JP7215636B1 - 炭化珪素質セラミックハニカム構造体及びその製造方法 - Google Patents
炭化珪素質セラミックハニカム構造体及びその製造方法 Download PDFInfo
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- JP7215636B1 JP7215636B1 JP2022185333A JP2022185333A JP7215636B1 JP 7215636 B1 JP7215636 B1 JP 7215636B1 JP 2022185333 A JP2022185333 A JP 2022185333A JP 2022185333 A JP2022185333 A JP 2022185333A JP 7215636 B1 JP7215636 B1 JP 7215636B1
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- silicon carbide
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- honeycomb structure
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- 239000000919 ceramic Substances 0.000 title claims abstract description 80
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 52
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 51
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000011148 porous material Substances 0.000 claims abstract description 192
- 239000002245 particle Substances 0.000 claims abstract description 155
- 238000005192 partition Methods 0.000 claims abstract description 71
- 230000001186 cumulative effect Effects 0.000 claims abstract description 39
- 239000011230 binding agent Substances 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims abstract description 26
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052753 mercury Inorganic materials 0.000 claims abstract description 24
- 230000002093 peripheral effect Effects 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 13
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 238000009826 distribution Methods 0.000 claims description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- 239000004927 clay Substances 0.000 claims description 7
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 6
- 238000010304 firing Methods 0.000 claims description 6
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 6
- 239000000347 magnesium hydroxide Substances 0.000 claims description 6
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 6
- 239000000395 magnesium oxide Substances 0.000 claims description 6
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 6
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 6
- 230000001590 oxidative effect Effects 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000002105 nanoparticle Substances 0.000 abstract description 17
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- 239000007789 gas Substances 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 10
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
