular shape with rounded corners, that is, the connecting portion between the first wall 151, the fourth wall 154, the second wall 152, and the third wall 153 may be a so-called rounded shape. .

図１Ｃに示すように、第１壁１５１と発光素子１２との距離（図１Ｃ中Ｄ１、以下、第１距離と称することがある）は、第３壁１５３又は第４壁１５４と発光素子１２との距離（図１Ｃ中Ｄ２、以下、第２距離と称することがある）よりも大きい。言い換えると、第１壁１５１と発光素子１２とによって挟まれた領域（図１Ｅ中１６１、以下、第１領域と称することがある）は、第３壁１５３又は第４壁１５４と発光素子１２とで挟まれた領域よりも大きい。なお、第１壁１５１と発光素子１２との距離は、第２壁１５２と発光素子１２との距離と異なっていてもよいが、同じであることが好ましい。言い換えると、第１領域１６１は、第２壁１５２と発光素子１２とによって挟まれた領域（図１Ｅ中１６２、以下、第２領域と称することがある）と異なっていてもよいが、同じであることが好ましい。第１距離Ｄ１は、例えば、発光素子の第１方向に沿った一辺の長さの０．５倍から１．５倍の範囲が挙げられる。具体的には、５００μｍから１５００μｍが挙げられる。第２距離Ｄ２は、例えば、発光素子間の距離と同等又はそれよりも大きく、発光素子間の距離の３倍よりも小さいことが好ましい。
第３壁１５３と発光素子１２との距離および第４壁１５４と発光素子１２との距離は同じとなるように設計される。複数の発光素子はなお、設計上は同じでも、製造時における部材公差や実装公差などによって誤差は生じる。本明細書において、距離、幅、高さ、面積が同じというときは、このような誤差は許容範囲に含まれるものとして、必ずしも同じになっていなくてもよい。 As shown in FIG. 1C, the distance between the first wall 151 and the light emitting element 12 (D1 in FIG. 1C, hereinafter sometimes referred to as the first distance) is the third wall 153 or the fourth wall 154 and the light emitting element 12 (D2 in FIG. 1C, hereinafter sometimes referred to as a second distance). In other words, the region sandwiched between the first wall 151 and the light emitting element 12 (161 in FIG. 1E, hereinafter sometimes referred to as the first region) is the third wall 153 or the fourth wall 154 and the light emitting element 12. larger than the area between The distance between the first wall 151 and the light emitting element 12 may be different from the distance between the second wall 152 and the light emitting element 12, but it is preferable that they are the same. In other words, the first region 161 may be different from the region sandwiched between the second wall 152 and the light emitting element 12 (162 in FIG. 1E, hereinafter sometimes referred to as the second region), but the same. Preferably. For example, the first distance D1 ranges from 0.5 to 1.5 times the length of one side of the light emitting element along the first direction. Specifically, it is 500 μm to 1500 μm. The second distance D2 is, for example, equal to or greater than the distance between the light emitting elements, and preferably less than three times the distance between the light emitting elements.
The distance between the third wall 153 and the light emitting element 12 and the distance between the fourth wall 154 and the light emitting element 12 are designed to be the same. Even if a plurality of light emitting elements are identical in design, errors occur due to component tolerances, mounting tolerances, and the like during manufacturing. In this specification, when the distance, width, height, and area are said to be the same, such errors are included in the allowable range, and they do not necessarily have to be the same.

