JP7119269B2 - 半導体発光装置及び製造方法 - Google Patents
半導体発光装置及び製造方法 Download PDFInfo
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- JP7119269B2 JP7119269B2 JP2018564362A JP2018564362A JP7119269B2 JP 7119269 B2 JP7119269 B2 JP 7119269B2 JP 2018564362 A JP2018564362 A JP 2018564362A JP 2018564362 A JP2018564362 A JP 2018564362A JP 7119269 B2 JP7119269 B2 JP 7119269B2
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- 239000004065 semiconductor Substances 0.000 title claims description 255
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 238000005253 cladding Methods 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 9
- 229910021591 Copper(I) chloride Inorganic materials 0.000 claims description 6
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 claims description 6
- 229910004613 CdTe Inorganic materials 0.000 claims description 5
- 229910004611 CdZnTe Inorganic materials 0.000 claims description 5
- 229910021589 Copper(I) bromide Inorganic materials 0.000 claims description 5
- 229910021595 Copper(I) iodide Inorganic materials 0.000 claims description 5
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 5
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 claims description 5
- 229910000661 Mercury cadmium telluride Inorganic materials 0.000 claims description 5
- 229910021612 Silver iodide Inorganic materials 0.000 claims description 5
- 229910007709 ZnTe Inorganic materials 0.000 claims description 5
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 claims description 5
- 229910002704 AlGaN Inorganic materials 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 239000013078 crystal Substances 0.000 description 7
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
- H01L33/002—Devices characterised by their operation having heterojunctions or graded gap
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
- H01L33/0008—Devices characterised by their operation having p-n or hi-lo junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/14—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/28—Materials of the light emitting region containing only elements of Group II and Group VI of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/42—Transparent materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- Engineering & Computer Science (AREA)
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- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
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Description
Claims (18)
- 基板と、
前記基板上にIII-V族半導体またはII-VI族半導体から形成された第1半導体層と、
前記第1半導体層上に形成された第1クラッド層と、
前記第1クラッド層上にIII-V族半導体またはII-VI族半導体から形成された活性層と、
前記活性層上に形成された第2クラッド層と、
前記第2クラッド層上にI-VII族半導体から形成された第2半導体層と、
前記第2半導体層上に形成された透明電極層と、
を含むことを特徴とする半導体発光装置。 - 前記第1半導体層はn-型半導体であり、前記第2半導体層はp-型半導体から構成されることを特徴とする請求項1に記載の半導体発光装置。
- 前記第1クラッド層はIII-V族半導体またはII-VI族半導体を含むことを特徴とする請求項1に記載の半導体発光装置。
- 前記第2クラッド層はI-VII族半導体を含むことを特徴とする請求項1に記載の半導体発光装置。
- 前記活性層と前記第2クラッド層との間に第3クラッド層をさらに含み、
前記第3クラッド層はIII-V族半導体またはII-VI族半導体から形成されることを特徴とする請求項1に記載の半導体発光装置。 - 前記I-VII族半導体はCuCl、CuBr、CuI、AgIのうちいずれか一つ、または2つ以上の組合からなることを特徴とする請求項1に記載の半導体発光装置。
