JP7124093B2 - 静電チャックおよび静電チャックの製造方法 - Google Patents
静電チャックおよび静電チャックの製造方法 Download PDFInfo
- Publication number
- JP7124093B2 JP7124093B2 JP2020539499A JP2020539499A JP7124093B2 JP 7124093 B2 JP7124093 B2 JP 7124093B2 JP 2020539499 A JP2020539499 A JP 2020539499A JP 2020539499 A JP2020539499 A JP 2020539499A JP 7124093 B2 JP7124093 B2 JP 7124093B2
- Authority
- JP
- Japan
- Prior art keywords
- aluminum oxide
- ceramic substrate
- electrostatic chuck
- zirconium
- atoms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
- C04B35/111—Fine ceramics
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/624—Sol-gel processing
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/64—Burning or sintering processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
- C04B2235/3206—Magnesium oxides or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
- C04B2235/3208—Calcium oxide or oxide-forming salts thereof, e.g. lime
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3244—Zirconium oxides, zirconates, hafnium oxides, hafnates, or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3418—Silicon oxide, silicic acids, or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5436—Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5445—Particle size related information expressed by the size of the particles or aggregates thereof submicron sized, i.e. from 0,1 to 1 micron
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5463—Particle size distributions
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
- C04B2235/602—Making the green bodies or pre-forms by moulding
- C04B2235/6025—Tape casting, e.g. with a doctor blade
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/658—Atmosphere during thermal treatment
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/72—Products characterised by the absence or the low content of specific components, e.g. alkali metal free alumina ceramics
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/74—Physical characteristics
- C04B2235/77—Density
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Structural Engineering (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Dispersion Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Compositions Of Oxide Ceramics (AREA)
Description
2:セラミック基体
3:静電吸着用電極
4:周壁
5:ガス流路
6:凸部
7:ガス導入孔
8:リード線
9:直流電源
10:酸化アルミニウム粒子
11:ジルコニウム原子存在領域
12:マグネシウム原子存在領域
21:上面側領域
22:下面側領域
Claims (3)
- 板状であって、一方の主面に試料保持面を有するセラミック基体と、該セラミック基体の内部または他方の主面に設けられた静電吸着用電極とを備えており、前記セラミック基体は、主成分が酸化アルミニウムである複数の粒子からなり、該複数の粒子は、マグネシウム原子およびジルコニウム原子が固溶する粒子を含む静電チャック。
- 前記セラミック基体は、マグネシウムの含有量C1(mol)に対するジルコニウムの含有量C2(mol)の比C2/C1が1以上である請求項1に記載の静電チャック。
- 前記セラミック基体は、アルミニウムの含有量C3(mol)に対する前記C2(mol)の比C2/C3が0.01以下である請求項2に記載の静電チャック。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018160153 | 2018-08-29 | ||
JP2018160153 | 2018-08-29 | ||
PCT/JP2019/033522 WO2020045432A1 (ja) | 2018-08-29 | 2019-08-27 | 静電チャックおよび静電チャックの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020045432A1 JPWO2020045432A1 (ja) | 2021-08-26 |
JP7124093B2 true JP7124093B2 (ja) | 2022-08-23 |
Family
ID=69644337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020539499A Active JP7124093B2 (ja) | 2018-08-29 | 2019-08-27 | 静電チャックおよび静電チャックの製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20210257243A1 (ja) |