樹脂壁１５０は、配線１１ａの一部を被覆するため、絶縁性の樹脂で形成されている。樹脂壁は、例えば、透光性の樹脂によって形成してもよいが、樹脂と光反射性物質との混合材料によって形成することが好ましい。樹脂としては、熱硬化性樹脂及び熱可塑性樹脂のいずれを用いてもよい。具体的には、エポキシ樹脂、シリコーン樹脂、変性エポキシ樹脂、変性シリコーン樹脂、ポリエステル樹脂、ポリイミド樹脂、変性ポリイミド樹脂、ポリフタルアミド（ＰＰＡ）、ポリカーボネート樹脂、ポリフェニレンサルファイド（ＰＰＳ）、液晶ポリマー（ＬＣＰ）、ＡＢＳ樹脂、フェノール樹脂、アクリル樹脂、ＰＢＴ樹脂等が挙げられる。なかでも、耐熱性および耐光性に優れたエポキシ樹脂、シリコーン樹脂等の熱硬化性樹脂を用いることが好ましい。光反射性物質としては、発光素子からの光を吸収しにくく、樹脂材料に対して屈折率差の大きい部材を用いることが好ましい。このような光反射性物質は、例えば、酸化チタン、酸化亜鉛、酸化ケイ素、酸化ジルコニウム、酸化イットリウム、イットリア安定化ジルコニア、チタン酸カリウム、酸化アルミニウム、窒化アルミニウム、窒化ホウ素、ムライト等が挙げられる。これら光反射性物質を、樹脂に対して５重量％から９０重量％の範囲で含有させることができる。樹脂壁を形成する、樹脂と光反射性物質との混合材料の粘度は、例えば、２００Ｐａ・ｓから８００Ｐａ・ｓの範囲が挙げられ、３５０Ｐａ・ｓから４５０Ｐａ・ｓの範囲が好ましい。また、樹脂壁は、樹脂とカーボンブラックやグラファイトなどの光吸収性物質を含む混合材料によって形成してもよい。 The resin wall 150 is made of an insulating resin to cover a portion of the wiring 11a. The resin wall may be formed of, for example, translucent resin, but is preferably formed of a mixed material of resin and light-reflecting substance. As the resin, either a thermosetting resin or a thermoplastic resin may be used. Specifically, epoxy resin, silicone resin, modified epoxy resin, modified silicone resin, polyester resin, polyimide resin, modified polyimide resin, polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP). , ABS resin, phenol resin, acrylic resin, PBT resin, and the like. Among them, thermosetting resins such as epoxy resins and silicone resins, which are excellent in heat resistance and light resistance, are preferably used. As the light-reflecting substance, it is preferable to use a member that hardly absorbs light from the light-emitting element and that has a large difference in refractive index with respect to the resin material. Examples of such light-reflecting substances include titanium oxide, zinc oxide, silicon oxide, zirconium oxide, yttrium oxide, yttria-stabilized zirconia, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, and mullite. These light-reflecting substances can be contained in the range of 5% to 90% by weight with respect to the resin. The viscosity of the mixed material of the resin and the light-reflecting substance forming the resin wall is, for example, in the range of 200 Pa·s to 800 Pa·s, preferably in the range of 350 Pa·s to 450 Pa·s. Alternatively, the resin wall may be formed of a mixed material containing a resin and a light-absorbing substance such as carbon black or graphite.

第１壁１５１、第２壁１５２、第３壁１５３及び第４壁１５４は、同じ高さ及び同じ幅で形成してもよいし、一部又は全部が異なる高さ及び／又は異なる幅で形成してもよい。一部が異なる高さ及び／又は異なる幅で形成される場合、発光素子１２を挟んで対向する２つの壁（具体的には第１壁１５１と第２壁１５２、第３壁１５３と第４壁１５４）がそれぞれ同じ高さ及び同じ幅で形成されることが好ましい）。樹脂壁１５０の、基板１１上面からの高さは、例えば、図１Ｄに示すように、発光素子１２の上面よりも高いことが好ましい。また、基板１１の上面から樹脂壁１５０の頂部までの高さは、基板１１の上面から透光性部材１４の上面までの高さよりも高くてもよいが、低いことが好ましい。例えば、基板１１の上面から透光性部材１４の上面までの高さが３５０μｍの場合、樹脂壁の高さは、１５０μｍから３００μｍの範囲が挙げられる。樹脂壁１５０の幅（つまり、樹脂壁が延伸する方向と直交する方向における樹脂壁１５０の底辺の長さ）は、自立できる強度を有する程度であればよく、その高さ、用いる材料等によって適宜設定することができる。樹脂壁１５０の幅は、例えば、２００μｍから６００μｍの範囲が挙げられる。
樹脂壁は、例えば、当該分野で公知の装置、例えば、空気圧等で液状の樹脂を連続的及び一定の吐出流量で吐出可能な吐出装置（樹脂吐出装置）を用いて形成することができる（特開２００９－１８２３０７号公報参照）。吐出装置を用いる場合、吐出装置のニードルの移動速度や吐出量を調整することで、所望の高さ及び幅を有する樹脂壁１５０を形成することができる。 The first wall 151, the second wall 152, the third wall 153 and the fourth wall 154 may be formed with the same height and the same width, or some or all of them may be formed with different heights and/or different widths. You may When the portions are formed with different heights and/or different widths, two walls facing each other across the light emitting element 12 (specifically, the first wall 151 and the second wall 152, the third wall 153 and the fourth wall). Preferably, the walls 154) are each formed with the same height and width). The height of the resin wall 150 from the top surface of the substrate 11 is preferably higher than the top surface of the light emitting element 12, as shown in FIG. 1D, for example. Also, the height from the top surface of the substrate 11 to the top of the resin wall 150 may be higher than the height from the top surface of the substrate 11 to the top surface of the translucent member 14, but is preferably lower. For example, when the height from the upper surface of the substrate 11 to the upper surface of the translucent member 14 is 350 μm, the height of the resin wall is in the range of 150 μm to 300 μm. The width of the resin wall 150 (that is, the length of the base of the resin wall 150 in the direction orthogonal to the direction in which the resin wall extends) is sufficient as long as it has sufficient strength to stand on its own, depending on the height, the material used, and the like. can be set. The width of the resin wall 150 is, for example, in the range of 200 μm to 600 μm.
The resin wall can be formed, for example, by using a device known in the art, for example, a discharge device (resin discharge device) capable of discharging liquid resin continuously and at a constant discharge flow rate by air pressure or the like (particularly See JP-A-2009-182307). When a discharge device is used, the resin wall 150 having a desired height and width can be formed by adjusting the moving speed and discharge amount of the needle of the discharge device.