- 前記第1半導体層および前記活性層の前記III-V族半導体は、GaN、GaP、GaAs、InP、AlGaN、AlGaP、AlInGaN、InGaAs、GaAsPのうちいずれか一つ、または2つ以上の組合からなることを特徴とする請求項1に記載の半導体発光装置。
- 前記第1半導体層および前記活性層の前記II-VI族半導体はCdO、CdS、CdSe、CdTe、ZnO、ZnS、ZnSe、ZnTe、CdZnTe、HgCdTe、HgZnTeのうちいずれか一つ、または2つ以上の組合からなることを特徴とする請求項1に記載の半導体発光装置。
- 半導体素子と、
蛍光体が含まれた光変換層を含み、
前記半導体素子は、
基板と、
前記基板上にIII-V族半導体またはII-VI族半導体から形成されたn-型半導体層と、
前記n-型半導体層上にIII-V族半導体またはII-VI族半導体から形成された第1クラッド層と、
前記第1クラッド層上にIII-V族半導体またはII-VI族半導体から形成された活性層と、
前記活性層上にI-VII族半導体から形成された第2クラッド層と、
前記第2クラッド層上にI-VII族半導体から構成されたp-型半導体層と、を含むことを特徴とする発光ダイオ-ド。 - 前記活性層と前記第2クラッド層との間に第3クラッド層をさらに含み、前記第3クラッド層はIII-V族半導体またはII-VI族半導体から形成されることを特徴とする請求項9に記載の発光ダイオ-ド。
- 前記第2クラッド層および前記p-型半導体層の前記I-VII族半導体はCuCl、CuBr、CuI、AgIのうちいずれか一つ、または2つ以上の組合からなることを特徴とする請求項9に記載の発光ダイオ-ド。
- 前記n-型半導体層、前記第1クラッド層、および前記活性層の前記III-V族半導体はGaN、GaP、GaAs、InP、AlGaN、AlGaP、AlInGaN、InGaAs、GaAsPのうちいずれか、一つまたは2つ以上の組合からなることを特徴とする請求項9に記載の発光ダイオ-ド。
- 前記n-型半導体層、前記第1クラッド層、及び前記活性層の前記II-VI族半導体は、CdO、CdS、CdSe、CdTe、ZnO、ZnS、ZnSe、ZnTe、CdZnTe、HgCdTe、HgZnTeのうちいずれか一つ、または2つ以上の組合からなることを特徴とする請求項9に記載の発光ダイオ-ド。
- 基板を準備する段階と、
前記基板にIII-V族半導体またはII-VI族半導体物質を含むn-型半導体を形成する段階と、
前記n-型半導体上にIII-V族半導体またはII-VI族半導体物質を含む第1クラッド層を形成する段階と、
前記第1クラッド層上にIII-V族半導体またはII-VI族半導体物質を含む活性層を形成する段階と、
前記活性層上にI-VII族半導体を含む第2クラッド層を形成する段階と、
第2クラッド層上にI-VII族半導体を含むp-型半導体を形成する段階と、を含むことを特徴とする半導体発光装置の製造方法。 - 前記活性層を形成する段階と前記第2クラッド層を形成する段階との間に第3クラッド層を形成する段階をさらに含み、前記第3クラッド層はIII-V族半導体またはII-VI族半導体物質を含むことを特徴とする請求項14に記載の半導体発光装置の製造方法。
- 前記第2クラッド層および前記p-型半導体の前記I-VII族半導体はCuCl、CuBr、CuI、AgIのうちいずれか一つ、または2つ以上の組合からなることを特徴とする請求項14に記載の半導体発光装置の製造方法。
- 前記第1クラッド層および前記活性層の前記III-V族半導体はGaN、GaP、GaAs、InP、AlGaN、AlGaP、AlInGaN、InGaAs、GaAsPのうちいずれか一つ、または2つ以上の組合からなることを特徴とする請求項14に記載の半導体発光装置の製造方法。
- 前記n-型半導体、前記第1クラッド層、および前記活性層の前記II-VI族半導体物質は、CdO、CdS、CdSe、CdTe、ZnO、ZnS、ZnSe、ZnTe、CdZnTe、HgCdTe、HgZnTeのうちいずれか一つ、または2つ以上の組合からなることを特徴とする請求項14に記載の半導体発光装置の製造方法。
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KR1020160073017A KR101831726B1 (ko) | 2016-06-13 | 2016-06-13 | 반도체 발광장치 및 제조방법 |
KR10-2016-0073017 | 2016-06-13 | ||
PCT/KR2017/006052 WO2017217706A1 (ko) | 2016-06-13 | 2017-06-12 | 반도체 발광장치 및 제조방법 |
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JP2019517741A JP2019517741A (ja) | 2019-06-24 |
JP7119269B2 true JP7119269B2 (ja) | 2022-08-17 |
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US (2) | US11145785B2 (ja) |
EP (1) | EP3471155B1 (ja) |
JP (1) | JP7119269B2 (ja) |
KR (1) | KR101831726B1 (ja) |
WO (1) | WO2017217706A1 (ja) |
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KR101948072B1 (ko) | 2018-01-29 | 2019-02-14 | 주식회사 페타룩스 | 전자소자 제조방법 |
KR102206768B1 (ko) * | 2019-04-23 | 2021-01-25 | 주식회사 페타룩스 | 반도체 발광 디바이스 |
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JP2007012688A (ja) | 2005-06-28 | 2007-01-18 | Toshiba Corp | 半導体発光素子 |
JP2010092934A (ja) | 2008-10-03 | 2010-04-22 | Showa Denko Kk | 半導体発光素子の製造方法 |
JP2010177586A (ja) | 2009-01-30 | 2010-08-12 | Fujifilm Corp | 発光素子及びその製造方法 |
