JP7151995B2 - 積層型キャパシタ及びその実装基板 - Google Patents
積層型キャパシタ及びその実装基板 Download PDFInfo
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- JP7151995B2 JP7151995B2 JP2018124630A JP2018124630A JP7151995B2 JP 7151995 B2 JP7151995 B2 JP 7151995B2 JP 2018124630 A JP2018124630 A JP 2018124630A JP 2018124630 A JP2018124630 A JP 2018124630A JP 7151995 B2 JP7151995 B2 JP 7151995B2
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- 239000003990 capacitor Substances 0.000 title claims description 76
- 239000000758 substrate Substances 0.000 title claims description 24
- 230000005534 acoustic noise Effects 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000002952 polymeric resin Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2045—Protection against vibrations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Description
110 キャパシタ本体
111 誘電体層
112、113 上部及び下部カバー領域
121、122 第1及び第2内部電極
131、132 第1及び第2外部電極
200 実装基板
210 基板
221、222 第1及び第2電極パッド
231、232 半田
Claims (7)
- 長さ方向の両端面を介して交互に露出する複数の第1及び第2内部電極を有する活性領域と、前記活性領域の上下側にそれぞれ配置される上部カバー領域及び下部カバー領域と、を有し、前記下部カバー領域の厚さが前記上部カバー領域の厚さより厚く形成されるキャパシタ本体と、
長さ方向において前記キャパシタ本体の両端面に形成される第1及び第2外部電極と、を含み、
前記キャパシタ本体の前記下部カバー領域にスペース部が前記長さ方向に形成され、
前記スペース部の長さをL1と、前記キャパシタ本体の長さをL0と定義するとき、0.5≦L1/L0<0.85を満足する、積層型キャパシタ。 - 前記キャパシタ本体において、前記スペース部と隣接する面が実装面である、請求項1に記載の積層型キャパシタ。
- 前記スペース部の長さをL1と、前記キャパシタ本体の長さをL0と定義するとき、0.5≦L1/L0≦0.70を満足する、請求項1または2に記載の積層型キャパシタ。
- 前記スペース部の厚さが15~30μmである、請求項1から3のいずれか一項に記載の積層型キャパシタ。
- 前記キャパシタ本体の実装面と前記スペース部との間の距離が30~200μmである、請求項1から4のいずれか一項に記載の積層型キャパシタ。
- 前記スペース部の長さが、前記第1及び第2内部電極がオーバーラップされた部分の長さより長く形成される、請求項1から5のいずれか一項に記載の積層型キャパシタ。
- 上部に第1及び第2電極パッドを有する基板と、
前記基板の前記第1及び第2電極パッドに前記第1及び第2外部電極がそれぞれ接続されるように実装される請求項1から6のいずれか一項に記載の積層型キャパシタと、を含む、積層型キャパシタの実装基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170178054A KR102426214B1 (ko) | 2017-12-22 | 2017-12-22 | 적층형 커패시터 및 그 실장 기판 |
KR10-2017-0178054 | 2017-12-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019114766A JP2019114766A (ja) | 2019-07-11 |
JP7151995B2 true JP7151995B2 (ja) | 2022-10-12 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018124630A Active JP7151995B2 (ja) | 2017-12-22 | 2018-06-29 | 積層型キャパシタ及びその実装基板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10553361B2 (ja) |
JP (1) | JP7151995B2 (ja) |
KR (1) | KR102426214B1 (ja) |
CN (1) | CN109961953B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102254876B1 (ko) * | 2019-06-03 | 2021-05-24 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 그 실장 기판 |
KR20190116132A (ko) | 2019-07-15 | 2019-10-14 | 삼성전기주식회사 | 적층형 커패시터 및 그 실장 기판 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001332439A (ja) | 2000-05-19 | 2001-11-30 | Rohm Co Ltd | 積層型セラミックコンデンサ |
JP2014096555A (ja) | 2012-11-09 | 2014-05-22 | Samsung Electro-Mechanics Co Ltd | 積層セラミックキャパシタ、積層セラミックキャパシタの回路基板実装構造及び積層セラミックキャパシタの包装体 |
JP2015207750A (ja) | 2014-04-21 | 2015-11-19 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | 積層セラミックキャパシタ及びその製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56121244U (ja) * | 1980-02-18 | 1981-09-16 | ||
JPH1126295A (ja) * | 1997-06-30 | 1999-01-29 | Taiyo Yuden Co Ltd | 積層チップ部品 |
JP2002280255A (ja) * | 2001-03-19 | 2002-09-27 | Murata Mfg Co Ltd | 積層セラミック電子部品及びその製造方法 |
JP3883528B2 (ja) * | 2003-08-19 | 2007-02-21 | Tdk株式会社 | 電子部品 |
KR101548773B1 (ko) | 2011-08-22 | 2015-08-31 | 삼성전기주식회사 | 적층 세라믹 커패시터의 회로 기판 실장 구조 |
CN102543428A (zh) * | 2012-01-18 | 2012-07-04 | 苏州达方电子有限公司 | 陶瓷电容 |
KR101309479B1 (ko) | 2012-05-30 | 2013-09-23 | 삼성전기주식회사 | 적층 칩 전자부품, 그 실장 기판 및 포장체 |
KR101548823B1 (ko) * | 2013-12-16 | 2015-08-31 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
JP2014212352A (ja) * | 2014-08-13 | 2014-11-13 | 株式会社村田製作所 | 積層セラミックコンデンサ、これを含む積層セラミックコンデンサ連、および、積層セラミックコンデンサの実装体 |
WO2016084876A1 (ja) * | 2014-11-28 | 2016-06-02 | 京セラ株式会社 | 積層セラミックコンデンサ |
KR102437801B1 (ko) | 2016-02-22 | 2022-08-30 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 그 제조 방법 |
US20180294102A1 (en) * | 2017-04-10 | 2018-10-11 | Presidio Components. Inc. | Multilayer Broadband Ceramic Capacitor with Internal Air Gap Capacitance |
KR102516764B1 (ko) * | 2017-12-08 | 2023-03-31 | 삼성전기주식회사 | 복합 전자 부품 |
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2017
- 2017-12-22 KR KR1020170178054A patent/KR102426214B1/ko active IP Right Grant
-
2018
- 2018-06-26 US US16/018,815 patent/US10553361B2/en active Active
- 2018-06-29 JP JP2018124630A patent/JP7151995B2/ja active Active
- 2018-10-23 CN CN201811235084.1A patent/CN109961953B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001332439A (ja) | 2000-05-19 | 2001-11-30 | Rohm Co Ltd | 積層型セラミックコンデンサ |
JP2014096555A (ja) | 2012-11-09 | 2014-05-22 | Samsung Electro-Mechanics Co Ltd | 積層セラミックキャパシタ、積層セラミックキャパシタの回路基板実装構造及び積層セラミックキャパシタの包装体 |
JP2015207750A (ja) | 2014-04-21 | 2015-11-19 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | 積層セラミックキャパシタ及びその製造方法 |
Also Published As
Publication number | Publication date |
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CN109961953B (zh) | 2022-04-15 |
KR102426214B1 (ko) | 2022-07-28 |
KR20190076334A (ko) | 2019-07-02 |
CN109961953A (zh) | 2019-07-02 |
US10553361B2 (en) | 2020-02-04 |
JP2019114766A (ja) | 2019-07-11 |
US20190198248A1 (en) | 2019-06-27 |
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