（第１凹部及び第２凹部の形成）
図２Ａ及び図２Ｂに示すように、第１壁１５１と発光素子１２との間であって、保護素子１３が配置された第１領域１６１に、第１方向に沿って、第１樹脂１８ａを塗布する。ここでの第１方向に沿うとは、第３壁１５３から第４壁１５４に向かうものであってもよいし、第４壁１５４から第３壁１５３に向かうものでもよい。第１樹脂１８ａの塗布を複数回行う場合は、第３壁１５３から第４壁１５４に向かう塗布を複数回行ってもよいし、第４壁１５４から第３壁１５３に向かう塗布を複数回行ってもよいし、両者を組み合わせてもよい。この場合、第１樹脂１８ａは、保護素子１３の上から、保護素子１３に被るように塗布することが好ましい。このような位置に第１樹脂１８ａを塗布することにより、保護素子１３を伝って、第１樹脂１８ａが発光素子１２側に移動しやすくなる。よって、図１Ｅ、１Ｆ及び図２Ｂ中の矢印Ｐに示す方向に第１樹脂１８ａが速やかに移動する。さらに、図２Ｃに示すように、矢印Ｑに示す方向においても、第１樹脂１８ａは、発光素子１２と第３壁１５３との間、発光素子１２と第４壁１５４との間、発光素子１２間及び発光素子１２と基板１１との間から、第３壁１５３、第４壁１５４、発光素子、基板１１及び／又は配線１１ａを伝って、第２領域１６２に向かって移動する。この際、発光素子１２側に移動した第１樹脂は、毛管現象により発光素子１２間において、発光素子１２の対向する側面間及び透光性部材１４の対向する側面間を這い上がり、発光素子１２と透光性部材１４の側面を被覆する。同様に、第１方向に配列する発光素子に沿って移動した第１樹脂は、第３壁及び第４壁と発光素子との間において、樹脂壁と発光素子１２との対向する側面間を這い上がり、発光素子１２の側面と透光性部材１４の側面と樹脂壁の側面とを被覆する。そして、第２領域１６２内に移動した第１樹脂１８ａは、図１Ｅ及び図２Ｃに示すように、第２壁１５２及び発光素子の側面に沿って濡れ広がる。その結果、第２領域１６２に、第１樹脂１８ａ又は樹脂壁で構成された内側面を有する第２凹部１７２を形成することができる。なお、第２凹部１７２の底面は、第１樹脂１８ａで構成されていてもよいし、第１樹脂１８ａから露出された基板の表面であってもよい。 (Formation of first recess and second recess)
As shown in FIGS. 2A and 2B, the first resin 18a is applied along the first direction to the first region 161 between the first wall 151 and the light emitting element 12 and where the protective element 13 is arranged. apply. Along the first direction here may be from the third wall 153 to the fourth wall 154 or from the fourth wall 154 to the third wall 153 . When the application of the first resin 18a is performed multiple times, the application may be performed multiple times from the third wall 153 to the fourth wall 154, or the application from the fourth wall 154 to the third wall 153 may be performed multiple times. or a combination of the two. In this case, the first resin 18 a is preferably applied from above the protection element 13 so as to cover the protection element 13 . By applying the first resin 18 a to such a position, it becomes easier for the first resin 18 a to move toward the light emitting element 12 along the protective element 13 . Therefore, the first resin 18a quickly moves in the direction indicated by the arrow P in FIGS. 1E, 1F and 2B. Furthermore, as shown in FIG. 2C, even in the direction indicated by the arrow Q, the first resin 18a extends between the light emitting element 12 and the third wall 153, between the light emitting element 12 and the fourth wall 154, and between the light emitting element 12 and the fourth wall 154. It moves toward the second region 162 from the space between the light emitting element 12 and the substrate 11 along the third wall 153, the fourth wall 154, the light emitting element, the substrate 11 and/or the wiring 11a. At this time, the first resin that has moved to the light emitting element 12 side crawls up between the opposing side surfaces of the light emitting element 12 and between the opposing side surfaces of the translucent member 14 between the light emitting elements 12 due to capillary action. and cover the side surface of the translucent member 14 . Similarly, the first resin that has moved along the light emitting elements arranged in the first direction crawls between the facing side surfaces of the resin wall and the light emitting elements 12 between the third wall and the fourth wall and the light emitting elements. It rises and covers the side surface of the light emitting element 12, the side surface of the translucent member 14, and the side surface of the resin wall. Then, the first resin 18a that has moved into the second region 162 wets and spreads along the side surfaces of the second wall 152 and the light emitting element, as shown in FIGS. 1E and 2C. As a result, a second recess 172 having an inner surface made of the first resin 18a or a resin wall can be formed in the second region 162 . The bottom surface of the second concave portion 172 may be composed of the first resin 18a, or may be the surface of the substrate exposed from the first resin 18a.

