JP7111823B2 - イオン性化合物を含む粘着剤組成物 - Google Patents
イオン性化合物を含む粘着剤組成物 Download PDFInfo
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C211/00—Compounds containing amino groups bound to a carbon skeleton
- C07C211/62—Quaternary ammonium compounds
- C07C211/63—Quaternary ammonium compounds having quaternised nitrogen atoms bound to acyclic carbon atoms
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- C—CHEMISTRY; METALLURGY
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- C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
- C07D233/64—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with substituted hydrocarbon radicals attached to ring carbon atoms, e.g. histidine
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
- C08K5/19—Quaternary ammonium compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3445—Five-membered rings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/43—Compounds containing sulfur bound to nitrogen
- C08K5/435—Sulfonamides
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Description
Claims (16)
- 以下の構造:
式(I)または式(II)の第2カチオン性化合物と、を含む組成物であって、式(I)は以下の構造
第1カチオン性化合物および第2カチオン性化合物のそれぞれが、以下の構造:
- 第1基材、第2基材、および第1基材と第2基材の間に配置された請求項1~3のいずれか一項に記載の組成物を含み、第1基材と第2基材とが前記複合材によって貼り合わされる装置。
- 前記第1基材が第1導電性表面を含み、前記第2基材が第2導電性表面を含み、前記組成物が導電性表面と接触して配置される、請求項4に記載の装置。
- 前記導電性表面が、電気伝導性金属、混合金属、合金、金属酸化物、混合金属酸化物、プラスチック、炭素質材料、複合金属、または伝導性ポリマーを含む、請求項4又は5に記載の装置。
- 前記導電性表面のうちの少なくとも1つがアルミニウムを含む、請求項4~6のいずれか一項に記載の装置。
- DC電源をさらに含み、前記第1導電性表面および前記第2導電性表面のうちの少なくとも1つが前記DC電源と電気的に連通していて閉鎖可能な電気回路を作り出し、
DC電源が3ボルト~100ボルトである、請求項4~7のいずれか一項に記載の装置。 - 前記導電性表面のうちの少なくとも1つへの電位の印加が前記組成物の粘着性を低減する、請求項4~8のいずれか一項に記載の装置。
- 前記第1導電性表面が第1導電層の表面であり、前記第2導電性表面が第2導電層の表面であり、前記第1導電層および前記第2導電層が厚さ20nm~200μmである、請求項4~9のいずれか一項に記載の装置。
- 前記導電性表面が基材上に配されており、
前記基材が、木材、厚紙、ガラス繊維または非電気伝導性プラスチックを含む、請求項4~10のいずれか一項に記載の装置。 - 前記組成物が前記第1導電性表面または前記第2導電性表面に対して低減した腐食効果を有し、
前記低減した腐食効果が、高湿および高温の条件下で15分~300時間の期間にわたって観察されうる、請求項4~11のいずれか一項に記載の装置。 - 請求項1~3のいずれか一項の組成物で第1基材を第2基材に貼着することを含む方法。
- 前記第1基材と前記第2基材の間に電位を印加することおよび前記第1基材を前記第2基材から分離することをさらに含む、請求項13に記載の方法。
- 第1イオン性化合物と第2イオン性化合物との混合物を含む粘着剤組成物であって、
第1イオン性化合物が以下の構造:
第2イオン性化合物が、以下の構造:
第1イオン性化合物および第2イオン性化合物のそれぞれが、以下の構造:
前記第1イオン性化合物は、前記第2イオン性化合物がある金属性材料に対して呈する対応する第2腐食度よりも大きい第1腐食度を、前記金属性材料に対して呈し、
前記第1イオン性化合物と前記第2イオン性化合物との混合物は、前記金属性材料に対して、第1腐食度よりも低い対応する第3腐食度を呈し、
前記金属性材料に適用した場合、前記第1イオン性化合物と前記第2イオン性化合物との混合物を含む前記組成物は、電位を印加すると、前記金属性材料から選択的に剥離されうる、粘着剤組成物。 - 電位を印加した時の前記金属性材料からの、前記第1イオン性化合物と前記第2イオン性化合物との混合物を含む前記組成物の剥離が、前記第2イオン性化合物のみを含む対応する第3組成物よりも高い前記金属性材料からの剥離性を呈する前記第1イオン性化合物を含む対応する第2組成物の剥離と実質的に同じように達成される、請求項15の粘着剤組成物。
Applications Claiming Priority (3)
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US201762589460P | 2017-11-21 | 2017-11-21 | |
US62/589,460 | 2017-11-21 | ||
PCT/US2018/061996 WO2019104028A1 (en) | 2017-11-21 | 2018-11-20 | Adhesive compositions comprising ionic compounds |
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JP2021504449A JP2021504449A (ja) | 2021-02-15 |
JP7111823B2 true JP7111823B2 (ja) | 2022-08-02 |
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JP2020545071A Active JP7111823B2 (ja) | 2017-11-21 | 2018-11-20 | イオン性化合物を含む粘着剤組成物 |
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US (1) | US20200308458A1 (ja) |