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- 229920003088 hydroxypropyl methyl cellulose Polymers 0.000 description 3
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- UFVKGYZPFZQRLF-UHFFFAOYSA-N hydroxypropyl methyl cellulose Chemical compound OC1C(O)C(OC)OC(CO)C1OC1C(O)C(O)C(OC2C(C(O)C(OC3C(C(O)C(O)C(CO)O3)O)C(CO)O2)O)C(CO)O1 UFVKGYZPFZQRLF-UHFFFAOYSA-N 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
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- 239000002002 slurry Substances 0.000 description 2
- 229910000505 Al2TiO5 Inorganic materials 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 239000001761 ethyl methyl cellulose Substances 0.000 description 1
- 235000010944 ethyl methyl cellulose Nutrition 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
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- 239000000203 mixture Substances 0.000 description 1
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- 229910052863 mullite Inorganic materials 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- AABBHSMFGKYLKE-SNAWJCMRSA-N propan-2-yl (e)-but-2-enoate Chemical compound C\C=C\C(=O)OC(C)C AABBHSMFGKYLKE-SNAWJCMRSA-N 0.000 description 1
- SBEQWOXEGHQIMW-UHFFFAOYSA-N silicon Chemical compound [Si].[Si] SBEQWOXEGHQIMW-UHFFFAOYSA-N 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
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Abstract
Description
本発明の炭化珪素質セラミックハニカム構造体は、炭化珪素質多孔質体の隔壁により仕切られた軸方向に貫通する複数の流路を有し、前記隔壁の気孔率が35~50%、メジアン細孔径が8~18μmであり、前記軸方向に直交する前記隔壁の断面において、前記隔壁の厚さT方向の中心を通り前記隔壁の表面に平行な直線C、並びに前記直線Cから前記隔壁の厚さ方向に±T/5及び±2T/5離れた位置に引いた直線Cに平行な直線を引き、各直線が横切る気孔部分の長さ(気孔幅)及び気孔の数を所定の長さについて測定したとき、全ての気孔の気孔幅の平均値である平均気孔幅Wが10~25μm、及び測定した気孔の総数を測定した各直線の全長さで割った値である単位長さ当たりの気孔数Nが20~40個/mmである。
本発明の炭化珪素質セラミックハニカム構造体の製造方法について、その一実施形態を説明する。
骨材と結合材とを含むセラミックス粒子と、有機バインダーとを配合し、混合、混練して得られた坏土をハニカム形状に押出成形し、得られた成形体を乾燥後、焼成して製造する。ここで、前記骨材が炭化珪素粒子であり、前記セラミックス粒子は、メジアン粒子径D50が35~45μm、粒子径と累積粒子体積との関係を示す曲線において、全粒子体積の10%に相当する累積粒子体積での粒子径D10が5~20μm、全粒子体積の90%に相当する累積粒子体積での粒子径D90が50~65μm、粒度分布偏差SD[ただし、SD=log(D80)-log(D20)であり、D20は全粒子体積の20%に相当する累積粒子体積での粒子径、D80は全粒子体積の80%に相当する累積粒子体積での粒子径でありD20<D80である]が0.20~0.40である。
表1に示す粒径を有する炭化珪素粒子、炭化珪素以外の粒子を表1に示す添加量で有機バインダーとしてヒドロキシプロピルメチルセルロースとともに配合し混合した。混合した原料に水を添加して混練して可塑性の坏土を形成し、ハニカム構造体成形用の金型から、スクリュー成形機により押出成形して、一辺が34 mmの外形四角形状で長さ304 mmのハニカム構造成形体を成形した。この成形体を熱風乾燥機にて120℃で2時間乾燥後、1300℃の最高温度で酸化雰囲気で焼成して、隔壁厚さ8 mil(0.20 mm)及びセル密度300 cpsi(46.5セル/cm2)を有する実施例1~4及び参考例1の炭化珪素質セラミックハニカム構造体を得た。
炭化珪素粒子及び結合材の粒子の種類及び添加量を表1に示すように変更し、さらに成形体を熱風乾燥した後に550℃で3時間の脱脂工程を追加し、1450℃の最高温度でアルゴン雰囲気で2時間焼成した以外は実施例1と同様にして、比較例1及び7の炭化珪素質セラミックハニカム構造体を得た。