第１領域１６１に塗布された第１樹脂１８ａは、発光素子１２側に移動すると共に、図２Ｃの矢印Ｒに示す方向において、保護素子１３側から、第１領域１６１内の第１壁１５１側に移動し、第１壁１５１に沿って濡れ広がる。その結果、第１領域１６１に、第１樹脂１８ａ又は樹脂壁で構成された内側面を有する第１凹部１７１を形成することができる。なお、第１凹部１７１の底面は、第１樹脂１８ａで構成されていてもよいし、第１樹脂１８ａから露出された基板の表面であってもよい。ここで、第１領域には保護素子が配置されているため、第１凹部１７１の底面は、図１Ｅに示すように、保護素子１３及び保護素子１３を被覆する第１樹脂１８ａを挟んだ２つの底面を備える。
このようにして、樹脂壁１５０で囲まれた領域において、第１方向に配列された複数の発光素子を挟んだ第１領域と第２領域とに、第１樹脂又は樹脂壁で構成された内側面を有する第１凹部と第２凹部とを形成することができる。 The first resin 18a applied to the first region 161 moves toward the light emitting element 12 and moves from the protection element 13 side to the first wall 151 side in the first region 161 in the direction indicated by the arrow R in FIG. 2C. , and wets and spreads along the first wall 151 . As a result, the first recess 171 having an inner surface made of the first resin 18a or the resin wall can be formed in the first region 161 . The bottom surface of the first concave portion 171 may be made of the first resin 18a, or may be the surface of the substrate exposed from the first resin 18a. Here, since the protective element is arranged in the first region, the bottom surface of the first concave portion 171 is two-dimensionally sandwiched between the protective element 13 and the first resin 18a covering the protective element 13, as shown in FIG. 1E. It has one bottom surface.
Thus, in the region surrounded by the resin wall 150, the first region and the second region sandwiching the plurality of light emitting elements arranged in the first direction are provided with the first resin or the resin wall. A first recess and a second recess having sides may be formed.

なお、第１領域１６１には保護素子１３が配置されているため、第１領域に塗布された第１樹脂は保護素子１３の表面を被覆する。このため、基板１１上における第１領域１６１と第２領域１６２との面積が同等である場合であっても、第１樹脂１８ａの第１領域１６１への塗布量に対して、第１領域１６１に留まる第１樹脂１８ａの量より、第１樹脂１８ａの第２領域への移動量が小さいと考えられる。よって、図２Ｃに示すように、保護素子１３及び保護素子１３を被覆する第１樹脂１８ａの体積分だけ、第１凹部１７１の容積が、第２凹部１７２の容積よりも小さく形成される。ここで、第１樹脂１８ａの第１領域１６１への塗布量とは、第１樹脂の容量を意味し、第１樹脂１８ａの第２領域への移動量とは、第２領域内に配置された第１樹脂１８ａの容量を示す。また、上述したように、配線１１ａが基板１１上に偏在することから、例えば、第１凹部１７１側に配置された配線１１ａの面積は、第２凹部１７２側に配置された配線１１ａの面積よりも大きい。言い換えると、第１領域１６１における配線１１ａの面積は、第２領域１６２における配線１１ａの面積よりも大きい。よって、配線１１ａの最表面に、基板１１の材料よりも第１樹脂１８ａに対して濡れ性の高い材料を用いることで、第１樹脂１８ａを、配線１１ａ上に位置する発光素子１２及び樹脂壁１５０側に効率的に移動させることができる。 Since the protection element 13 is arranged in the first area 161 , the first resin applied to the first area covers the surface of the protection element 13 . Therefore, even if the areas of the first region 161 and the second region 162 on the substrate 11 are the same, the amount of the first resin 18a applied to the first region 161 increases. It is considered that the amount of movement of the first resin 18a to the second region is smaller than the amount of the first resin 18a remaining in the region. Therefore, as shown in FIG. 2C, the volume of the first recess 171 is formed smaller than the volume of the second recess 172 by the volume of the protection element 13 and the first resin 18a covering the protection element 13 . Here, the amount of the first resin 18a applied to the first region 161 means the volume of the first resin, and the amount of movement of the first resin 18a to the second region means the amount of the first resin 18a disposed in the second region. 1 shows the capacity of the first resin 18a. Further, as described above, since the wiring 11a is unevenly distributed on the substrate 11, for example, the area of the wiring 11a arranged on the side of the first recess 171 is larger than the area of the wiring 11a arranged on the side of the second recess 172. is also big. In other words, the area of the wiring 11 a in the first region 161 is larger than the area of the wiring 11 a in the second region 162 . Therefore, by using a material having higher wettability with respect to the first resin 18a than the material of the substrate 11 for the outermost surface of the wiring 11a, the first resin 18a can be used as the light emitting element 12 and the resin wall located on the wiring 11a. It can be efficiently moved to the 150 side.