JP (1) | JP7124093B2 (ja) |
KR (1) | KR102494447B1 (ja) |
CN (1) | CN112534565A (ja) |
WO (1) | WO2020045432A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102432509B1 (ko) * | 2018-02-20 | 2022-08-12 | 엔지케이 인슐레이터 엘티디 | 복합 소결체, 반도체 제조 장치 부재 및 복합 소결체의 제조 방법 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000313656A (ja) | 1999-04-28 | 2000-11-14 | Taiheiyo Cement Corp | 耐蝕性セラミックス材料および耐蝕性部材 |
JP2001146465A (ja) | 1999-11-16 | 2001-05-29 | Natl Research Inst For Metals Ministry Of Education Culture Sports Science & Technology | アルミナ系超塑性セラミックス |
JP3505709B2 (ja) | 2000-08-31 | 2004-03-15 | Necインフロンティア株式会社 | マルチカードリーダ |
JP2008098626A (ja) | 2006-09-13 | 2008-04-24 | Ngk Insulators Ltd | 静電チャック及びその製造方法 |
JP2014185053A (ja) | 2013-03-22 | 2014-10-02 | Ngk Insulators Ltd | セラミックス部材及び半導体製造装置用部材 |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0156377B1 (ko) * | 1988-11-03 | 1998-07-21 | 케나메탈 아이엔씨. | 지르코니아 및 실리콘 카바이드를 포함하는 알루미나 주성분 세라믹 절삭 인서트 |
JPH0214874A (ja) * | 1989-05-26 | 1990-01-18 | Kasei Optonix Co Ltd | アルミナ磁器の製造方法 |
JP4033508B2 (ja) * | 1996-11-14 | 2008-01-16 | 富士通株式会社 | 静電チャック |
JPH11176920A (ja) * | 1997-12-12 | 1999-07-02 | Shin Etsu Chem Co Ltd | 静電吸着装置 |
AU2001296005A1 (en) * | 2000-10-23 | 2002-05-15 | National Institute Of Advanced Industrial Science And Technology | Composite structure and method for manufacture thereof |
JP4421874B2 (ja) * | 2003-10-31 | 2010-02-24 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
JP4476701B2 (ja) * | 2004-06-02 | 2010-06-09 | 日本碍子株式会社 | 電極内蔵焼結体の製造方法 |
JP4467453B2 (ja) * | 2004-09-30 | 2010-05-26 | 日本碍子株式会社 | セラミックス部材及びその製造方法 |
JP4722463B2 (ja) * | 2004-12-03 | 2011-07-13 | 黒崎播磨株式会社 | 静電チャック用誘電体セラミックス及びその製造方法 |
JP4648030B2 (ja) * | 2005-02-15 | 2011-03-09 | 日本碍子株式会社 | イットリア焼結体、セラミックス部材、及び、イットリア焼結体の製造方法 |
JP4796354B2 (ja) * | 2005-08-19 | 2011-10-19 | 日本碍子株式会社 | 静電チャック及びイットリア焼結体の製造方法 |
US7701693B2 (en) * | 2006-09-13 | 2010-04-20 | Ngk Insulators, Ltd. | Electrostatic chuck with heater and manufacturing method thereof |
JP4961189B2 (ja) * | 2006-10-20 | 2012-06-27 | 株式会社ニッカトー | 多孔質アルミナ質焼結体からなる真空チャック用部材およびその製造方法 |
US7667944B2 (en) * | 2007-06-29 | 2010-02-23 | Praxair Technology, Inc. | Polyceramic e-chuck |
JP5189928B2 (ja) * | 2008-08-18 | 2013-04-24 | 日本碍子株式会社 | セラミックス部材の作成方法及び静電チャック |
JP2010177698A (ja) * | 2010-04-12 | 2010-08-12 | Fujitsu Semiconductor Ltd | 静電チャックの製造方法 |
CN102834913B (zh) * | 2010-07-26 | 2016-01-06 | 京瓷株式会社 | 静电吸盘 |
WO2013111363A1 (ja) * | 2012-01-26 | 2013-08-01 | 京セラ株式会社 | 静電チャック |
WO2014129625A1 (ja) * | 2013-02-25 | 2014-08-28 | 京セラ株式会社 | 試料保持具 |
KR102215364B1 (ko) * | 2013-12-02 | 2021-02-10 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 및 그 제조방법 |
KR102508957B1 (ko) * | 2015-03-24 | 2023-03-13 | 스미토모 오사카 세멘토 가부시키가이샤 | 정전 척 장치 |
CN108475657B (zh) * | 2016-01-12 | 2023-12-22 | 住友大阪水泥股份有限公司 | 静电卡盘装置及静电卡盘装置的制造方法 |
JP6237954B1 (ja) * | 2016-01-27 | 2017-11-29 | 住友大阪セメント株式会社 | セラミックス材料、静電チャック装置 |
JP6531693B2 (ja) * | 2016-03-30 | 2019-06-19 | 住友大阪セメント株式会社 | 静電チャック装置、静電チャック装置の製造方法 |
JP6781261B2 (ja) * | 2017-02-23 | 2020-11-04 | 住友大阪セメント株式会社 | 複合焼結体、静電チャック部材、および静電チャック装置 |