EP (1) | EP3713998A1 (ja) |
JP (1) | JP7111823B2 (ja) |
KR (1) | KR20200089304A (ja) |
CN (1) | CN111630096B (ja) |
TW (1) | TW201936564A (ja) |
WO (1) | WO2019104028A1 (ja) |
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WO2020086454A1 (en) * | 2018-10-23 | 2020-04-30 | Nitto Denko Corporation | Corrosion resistant electrochemically de-bondable adhesive composition for use in high and low humidity environments |
Citations (1)
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WO2017064918A1 (ja) | 2015-10-16 | 2017-04-20 | 日東電工株式会社 | 電気剥離用粘着剤組成物、粘着シート、及び接合体 |
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US4099007A (en) * | 1969-04-02 | 1978-07-04 | Hoechst Aktiengesellschaft | N,n-substituted 2,4,5-triketoimidazolidines and a process for their preparation |
JP2854639B2 (ja) * | 1989-12-07 | 1999-02-03 | 東芝ケミカル株式会社 | フレキシブル印刷回路基板用接着剤組成物 |
EP1626041B1 (fr) | 1998-02-03 | 2016-07-13 | ACEP Inc. | Nouveaux matériaux utiles en tant que solutés électrolytiques |
JP2011016990A (ja) * | 2009-06-09 | 2011-01-27 | Nippon Synthetic Chem Ind Co Ltd:The | 粘着剤組成物および粘着剤、ならびに光学部材用粘着剤、それを用いて得られる粘着剤層付き光学部材 |
EP2752861A4 (en) * | 2011-08-30 | 2015-04-01 | Oceans King Lighting Science | IONIC LIQUID WITH DOUBLE CENTER QUATERNARY AMMONIUM SALT, PROCESS FOR PREPARING THE SAME, AND USE THEREOF |
JP2013237721A (ja) * | 2012-05-11 | 2013-11-28 | Nitto Denko Corp | 再剥離用水分散型アクリル系粘着剤組成物、及び粘着シート |
EP3187487B1 (en) * | 2014-08-29 | 2020-04-22 | National Institute of Advanced Industrial Science and Technology | Ionic liquid and plastic crystal |
JP6768281B2 (ja) | 2015-10-16 | 2020-10-14 | 日東電工株式会社 | 粘着シート接合体分離方法 |
WO2017064925A1 (ja) | 2015-10-16 | 2017-04-20 | 日東電工株式会社 | 両面粘着シート、両面粘着シート接合体、および、被着体の接合・分離方法 |
JP6767104B2 (ja) | 2015-11-24 | 2020-10-14 | 日東電工株式会社 | 被着体の接合・分離方法 |
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2018
- 2018-11-20 EP EP18815473.6A patent/EP3713998A1/en not_active Withdrawn
- 2018-11-20 CN CN201880086862.7A patent/CN111630096B/zh active Active
- 2018-11-20 TW TW107141337A patent/TW201936564A/zh unknown
- 2018-11-20 KR KR1020207017692A patent/KR20200089304A/ko active IP Right Grant
- 2018-11-20 US US16/765,713 patent/US20200308458A1/en not_active Abandoned
- 2018-11-20 WO PCT/US2018/061996 patent/WO2019104028A1/en unknown
- 2018-11-20 JP JP2020545071A patent/JP7111823B2/ja active Active
Patent Citations (1)
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WO2017064918A1 (ja) | 2015-10-16 | 2017-04-20 | 日東電工株式会社 | 電気剥離用粘着剤組成物、粘着シート、及び接合体 |
Non-Patent Citations (2)
Title |
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Angew. Chem. Int. Ed.,2012年,51,8585-8588 |
Journal of Molecular Liquids,2015年,212,775-784 |
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Publication number | Publication date |
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US20200308458A1 (en) | 2020-10-01 |
TW201936564A (zh) | 2019-09-16 |
WO2019104028A1 (en) | 2019-05-31 |
CN111630096B (zh) | 2022-02-18 |
CN111630096A (zh) | 2020-09-04 |
JP2021504449A (ja) | 2021-02-15 |
EP3713998A1 (en) | 2020-09-30 |
KR20200089304A (ko) | 2020-07-24 |
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