第１樹脂１８ａは、例えば、透光性の樹脂によって形成してもよいが、遮光性を有する樹脂によって形成することが好ましく、光反射性を有する樹脂によって形成することがより好ましい。このような樹脂としては、樹脂壁で例示した材料のなかから適宜選択することができる。第１樹脂１８ａは、樹脂壁を構成する材料と異なる材料を用いてもよいが、同じ材料を用いることが好ましい。第１樹脂１８ａは、樹脂壁を形成する場合の粘度よりも小さいものを用いることが好ましい。例えば、第１樹脂１８ａの粘度は、移動のしやすさ、濡れ広がりやすさ等を考慮して、１００Ｐａ・ｓ以下が挙げられ、５０Ｐａ・ｓ以下が好ましく、４Ｐａ・ｓから２０Ｐａ・ｓの範囲がより好ましい。 The first resin 18a may be made of, for example, a translucent resin, but is preferably made of a light-shielding resin, and more preferably made of a light-reflective resin. Such a resin can be appropriately selected from the materials exemplified for the resin wall. Although the first resin 18a may be made of a material different from the material forming the resin wall, it is preferable to use the same material. It is preferable that the first resin 18a has a viscosity lower than that of the resin wall. For example, the viscosity of the first resin 18a may be 100 Pa·s or less, preferably 50 Pa·s or less, and in the range of 4 Pa·s to 20 Pa·s, in consideration of ease of movement, ease of wetting and spreading. is more preferred.

第１樹脂１８ａの塗布は、上述したように、当該分野で公知の方法のいずれを利用してもよい。例えば、空気圧等で液状の樹脂を連続的及び一定の吐出流量で吐出可能な吐出装置（樹脂吐出装置）を用いることができる（特開２００９－１８２３０７号公報参照）。吐出装置を用いる場合、吐出装置のニードルの移動速度を一定とすることが好ましい。
第１凹部１７１及び第２凹部１７２を形成するために、第１領域１６１に塗布する第１樹脂１８ａの塗布量は、例えば、第１壁１５１の高さ、第１距離Ｄ１、発光素子の一辺の長さ、配列する発光素子の数等から適宜設定することができ、例えば、（第１壁１５１の高さ）×（第１距離Ｄ１）×（発光素子の一辺の長さ×配列する発光素子の数）によって算出される容積の１．５倍から３倍の範囲の容量が挙げられる。 Application of the first resin 18a may utilize any method known in the art, as described above. For example, it is possible to use a discharge device (resin discharge device) capable of discharging liquid resin continuously and at a constant discharge flow rate by air pressure or the like (see Japanese Patent Application Laid-Open No. 2009-182307). When using an ejection device, it is preferable to keep the moving speed of the needle of the ejection device constant.
In order to form the first concave portion 171 and the second concave portion 172, the amount of the first resin 18a applied to the first region 161 is, for example, the height of the first wall 151, the first distance D1, and the length of one side of the light emitting element. It can be set as appropriate from the length, the number of light emitting elements to be arranged, etc. number of elements) in the range of 1.5 to 3 times the volume calculated.

（被覆部材１８の形成）
図２Ｄ、図２Ｅに示すように、第１凹部１７１及び第２凹部１７２に第２樹脂１８ｂを塗布する。第２樹脂１８ｂの塗布後、第１樹脂１８ａ及び第２樹脂１８ｂを硬化する。これによって、図１Ｇ及び１Ｈに示すように、透光性部材１４の側面を被覆する被覆部材１８を形成することができる。
ここで、上述したように、第１凹部１７１の容積は、第２凹部１７２の容積よりも小さく形成される。このため、第１凹部１７１内への第２樹脂の塗布量は、第２凹部１７２内への第２樹脂の塗布量よりも少ないことが好ましい。
第１樹脂１８ａ及び第２樹脂１８ｂの硬化は、同工程として行うことが好ましい。第１樹脂１８ａの硬化工程後に第２樹脂１８ｂを配置してもよいが、第１樹脂１８ａと第２樹脂１８ｂの塗布を連続して行い、第１樹脂１８ａ及び第２樹脂１８ｂを同時に硬化することが好ましい。
第２樹脂１８ｂは、第１樹脂１８ａと同じ材料を用いることが好ましい。第１樹脂１８ａ及び第２樹脂１８ｂに同じ材料を用いることで、同じ条件下で同時に硬化することができる。
第１樹脂１８ａと第２樹脂１８ｂとが略同時に硬化されることにより、第１樹脂１８ａと第２樹脂１８ｂとが一体化された被覆部材１８が形成される。これにより、第１樹脂１８ａと第２樹脂１８ｂとの境界に界面が形成されず、第１樹脂１８ａと第２樹脂１８ｂの密着性が向上し、剥離が抑制される。 (Formation of covering member 18)
As shown in FIGS. 2D and 2E, the first recess 171 and the second recess 172 are coated with the second resin 18b. After applying the second resin 18b, the first resin 18a and the second resin 18b are cured. Thereby, as shown in FIGS. 1G and 1H, a covering member 18 that covers the side surface of the translucent member 14 can be formed.
Here, as described above, the volume of the first recess 171 is formed smaller than the volume of the second recess 172 . Therefore, it is preferable that the amount of the second resin applied to the inside of the first concave portion 171 is smaller than the amount of the second resin applied to the inside of the second concave portion 172 .
It is preferable that the first resin 18a and the second resin 18b are cured in the same step. Although the second resin 18b may be placed after the curing process of the first resin 18a, the first resin 18a and the second resin 18b are continuously applied and the first resin 18a and the second resin 18b are cured at the same time. is preferred.
It is preferable to use the same material as the first resin 18a for the second resin 18b. By using the same material for the first resin 18a and the second resin 18b, they can be cured simultaneously under the same conditions.
By curing the first resin 18a and the second resin 18b substantially simultaneously, the covering member 18 in which the first resin 18a and the second resin 18b are integrated is formed. As a result, an interface is not formed at the boundary between the first resin 18a and the second resin 18b, the adhesion between the first resin 18a and the second resin 18b is improved, and peeling is suppressed.