EP3591690B1 (en) * | 2017-02-28 | 2022-10-05 | NHK Spring Co., Ltd. | Substrate supporting unit and film forming device having substrate supporting unit |
KR102391368B1 (ko) * | 2017-06-29 | 2022-04-27 | 스미토모 오사카 세멘토 가부시키가이샤 | 복합 소결체, 정전 척 부재 및 정전 척 장치 |
JP6798640B2 (ja) * | 2018-03-23 | 2020-12-09 | 住友大阪セメント株式会社 | 静電チャック装置および静電チャック装置の製造方法 |
KR101965895B1 (ko) * | 2018-11-08 | 2019-04-04 | 주식회사 케이에스엠컴포넌트 | 정전 척 및 그 제조 방법 |
WO2020235651A1 (ja) * | 2019-05-22 | 2020-11-26 | 住友大阪セメント株式会社 | 複合焼結体、静電チャック部材、静電チャック装置および複合焼結体の製造方法 |
CN112510320A (zh) * | 2020-11-18 | 2021-03-16 | 东莞市魔方新能源科技有限公司 | 一种锂离子电池用隔膜的制备方法、隔膜及锂离子电池 |
CN113816729B (zh) * | 2021-08-17 | 2023-07-04 | 山东大学 | 一种静电纺丝纳米纤维增韧氧化铝陶瓷及其制备方法 |
-
2019
- 2019-08-27 JP JP2020539499A patent/JP7124093B2/ja active Active
- 2019-08-27 US US17/265,237 patent/US20210257243A1/en active Pending
- 2019-08-27 WO PCT/JP2019/033522 patent/WO2020045432A1/ja active Application Filing
- 2019-08-27 CN CN201980052004.5A patent/CN112534565A/zh active Pending
- 2019-08-27 KR KR1020207036223A patent/KR102494447B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000313656A (ja) | 1999-04-28 | 2000-11-14 | Taiheiyo Cement Corp | 耐蝕性セラミックス材料および耐蝕性部材 |
JP2001146465A (ja) | 1999-11-16 | 2001-05-29 | Natl Research Inst For Metals Ministry Of Education Culture Sports Science & Technology | アルミナ系超塑性セラミックス |
JP3505709B2 (ja) | 2000-08-31 | 2004-03-15 | Necインフロンティア株式会社 | マルチカードリーダ |
JP2008098626A (ja) | 2006-09-13 | 2008-04-24 | Ngk Insulators Ltd | 静電チャック及びその製造方法 |
JP2014185053A (ja) | 2013-03-22 | 2014-10-02 | Ngk Insulators Ltd | セラミックス部材及び半導体製造装置用部材 |
Also Published As
Publication number | Publication date |
---|---|
CN112534565A (zh) | 2021-03-19 |
KR20210011408A (ko) | 2021-02-01 |
KR102494447B1 (ko) | 2023-02-06 |
JPWO2020045432A1 (ja) | 2021-08-26 |
US20210257243A1 (en) | 2021-08-19 |
WO2020045432A1 (ja) | 2020-03-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI511831B (zh) | Electrostatic sucker | |
JP5409917B2 (ja) | 静電チャック | |
US9136031B2 (en) | Alumina sintered body, member including the same, and semiconductor manufacturing apparatus | |
JP6307344B2 (ja) | 酸化物焼結体及びスパッタリングターゲット | |
JPWO2013065666A1 (ja) | ガスノズル、これを用いたプラズマ装置およびガスノズルの製造方法 | |
WO2007026739A1 (ja) | 耐食性部材、これを用いた処理装置および試料処理方法ならびに耐食性部材の製造方法 | |
JP7124093B2 (ja) | 静電チャックおよび静電チャックの製造方法 | |
CN113874336A (zh) | 复合烧结体、静电卡盘部件、静电卡盘装置及复合烧结体的制造方法 | |
US11434172B2 (en) | Sintered body | |
JP6449916B2 (ja) | 試料保持具 | |
JP2018065707A (ja) | 導電性マイエナイト化合物の製造方法および導電性マイエナイト化合物の焼結体 | |
CN106660884A (zh) | 耐蚀性部件、静电卡盘用部件及耐蚀性部件的制造方法 | |
CN109133878B (zh) | 复合陶瓷及其制备方法 | |
US11934096B2 (en) | Frame member for electron beam lithography device and electron beam lithography device | |
JP7339979B2 (ja) | 窒化ケイ素焼結体の製造方法 | |
JP7432040B2 (ja) | 窒化ケイ素焼結体 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210201 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220105 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220302 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220726 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220810 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7124093 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |