JP7205941B2 - ボンディング装置 - Google Patents
ボンディング装置 Download PDFInfo
- Publication number
- JP7205941B2 JP7205941B2 JP2021513654A JP2021513654A JP7205941B2 JP 7205941 B2 JP7205941 B2 JP 7205941B2 JP 2021513654 A JP2021513654 A JP 2021513654A JP 2021513654 A JP2021513654 A JP 2021513654A JP 7205941 B2 JP7205941 B2 JP 7205941B2
- Authority
- JP
- Japan
- Prior art keywords
- die
- electronic component
- bonding
- module
- semiconductor die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims description 111
- 230000032258 transport Effects 0.000 claims description 51
- 239000000758 substrate Substances 0.000 claims description 13
- 230000007246 mechanism Effects 0.000 description 78
- 230000007723 transport mechanism Effects 0.000 description 66
- 235000012431 wafers Nutrition 0.000 description 29
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 7
- 239000013067 intermediate product Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000010485 coping Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0419—Feeding with belts or tapes tape feeders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
- H05K13/0434—Feeding one by one by other means than belts with containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7565—Means for transporting the components to be connected
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
Claims (4)
- キャリアテープから電子部品を取り出し、取り出した前記電子部品を搬送する電子部品提供モジュールと、
半導体ダイを突き上げてダイシングシートに貼り付けられたウェハから前記半導体ダイをピックアップするピックアップ部を有し、ピックアップした前記半導体ダイを搬送するダイ提供モジュールと、
前記ダイ提供モジュールから提供される前記半導体ダイ及び前記電子部品提供モジュールから提供される前記電子部品を基板に配置可能であるボンディングモジュールと、を備え、
前記電子部品提供モジュールは、前記キャリアテープから取り出された前記電子部品を前記電子部品提供モジュールから搬出する第1搬送部を有し、
前記ダイ提供モジュールは、ピックアップされた前記半導体ダイを前記ダイ提供モジュールから搬出する第2搬送部を有し、
前記第1搬送部及び前記第2搬送部のいずれか一方は、前記電子部品及び前記半導体ダイの両方を前記ボンディングモジュールに搬送する共通搬送路であり、他方は、前記電子部品及び前記半導体ダイのいずれか一方を前記共通搬送路に搬出する独立搬送路である、ボンディング装置。 - 前記第1搬送部及び前記第2搬送部は、所定の搬送方向に向けて前記半導体ダイ及び前記電子部品を搬送する、請求項1に記載のボンディング装置。
- 前記搬送方向に沿って、前記電子部品提供モジュール、前記ダイ提供モジュール及び前記ボンディングモジュールの順に配置されている、請求項2に記載のボンディング装置。
- 前記ボンディングモジュールは、前記第1搬送部から前記電子部品を受け取り可能であって受け取った前記電子部品を前記基板に配置すると共に、前記第2搬送部から前記半導体ダイを受け取り可能であって受け取った前記半導体ダイを前記基板に配置する配置手段を有する、請求項1~3のいずれか一項に記載のボンディング装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019075412 | 2019-04-11 | ||
JP2019075412 | 2019-04-11 | ||
PCT/JP2020/015746 WO2020209269A1 (ja) | 2019-04-11 | 2020-04-07 | ボンディング装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2020209269A1 JPWO2020209269A1 (ja) | 2020-10-15 |
JPWO2020209269A5 JPWO2020209269A5 (ja) | 2022-06-09 |
JP7205941B2 true JP7205941B2 (ja) | 2023-01-17 |
Family
ID=72751115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021513654A Active JP7205941B2 (ja) | 2019-04-11 | 2020-04-07 | ボンディング装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US11749541B2 (ja) |
JP (1) | JP7205941B2 (ja) |
KR (1) | KR20210144881A (ja) |
CN (1) | CN113661564B (ja) |
SG (1) | SG11202111144YA (ja) |
TW (1) | TWI734434B (ja) |
WO (1) | WO2020209269A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI734434B (zh) * | 2019-04-11 | 2021-07-21 | 日商新川股份有限公司 | 接合裝置 |
WO2024023926A1 (ja) * | 2022-07-26 | 2024-02-01 | ヤマハ発動機株式会社 | 表面実装機及び表面実装方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011035178A (ja) | 2009-08-03 | 2011-02-17 | Hitachi High-Technologies Corp | 電子部品実装装置 |
JP2012019189A (ja) | 2010-06-11 | 2012-01-26 | Shibaura Mechatronics Corp | 電子部品の実装装置及び実装方法 |