炭化珪素粒子及び結合材の粒子の種類及び添加量を表1に示すように変更して、実施例1と同様にハニカム構造成形体を成形し、比較例2及び4~6は1300℃の最高温度で、比較例3は1400℃の最高温度で酸化雰囲気で焼成した以外は実施例1と同様にして、比較例2~6の炭化珪素質セラミックハニカム構造体を得た。
平均気孔幅、及び単位長さ当たりの気孔数は、次のように測定する。
セラミックスハニカム構造体の軸方向に直交する断面における隔壁の断面を走査型電子顕微鏡(SEM)で倍率200倍で撮像する。撮像されたSEM写真を画像解析ソフト(Media Cybernetics 社製 Image-Pro Plus ver.7.0)で測定する。具体的には、撮像されたSEM写真を画像解析ソフトで図4に示す白黒2値化処理を行う。そして、図5に示すように、撮像された隔壁12の断面において、隔壁の厚さT方向の中心を通り隔壁の表面に平行な直線Cと、この直線Cから隔壁の厚さ方向に±T/5及び±2T/5離れた位置に直線Cに平行な直線を引く。各直線が横切る気孔部分の長さである気孔幅と、各直線が横切る気孔の数とを所定の長さについて測定したとき、測定した全ての気孔幅の合計長さを、測定した気孔の総数で割った値を平均気孔幅Wとし、測定した気孔の総数を、測定した各直線の全長さで割った値を単位長さ当たりの気孔数Nとした。
気孔率、及びメジアン細孔径は、水銀圧入法により測定した。セラミックハニカム構造体から切り出した試験片(10 mm×10 mm×10 mm)を、Micromeritics社製オートポアIIIの測定セル内に収納し、セル内を減圧した後、水銀を導入して加圧し、加圧時の圧力と試験片内に存在する細孔中に押し込まれた水銀の体積との関係を求めた。前記圧力を細孔径に換算し、細孔径の大きい側から小さい側に向かって積算した累積細孔容積(水銀の体積に相当)を細孔径に対してプロットし、細孔径と累積細孔容積との関係を示すグラフを得た。水銀を導入する圧力は0.5 psi(0.35×10-3 kg/mm2)とし、圧力から細孔径を算出する際の常数は、接触角=130°及び表面張力=484 dyne/cmの値を使用した。なお水銀の加圧力が1800 psi(1.26 kg/mm2、細孔径約0.1μmに相当)での累積細孔容積を全細孔容積とした。
熱膨張係数は、4.5 mm×4.5 mmの断面形状及び50 mmの長さの試験片を、長手方向が流路方向にほぼ一致するように切り出し、熱機械分析装置(TMA、リガク社製ThermoPlus、圧縮荷重方式/示差膨張方式)を用いて、一定荷重20 gをかけながら、昇温速度10℃/minで室温から800℃まで加熱した時の全長方向の長さの増加量を測定して、40~800℃間の平均熱膨張係数として求めた。結果を表2に示す。
PM捕集後の圧力損失は、圧力損失テストスタンドに固定したセラミックハニカムフィルタに、空気流量10 Nm3/minで、平均粒径0.11μmの燃焼煤を1.3 g/hの速度で投入し、フィルタ体積1リットルあたりの煤付着量が2 gとなった時の流入側と流出側との差圧(圧力損失)から以下の基準により評価した。すなわち、圧力損失が、
2.8 kPaを越える場合を(×)、
2.5 kPaを超え2.8 kPa以下の場合を(△)、
2.3 kPaを超え2.5 kPa以下の場合を(○)、及び
2.3 kPa以下の場合を(◎)
としてPM捕集後の圧力損失を評価した。
捕集後の粒子数基準でのPM捕集率は、圧力損失テストスタンドに固定したセラミックハニカムフィルタに、空気流量10 Nm3/minで、平均粒径0.11μmの燃焼煤を1.3 g/hの速度で投入しながら、1分毎にハニカムフィルタに流入する燃焼煤の粒子数とハニカムフィルタから流出する燃焼煤の粒子数とをSMPS(Scanning Mobility Particle Sizer)(TIS社製モデル3936)を用いて計測し、投入開始40分後から41分後までの1分間にハニカムフィルタに流入する燃焼煤の粒子数Nin、及びハニカムフィルタから流出する燃焼煤の粒子数Noutから、式:(Nin-Nout)/Nin によりPM捕集率を求めた。PM捕集率が、
98%以上の場合を(◎)、
96%以上98%未満の場合を(○)、
95%以上96%未満の場合を(△)、及び
95%未満の場合を(×)
としてPM捕集後のPM捕集率を評価した。
Claims (4)
- 炭化珪素質多孔質体の隔壁により仕切られた軸方向に貫通する複数の流路を有する炭化珪素質セラミックハニカム構造体であって、
前記炭化珪素質セラミックハニカム構造体は、複数のハニカムセグメントが接合材層によって接合一体化され、前記軸方向に直交する断面の外周形状が円形であり、外周に外周壁を有し、
前記ハニカムセグメントが骨材と結合材とを含むセラミックス粒子の焼結体からなり、
前記結合材が、アルミナ粒子、水酸化アルミニウム粒子、酸化マグネシウム粒子、水酸化マグネシウム粒子からなる群から選ばれた少なくとも1種であり、
前記隔壁の気孔率が40~50%、メジアン細孔径が8~18μmであり、
前記軸方向に直交する前記隔壁の断面において、
前記隔壁の厚さT方向の中心を通り前記隔壁の表面に平行な直線C、並びに前記直線Cから前記隔壁の厚さ方向に±T/5及び±2T/5離れた位置に引いた直線Cに平行な直線を引き、
各直線が横切る気孔部分の長さ(気孔幅)及び気孔の数を所定の長さについて測定したとき、
全ての気孔の気孔幅の平均値である平均気孔幅Wが10~25μm、及び
測定した気孔の総数を測定した各直線の全長さで割った値である単位長さ当たりの気孔数Nが20~40個/mmであり、
水銀圧入法によって測定された前記隔壁の細孔径と累積細孔容積との関係において、前記隔壁の細孔径が20μm以上の細孔容積が全細孔容積の10~20%であり、前記隔壁の細孔径9μm以下の細孔容積が全細孔容積の3~25%であることを特徴とする炭化珪素質セラミックハニカム構造体。 - 前記ハニカムセグメントの流路は、流入側端面に目封止部を有する流入側封止流路と、流出側端面に目封止部を有する流出側封止流路とが隣接して交互に形成されていることを特徴とする請求項1に記載の炭化珪素質セラミックハニカム構造体。