第２樹脂１８ｂは、上述した第１樹脂１８ａと同様の方法で塗布することができる。第２樹脂１８ｂの第１凹部１７１及び第２凹部１７２の塗布は、任意の順序とすることができる。
ここで、第１領域への第１樹脂の塗布量をＡ、第１凹部内への第２樹脂の塗布量をＢ、第２凹部内への第２樹脂の塗布量をＣとすると、塗布量Ａ、Ｂ及びＣは、同じであってもよいし、いずれか１つが異なっていてもよいし、全部が異なっていてもよい。例えば、第１領域の面積と第２領域の面積とが略同じである場合には、塗布量Ａ≒塗布量Ｃ、かつ、塗布量Ａ（Ｃ）＞塗布量Ｂであることが好ましい。 The second resin 18b can be applied in the same manner as the first resin 18a described above. The application of the second resin 18b to the first concave portions 171 and the second concave portions 172 may be performed in any order.
Here, let A be the amount of the first resin applied to the first region, B be the amount of the second resin applied to the first recess, and C be the amount of the second resin applied to the second recess. The quantities A, B and C can be the same, any one can be different, or all can be different. For example, when the area of the first region and the area of the second region are substantially the same, it is preferable that the coating amount A≈the coating amount C and the coating amount A(C)>the coating amount B.

第１樹脂１８ａの塗布により形成される第１凹部１７１内及び第２凹部１７２内に第２樹脂１８ｂを塗布した後、第１樹脂１８ａと第２樹脂１８ｂとを硬化して、被覆部材１８を形成する。
被覆部材１８の表面は、第１凹部１７１内及び第２凹部１７２内のいずれにおいても略平坦であることが好ましい。被覆部材１８は、その表面の基板からの高さが、透光性部材１４の上面と略同じ高さであるか、それよりも低いことが好ましい。 After the second resin 18b is applied in the first concave portion 171 and the second concave portion 172 formed by applying the first resin 18a, the first resin 18a and the second resin 18b are cured to remove the coating member 18. Form.
The surface of the covering member 18 is preferably substantially flat both inside the first recess 171 and inside the second recess 172 . It is preferable that the height of the surface of the covering member 18 from the substrate be approximately the same height as the upper surface of the translucent member 14 or lower than that.

上述したように、本実施形態では、第２樹脂１８ｂの塗布前に、発光素子間及び透光性部材間に第１樹脂１８ａが配置され、第１凹部１７１及び第２凹部１７２が形成される。これにより、第２樹脂１８ｂの、第１領域１６１と第２領域１６２間における移動が制御される。つまり、第２樹脂１８ｂの、隣接する透光性部材１４間への移動が制御されるため、第２樹脂の透光性部材１４の上面への這い上がりを効果的に抑制することができる。また、隣接する発光素子間及び透光性部材間において、樹脂の移動によるボイド等の発生を抑制することができ、適所において、確実に樹脂を充填することが可能となる。 As described above, in the present embodiment, before applying the second resin 18b, the first resin 18a is arranged between the light emitting elements and between the translucent members, and the first concave portion 171 and the second concave portion 172 are formed. . Thereby, movement of the second resin 18b between the first region 161 and the second region 162 is controlled. In other words, since the movement of the second resin 18b between the adjacent translucent members 14 is controlled, it is possible to effectively suppress the second resin from creeping up to the top surface of the translucent member 14 . Moreover, it is possible to suppress the generation of voids or the like due to movement of the resin between the adjacent light emitting elements and between the translucent members, and it is possible to reliably fill the resin in an appropriate place.