WO2014049833A1 (ja) | 2012-09-28 | 2014-04-03 | 富士機械製造株式会社 | 対基板作業機 |
JP2016031975A (ja) | 2014-07-28 | 2016-03-07 | 富士機械製造株式会社 | 通信システム、実装機及び通信データ処理方法 |
WO2017119217A1 (ja) | 2016-01-06 | 2017-07-13 | 株式会社新川 | 電子部品実装装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3054480B2 (ja) * | 1991-12-20 | 2000-06-19 | 株式会社日立製作所 | ペレットボンディング装置 |
US5608638A (en) * | 1995-02-06 | 1997-03-04 | Advanced Micro Devices | Device and method for automation of a build sheet to manufacture a packaged integrated circuit |
CH693229A5 (de) * | 1997-04-30 | 2003-04-30 | Esec Tradingsa | Einrichtung und Verfahren zur Montage vonHalbleiterchips auf einem Substrat. |
KR100252317B1 (ko) * | 1997-10-30 | 2000-04-15 | 윤종용 | 리드 프레임의 다이 본딩장치 |
WO2005039268A1 (ja) * | 2003-10-15 | 2005-04-28 | Matsushita Electric Industrial Co., Ltd. | 部品装着装置 |
JP4397349B2 (ja) * | 2005-05-20 | 2010-01-13 | 株式会社新川 | チップボンディング装置 |
JP6055239B2 (ja) * | 2012-08-29 | 2016-12-27 | ファスフォードテクノロジ株式会社 | ダイボンディング装置並びにダイピックアップ装置及びダイピックアップ方法 |
WO2015075832A1 (ja) * | 2013-11-25 | 2015-05-28 | キヤノンマシナリー株式会社 | ボンディング装置およびボンディング方法 |
US10199254B2 (en) * | 2015-05-12 | 2019-02-05 | Nexperia B.V. | Method and system for transferring semiconductor devices from a wafer to a carrier structure |
JP6622306B2 (ja) | 2015-06-26 | 2019-12-18 | 株式会社Fuji | 部品実装機 |
JP6488940B2 (ja) * | 2015-08-07 | 2019-03-27 | 富士電機株式会社 | 半導体装置 |
TWI632626B (zh) * | 2016-01-06 | 2018-08-11 | 日商新川股份有限公司 | Electronic parts processing unit |
GB2549250B (en) * | 2016-02-15 | 2021-06-30 | Pragmatic Printing Ltd | Apparatus and method for manufacturing plurality of electronic circuits |
JP6705668B2 (ja) * | 2016-03-11 | 2020-06-03 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
KR20190022159A (ko) * | 2017-08-25 | 2019-03-06 | 세메스 주식회사 | 다이 본딩 장치 |
KR102047035B1 (ko) * | 2017-09-25 | 2019-11-20 | 세메스 주식회사 | 다이 본딩 장치 |
TWI734434B (zh) * | 2019-04-11 | 2021-07-21 | 日商新川股份有限公司 | 接合裝置 |
-
2020
- 2020-04-01 TW TW109111338A patent/TWI734434B/zh active
- 2020-04-07 US US17/602,279 patent/US11749541B2/en active Active
- 2020-04-07 JP JP2021513654A patent/JP7205941B2/ja active Active
- 2020-04-07 CN CN202080027169.XA patent/CN113661564B/zh active Active
- 2020-04-07 SG SG11202111144YA patent/SG11202111144YA/en unknown
- 2020-04-07 WO PCT/JP2020/015746 patent/WO2020209269A1/ja active Application Filing
- 2020-04-07 KR KR1020217035721A patent/KR20210144881A/ko not_active Application Discontinuation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011035178A (ja) | 2009-08-03 | 2011-02-17 | Hitachi High-Technologies Corp | 電子部品実装装置 |
JP2012019189A (ja) | 2010-06-11 | 2012-01-26 | Shibaura Mechatronics Corp | 電子部品の実装装置及び実装方法 |
WO2014049833A1 (ja) | 2012-09-28 | 2014-04-03 | 富士機械製造株式会社 | 対基板作業機 |
JP2016031975A (ja) | 2014-07-28 | 2016-03-07 | 富士機械製造株式会社 | 通信システム、実装機及び通信データ処理方法 |
WO2017119217A1 (ja) | 2016-01-06 | 2017-07-13 | 株式会社新川 | 電子部品実装装置 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2020209269A1 (ja) | 2020-10-15 |
SG11202111144YA (en) | 2021-11-29 |
US20220165591A1 (en) | 2022-05-26 |
WO2020209269A1 (ja) | 2020-10-15 |
CN113661564A (zh) | 2021-11-16 |
CN113661564B (zh) | 2024-03-01 |
US11749541B2 (en) | 2023-09-05 |
TWI734434B (zh) | 2021-07-21 |
TW202041138A (zh) | 2020-11-01 |
KR20210144881A (ko) | 2021-11-30 |
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