- 請求項1に記載の炭化珪素質セラミックハニカム構造体を製造する方法であって、
骨材と結合材とを含むセラミックス粒子と、有機バインダーとを配合し、混合、混練して得られた坏土をハニカム形状に押出成形し、得られた成形体を乾燥後、焼成した複数のハニカムセグメントを接合し、前記接合されたハニカムセグメントの外周を円形状に加工し、前記加工された外周に外皮材をコーティングして外周壁を形成し、
前記骨材が炭化珪素粒子であり、
前記結合材が、アルミナ粒子、水酸化アルミニウム粒子、酸化マグネシウム粒子、水酸化マグネシウム粒子からなる群から選ばれた少なくとも1種であり、
前記骨材と前記結合材とを含む前記セラミックス粒子は、
メジアン粒子径D50が37~45μmであり、
粒子径と累積粒子体積との関係を示す曲線において、
全粒子体積の10%に相当する累積粒子体積での粒子径D10が5~20μm、
全粒子体積の90%に相当する累積粒子体積での粒子径D90が52~65μm、
粒度分布偏差SD[ただし、SD=log(D80)-log(D20)であり、D20は全粒子体積の20%に相当する累積粒子体積での粒子径、D80は全粒子体積の80%に相当する累積粒子体積での粒子径でありD20<D80である]が0.20~0.40であることを特徴とする炭化珪素質セラミックハニカム構造体の製造方法。 - 前記焼成は、1200~1350℃の温度範囲で、酸化雰囲気で行うことを特徴とする請求項3に記載の炭化珪素質セラミックハニカム構造体の製造方法。
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WO2004106265A1 (ja) | 2003-05-29 | 2004-12-09 | Ngk Insulators, Ltd. | ハニカム構造体の製造方法及びハニカム構造体製造用炭化珪素粒子 |
WO2005009922A1 (ja) | 2003-07-25 | 2005-02-03 | Ngk Insulators, Ltd. | セラミックス多孔質体及びその透過性能評価方法 |
JP2007290951A (ja) | 2006-03-31 | 2007-11-08 | Ibiden Co Ltd | ハニカム構造体およびその製造方法 |
JP2009196104A (ja) | 2008-02-19 | 2009-09-03 | Tokyo Yogyo Co Ltd | ハニカム構造体 |
WO2016152236A1 (ja) | 2015-03-24 | 2016-09-29 | 日立金属株式会社 | セラミックハニカム構造体 |
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JP5066400B2 (ja) * | 2007-07-13 | 2012-11-07 | 日野自動車株式会社 | 排気浄化装置 |
EP2832713B1 (en) * | 2012-03-28 | 2019-02-27 | NGK Insulators, Ltd. | Porous material and honeycomb structure |
JP6788515B2 (ja) | 2017-02-02 | 2020-11-25 | 日本碍子株式会社 | 目封止ハニカム構造体 |
JP6802096B2 (ja) | 2017-03-14 | 2020-12-16 | 日本碍子株式会社 | 目封止ハニカム構造体 |
JP2019150737A (ja) | 2018-02-28 | 2019-09-12 | 日本碍子株式会社 | ハニカム構造体 |
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WO2004106265A1 (ja) | 2003-05-29 | 2004-12-09 | Ngk Insulators, Ltd. | ハニカム構造体の製造方法及びハニカム構造体製造用炭化珪素粒子 |
WO2005009922A1 (ja) | 2003-07-25 | 2005-02-03 | Ngk Insulators, Ltd. | セラミックス多孔質体及びその透過性能評価方法 |
JP2007290951A (ja) | 2006-03-31 | 2007-11-08 | Ibiden Co Ltd | ハニカム構造体およびその製造方法 |
JP2009196104A (ja) | 2008-02-19 | 2009-09-03 | Tokyo Yogyo Co Ltd | ハニカム構造体 |
WO2016152236A1 (ja) | 2015-03-24 | 2016-09-29 | 日立金属株式会社 | セラミックハニカム構造体 |
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JP7188652B1 (ja) | 2022-12-13 |
EP4230280A1 (en) | 2023-08-23 |
JP2023022129A (ja) | 2023-02-14 |
JPWO2022202910A1 (ja) | 2022-09-29 |
US20240034685A1 (en) | 2024-02-01 |
CN116685386B (zh) | 2024-04-26 |
KR20230091174A (ko) | 2023-06-22 |
KR102590833B1 (ko) | 2023-10-17 |
CN116685386A (zh) | 2023-09-01 |
US11993545B2 (en) | 2024-05-28 |
WO2022202910A1 (ja) | 2022-09-29 |
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