US20100283066A1 (en) | 2007-12-06 | 2010-11-11 | Panasonic Corporation | Light emitting device and display device using the same |
JP2011049453A (ja) | 2009-08-28 | 2011-03-10 | Sharp Corp | 窒化物半導体発光素子 |
JP2013511147A (ja) | 2009-11-18 | 2013-03-28 | ユニバーシティ オブ ソウル インダストリー コーポレーション ファウンデーション | 銅混合i−vii化合物半導体発光デバイス |
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JP3420028B2 (ja) * | 1997-07-29 | 2003-06-23 | 株式会社東芝 | GaN系化合物半導体素子の製造方法 |
JPH1187778A (ja) * | 1997-09-02 | 1999-03-30 | Toshiba Corp | 半導体発光素子、半導体発光装置およびその製造方法 |
EP0908988A3 (en) * | 1997-10-06 | 2001-10-17 | Sharp Kabushiki Kaisha | Light-emitting device and fabricating method thereof |
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JP2005005518A (ja) * | 2003-06-12 | 2005-01-06 | Sharp Corp | 半導体発光素子 |
JP2005117020A (ja) * | 2003-09-16 | 2005-04-28 | Stanley Electric Co Ltd | 窒化ガリウム系化合物半導体素子とその製造方法 |
EP1759425A2 (en) * | 2004-06-25 | 2007-03-07 | Dublin City University | An electroluminescent device for the production of ultra-violet light |
JP2009200251A (ja) * | 2008-02-21 | 2009-09-03 | Panasonic Corp | 発光素子およびそれを用いた表示装置 |
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TW201508223A (zh) * | 2013-08-20 | 2015-03-01 | Lextar Electronics Corp | 發光裝置 |
KR20150103562A (ko) * | 2014-03-03 | 2015-09-11 | 삼성전자주식회사 | 형광막을 갖는 발광 소자 패키지 및 그 제조 방법 |
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- 2016-06-13 KR KR1020160073017A patent/KR101831726B1/ko active IP Right Grant
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- 2017-06-12 WO PCT/KR2017/006052 patent/WO2017217706A1/ko unknown
- 2017-06-12 US US16/309,321 patent/US11145785B2/en active Active
- 2017-06-12 EP EP17813530.7A patent/EP3471155B1/en active Active
- 2017-06-12 JP JP2018564362A patent/JP7119269B2/ja active Active
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- 2021-09-15 US US17/476,109 patent/US20220005970A1/en not_active Abandoned
Patent Citations (6)
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JP2007012688A (ja) | 2005-06-28 | 2007-01-18 | Toshiba Corp | 半導体発光素子 |
US20100283066A1 (en) | 2007-12-06 | 2010-11-11 | Panasonic Corporation | Light emitting device and display device using the same |
JP2010092934A (ja) | 2008-10-03 | 2010-04-22 | Showa Denko Kk | 半導体発光素子の製造方法 |
JP2010177586A (ja) | 2009-01-30 | 2010-08-12 | Fujifilm Corp | 発光素子及びその製造方法 |
JP2011049453A (ja) | 2009-08-28 | 2011-03-10 | Sharp Corp | 窒化物半導体発光素子 |
JP2013511147A (ja) | 2009-11-18 | 2013-03-28 | ユニバーシティ オブ ソウル インダストリー コーポレーション ファウンデーション | 銅混合i−vii化合物半導体発光デバイス |
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Publication number | Publication date |
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JP2019517741A (ja) | 2019-06-24 |
WO2017217706A1 (ko) | 2017-12-21 |
KR101831726B1 (ko) | 2018-02-23 |
US20190189832A1 (en) | 2019-06-20 |
EP3471155A4 (en) | 2020-03-04 |
KR20170140563A (ko) | 2017-12-21 |
US20220005970A1 (en) | 2022-01-06 |
EP3471155A1 (en) | 2019-04-17 |
EP3471155B1 (en) | 2022-06-01 |
US11145785B2 (en) | 2021-10-12 |
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