つまり、上述したように、本実施形態では、第１樹脂の塗布により第１凹部及び第２凹部が形成され、第１凹部及び第２凹部に第２樹脂が塗布される。このため、第１凹部と第２凹部との間（つまり、発光素子１２間、発光素子と第３壁及び第４壁との間）における被覆部材１８の上面には第１樹脂１８ａ、第１凹部及び第２凹部の上面には第２樹脂１８ｂが配置されることとなる。これに対し、第１樹脂１８ａと第２樹脂１８ｂとを同時に硬化させることにより、第１樹脂１８ａと第２樹脂１８ｂとが一体化された被覆部材１８を得ることができる。一体化された被覆部材１８は、第１樹脂１８ａと第２樹脂１８ｂとの間に界面が形成されないので、クラックや樹脂割れ等が抑制され、信頼性の高い発光装置とすることができる。 That is, as described above, in the present embodiment, the first concave portion and the second concave portion are formed by applying the first resin, and the second resin is applied to the first concave portion and the second concave portion. Therefore, the first resin 18a and the first resin 18a are provided on the upper surface of the covering member 18 between the first recess and the second recess (that is, between the light emitting element 12 and between the light emitting element and the third and fourth walls). The second resin 18b is arranged on the upper surfaces of the recess and the second recess. On the other hand, by simultaneously curing the first resin 18a and the second resin 18b, the covering member 18 in which the first resin 18a and the second resin 18b are integrated can be obtained. Since the integrated coating member 18 does not form an interface between the first resin 18a and the second resin 18b, cracks, resin breaks, etc. are suppressed, and a highly reliable light emitting device can be obtained.

このように、被覆部材１８を形成することにより、図３に示すように、透光性部材１４の上面が被覆部材１８から露出した発光装置２０を、簡便かつ確実に製造することができる。 By forming the covering member 18 in this way, the light-emitting device 20 in which the upper surface of the translucent member 14 is exposed from the covering member 18 as shown in FIG. 3 can be manufactured easily and reliably.

１０ 第１中間体
１１ 基板
１１ａ 配線
１１ｂ 一辺
１１ｃ 他辺
１２ 発光素子
１３ 保護素子
１４ 透光性部材
１８ 被覆部材
１８ａ 第１樹脂
１８ｂ 第２樹脂
２０ 発光装置
１５１ 第１壁
１５２ 第２壁
１５３ 第３壁
１５４ 第４壁
１６１ 第１領域
１６２ 第２領域
１７１ 第１凹部
１７２ 第２凹部 10 First intermediate 11 Substrate 11a Wiring 11b One side 11c Other side 12 Light emitting element 13 Protection element 14 Translucent member 18 Covering member 18a First resin 18b Second resin 20 Light emitting device 151 First wall 152 Second wall 153 Third Wall 154 Fourth wall 161 First region 162 Second region 171 First recess 172 Second recess

Claims (13)

基板と、前記基板の上面に第１方向に配列された複数の発光素子と、前記第１方向に直交する第２方向において前記複数の発光素子と離隔しかつ対向して前記基板の上面に配置された保護素子と、前記複数の発光素子のそれぞれの上面に接合された透光性部材とを備えた第１中間体を準備する工程と、
前記第１方向に延伸する第１壁及び第２壁と、前記第１壁と前記第２壁との間に配置され、前記第２方向に延伸する第３壁及び第４壁とを含み、前記複数の発光素子及び前記保護素子を取り囲む樹脂壁を前記基板上に形成する工程と、
前記第１壁と前記発光素子との間であって、前記保護素子が配置された第１領域に、前記第１方向に沿って第１樹脂を塗布して、前記第１領域から、前記第２壁と前記発光素子との間の第２領域に渡って前記第１樹脂を移動させて、前記第１領域において前記第１樹脂又は前記樹脂壁で構成された内側面を有する第１凹部を形成し、前記第２領域において前記第１樹脂又は前記樹脂壁で構成された内側面を有する第２凹部を形成する工程と、
前記第１凹部内及び前記第２凹部内にそれぞれ第２樹脂を塗布する工程と、
前記第１樹脂及び前記第２樹脂を硬化することにより前記透光性部材の側面を被覆する被覆部材を形成する工程と、を含む発光装置の製造方法。 a substrate; a plurality of light emitting elements arranged in a first direction on the upper surface of the substrate; a step of preparing a first intermediate body comprising a protective element attached to the protective element and a translucent member bonded to the upper surface of each of the plurality of light emitting elements;
a first wall and a second wall extending in the first direction; and a third wall and a fourth wall disposed between the first wall and the second wall and extending in the second direction; forming a resin wall surrounding the plurality of light emitting elements and the protective element on the substrate;
A first resin is applied in the first direction between the first wall and the light emitting element and in the first region where the protective element is arranged, and the first resin is applied from the first region to the first region. moving the first resin over a second region between the two walls and the light emitting element to form a first recess having an inner surface made of the first resin or the resin wall in the first region; forming a second recess having an inner surface made of the first resin or the resin wall in the second region;
applying a second resin to each of the first recess and the second recess;
A method of manufacturing a light-emitting device, comprising: forming a covering member covering the side surface of the translucent member by curing the first resin and the second resin. 第２距離は、前記第３壁及び前記第４壁と前記発光素子との距離であり、
前記第２距離は、前記発光素子間の距離と同等又はそれよりも大きく、かつ前記発光素子間の距離の３倍よりも小さい請求項１に記載の発光装置の製造方法。 the second distance is the distance between the third wall and the fourth wall and the light emitting element;
2. The method of manufacturing a light emitting device according to claim 1, wherein the second distance is equal to or greater than the distance between the light emitting elements and less than three times the distance between the light emitting elements. 第１距離は、前記第１壁と前記発光素子との距離であり、
前記第２壁と前記発光素子との間の距離は前記第１距離と同じ距離である請求項１または２に記載の発光装置の製造方法。 the first distance is the distance between the first wall and the light emitting element;
3. The method of manufacturing a light emitting device according to claim 1, wherein the distance between said second wall and said light emitting element is the same as said first distance. 前記基板は、前記基板の上面に前記複数の発光素子及び前記保護素子が載置される配線を備え、
平面視において、前記第１壁と前記発光素子との間の前記配線の面積は、前記第２壁と前記発光素子との間の前記配線の面積よりも大きい請求項１～３のいずれか１項に記載の発光装置の製造方法。 the substrate includes wiring on which the plurality of light emitting elements and the protective element are mounted on the upper surface of the substrate;
4. The wiring according to any one of claims 1 to 3, wherein in plan view, the area of the wiring between the first wall and the light emitting element is larger than the area of the wiring between the second wall and the light emitting element. 10. A method for manufacturing the light emitting device according to claim 1. 前記第１凹部内への前記第２樹脂の塗布量が、前記第２凹部内への前記第２樹脂の塗布量よりも少ない請求項１～４のいずれか１項に記載の発光装置の製造方法。 The manufacturing of the light-emitting device according to any one of claims 1 to 4, wherein the amount of the second resin applied to the inside of the first recess is smaller than the amount of the second resin applied to the inside of the second recess. Method. 前記樹脂壁を、前記樹脂壁の上端が、前記発光素子の上面よりも高く、かつ、前記透光性部材の上面よりも低く位置するように形成する請求項１～５のいずれか１項に記載の発光装置の製造方法。 6. The resin wall according to any one of claims 1 to 5, wherein the resin wall is formed such that the upper end of the resin wall is positioned higher than the upper surface of the light emitting element and lower than the upper surface of the translucent member. A method of manufacturing the described light emitting device. 前記第１樹脂及び前記第２樹脂は光反射性物質を含む請求項１～６のいずれか１項に記載の発光装置の製造方法。 7. The method of manufacturing a light emitting device according to claim 1, wherein the first resin and the second resin contain a light reflecting material. 前記第１樹脂と前記第２樹脂は同じ材料を用いる請求項１～７のいずれか１項に記載の発光装置の製造方法。 8. The method of manufacturing a light emitting device according to claim 1, wherein the same material is used for the first resin and the second resin. 前記発光素子間の距離は、前記発光素子の第１方向に沿った一辺の０．１倍～０．５倍である請求項１～８のいずれか１項に記載の発光装置の製造方法。 The method of manufacturing a light emitting device according to any one of claims 1 to 8, wherein the distance between the light emitting elements is 0.1 to 0.5 times the length of one side of the light emitting elements along the first direction. 前記透光性部材は蛍光体を含有する請求項１～９のいずれか１項に記載の発光装置の製造方法。 10. The method of manufacturing a light-emitting device according to claim 1, wherein the translucent member contains a phosphor. 前記樹脂壁を形成する工程において、前記第１壁と前記発光素子との距離である第１距離が、前記第３壁及び前記第４壁と前記発光素子との距離である第２距離よりも大きい請求項１～１０のいずれか１項に記載の発光装置の製造方法。 In the step of forming the resin wall, a first distance between the first wall and the light emitting element is longer than a second distance between the third wall and the fourth wall and the light emitting element. A method for manufacturing a light-emitting device according to any one of claims 1 to 10. 前記発光素子と前記第３壁との間、前記発光素子と前記第４壁との間、前記発光素子間及び前記発光素子と前記基板との間から前記第１樹脂を移動させる請求項１～１１のいずれか１項に記載の発光装置の製造方法。 The first resin is moved from between the light emitting element and the third wall, between the light emitting element and the fourth wall, between the light emitting elements, and between the light emitting element and the substrate. 12. The method for manufacturing the light emitting device according to any one of 11. 前記第１樹脂を、前記保護素子の上から、前記保護素子を被覆するように塗布する請求項１～１２のいずれか１項に記載の発光装置の製造方法。
13. The method of manufacturing a light-emitting device according to claim 1, wherein the first resin is applied from above the protection element so as to cover the protection element.
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